CN105989913A - Flexible connection busbar - Google Patents
Flexible connection busbar Download PDFInfo
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- CN105989913A CN105989913A CN201510075403.7A CN201510075403A CN105989913A CN 105989913 A CN105989913 A CN 105989913A CN 201510075403 A CN201510075403 A CN 201510075403A CN 105989913 A CN105989913 A CN 105989913A
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- conductive layer
- busbar
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Abstract
The invention relates to the technical field of metal busbars, and discloses a flexible connection busbar. The flexible connection busbar comprises conducting layers and insulating layers, and is characterized in that at least 10 conducting layers are parallelly stacked together to form a conducting layer group, and the upper surface and the lower surface of each conducting layer are coated with the insulating layer; an insulating segment is removed at both ends of the conducting layer group according to the length of a preset lapping surface, and the conducting layers with the insulating segments being removed are welded into an integral body so as to form a hard single layer. The flexible connection busbar can overcome a problem of great material waste caused by an epistrophe effect while the application performance remains the same. The flexible connection busbar also reduces the material cost, the production cost and the product weight, saves energy and reduces carbon emission.
Description
Technical field
The present invention relates to busbar technical field, in particular, be flexible coupling busbar particularly to one.
Background technology
Be flexible coupling busbar (electric conductor) owing to its electric conductivity having is strong, it is big to bear electric current, alternating current resistance is little, shock-proof durable and reliability high, be widely used in the fields such as new-energy automobile, power system, ac motor control system, switch transformer.The existing busbar that is flexible coupling (electric conductor), in order to increase its high frequency electric percent of pass, is typically designed into multilamellar.But there is no insulating barrier between existing multilamellar busbar (electric conductor), very big to reducing high frequency electric skin effect problem limitation, and waste of material is big, volume is the biggest.
Summary of the invention
Present invention aims to the technical problem that prior art exists, one is provided to be flexible coupling busbar, can be while application performance be constant, the problem that the waste of material caused because of skin effect problem is big can be reduced, decrease material cost, production cost and product weight energy-conservation minimizing carbon emission.
In order to solve posed problems above, the technical solution used in the present invention is:
One is flexible coupling busbar, and this busbar that is flexible coupling includes conductive layer and insulating barrier, and by parallel for the conductive layers of at least 10 layers formation conductive layer group that is stacked together, the upper and lower surface of every layer of conductive layer scribbles insulating barrier；Insulating segment is removed according to default faying surface length in the two ends of conductive layer group, and the conductive layer bond pads removing insulating segment is integrally formed hard monolayer.
Described conductive layer uses T2 red copper Copper Foil, and it selects 10～100 layers, and the thickness of conductive layer is 0.03mm～0.3mm, and width is 10mm～100mm.
The thickness of described insulating barrier is chosen as 0.005mm～0.05mm.
A length of the 30～500mm of described hard monolayer.
Gap between described adjacent conductive layer is 0.01～0.1mm.
Described insulating barrier uses aluminum phosphate solution and epoxy resin to carry out proportioning according to 1/6～1/50.
Al in described aluminum phosphate solution2O3/H3PO4Thing mass ratio be 0.13～0.3.
Compared with prior art, the beneficial effects of the present invention is:
The present invention can be while application performance be constant, it is possible to reduces the problem that the waste of material caused because of skin effect problem is big, decreases material cost, production cost and product weight energy-conservation minimizing carbon emission.
Accompanying drawing explanation
Fig. 1 is that the present invention is flexible coupling the structural representation of busbar.
Fig. 2 is that the present invention is flexible coupling the graph of relation of busbar inductance size and thickness of insulating layer.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Accompanying drawing gives presently preferred embodiments of the present invention.But, the present invention can realize in many different forms, however it is not limited to embodiment described herein.On the contrary, providing the purpose of these embodiments is to make the understanding to the disclosure more thorough comprehensively.
Unless otherwise defined, all of technology used herein is identical with the implication that the those skilled in the art belonging to the present invention are generally understood that with scientific terminology.The term used the most in the description of the invention is intended merely to describe the purpose of specific embodiment, it is not intended that in limiting the present invention.
Refering to shown in Fig. 1, the one that the present invention provides is flexible coupling busbar, and this busbar that is flexible coupling includes conductive layer 1 and insulating barrier 2, the parallel formation conductive layer group that is stacked together of plurality of conductive layers 1, the upper and lower surface of every layer of conductive layer 1 scribbles insulating barrier 2, thereby may be ensured that and insulate between adjacent conductive layer 1.Insulating segment is removed according to default faying surface length in the two ends of conductive layer group, and the conductive layer group that will remove insulating segment uses molecule diffusion welding (DW), and logical super-high-current adds thermocompression bonding and is connected into and is integrally formed hard monolayer 3.
In the present embodiment, conductive layer 1 uses T2 red copper Copper Foil, and its density is 8.9g/cm3, conductivity is 98.3%IACS, and heat conductivity is 388W/m-K.Conductive layer 1 is typically at least set to 10 layers according to current-carrying capacity size and thickness difference, selects 10～100 layers in the present embodiment, and the length of hard monolayer 3 is typically set to 30-500mm.The thickness of conductive layer 1 is 0.03mm～0.3mm, and width is 10mm～100mm.
In above-mentioned, being normally set up ambient temperature is 40 DEG C, and temperature rise of conductor is 50 DEG C, and the copper temperature-coefficient of electrical resistance when 20 DEG C is 1.724 μ Ω cm, then the current-carrying capacity I formula of single conductive layer 1 is as follows:
I=7.73A0.5p0.39
Wherein, A is the cross-sectional area of conductive layer, and p is the girth of conductive layer.
In above-mentioned, the length of hard monolayer 3, width, thickness etc. are as shown in table 1 with the relation of current-carrying capacity size.
Table 1
I.e. it can be seen that the girth of the reference current-carrying capacity of busbar and busbar and the proportional relation of sectional area of busbar in table 1.By above-mentioned formula it can also be seen that in the case of cross-sectional area A is certain, perimeter p is the longest, and its current capacity is the biggest, and i.e. conductive layer 1 is the thinnest and the number of plies is the most, and its current capacity is the strongest, but conductive layer 1 is the thinnest, the decline of its mechanical strength is easy for producing breakage.
In above-mentioned, between adjacent conductive layer 1, leave gap, and gap is 0.01-0.1mm.Magnetic field adjacent conductive layer 1 being produced due to kindred effect is significantly offset, and in the case of conductive layer 1 size is certain, the more small inductor of the spacing between adjacent conductive layer 1 is the least, therefore reduces the distance between plurality of conductive layers 1 under meeting resistance to pressure request as far as possible.
If conductive layer 1 upper and lower surface does not has insulating barrier 2, under the effect of exchange flux, can produce faradic current in conductive layer 1, then conductive layer 1 conducting becomes an entirety, is equivalent to a biggest conductor of area, and circuit is the shortest, and its resistance value is the least.Although the voltage of sensing is the highest, but electric current is very big, so can produce bigger eddy-current loss.After increasing insulating barrier 2 between every conductive layer 1, conductive section is divided into the conductor of a lot of small bores, and such single chip resistance increases, although still suffer from eddy-current loss, but can be much smaller.
In the present embodiment, insulating barrier 2 uses phosphoric acid-chromic acid system coating, and it uses temperature to be 70～80 DEG C, and interface resistance is 5～50 Ω cm2/ sheet.Coating uses 1 part of aluminum phosphate solution (Al2O3/H3PO4Thing mass ratio be 0.13～0.3) be configured to half inorganic solution, i.e. aluminum phosphate solution with 25 parts of epoxy resin and carry out proportioning with epoxy resin according to 1/6～1/50, control coated weight by the paint roller of trough of belt and be coated baking and be dried.In the present embodiment, aluminum phosphate solution and epoxy resin use 1/25 to carry out proportioning, and the coating obtained is best suitable for being coated on red copper copper foil surface, and the coating performance obtained is excellent, smooth appearance.If the insulating properties of the insulating barrier 2 that epoxy resin crosses same thickness at least can reduce, epoxy resin is crossed drying at most and is required time for oversize, affects coating efficiency.
In above-mentioned, as shown in Figure 2, owing to the thickness of insulating barrier 2 is the thinnest, the inductance of busbar is the least, and impedance is the least, and current capacity is the strongest, but the thickness of insulating barrier 2 more thin insulating ability is the poorest.Therefore, in the case of ensureing busbar inductance and insulating barrier 2 insulating capacity at the same time, the thickness of insulating barrier 2 is chosen as 0.005mm～0.05mm.
Above-described embodiment is the present invention preferably embodiment; but embodiments of the present invention are also not restricted to the described embodiments; the change made under other any spirit without departing from the present invention and principle, modify, substitute, combine, simplify; all should be the substitute mode of equivalence, within being included in protection scope of the present invention.
Claims (7)
1. the busbar that is flexible coupling, it is characterised in that: this busbar that is flexible coupling includes conductive layer (1) and absolutely
Edge layer (2), forms conductive layer group by parallel for the conductive layers of at least 10 layers (1) being stacked together, every layer
The upper and lower surface of conductive layer (1) scribbles insulating barrier (2)；The two ends of conductive layer group are according to default faying surface
Length removes insulating segment, and the conductive layer bond pads removing insulating segment is integrally formed hard monolayer (3).
The busbar that is flexible coupling the most according to claim 1, it is characterised in that: described conductive layer (1)
Using T2 red copper Copper Foil, it selects 10～100 layers, and the thickness of conductive layer (1) is 0.03mm～0.3mm,
Width is 10mm～100mm.
The busbar that is flexible coupling the most according to claim 1, it is characterised in that: described insulating barrier (2)
Thickness be chosen as 0.005mm～0.05mm.
The busbar that is flexible coupling the most according to claim 1, it is characterised in that: described hard monolayer (3)
A length of 30～500mm.
The busbar that is flexible coupling the most according to claim 1, it is characterised in that: described adjacent conductive layer
(1) gap between is 0.01～0.1mm.
The busbar that is flexible coupling the most according to claim 1, it is characterised in that: described insulating barrier (2)
Aluminum phosphate solution and epoxy resin is used to carry out proportioning according to 1/6～1/50.
The busbar that is flexible coupling the most according to claim 6, it is characterised in that: described aluminum phosphate solution
Middle Al2O3/H3PO4Thing mass ratio be 0.13～0.3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510075403.7A CN105989913A (en) | 2015-02-12 | 2015-02-12 | Flexible connection busbar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510075403.7A CN105989913A (en) | 2015-02-12 | 2015-02-12 | Flexible connection busbar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105989913A true CN105989913A (en) | 2016-10-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510075403.7A Pending CN105989913A (en) | 2015-02-12 | 2015-02-12 | Flexible connection busbar |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110197742A (en) * | 2019-07-10 | 2019-09-03 | 苏州科伦特电源科技有限公司 | A kind of busbar structure of uniformly distributed electric current |
| CN111952804A (en) * | 2019-05-17 | 2020-11-17 | 罗杰斯私人有限公司 | Interface region for connecting a pin-like element to a busbar, system comprising an interface region and method for manufacturing an interface region |
| CN113711444A (en) * | 2019-04-19 | 2021-11-26 | 怡得乐工业有限公司 | Multi-part connector for transmitting electrical power |
| CN114725742A (en) * | 2022-04-18 | 2022-07-08 | 广东冠睿科技技术有限公司 | Busbar device and power distribution cabinet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201242904Y (en) * | 2008-06-27 | 2009-05-20 | 浙江万马电缆股份有限公司 | Cable conductor capable of resisting skin effect |
| CN102945711A (en) * | 2012-12-07 | 2013-02-27 | 安费诺-泰姆斯(常州)通讯设备有限公司 | Manufacturing method for flexible soft copper bar assembly for electric connection |
| US20130048336A1 (en) * | 2011-08-22 | 2013-02-28 | Adhesives Research, Inc. | Polymeric coated busbar tape for photovoltaic systems |
| CN204516376U (en) * | 2015-02-12 | 2015-07-29 | 深圳市振勤电子科技有限公司 | One is flexible coupling busbar |
-
2015
- 2015-02-12 CN CN201510075403.7A patent/CN105989913A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201242904Y (en) * | 2008-06-27 | 2009-05-20 | 浙江万马电缆股份有限公司 | Cable conductor capable of resisting skin effect |
| US20130048336A1 (en) * | 2011-08-22 | 2013-02-28 | Adhesives Research, Inc. | Polymeric coated busbar tape for photovoltaic systems |
| CN102945711A (en) * | 2012-12-07 | 2013-02-27 | 安费诺-泰姆斯(常州)通讯设备有限公司 | Manufacturing method for flexible soft copper bar assembly for electric connection |
| CN204516376U (en) * | 2015-02-12 | 2015-07-29 | 深圳市振勤电子科技有限公司 | One is flexible coupling busbar |
Non-Patent Citations (2)
| Title |
|---|
| A.D.沃特: "《甚低频无线电工程》", 31 January 1973 * |
| 吴玉荣等: "《建筑材料手册》", 31 December 1981 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113711444A (en) * | 2019-04-19 | 2021-11-26 | 怡得乐工业有限公司 | Multi-part connector for transmitting electrical power |
| CN111952804A (en) * | 2019-05-17 | 2020-11-17 | 罗杰斯私人有限公司 | Interface region for connecting a pin-like element to a busbar, system comprising an interface region and method for manufacturing an interface region |
| CN110197742A (en) * | 2019-07-10 | 2019-09-03 | 苏州科伦特电源科技有限公司 | A kind of busbar structure of uniformly distributed electric current |
| CN114725742A (en) * | 2022-04-18 | 2022-07-08 | 广东冠睿科技技术有限公司 | Busbar device and power distribution cabinet |
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Application publication date: 20161005 |