CN105934692A - Methods for forming antireflection coatings for displays - Google Patents
Methods for forming antireflection coatings for displays Download PDFInfo
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- CN105934692A CN105934692A CN201480074304.0A CN201480074304A CN105934692A CN 105934692 A CN105934692 A CN 105934692A CN 201480074304 A CN201480074304 A CN 201480074304A CN 105934692 A CN105934692 A CN 105934692A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00865—Applying coatings; tinting; colouring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00951—Measuring, controlling or regulating
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/006—Anti-reflective coatings
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Abstract
A display may be provided with display layers. Ambient light reflections may be suppressed by forming antireflection coatings on one or more surfaces of the display layers. An antireflection coating may be formed by depositing alternating high and low index of refraction dielectric layers using a sputtering tool. A controller may control the operation of a spectrometer and the sputtering tool. To ensure that the antireflection coating exhibits a desired color, the controller may direct the sputtering tool or other equipment to deposit a subset of the dielectric layers for the antireflection coating. A spectrum may then be measured with the spectrometer. Based on the measured light spectrum, thickness adjustments or other adjustments may be made to remaining dielectric layers to ensure that the antireflection coating color matches a target color.
Description
Technical field
Present invention relates generally to electronic equipment, and relate more specifically to that there is showing with anti-reflection coating
Show the electronic equipment of device.
Background technology
Electronic equipment generally includes display.Such as, cell phone, computer and television set have display
Device.
The performance of display may by the reflection of ambient light from each layer glass in display not
Profit impact.Such as, in outdoor environment, the image on display may be by the surface from display
Exaggerated reflex and be blurred.In order to solve this problem, usually from display provides anti-reflection coating.
Can come by depositing the dielectric layer with high index of refraction and low-refraction alternately on display surface
Form anti-reflection coating.
The layer thickness inaccuracy of the dielectric layer owing to being deposited, anti-reflection coating usually shows undesirably
Colour cast.This may cause the earning rate when manufacturing the display with anti-reflection coating low.
It is therefore desirable to be able to provide the improvement for forming anti-reflection coating in electronic equipment display
Method.
Summary of the invention
Environment can be suppressed by forming anti-reflection coating on one or more display layers in the display
Luminous reflectance.
Shape can be carried out by the dielectric layer using sputter tool to deposit high index of refraction alternately and low-refraction
Become anti-reflection coating.Controller can control the operation of spectrogrph and sputter tool.
Color of object is shown so that can not had by display display image in order to ensure anti-reflection coating
Less desirable colour cast, controller may indicate that sputter tool or other equipment deposition electricity for anti-reflection coating
The subset of dielectric layer.Then may utilize spectrogrph and carry out measure spectrum.Based on from measured by the subset of layer
Spectrum, can deposit remaining dielectric layer time carry out thickness adjustment or other adjust.Thickness adjusts and helps
In the color matching color of object guaranteeing anti-reflection coating.
Accompanying drawing explanation
Fig. 1 is that the exemplary electronic with the display with anti-reflection coating according to embodiment sets
The perspective view of standby such as laptop computer.
Fig. 2 is that the exemplary electronic with the display with anti-reflection coating according to embodiment sets
The perspective view of standby such as hand-held electronic equipment.
Fig. 3 is that the exemplary electronic with the display with anti-reflection coating according to embodiment sets
The perspective view of standby such as panel computer.
Fig. 4 is that the exemplary electronic with the display with anti-reflection coating according to embodiment sets
Standby such as computer or the perspective view of the display of television set.
Fig. 5 is that the cross-sectional side of the exemplary display with anti-reflection coating according to embodiment regards
Figure.
Fig. 6 is the cross-sectional side view of the exemplary anti-reflection coating according to embodiment.
Fig. 7 is the reflectance spectrum in visible light wave strong point of the exemplary anti-reflection coating according to embodiment
Curve chart.
Fig. 8 show according to embodiment from antireflection layer thickness variation to display color
The color space figure of impact.
Fig. 9 shows two dielectric layers at according to the top adjusting anti-reflection layer of embodiment
The thickness color space figure on the impact of display color.
Figure 10 shows the figure of the equipment that can use according to embodiment when forming anti-reflection layer
Show.
Figure 11 be according to embodiment by the dielectric layer to the top in anti-reflection layer
Individual or multiple dielectric layers carry out dielectric layer thickness adjustment and form relate in anti-reflection layer exemplary
The flow chart of step.
Figure 12 be according to embodiment by the dielectric layer in anti-reflection layer being carried out thickness adjustment and
Form the flow chart of the illustrative steps related in anti-reflection layer.
Detailed description of the invention
Electronic equipment can have display.Can be that display provides the anti-reflection layer being used for suppressing luminous reflectance.
Fig. 1, Fig. 2, Fig. 3 and Fig. 4 show the class can with the display with anti-reflection coating
The example electronic device of type.
The electronic equipment 10 of Fig. 1 has the shape of laptop computer and has upper case 12A and band
There is the lower case 12B of parts such as keyboard 16 and Trackpad 18.Equipment 10 has hinge arrangement 20
(sometimes referred to as shaft coupling socket), to allow upper case 12A relative to lower case 12B in side
Rotate around rotary shaft 24 on 22.Display 14 is installed in shell 12A.Upper case 12A
Sometimes display casing or lid it are referred to alternatively as, should by rotating around rotary shaft 24 towards lower case 12B
Upper case 12A and be placed on make position.
Fig. 2 shows based on handheld device such as cell phone, music player, game station, navigation
The exemplary configuration of the electronic equipment 10 of unit or other compact devices.Such configuration at equipment 10
In, shell 12 have back to front surface and rear surface.Display 14 is installed in shell 12
On front.Display 14 can have outer layer, and this outer layer includes for parts such as button 26 and speaker
The opening of port 28.
In the fig. 3 embodiment, electronic equipment 10 is panel computer.In the electronic equipment 10 of Fig. 3,
Equipment 10 have back to flat front and rear surface.Display 14 is installed in equipment 10
On front surface.As it is shown on figure 3, display 14 can have the opening for accommodating button 26.
Fig. 4 shows the exemplary configuration of electronic equipment 10, wherein equipment 10 be computer display,
There is computer or the television set of integration computer display.Display 14 is installed in equipment 10
Front surface on.In such layout, the shell 12 of equipment 10 may be mounted to that on wall or
Can have optional structure, such as equipment 10 being supported on flat surfaces such as desktop or desk
Support 30.
Display 14 can be that liquid crystal display, organic light emitting diode display, plasma show
Device, electrophoretic display, electric moistening display, the display of use other types Display Technique or include making
With the display of the display structure that these Display Techniques are formed in more than one Display Technique.
Fig. 5 shows the cross-sectional side view of exemplary display.As it is shown in figure 5, display 14
Can have display layer such as display layer 32.The type being included in the layer in display layer 32 depends on being formed
The type of the technology used during display 14.Such as, if display 14 is liquid crystal display, then layer
32 can include backlight, upper polariser and lower polariser and color-filter layer, liquid crystal layer and be inserted in
Tft layer between upper polariser and lower polariser.It is Organic Light Emitting Diode at display 14
In the configuration of display, layer 32 can include layer such as substrate layer, on this layer formed light emitting diode and
The array of thin-film transistor circuit.
Display 14 can include optional cover layer such as display cover layer 34.Display cover layer 34
Can other layers such as display layer 32 in overlaid displays 14, and can help using display 14 and setting
Display layer 32 is protected during standby 10.Display cover layer 34 can by sheet of transparent plastic, transparent glass layer,
Ceramic layer or other clear layers are formed.
Display 14 can have one or more layers anti-reflection coating.Such as, display 14 can have counnter attack
Penetrate layer such as layer 36.Layer 36 can be formed on the surface of the display base plate in display 14.Such as,
Layer 36 can be formed on the upper surface of display cover layer 34 or in other display layer surface one or more
(such as, on one or more surfaces of display layer 32).If it is required, cover layer 34 can be saved,
And other layers in color-filter layer or display layer 32 may act as the outermost layer of display 14 available layer
36 are coated.The configuration of display 14 described the most sometimes as example, in the configuration,
Anti-reflection layer 36 is formed on the outermost layer of display 14, the exemplary display cover layer of such as Fig. 5
On 34.But, this is merely exemplary.Anti-reflection layer 36 can be formed at the layer in display 14
On any suitable surface.
Fig. 6 is the cross-sectional side of the exemplary anti-reflection coating on display layer 64 (such as, layer 34 etc.)
View.As shown in Figure 6, anti-reflection layer 36 can have multiple dielectric layer 36L, such as has corresponding thickness
Degree the dielectric layer L1 of T1, T2, T3, T4, T5, T6, T7, T8 and T9, L2, L3, L4,
L5, L6, L7, L8 and L9.Dielectric layer 36L can have high index of refraction alternately and low-refraction.
Any suitable dielectric substance can be used when cambium layer 36L.Such as, layer 36L can be all by electrolyte
As silicon nitride (refractive index is 1.75) and silicon oxide (refractive index is 1.45) are formed.This exemplary configuration
In silicon nitride layer formed with " low " index layer formed by silicon oxide replace " high " index layer.
In the layout of Fig. 6, such as, layer L1, L3, L5, L7 and L9 can be formed by silicon oxide, and
Layer L2, L4, L6 and L8 can be formed by silicon nitride.If it is required, formed height dielectric stack or
Other kinds of electrolyte can be used when other dielectric layers of anti-reflection coating.Use nitrogen alternately
SiClx and silicon oxide layer form what the anti-reflection coating 36 of Fig. 6 was merely exemplary.
Fig. 7 is the curve chart (reflection of the reflectance spectrum of the exemplary anti-reflection layer of the layer 36 of such as Fig. 6
Rate R is shown the function into optical wavelength).In the embodiment of Fig. 7, from 380nm to 780nm
Inhibitory reflex in the visible wavelength of scope.
Use anti-reflection coating computer model, can count for the dielectric layer 36L of anti-reflection layer 36
Calculate desired thickness.When deposit dielectrics is to form anti-reflection layer 36, these one-tenth-value thickness 1/10s can be used as
Nominal value.Owing to manufacturing change, the actual (real) thickness of sedimentary 36L can be thick slightly offset from its nominal
Degree.The change of these thickness affects the colour cast of anti-reflection layer 36, thus affects the colour cast of display 14.
For example, it is contemplated that have the display of the layer 36 of anti-reflection layer such as Fig. 6.Generally, layer 36 can have
Have five or a more dielectric layer, seven or more dielectric layer, more than eight dielectric layers or its
His an appropriate number of dielectric layer.In the embodiment in fig 6, anti-reflection layer 36 has nine different thickness
The dielectric layer of degree.Fig. 8 is the display of the anti-reflection layer 36 being coated with anti-reflection layer such as Fig. 6
Color space figure.The curve chart of Fig. 8 depicts Lab color space, and represents use color coordinates a*
Color with b*.The expectation for layer 36 and display 14 (" target ") in the embodiment of Fig. 8
Color is represented by color of object TG.This color can be selected by display designer, to avoid display
Device 14 occurs that less desirable rich shade is inclined.
If (that is, refractive index and thickness is not according to its expected value just can to manufacture a layer 36L as expectation
Change), display 14 and layer 36 will be characterized by desired object color TG.But, in reality feelings
In condition, exist may cause layer 36L some deviate its desired characteristic inevitably manufacture change.Example
As, the thickness change in each layer of 36L may cause the change of color, such as Fig. 8 center line L1 ... L9
Shown.As an embodiment, if the thickness of L2 deposition is less by 3% than expected value, then layer 36 He
The gained color of display 14 will be represented by point 38 rather than target color point TG, and the layer L2 deposited
Thickness big 3% will cause layer 36 and display 14 to show by the point in the curve chart of Fig. 8 than expected value
40 colors represented.The thickness change of other layer of 36L is likely to cause layer 36 and the color of display 14
Change according to color of object TG.
In order to overcome these to manufacture change, one or more light can be used during the process of sedimentary 36L
Spectrometry.Then being corrected property can adjust during dielectric deposition operates, to guarantee satisfied antireflection
Layer performance.Utilize a kind of suitable layout, (such as, in deposition five after the subset of sedimentary 36L
After individual or more layer 36L, after deposition seven or more layer 36L, in deposition more than seven
After layer 36L, or after deposition is less than seven layer 36L etc.), the top to anti-reflection coating 36
Two dielectric layer 36L carry out layer thickness adjustment.Utilize the layout that another is suitable, adjust during depositing
Layer one layer of 36L, two-layer or more than two-layer rather than only top two-layer thickness.
Fig. 9 shows can how two, the top (outermost) dielectric layer 36L to anti-reflection layer 36
Thickness T8 and T9 be adjusted guaranteeing that the color of layer 36 accurately mates desired color of object TG
Lab color space figure.For the layout of Fig. 9, Initial deposition layer L1 ... L7.Then light is obtained
Compose to measure the color of the anti-reflection layer 36 that part is formed.The manufacture change of reality will cause display 14
Color according to there is the layer L1 of its nominal thickness just being formed ... intended color during L7 and
Change.As layer L1 ... the result of these changes of L7, if it is desired that come with nominal thickness T8 and T9
Cambium layer L8 and L9, be by the calculating color produced for the stacking made by anti-reflection coating 36
Will deviate from color of object TG.Can be based on from layer L1 ... the spectrum that L7 measures carrys out computation layer L1 ... L7
Manufacture change impact.Such as, defeated as anti-reflection layer model of measured spectroscopic data can be used
Enter with prediction: if layer L8 and L9 of deposition has the nominal thickness of its initial plan, once make,
Anti-reflection layer 36 and display 14 just represent having the point 42 by the color space curve chart of Fig. 9
Color.
In order to determine the suitable thickness for layer L8 and L9, anti-reflection layer model is measurable will be with layer 36
The color being associated.Specifically, anti-reflection coating model can be used for based on measured spectrum and uses layer
The various the most potential thickness of L8 with L9 as input calculate for will deposition L8 and L9 layer after
The final color of the layer 36 produced.This modeled process can be used for identification will be at deposition anti-reflection layer 36
Last two-layer time use thickness adjust Δ T8 and Δ T9, to guarantee that final color does not deviates by target
Color TG.Thickness adjust Δ T8 represent can be used for by the color of layer 36 from point 42 change to point 44 come
Calculating deviation from the nominal thickness T8 of layer L8.Thickness adjusts T9 and represents and can be used for the color of layer 36
The calculating deviation of the nominal thickness T9 from layer L9 of color of object TG it is adjusted to from point 44.Because
The value of Δ T8 and T9 calculated (in this embodiment) before sedimentary L8 and L9, described can
The final color coupling color of object TG of display 14 is guaranteed by the thickness of sedimentary L8 and L9.
If it is required, can (such as, three, the more layers of anti-reflection coating 36 that are adjusted of deposit thickness
Or more layers can have the thickness modified from its nominal value).The embodiment of Fig. 9 is merely exemplary
's.
Figure 10 shows the system diagram of the example devices that can use when depositing anti-reflection layer 36.As
Shown in Figure 10, depositing system 46 can have coating source such as heavy on the surface 62 of substrate 64
The source 58 of long-pending dielectric layer.Substrate 64 can be display layer, such as display cover layer 34 or be used for showing
Show other display layers 32 of device 14.Coating source 58 can be sputter tool or for sinking on surface 62
Other equipment of long-pending dielectric layer, this dielectric layer such as silicon nitride layer, silicon oxide layer or for antireflection
Other dielectric layers 36L of layer 36.
On substrate 64 at one or more times during the process of sedimentary 36, spectrum (example can be collected
As, it is used for the reflectance spectrum of the wave-length coverage of such as visible wavelength), sunk on substrate 64 to characterize
The color of long-pending layer.Such as, light source 48 can launch light 50, and this light 50 is from surface 62 quilt of substrate 64
Reflection as reflection light 52, and controller 56 to may indicate that spectrogrph 54 is measured in wave-length coverage each
The amount of the reflection light 52 of the visible light wave strong point of the exemplary spectrum of wavelength such as Fig. 7.Such as, light source
48 can be the white light source producing white light 50.Spectrogrph 54 can have tunable bandpass filters.Control
Device 56 adjustable tunable optic filter is with between all wavelengths at the curve chart of Fig. 7 or these wavelength suitable
Inswept band filter when between subset.
Once controller 56 have collected spectrum, and controller 56 just can process for heavy on substrate 64
Long-pending material and the spectroscopic data collected, should take anything to correct to determine during subsequent deposition operates
Action.Such as, controller 56 can be implemented nine layers of anti-reflection layer and (or has a layer 36L of varying number
Anti-reflection layer) model.Based on measured spectroscopic data, controller 56 can use anti-reflection layer mould
Type calculates the expectation of some layers in anti-reflection layer 36 and adjusts thickness.Use type shown in Fig. 9
Method, such as controller 56 can determine that new optimal thickness, with from coating source 58 sedimentary L8 and
Use during L9.Then controller 56 may indicate that coating source 58 deposition has the layer of the suitably thickness of adjustment
L8 and L9.
Generally, controller 56 can use spectroscopic data to determine how adjustment sputter tool 58 to substrate
The sputter used when depositing sputter medium 60 on the surface 62 of 64 is arranged.This setting of adjustable is to adjust institute
The refractive index of deposition material and/or the thickness of deposited material.The most sometimes the configuration of thickness adjustment will be carried out
Describe as example, but generally can by utilize controller 56 control source 58 carry out refractive index adjustment,
Thickness adjusts and/or other deposition parameters adjust.
Figure 11 shows and uses the layout combining the type described in Fig. 9 to relate to when forming anti-reflection layer 36
Illustrative steps.
In step 66 place, on substrate 64, deposition is for the initial set of the layer 36L of anti-reflection layer 36.
Quantity in the layer 36L of step 66 place deposition is less than the sum of the layer 36L for anti-reflection layer 36.Example
As, in nine layers of anti-reflection layer design, subset such as the first seven layer of 36L of nine layers can be deposited in step 66 place,
Thus stay other two upper strata (that is, layer L7 and L8) to be deposited a little later.Operation in step 66
Period, the layer 36L of deposition can deposit in the following way: uses controller 56 to indicate coating source 58 to deposit
Each layer in these layers, each layer has the nominal thickness using anti-reflection layer model to calculate.
In step 68 place, in sedimentary L1 ... after L7, controller 56 can use light source 48 and light
The spectral measurement of the light from sedimentary reflection collected by spectrometer 54.Such as, spectrogrph 54 can collect for
The visible reflectance spectrum of sedimentary.
Owing to manufacturing change, the actual value of deposit thickness is incited somebody to action typically will be according to its desired nominal
Some change of thickness.The reality of the layer of deposition during step 66 can be determined by using iterative technique
Deposit thickness (that is, the thickness of the first seven layer of 36L), to change in the layer thickness in anti-reflection layer model
Each layer thickness, until the spectrum that modeled spectral coupling is measured in step 68 place.
In step 72 place, anti-reflection layer model can use the first seven layer of 36L actual deposition thickness and about
The information of desired object color TG calculates thickness T8 and T9 suitable being respectively used to layer L8 and L9
Work as adjusted value.Manufacturing change owing to existing when depositing the first seven layer of 36L, therefore the value of T8 and T9 will somewhat
The nominal value of deviation T8 and T9, this nominal value will occur before any deposition operation anti-reflection layer
During modeling, meter is calculated.Then can use the adjusted value of T8 and T9 after step 74 place deposits two-layer (
This embodiment is L8 and L9).Because during adjustment thickness T8 and T9 compensate for cambium layer L1-L7
The manufacture change existed, so anti-reflection layer 36 will have the color of coupling color of object TG.Can pass through
The spectrum of collecting layer 36 performing passes through-and failure testing (step 76) confirms this point.If layer 36
Color the most as expected, then can obsolete display 14.Otherwise, layer 36 will by test, and
Can be used for the display 14 of electronic equipment 10.
If it is required, spectral measurement can be carried out at the other times during manufacturing the process of layer 36.Example
As, it is not necessary to only carry out single spectral measurement.Such as, spectrum for the first time can be carried out before sedimentary L8
Measure, and second time spectral measurement can be carried out before sedimentary L9.Spectrum for the first time can be used to survey
Amount adjusts the one-tenth-value thickness 1/10 of T8, and second time spectral measurement can be used to tune the one-tenth-value thickness 1/10 of T9.If
Need, spectral measurement three times or more can be carried out, carry out corresponding layer thickness three times or more afterwards
Adjust or other deposition parameters adjust.Also during sedimentary 36L, spectroscopic data can be gathered in way.Example
As, spectroscopic data can be gathered at the one or more points of sedimentary L9 midway, and in real-time adjustment layer
This spectroscopic data is used during the thickness of L9.Figure 12 showing, use such as these technology carry out cambium layer 36
During the flow chart of illustrative steps that relates to.
As shown in Figure 12, coating source 58 can be used to deposit for anti-reflection layer 36 in step 78 place
The one or more complete or layer 36L (Figure 10) of part.
In step 80 place, controller can use spectrogrph 54 to measure the surface 62 from substrate 64
Reflectance spectrum, and characterize the color of deposited dielectric material.
Using the anti-reflection layer model implemented on controller 56, in step 82 place, controller 56 can
Calculate one or more thickness of one or more sedimentary 36 in step 82 place, and can determine that and should adopt
Take what corrective action (such as, the layer deposited afterwards being carried out thickness adjustment etc.).As illustrated by line 84,
Then operation can be looped back to step 78, during this period, can add the one or more of deposition of dielectric materials
During complete or part layer, it is considered to the layer thickness identified during step 82 adjusts and other corrective actions.
