CN106011768A - Rotating silver target used in magnetron sputtering process - Google Patents
Rotating silver target used in magnetron sputtering process Download PDFInfo
- Publication number
- CN106011768A CN106011768A CN201610610987.8A CN201610610987A CN106011768A CN 106011768 A CN106011768 A CN 106011768A CN 201610610987 A CN201610610987 A CN 201610610987A CN 106011768 A CN106011768 A CN 106011768A
- Authority
- CN
- China
- Prior art keywords
- silver target
- rotating
- rotating silver
- rotary shaft
- magnetron sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a rotating silver target used in a magnetron sputtering process. The rotating silver target comprises a support rack, fixing buckles, a rotating shaft, a rotating silver target tube body, a motor and a motor control unit, wherein the rotating shaft penetrates through the rotating silver target tube body; the rotating shaft is relatively fixed with the rotating silver target tube body by cooperation of the fixing buckles at two ends of the rotating silver target tube body; one end of the rotating shaft is connected with the support rack; the other end of the rotating shaft is connected with the motor. The rotating silver target provided by the invention is high in utilization rate, scaling-off of the hitting arc and the target surface can be effectively reduced, the sputtering velocity is high, and the cost can be lowered.
Description
Technical field
The present invention relates to magnetron sputtering field, particularly relate to the rotating silver target used in a kind of magnetron sputtering technique.
Background technology
Sputter coating process is widely used in the fields such as integrated circuit, magnetic recording, flat-panel screens.Along with the development of surface coating technology, the demand of this functional material with high added value of sputtering target material increases the most year by year.Existing target is generally planar rectangular target, and shortcoming is
The utilization ratio of this plane sputtering target material is relatively low, and the consumption of target is big, and production cost is high.
Summary of the invention
The technical problem to be solved in the present invention is to design the rotating silver target used in a kind of magnetron sputtering technique, solves existing planar targets utilization ratio relatively low, and the consumption of target is big, the technical problem that production cost is high.
The present invention solves the technical scheme of its technical problem:
The rotating silver target used in a kind of magnetron sputtering technique, it is characterised in that include bracing frame, fixing buckle, rotary shaft, rotating silver target body, motor, motor control unit；Described rotating silver target tubular body is installed with described rotary shaft, described rotary shaft is clasped by described rotating silver target body two ends described fixing and described rotating silver target body is relatively fixed, described rotary shaft one end is connected with support frame as described above, and the other end of described rotary shaft is connected with described motor.
Described fixing buckle is arranged on described rotating silver target body and support frame as described above connecting place and described rotating silver target body and described motor connecting place.
The rotating speed of described rotary shaft can be controlled by described motor control unit.
Described fixing buckle is detachably installed.
The beneficial effects of the present invention is target utilization high, effectively arc is beaten in minimizing and target surface falls slag, and sputter rate is high, reduces cost.
Accompanying drawing explanation
Below in conjunction with the accompanying drawings the detailed description of the invention of the present invention is further elucidated with.
Fig. 1 is the structural front view of the rotating silver target used in a kind of magnetron sputtering technique.
Detailed description of the invention
In conjunction with the structural front view of the rotating silver target used in a kind of magnetron sputtering technique of Fig. 1 present invention, the present invention is further detailed.
The rotating silver target used in a kind of magnetron sputtering technique, it is characterised in that include bracing frame 5, fixing buckle 3, rotary shaft 2, rotating silver target body, motor 4, motor control unit；Rotating silver target tubular body is installed with rotary shaft 2, and rotary shaft 2 is relatively fixed with rotating silver target body by fixing buckle 3 cooperation at rotating silver target body two ends, and rotary shaft 2 one end is connected with bracing frame 5, and the other end of rotary shaft 2 is connected with motor 4.
Fixing buckle 3 is arranged on rotating silver target body and bracing frame 5 connecting place and rotating silver target body and motor 4 connecting place.
It is through that the rotating silver target tubular body of the rotating silver target used in a kind of magnetron sputtering technique of the present invention can accommodate rotary shaft 2, coordinated by the fixing buckle 3 at rotating silver target body two ends and fix rotary shaft 2 so that rotating silver target body, fixing buckle 3 and the relative position of rotary shaft 2 are fixed.Rotary shaft 2 one end is connected with bracing frame 5, and bracing frame 5 junction is provided with bearing, and rotary shaft 2 can be allowed to rotate freely in fixed position.Rotary shaft 2 other end is connected with motor 4, by the drive of motor 4, rotary shaft 2 can be made to rotate, so that rotating silver target body rotates.Rotary target solves flat target and falls the problem of slag and target utilization, and improves sputter rate, and target utilization is high, means longer operation time, energy-conserving and environment-protective simultaneously.Sputter rate is high simultaneously, and effectively arc is beaten in minimizing and target surface falls slag, and technology stability is good.Without " burning target ", target consumption can be saved and burn the target time.
The rotating speed of rotary shaft 2 can be controlled by motor control unit.
Fixing buckle 3 is detachably installed.
The rotating speed of rotary shaft 2 can be controlled by motor control unit, thus for the rotating speed of different technological process regulation rotating silver target bodys 1.Fixing buckle 3 can installing/dismounting, it is possible to changes target operation quickly and easily, thus reduces the cost, increases production capacity.
Elaborate a lot of detail in the above description so that fully understanding the present invention.But above description is only presently preferred embodiments of the present invention, the present invention can implement to be much different from alternate manner described here, and therefore the present invention is not limited by disclosed above being embodied as.The most any those skilled in the art are without departing under technical solution of the present invention ambit, technical solution of the present invention is made many possible variations and modification by the method and the technology contents that all may utilize the disclosure above, or is revised as the Equivalent embodiments of equivalent variations.Every content without departing from technical solution of the present invention, the technical spirit of the foundation present invention, to any simple modification made for any of the above embodiments, equivalent variations and modification, all still falls within the range of technical solution of the present invention protection.
Claims (4)
1. the rotating silver target used in a magnetron sputtering technique, it is characterised in that include bracing frame (5), fixing buckle (3), rotary shaft (2), rotating silver target body (1), motor (4), motor control unit；Described rotating silver target body (1) is internal is installed with described rotary shaft (2), described rotary shaft (2) is relatively fixed with described rotating silver target body (1) by described fixing buckle (3) cooperation at described rotating silver target body (1) two ends, described rotary shaft (2) one end is connected with support frame as described above (5), and the other end of described rotary shaft (2) is connected with described motor (4).
2. the rotating silver target used in a magnetron sputtering technique, it is characterized in that, described fixing buckle (3) is arranged on described rotating silver target body (1) and support frame as described above (5) connecting place and described rotating silver target body (1) and described motor (4) connecting place.
3. the rotating silver target used in a magnetron sputtering technique, it is characterised in that the rotating speed of described rotary shaft (2) can be controlled by described motor control unit.
4. the rotating silver target used in a magnetron sputtering technique, it is characterised in that described fixing buckle (3) is detachably installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610610987.8A CN106011768A (en) | 2016-07-29 | 2016-07-29 | Rotating silver target used in magnetron sputtering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610610987.8A CN106011768A (en) | 2016-07-29 | 2016-07-29 | Rotating silver target used in magnetron sputtering process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106011768A true CN106011768A (en) | 2016-10-12 |
Family
ID=57115307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610610987.8A Pending CN106011768A (en) | 2016-07-29 | 2016-07-29 | Rotating silver target used in magnetron sputtering process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106011768A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1491295A (en) * | 2001-02-17 | 2004-04-21 | ��������ˡ��ֶ� | Cylindrical magnetron target and apparatus for affixing target to rotatable spindle assembly |
| CN2808932Y (en) * | 2005-03-14 | 2006-08-23 | 深圳南玻南星玻璃加工有限公司 | High power sputtering film coating source |
| CN1912175A (en) * | 2005-08-10 | 2007-02-14 | 应用薄膜有限责任与两合公司 | Vacuum-coating machine with motor-driven rotary cathode |
| CN102465258A (en) * | 2010-11-18 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | Film-coated piece and preparation method thereof |
| CN102644056A (en) * | 2012-05-10 | 2012-08-22 | 深圳市创益科技发展有限公司 | Magnetron sputtering device used for thin film solar cell and control system thereof |
| CN102822381A (en) * | 2010-03-31 | 2012-12-12 | 野马真空***股份有限公司 | Cylindrical rotating magnetron sputtering cathode device and method of depositing material using radio frequency emissions |
| CN104532200A (en) * | 2014-12-24 | 2015-04-22 | 四川亚力超膜科技有限公司 | Columnar rotation magnetic control sputtering target |
| CN204387313U (en) * | 2015-01-08 | 2015-06-10 | 厦门映日新材料科技有限公司 | Rotary target material mandrel mechanism |
-
2016
- 2016-07-29 CN CN201610610987.8A patent/CN106011768A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1491295A (en) * | 2001-02-17 | 2004-04-21 | ��������ˡ��ֶ� | Cylindrical magnetron target and apparatus for affixing target to rotatable spindle assembly |
| CN2808932Y (en) * | 2005-03-14 | 2006-08-23 | 深圳南玻南星玻璃加工有限公司 | High power sputtering film coating source |
| CN1912175A (en) * | 2005-08-10 | 2007-02-14 | 应用薄膜有限责任与两合公司 | Vacuum-coating machine with motor-driven rotary cathode |
| CN102822381A (en) * | 2010-03-31 | 2012-12-12 | 野马真空***股份有限公司 | Cylindrical rotating magnetron sputtering cathode device and method of depositing material using radio frequency emissions |
| CN102465258A (en) * | 2010-11-18 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | Film-coated piece and preparation method thereof |
| CN102644056A (en) * | 2012-05-10 | 2012-08-22 | 深圳市创益科技发展有限公司 | Magnetron sputtering device used for thin film solar cell and control system thereof |
| CN104532200A (en) * | 2014-12-24 | 2015-04-22 | 四川亚力超膜科技有限公司 | Columnar rotation magnetic control sputtering target |
| CN204387313U (en) * | 2015-01-08 | 2015-06-10 | 厦门映日新材料科技有限公司 | Rotary target material mandrel mechanism |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |