CN105950100A - {0><}0{>Organosilicon pouring sealant with high curing speed and low wiredrawing capability and preparation method thereof<0} - Google Patents

{0><}0{>Organosilicon pouring sealant with high curing speed and low wiredrawing capability and preparation method thereof<0} Download PDF

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Publication number
CN105950100A
CN105950100A CN201610373890.XA CN201610373890A CN105950100A CN 105950100 A CN105950100 A CN 105950100A CN 201610373890 A CN201610373890 A CN 201610373890A CN 105950100 A CN105950100 A CN 105950100A
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CN
China
Prior art keywords
parts
silicone oil
wire drawing
organic silicon
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610373890.XA
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Chinese (zh)
Inventor
李军明
吴雯雯
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JIANGSU CREVO TECHNOLOGY Co Ltd
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JIANGSU CREVO TECHNOLOGY Co Ltd
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Priority to CN201610373890.XA priority Critical patent/CN105950100A/en
Publication of CN105950100A publication Critical patent/CN105950100A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

{0><}0{>The invention discloses an organosilicon pouring sealant with high curing speed and low wiredrawing capability. The organosilicon pouring sealant is prepared from the following ingredients in parts by weight: 60-80 parts of alpha,omega-dihydroxyl dimethyl polysiloxane, 12-24 parts of calcium chloride, 30-35 parts of divinyl silicone oil, 10-15 parts of hydrogen-containing silicone oil, 10-20 parts of aluminum oxide, 1-10 parts of nano calcium carbonate, 2-5 parts of methyl-silicone oil, 1-5 parts of methyl fluoride silicone oil, 5-10 parts of a cross-linking agent and 1-5 parts of a catalyst. <0}{0><}0{>The invention also discloses a preparation method of the organosilicon pouring sealant with high curing speed and low wiredrawing capability. <0}{0><}0{>The organosilicon pouring sealant with high curing speed and low wiredrawing capability, which is prepared from the ingredients adopted in the invention, is applied to solar cells, is low in wiredrawing capability, high in intensity, high in tensile strength, short in curing time and high in viscosity, and furthermore is good in fluidity and good in filling effect during a coating process.

Description

A kind of organic silicon potting adhesive of the low wire drawing of quick solidifying and preparation method thereof
Technical field
The present invention relates to a kind of casting glue, the organic silicon potting adhesive of the low wire drawing of a kind of quick solidifying.
Background technology
Though silicone rubber extensively makes at numerous areas because it has high temperature resistant, low temperature resistant, insulation and the excellent properties such as ageing-resistant With, but in building trade, a large amount of room curing silicon rubbers being used as to seal and bond all need addition reinforced filling just to be changed The mechanical property of its pure room curing silicon rubber kind and thixotropic property, thus embody use value.
The organic silicon potting adhesive of the known low wire drawing of quick solidifying is mostly double-component, needs to mix during use, mixed Containing a large amount of bubbles during conjunction, need to wait that the long period just can carry out embedding.
Summary of the invention
Goal of the invention: the organic silicon potting adhesive that the invention reside in the solution low wire drawing of existing quick solidifying is mostly double-component, fills The time-consuming long problem of envelope.
Technical scheme: the present invention provides techniques below scheme: the organic silicon potting adhesive of the low wire drawing of a kind of quick solidifying, by weight Number includes following components: α, alpha, omega-dihydroxy polydimethyl siloxane 60～80 parts, calcium chloride 12～24 parts, double second Thiazolinyl silicone oil 30～35 parts, containing hydrogen silicone oil 10～15 parts, aluminium oxide 10～20 parts, nano-calcium carbonate 1～10 parts, methyl Silicone oil 2～5 parts, fluoromethane silicone oil 1～5 parts, cross-linking agent 5～10 parts and catalyst 1～5 parts.
As optimization, described nano-calcium carbonate particle diameter is not more than 230nm.
As optimization, described catalyst is platinum catalyst.
As optimization, described cross-linking agent be in four butoxy silanes, MTMS and trimethoxy silane extremely The mixture of few two kinds.
The preparation method of the organic silicon potting adhesive of the low wire drawing of a kind of quick solidifying, comprises the following steps:
1) by α, alpha, omega-dihydroxy polydimethyl siloxane, calcium chloride, bi-vinyl silicone oil, nano-calcium carbonate, oxidation Aluminum, methyl-silicone oil and the mixing of fluoromethane silicone oil, then carry out evacuation, redistillation；
2) in step 1) material that obtains adds containing hydrogen silicone oil, catalyst and cross-linking agent, after no longer effervescent, then Secondary carry out evacuation, and distill；
3) at room temperature stand, complete solidification.
As optimization, described step 1) and step 2) in distillation time according to step 1) in put into quality of material summation 120kg/h carries out calculating distillation time.
Beneficial effect: the present invention compared with prior art:
1, solidification can be completed under the organic silicon potting adhesive of one pack system, room temperature, the shortest.
2, the organic silicon potting adhesive intensity of the low wire drawing of quick solidifying that the present invention provides is big, and tensile strength is high, meanwhile, Good fluidity in coating procedure, filling effect is good.
3, use nano-calcium carbonate particle diameter to be not more than 230nm, join with bi-vinyl silicone oil, methyl-silicone oil and fluoromethane silicone oil Close, and add aluminium oxide and nano-calcium carbonate quickening response speed, improve bubble output speed, accelerate solidification progress.
4, use addition α, alpha, omega-dihydroxy polydimethyl siloxane and calcium chloride, reduce its probability producing wire drawing, carry High product quality.
Detailed description of the invention
Embodiment 1
The organic silicon potting adhesive of the low wire drawing of a kind of quick solidifying, includes following components: α by weight, alpha, omega-dihydroxy poly-two Methylsiloxane 60 parts, 12 parts of calcium chloride, bi-vinyl silicone oil 30 parts, containing hydrogen silicone oil 10 parts, aluminium oxide 10 parts, Nano-calcium carbonate 1 part, methyl-silicone oil 2 parts, fluoromethane silicone oil 1 part, cross-linking agent 5 parts and catalyst 1 part.
Described nano-calcium carbonate particle diameter is not more than 230nm.
Described catalyst is platinum catalyst.
Described cross-linking agent is the mixed of at least two in four butoxy silanes, MTMS and trimethoxy silane Compound.
Use the present embodiment proportioning to prepare casting glue and only need 73min, and the organic silicon potting adhesive intensity obtained is big, viscosity Height, wire drawing rate is low.
Embodiment 2
The organic silicon potting adhesive of the low wire drawing of a kind of quick solidifying, includes following components: α by weight, alpha, omega-dihydroxy poly-two Methylsiloxane 80 parts, 24 parts of calcium chloride, bi-vinyl silicone oil 35 parts, containing hydrogen silicone oil 15 parts, aluminium oxide 20 parts, Nano-calcium carbonate 10 parts, methyl-silicone oil 5 parts, fluoromethane silicone oil 5 parts, cross-linking agent 10 parts and catalyst 5 parts.
Described nano-calcium carbonate particle diameter is not more than 230nm.
Described catalyst is platinum catalyst.
Described cross-linking agent is the mixed of at least two in four butoxy silanes, MTMS and trimethoxy silane Compound.
Use the present embodiment proportioning to prepare casting glue and only need 76min, and the organic silicon potting adhesive intensity obtained is big, viscosity High.
Embodiment 3
The organic silicon potting adhesive of the low wire drawing of a kind of quick solidifying, includes following components: α by weight, alpha, omega-dihydroxy poly-two Methylsiloxane 70 parts, 18 parts of calcium chloride, bi-vinyl silicone oil 33 parts, containing hydrogen silicone oil 13 parts, aluminium oxide 15 parts, Nano-calcium carbonate 5 parts, methyl-silicone oil 3 parts, fluoromethane silicone oil 3 parts, cross-linking agent 7 parts and catalyst 3 parts.
Described nano-calcium carbonate particle diameter is not more than 230nm.
Described catalyst is platinum catalyst.
Described cross-linking agent is the mixed of at least two in four butoxy silanes, MTMS and trimethoxy silane Compound.
Use the present embodiment proportioning to prepare casting glue and only need 71min, and the organic silicon potting adhesive intensity obtained is big, viscosity High.
Embodiment 4
The preparation method of the organic silicon potting adhesive of the low wire drawing of a kind of quick solidifying, comprises the following steps:
1) by α, alpha, omega-dihydroxy polydimethyl siloxane, calcium chloride, bi-vinyl silicone oil, nano-calcium carbonate, oxidation Aluminum, methyl-silicone oil and the mixing of fluoromethane silicone oil, then carry out evacuation, redistillation；
2) in step 1) material that obtains adds containing hydrogen silicone oil, catalyst and cross-linking agent, after no longer effervescent, then Secondary carry out evacuation, and distill；
3) at room temperature stand, complete solidification.
Described step 1) and step 2) in distillation time according to step 1) in put into quality of material summation 120kg/h Carry out calculating distillation time.
The thinking of the organic silicon potting adhesive that the invention provides the low wire drawing of a kind of quick solidifying and preparation method thereof and method, specifically The method and the approach that realize this technical scheme are a lot, and the above is only the preferred embodiment of the present invention, it is noted that For those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to make some Improvements and modifications, these improvements and modifications also should be regarded as protection scope of the present invention, each composition the clearest and the most definite in the present embodiment Part all can use prior art to be realized.

Claims (6)

1. the organic silicon potting adhesive of the low wire drawing of quick solidifying, it is characterised in that: include following components by weight: α, alpha, omega-dihydroxy polydimethyl siloxane 60～80 parts, calcium chloride 12～24 parts, bi-vinyl silicone oil 30～35 parts, Containing hydrogen silicone oil 10～15 parts, aluminium oxide 10～20 parts, nano-calcium carbonate 1～10 parts, methyl-silicone oil 2～5 parts, fluoromethane silicon Oil 1～5 part, cross-linking agent 5～10 parts and catalyst 1～5 parts.
The organic silicon potting adhesive of the low wire drawing of quick solidifying the most according to claim 1, it is characterised in that: described nanometer Calcium carbonate particle diameter is not more than 230nm.
The organic silicon potting adhesive of the low wire drawing of quick solidifying the most according to claim 1, it is characterised in that: described catalysis Agent is platinum catalyst.
The organic silicon potting adhesive of the low wire drawing of quick solidifying the most according to claim 1, it is characterised in that: described crosslinking Agent is the mixture of at least two in four butoxy silanes, MTMS and trimethoxy silane.
5. a preparation method for the organic silicon potting adhesive of the low wire drawing of quick solidifying as claimed in claim 1, its feature exists In: comprise the following steps:
1) by α, alpha, omega-dihydroxy polydimethyl siloxane, calcium chloride, bi-vinyl silicone oil, nano-calcium carbonate, oxidation Aluminum, methyl-silicone oil and the mixing of fluoromethane silicone oil, then carry out evacuation, redistillation；
2) in step 1) material that obtains adds containing hydrogen silicone oil, catalyst and cross-linking agent, after no longer effervescent, then Secondary carry out evacuation, and distill；
3) at room temperature stand, complete solidification.
The preparation method of the organic silicon potting adhesive of the low wire drawing of quick solidifying the most according to claim 5, it is characterised in that: Described step 1) and step 2) in distillation time according to step 1) in put into quality of material summation 120kg/h count Calculate distillation time.
CN201610373890.XA 2016-05-31 2016-05-31 {0><}0{>Organosilicon pouring sealant with high curing speed and low wiredrawing capability and preparation method thereof<0} Pending CN105950100A (en)

Priority Applications (1)

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CN201610373890.XA CN105950100A (en) 2016-05-31 2016-05-31 {0><}0{>Organosilicon pouring sealant with high curing speed and low wiredrawing capability and preparation method thereof<0}

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107523260A (en) * 2017-09-08 2017-12-29 北京天山新材料技术有限公司 The double cured silicone compounds of two-component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102558867A (en) * 2011-12-13 2012-07-11 北京海斯迪克新材料有限公司 Low-trailing heat conductive silicone grease composition and preparation method thereof
CN104449547A (en) * 2014-11-25 2015-03-25 广西华纳新材料科技有限公司 single-component dealcoholized and room temperature vulcanized organosilicone pouring sealant for LEDs and preparation method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102558867A (en) * 2011-12-13 2012-07-11 北京海斯迪克新材料有限公司 Low-trailing heat conductive silicone grease composition and preparation method thereof
CN104449547A (en) * 2014-11-25 2015-03-25 广西华纳新材料科技有限公司 single-component dealcoholized and room temperature vulcanized organosilicone pouring sealant for LEDs and preparation method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107523260A (en) * 2017-09-08 2017-12-29 北京天山新材料技术有限公司 The double cured silicone compounds of two-component
CN107523260B (en) * 2017-09-08 2021-05-25 富乐(苏州)新材料有限公司 Two-component dual-cure silicone compound

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Application publication date: 20160921