CN106009150A - High density electronic connecting wire - Google Patents
High density electronic connecting wire Download PDFInfo
- Publication number
- CN106009150A CN106009150A CN201610371753.2A CN201610371753A CN106009150A CN 106009150 A CN106009150 A CN 106009150A CN 201610371753 A CN201610371753 A CN 201610371753A CN 106009150 A CN106009150 A CN 106009150A
- Authority
- CN
- China
- Prior art keywords
- high density
- parts
- electronic connecting
- density electronic
- connecting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/062—HDPE
Abstract
The invention discloses a high density electronic connecting wire. The high density electronic connecting wire comprises, by mass, 45-65 parts of high density polyethylene, 3-7 parts of a flexibilizer, 20-25 parts of an active heat conduction filler, 1-2 parts of a coupling agent, 8-10 parts of linear low density polyethylene low density polyethylene, 2-8 parts of a phosphite antioxidant and 2-16 parts of a bridging agent. The high density electronic connecting wire has the characteristics of high toughness, good wear resistance, large strength, stable quality, convenient processing production, good high-temperature and low-temperature resistance, and long service life.
Description
Technical field
The present invention relates to the technical field of electric wire, particularly relate to a kind of high density electronic connecting line.
Background technology
Electronic connecting line is a kind of abbreviation of electric equipment inner wire, and for the connecting line within general electronics, electric equipment, powered is mainly based on weakness, with the cable of forceful electric power category is different concept.PVC electronic connecting line in the market, ambient temperature is used to be usually no more than 70 DEG C, rated temperature is 105 DEG C, rated voltage 300V, have aging resistance, easily burst at the seams, peeling, antiacid alkali, oil resistant and the advantage such as humidity resistance is good, but it is high to there is hardness, the most pliable, in-convenience in use, and actually used during, use that ambient temperature is too high does not has safety prevention measure.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of high density electronic connecting line, has that toughness is high, wearability is good, intensity is big, steady quality, processing is convenient, high temperature resistant and low temperature properties is good, service life length feature.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provides a kind of high density electronic connecting line, the one-tenth of following mass percent is grouped into:
High density polyethylene (HDPE)
45-65 part；
Toughener
3-7 part；
Activity heat filling
20-25 part；
Coupling agent
1-2 part；
Linear low density polyethylene
8-10 part；
Phosphite antioxidant
2-8 part；
Bridging agent
2-16 part.
In a preferred embodiment of the present invention, described toughener is liquid propene acid esters rubber.
In a preferred embodiment of the present invention, described coupling agent is gamma-mercaptopropyltriethoxysilane.
In a preferred embodiment of the present invention, described bridging agent is trimethylhexamethylenediamine.
The invention has the beneficial effects as follows: the high density electronic connecting line of the present invention have that toughness is high, wearability is good, intensity is big, steady quality, processing is convenient, high temperature resistant and low temperature properties is good, service life length feature.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
The embodiment of the present invention includes:
A kind of high density electronic connecting line, is grouped into by the one-tenth of following mass percent:
High density polyethylene (HDPE)
45-65 part；
Toughener
3-7 part；
Activity heat filling
20-25 part；
Coupling agent
1-2 part；
Linear low density polyethylene
8-10 part；
Phosphite antioxidant
2-8 part；
Bridging agent
2-16 part.
In above-mentioned, described toughener is liquid propene acid esters rubber；There is superior resistance to mineral oil and pyro-oxidation resistance, in addition, the most important thing is that it is sufficiently stable to the extreme pressure type lubricating oil containing extreme pressure agents such as sulfur, chlorine, phosphorus, use temperature up to 150 DEG C, being interrupted use temperature can be more higher, acrylate rubber also has excellent ozone resistants, air-tightness, resistance to subdues and resistance to breach growth property, and uvioresistant discolouration etc..
Described coupling agent is gamma-mercaptopropyltriethoxysilane, and gamma-mercaptopropyltriethoxysilane is a kind of chemical substance, non-oxidizability and increase its with resin etc. high molecular cementability；In rubber industry, it is usually used in processing white carbon, white carbon black, the inorganic filler such as glass fibre, Muscovitum, mechanical property and the anti-wear performance of rubber can be effectively improved.
Described bridging agent is trimethylhexamethylenediamine.Trimethylhexamethylenediamine is a kind of chemical substance, and molecular formula is C9H22N2.Cold curing, working life is long, and toxicity is little, and every 100 parts of normal resins are with 21 parts of solidifications: 80 DEG C 1 hour+150 DEG C 2 hours.Performance: 50 minutes working lives 400 grams 25 DEG C or 50 DEG C 10 minutes, Martin heat resistance 92 DEG C, bending strength 1150kg/cm2, impact strength 20Kg-cm/cm2 tg δ 0.0009 (23 DEG C, 100C/S) sheet resistance 5.4x1011 Ω (300V) volume resistance 9x1015 Ω .cm(300V) intermediate temperature setting, cryogenic property be good.
In sum, the high density electronic connecting line of the present invention, have that toughness is high, wearability is good, intensity is big, steady quality, processing is convenient, high temperature resistant and low temperature properties is good, service life length feature.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the invention content to be made or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical field, the most in like manner it is included in the scope of patent protection of the present invention.
Claims (4)
1. a high density electronic connecting line, it is characterised in that be grouped into by the one-tenth of following mass percent:
High density polyethylene (HDPE)
45-65 part；
Toughener
3-7 part；
Activity heat filling
20-25 part；
Coupling agent
1-2 part；
Linear low density polyethylene
8-10 part；
Phosphite antioxidant
2-8 part；
Bridging agent
2-16 part.
High density electronic connecting line the most according to claim 1, it is characterised in that described toughener is liquid propene acid esters rubber.
High density electronic connecting line the most according to claim 1, it is characterised in that described coupling agent is gamma-mercaptopropyltriethoxysilane.
High density electronic connecting line the most according to claim 1, it is characterised in that described bridging agent is trimethylhexamethylenediamine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610371753.2A CN106009150A (en) | 2016-05-31 | 2016-05-31 | High density electronic connecting wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610371753.2A CN106009150A (en) | 2016-05-31 | 2016-05-31 | High density electronic connecting wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106009150A true CN106009150A (en) | 2016-10-12 |
Family
ID=57091843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610371753.2A Pending CN106009150A (en) | 2016-05-31 | 2016-05-31 | High density electronic connecting wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106009150A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103897241A (en) * | 2012-12-27 | 2014-07-02 | 山西博亮硅业有限公司 | Heat conductive plastics and manufacturing method thereof |
-
2016
- 2016-05-31 CN CN201610371753.2A patent/CN106009150A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103897241A (en) * | 2012-12-27 | 2014-07-02 | 山西博亮硅业有限公司 | Heat conductive plastics and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |