CN106004074B - A kind of manufacture method of thermal printing head heating base plate - Google Patents

A kind of manufacture method of thermal printing head heating base plate Download PDF

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Publication number
CN106004074B
CN106004074B CN201610347355.7A CN201610347355A CN106004074B CN 106004074 B CN106004074 B CN 106004074B CN 201610347355 A CN201610347355 A CN 201610347355A CN 106004074 B CN106004074 B CN 106004074B
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CN
China
Prior art keywords
photoresists
insulative substrate
base plate
electrode
printing head
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CN201610347355.7A
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Chinese (zh)
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CN106004074A (en
Inventor
王吉刚
远藤孝文
冷正超
邓丽艳
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Shandong Hualing Electronics Co Ltd
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Shandong Hualing Electronics Co Ltd
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Priority to CN201610347355.7A priority Critical patent/CN106004074B/en
Publication of CN106004074A publication Critical patent/CN106004074A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Electronic Switches (AREA)

Abstract

The present invention proposes a kind of manufacture method of thermal printing head heating base plate, including step 1, on insulative substrate surface is coated with photoresists；Step 2, by photomask to photoresists carry out light irradiation；Step 3, by the first alkaline solution soak photoresists, selectivity dissolved；Step 4, insulative substrate is soaked in the colloidal solution including at least Pd, allows Pd to be attached to insulative substrate and photoresists surface, form Pd catalyst layers；Step 5, insulative substrate is soaked in the second alkaline solution, photoresists and the Pd catalyst layers for adsorbing its surface are together removed；Step 6, by implementing electroless plating to Pd catalyst layer surface, form electrode conductor layer, electrode conductor layer includes the public electrode and multiple individual electrodes of comb teeth-shaped, and individual electrode is between adjacent two broach of public electrode；Step 7, in electrode surface, along main scanning direction formation heating resistor.Above-mentioned manufacture method operating procedure is simple, and device therefor cost is low.

Description

A kind of manufacture method of thermal printing head heating base plate
Technical field
The present invention relates to thermal printing head, more particularly to a kind of thermal printing head heating for facsimile machine, printer The manufacture method of substrate.
Background technology
Heating base plate used in thermal printing head of the prior art can be touched using treated cation process, colloidal solution Matchmaker's treatment process is manufactured with the electro-plating method of acceleration electrode process.Although being referred in the prior art using macromolecular fibre material Expect sorption Pd（Chemical element palladium）Electro-plating method, but do not refer to using photoresists formation circuit method.
The content of the invention
In order to solve problems of the prior art, the present invention proposes a kind of system of thermal printing head heating base plate Method is made, so as to which in the case of no high price apparatus, heating part just can be formed using simple procedures.
To achieve these goals, the present invention proposes a kind of manufacture method of thermal printing head heating base plate, described Manufacture method comprises the following steps：Step 1, the surface coating photoresists in insulative substrate；Step 2, by photomask to institute State photoresists and carry out light irradiation, wherein the photomask is provided with the patterned photomask of chromium material；Step 3, pass through first Alkaline solution soaks the photoresists, the selective dissolving photoresists；Step 4, by the insulative substrate be soaked in Less in the colloidal solution comprising Pd, Pd is allowed to be attached to the surface of the photoresists of the insulative substrate and retention, to form Pd Catalyst layer；Step 5, the insulative substrate is soaked in the second alkaline solution, the photoresists of the retention all dissolved, Meanwhile, the Pd catalyst layers for being adsorbed in the photoresists surface are also together removed so that be deposited in the insulative substrate Pd catalyst layers form the conduction circuit of expected figure；Step 6, pass through and implement electroless plating, analysis to the surfaces of Pd catalyst layers Go out conductive materials, form the layer by the electrode conductor of conductor of Pd catalyst layers and the conductive materials, the electrode conductor layer includes public affairs Common electrode and multiple individual electrodes, the public electrode are comb teeth-shaped, and it is adjacent that each individual electrode is located at public electrode respectively Two broach between；Step 7, the surface in public electrode and individual electrode, continuous banding is formed along main scanning direction Heating resistor, the heating resistor is split to form some heatings by public electrode along the broach that main scanning direction is arranged in order Portion.
Preferably, the insulative substrate is constituted using ceramic material, clear glass or macromolecule resin.
Preferably, when the insulative substrate is made up of ceramic material, the setting glass in the insulative substrate The smooth layer of glass material formation.
Preferably, when the insulative substrate is constituted using macromolecule resin, added between step 3 and step 4 Adjust process：The insulative substrate is soaked in cationic surfactant, is rinsed again afterwards.
Preferably, the step 4 comprises the following steps：Step 41, the insulative substrate is soaked in Pd/Sn colloids In catalyst, the Pd/Sn colloid catalysts are allowed to be attached to the surface of the photoresists of the insulative substrate and retention；Step 42nd, the insulative substrate is soaked in dissolving Sn and insoluble Pd acid solution, allows Pd catalyst layers to be attached to described exhausted The surface of edge substrate and the photoresists of retention.
Preferably, the thickness of the public electrode and individual electrode is 3~5 μm.
Preferably, the heating resistor in the step 7 uses thick-film resistor paste in public electrode and individual electrode Surface, form continuous banding along main scanning direction, then formed through oversintering；Or the method for using magnetron sputtering, The surface of public electrode and individual electrode, Ta-SiO is sputtered along main scanning direction2Target is formed.
Preferably, diaphragm formation process is added after step 7：Insulating properties diaphragm is covered in the common electrical The surface of pole, individual electrode and heating part.
Preferably, the insulating properties diaphragm uses Sialon or oxide-nitride film.
The beneficial effect of the program of the present invention is that the operating procedure of above-mentioned manufacture method is simple, device therefor cost It is low.
Brief description of the drawings
Fig. 1 shows thermal printing head involved in the present invention heating base plate coating process and the section of glue exposure process Figure.
Fig. 2 shows that thermal printing head involved in the present invention images the sectional drawing of process with heating base plate.
Fig. 3 shows that thermal printing head involved in the present invention adjusts the sectional drawing of process with heating base plate.
Fig. 4 shows the sectional drawing of thermal printing head involved in the present invention with heating base plate catalytic process steps.
Fig. 5 shows that thermal printing head involved in the present invention accelerates the sectional drawing of process with heating base plate.
Fig. 6 shows the sectional drawing of the photoresists stripping process of thermal printing head heating base plate involved in the present invention.
Fig. 7 shows the sectional drawing of thermal printing head involved in the present invention with heating base plate electroless plating process.
Fig. 8 shows the electrode part amplification on the heating part periphery of thermal printing head heating base plate involved in the present invention Plan.
Fig. 9 shows the partial cut-away figure on the heating part periphery of thermal printing head heating base plate involved in the present invention.
Figure 10 shows the flow chart of the manufacturing process of thermal printing head heating base plate involved in the present invention.
Reference：1- insulative substrates, 2- smooth layers, 3- photoresists, 3a- exposure areas, 3b- retains region, 4- light Mask, 4a- photomasks, 5- cationic surfactants, 6-Pd/Sn colloid catalysts, 7-Pd catalyst layers, 8- electrode conductors layer, 8a- public electrodes, 8b- individual electrodes, 9- heating resistors, 9a- heating parts, 10- insulating properties diaphragms.
Embodiment
The embodiment to the present invention is further described below in conjunction with the accompanying drawings.
Fig. 1 shows thermal printing head involved in the present invention heating base plate coating process and the section of glue exposure process Figure.As shown in figure 1, being coated with the photoresists 3 of 1 μm~3 μm thickness on the surface of insulative substrate 1 with equipment such as coating rollers, this claims For coating process.Wherein, the insulative substrate 1 can be constituted using ceramic material, clear glass or macromolecule resin etc..Work as institute When stating insulative substrate 1 and being made up of ceramic material, to relax the roughness of ceramic base plate surface, it can be set on ceramic substrate The smooth layer 2 formed with glass material.Certainly, when the insulative substrate 1 is constituted using the material with flatness, then not Need to set smooth layer 2.
When photoresists 3 are positive photoresist, by the photomask 4 for being arranged at the top of photoresists 3（Clear glass dry plate can be used） The light such as irradiation ultraviolet radiation, the photomask 4 is provided with the patterned photomask 4a of chromium material so that the photoresists of exposure area The 3 dissolubility increase in alkaline solution.This procedure is referred to as glue exposure process.
Fig. 2 shows that thermal printing head involved in the present invention images the sectional drawing of process with heating base plate.By above-mentioned Glue exposure process, can form exposure area 3a on the photoresists 3 and retain region 3b, wherein the exposure area 3a refers to The region of photoresists 3 through light irradiations such as ultraviolets, the retention region 3b refers to by the photomask 4a, not by ultraviolet etc. Light irradiation（It is i.e. unexposed）The region of photoresists 3.Pass through TMAH（TMAH）Soak described photosensitive Deng alkaline solution Glue 3, removes the photoresists 3 of the exposure area 3a, and this process is referred to as imaging process.
Fig. 3 shows that thermal printing head involved in the present invention adjusts the sectional drawing of process with heating base plate.Will be described exhausted Edge substrate 1 is soaked in cationic surfactant 5, is rinsed again afterwards.The cationic surfactant 5 can adhere to In the insulative substrate 1 and retain region 3b photoresists 3 surface, afterwards by rinse, the insulative substrate 1 with And the bumps on the retention region 3b surface of photoresists 3 can be relaxed.This process is referred to as adjusting process.The insulative substrate 1 When constituting using macromolecule resin, it is adapted to set this procedure.
Fig. 4 shows the sectional drawing of thermal printing head involved in the present invention with heating base plate catalytic process steps.Will be described exhausted Edge substrate 1 is soaked in Pd/Sn colloid catalysts 6（Pd is chemical element " palladium ", and Sn is chemical element " tin "）In, allow described Pd/Sn colloid catalysts 6 are attached to the insulative substrate 1 and retain the surface of region 3b photoresists 3, and this procedure claims For catalytic process steps.
Fig. 5 shows that thermal printing head involved in the present invention accelerates the sectional drawing of process with heating base plate.Will be described exhausted Edge substrate 1 is soaked in the acid solutions such as dissolving Sn and insoluble Pd sulfuric acid or hydrochloric acid, allows Pd catalyst layers 7 to be attached to described The surface of insulative substrate 1 and retention region 3b photoresists 3, this procedure is referred to as accelerating process.
Fig. 6 shows the sectional drawing of the photoresists stripping process of thermal printing head heating base plate involved in the present invention. The insulative substrate 1 is soaked in TMAH（TMAH）Deng in alkaline solution, by the sense of the retention region 3b The all dissolvings of optical cement 3, meanwhile, the Pd catalyst layers 7 for being adsorbed in the surface of photoresists 3 are also together removed, thus obtained by The conductor layer that Pd catalyst layers 7 on the 3a of exposure area are formed, the thickness of the conductor layer is 5~30nm, the pattern of the conductor layer The photomask 4a set on the photomask 4 figure is determined.This procedure is referred to as glue stripping process.
Fig. 7 shows the sectional drawing of thermal printing head involved in the present invention with heating base plate electroless plating process.It is logical Cross and electroless plating is implemented to the surface of the Pd catalyst layers 7 as conductor layer, separate out conduction Ni compounds, touched to be formed with Pd Matchmaker's 7 and Ni of layer compounds are the electrode conductor layer 8 of conductor, about 3~5 μm of the thickness of electrode conductor layer 8.
Fig. 8 shows the electrode part amplification on the heating part periphery of thermal printing head heating base plate involved in the present invention Plan.Electrode conductor layer 8 includes public electrode 8a and multiple individual electrode 8b, the public electrode 8a and indivedual Electrode 8b thickness is preferably at 3~5 μm, by the figure for setting the photomask 4a on the photomask 4 so that the common electrical Pole 8a is comb teeth-shaped, and each individual electrode 8b is located between two adjacent broach of public electrode 8a respectively.This procedure Referred to as electroless plating process.The effect of the process is to reduce the impedance of electrode.
On public electrode 8a and individual electrode 8b surface, formed continuously using thick-film resistor paste along main scanning direction Banding, then through oversintering, forms heating resistor 9；Or using the method for magnetron sputtering, in public electrode 8a and indivedual electricity Pole 8b surface, Ta-SiO is sputtered along main scanning direction2Target forms the heating resistor 9 of continuous banding.The heating electric Resistance body 9 is split to form some heating part 9a by public electrode 8a along the broach that main scanning direction is arranged in order, each heating part 9a Long side direction size be 0.125mm（pitch）, short side direction（Direction of transfer）Size be 0.15mm.This process is heating Portion's formation process.
Fig. 9 shows the partial cut-away figure on the heating part periphery of thermal printing head heating base plate involved in the present invention. Insulating properties diaphragm 10 is covered in the public electrode 8a, individual electrode 8b and heating part 9a surface, to prevent outside The harmful effect that environment triggers.Wherein described insulating properties diaphragm 10 can use SiAlON（Sialon）、SiON（Silicon oxynitride）Deng Insulation film.This procedure is referred to as diaphragm formation process.
Figure 10 shows the flow chart of the manufacturing process of thermal printing head heating base plate involved in the present invention.From figure As can be seen that the manufacturing process includes following process：
1）Coating process：Photoresists 3 are coated with the surface of insulative substrate 1.
2）Glue exposure process：By photomask 4 to light such as the irradiation ultraviolet radiations of photoresists 3, the photomask 4 is provided with chromium material The patterned photomask 4a of matter so that dissolubility increase of the photoresists 3 of exposure area in alkaline solution.
3）Image process：Pass through the first alkaline solution（The alkaline solution such as TMAH）The photoresists 3 are soaked, institute is removed State exposure area 3a photoresists 3.
4）Adjust process：The insulative substrate 1 is soaked in cationic surfactant 5, is rinsed again afterwards. When the insulative substrate 1 is constituted using macromolecule resin, it is adapted to set this procedure.
5）Catalytic process steps：The insulative substrate 1 is soaked in Pd/Sn colloid catalysts 6, the Pd/Sn colloids are allowed Catalyst 6 is attached to the insulative substrate 1 and retains the surface of region 3b photoresists 3.
6）Accelerate process：The insulative substrate 1 is soaked in the acidity such as dissolving Sn and insoluble Pd sulfuric acid or hydrochloric acid In solution, allow Pd catalyst layers 7 to be attached to the insulative substrate 1 and retain the surface of region 3b photoresists 3.
7）Glue stripping process：The insulative substrate 1 is soaked in the second alkaline solution（The alkalescence such as TMAH is molten Liquid）, the photoresists 3 of the retention region 3b are all dissolved, meanwhile, the Pd catalyst layers 7 on the surface of photoresists 3 will be adsorbed in Also together remove.
8）Electroless plating process：Electroless plating is implemented by the surface to Pd catalyst layers 7, conduction Ni compounds are separated out （Ni compounds such as Ni-P, Ni-B based on Ni）, to be formed using Pd catalyst layers 7 and Ni compounds as the electricity of conductor Pole conductor layer 8, electrode conductor layer 8 includes public electrode 8a and multiple individual electrode 8b, the public electrode 8a and Individual electrode 8b thickness is preferably at 3~5 μm, by the figure for setting the photomask 4a on the photomask 4 so that the public affairs Common electrode 8a is comb teeth-shaped, and each individual electrode 8b is located between two adjacent broach of public electrode 8a respectively.
9）Heating part formation process：On public electrode 8a and individual electrode 8b surface, thick film is used along main scanning direction Resistance slurry forms continuous banding, then through oversintering, forms heating resistor 9；Or the method for using magnetron sputtering, Public electrode 8a and individual electrode 8b surface, Ta-SiO is sputtered along main scanning direction2Target forms the heating of continuous banding Resistive element 9.The heating resistor 9 is split to form some heatings by public electrode 8a along the broach that main scanning direction is arranged in order Portion 9a.
10）Diaphragm formation process：By insulating properties diaphragm 10 be covered in the public electrode 8a, individual electrode 8b and Heating part 9a surface.Wherein described insulating properties diaphragm 10 can use SiAlON（Sialon）、SiON（Silicon oxynitride）Deng insulation Film.
In summary, the manufacturing process of thermal printing head heating base plate involved in the present invention has operating procedure letter It is single, the low advantage of device therefor cost.

Claims (9)

1. a kind of manufacture method of thermal printing head heating base plate, it is characterised in that：The manufacture method comprises the following steps： Step 1, the surface coating photoresists in insulative substrate；Step 2, by photomask to the photoresists carry out light irradiation, its Described in photomask be provided with chromium material patterned photomask；Step 3, by the first alkaline solution soak it is described photosensitive Glue, the selective dissolving photoresists；Step 4, the insulative substrate is soaked in the colloidal solution including at least Pd, Pd is allowed to be attached to the surface of the photoresists of the insulative substrate and retention, to form Pd catalyst layers；Step 5, will it is described absolutely Edge substrate is soaked in the second alkaline solution, and the photoresists of the retention are all dissolved, meanwhile, it will be adsorbed in described photosensitive The Pd catalyst layers on glue surface are also together removed so that the Pd catalyst layers being deposited in the insulative substrate form expected figure Conduction circuit；Step 6, by implementing electroless plating to the surfaces of Pd catalyst layers, separate out conductive materials, formed with Pd catalyst Layer and the electrode conductor layer that the conductive materials are conductor, the electrode conductor layer include public electrode and multiple individual electrodes, The public electrode is comb teeth-shaped, and each individual electrode is located between two adjacent broach of public electrode respectively；Step 7, The surface of public electrode and individual electrode, forms the heating resistor of continuous banding, the heating resistor along main scanning direction Body is split to form some heating parts by public electrode along the broach that main scanning direction is arranged in order.
2. the manufacture method of thermal printing head heating base plate according to claim 1, it is characterised in that：The insulating properties Substrate is constituted using ceramic material, clear glass or macromolecule resin.
3. the manufacture method of thermal printing head heating base plate according to claim 2, it is characterised in that：When the insulation When property substrate is made up of ceramic material, the smooth layer that setting is formed with glass material in the insulative substrate.
4. the manufacture method of thermal printing head heating base plate according to claim 2, it is characterised in that：When the insulation Property substrate using macromolecule resin constitute when, between step 3 and step 4 add regulation process：The insulative substrate is soaked Steep in cationic surfactant, be rinsed again afterwards.
5. the manufacture method of thermal printing head heating base plate according to claim 1, it is characterised in that：The step 4 Comprise the following steps：Step 41, the insulative substrate is soaked in Pd/Sn colloid catalysts, allows the Pd/Sn colloids to urge Agent is attached to the surface of the photoresists of the insulative substrate and retention；Step 42, the insulative substrate is soaked in In the acid solution for dissolving Sn and insoluble Pd, Pd catalyst layers are allowed to be attached to the photoresists of the insulative substrate and retention Surface.
6. the manufacture method of thermal printing head heating base plate according to claim 1, it is characterised in that：The common electrical The thickness of pole and individual electrode is 3~5 μm.
7. the manufacture method of thermal printing head heating base plate according to claim 1, it is characterised in that：The step 7 In heating resistor using thick-film resistor paste on the surface of public electrode and individual electrode, formed continuously along main scanning direction Banding, then formed through oversintering；Or using the method for magnetron sputtering, on the surface of public electrode and individual electrode, edge Main scanning direction sputters Ta-SiO2Target is formed.
8. the manufacture method of thermal printing head heating base plate according to claim 1, it is characterised in that：Step 7 it Diaphragm formation process is added afterwards：Insulating properties diaphragm is covered in the table of the public electrode, individual electrode and heating part Face.
9. the manufacture method of thermal printing head heating base plate according to claim 8, it is characterised in that：The insulating properties Diaphragm uses Sialon or oxide-nitride film.
CN201610347355.7A 2016-05-24 2016-05-24 A kind of manufacture method of thermal printing head heating base plate Active CN106004074B (en)

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JP4241789B2 (en) * 2006-09-12 2009-03-18 アルプス電気株式会社 Thermal head and manufacturing method thereof
CN101620965A (en) * 2008-07-01 2010-01-06 四川虹欧显示器件有限公司 Methods for manufacturing strip barrier and rear substrate
CN102107559A (en) * 2009-12-25 2011-06-29 山东华菱电子有限公司 Method for manufacturing thermosensitive printing head
KR101108162B1 (en) * 2010-01-11 2012-01-31 서울대학교산학협력단 Manufacturing method for the high resolution organic thin film pattern
JP5765843B2 (en) * 2011-02-14 2015-08-19 セイコーインスツル株式会社 Manufacturing method of thermal head
CN102832319A (en) * 2012-08-27 2012-12-19 苏州金科信汇光电科技有限公司 Disk type integrated LED light source and preparation method thereof
CN103309541A (en) * 2013-06-27 2013-09-18 袁博 Manufacturing method for capacitance type touch screen wire circuit
CN105448467B (en) * 2015-12-21 2017-12-29 深圳顺络电子股份有限公司 A kind of preparation method of electronic component electrode

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