The operation of Figure 12 can be continued executing with, until full form stratification 36.Because in deposition for anti-reflection layer 36
Layer 36L process during made real-time adjustment, so coupling is expected by the color that shows of layer 36
Color of object TG.
Above content is merely exemplary, those skilled in the art can be without departing from described embodiment
Scope and spirit in the case of various modification can be adapted.The embodiment above can individually be implemented or can be any
Combination is implemented.
Claims (20)
1. for the method forming anti-reflection coating on the surface of display layer, including:
On the described surface of described display layer, deposition is for the electrolyte of described anti-reflection coating
Layer；
Measure the spectrum of the light reflected from the dielectric layer deposited；And
It is based at least partially on measured spectrum to determine and to be coated with for for described antireflection
At least one dielectric layer thickness that at least one additional dielectric layer of layer is made adjusts.
Method the most according to claim 1, also includes:
By at least one dielectric deposition described to adjusting based on described dielectric layer thickness
And the thickness adjusted.
Method the most according to claim 2, wherein deposits described dielectric layer and includes what deposition replaced
The dielectric layer of high index of refraction and the dielectric layer of low-refraction.
Method the most according to claim 3, wherein deposits described dielectric layer and includes depositing at least seven
Individual dielectric layer.
Method the most according to claim 4, wherein deposition at least one dielectric layer described is included in
Deposited on top the 8th dielectric layer of described seven dielectric layers.
6. the method forming anti-reflection coating on the surface of display base plate, wherein said antireflection
Coating includes that multiple dielectric layer, described method include:
On the described surface of described display base plate, deposition is for the institute of described anti-reflection coating
State the subset of multiple dielectric layer；
Measure the spectrum of the light reflected from the subset deposited of the plurality of dielectric layer；And
Deposited on top in the subset deposited of the plurality of dielectric layer is prevented for described
The other two dielectric layer of reflectance coating.
Method the most according to claim 6, wherein deposits described other two dielectric layer and includes sinking
The long-pending described other two layer with the thickness adjusted based on measured spectrum.
Method the most according to claim 6, wherein deposits the described subset of the plurality of dielectric layer
Dielectric layer and the dielectric layer of low-refraction including deposition high index of refraction alternately.
Method the most according to claim 6, wherein said display base plate includes that electronic equipment shows
Outermost display layer in device, and the described subset wherein depositing the plurality of dielectric layer includes
Sputter tool is utilized to carry out deposit dielectrics.
Method the most according to claim 9, wherein said outermost display layer includes display cover layer,
And the described subset wherein depositing the plurality of dielectric layer includes depositing at least one oxidation
Silicon layer.
11. methods according to claim 9, wherein deposit the described subset of the plurality of dielectric layer
Including silicon oxide layer deposited and silicon nitride layer.
12. methods according to claim 7, wherein deposit the described subset of the plurality of dielectric layer
Including deposition at least five dielectric layer.
13. methods according to claim 7, the described subset wherein depositing the plurality of layer includes sinking
Long-pending seven dielectric layers, and wherein deposit described other two dielectric layer and be included in described seven
Deposited on top the 8th dielectric layer of individual dielectric layer and the 9th dielectric layer.
14. methods according to claim 7, wherein measure described spectrum and include measuring visible spectrum.
15. methods according to claim 7, wherein deposit described other two dielectric layer and include sinking
The long-pending described other two layer being respectively provided with the first thickness and the second thickness, described first thickness and
Described second thickness is adjusted to guarantee that described anti-reflection coating shows coupling color of object
Color.
16. method according to claim 15, wherein deposit the described son of the plurality of dielectric layer
Collection includes dielectric layer and the dielectric layer of low-refraction of deposition high index of refraction alternately.
17. 1 kinds of devices being used for forming anti-reflection coating on a surface of a substrate, including:
Coating source, described coating source deposits for described counnter attack on the described surface of described substrate
Penetrate the dielectric layer of coating；
Spectrogrph, described spectrogrph obtains the described electrolyte on the surface of described substrate
The spectrum of the light of layer reflection；With
Controller, described controller be configured to be based at least partially on described spectrum adjust with
The described dielectric layer being used for described anti-reflection coating is deposited to described base from described coating source
The deposition parameter being associated on the described surface of plate.
18. devices according to claim 17, wherein said coating source includes by described controller control
The sputter tool of system.
19. devices according to claim 18, wherein said sputter tool is configured to use in deposition
When the described dielectric layer of described anti-reflection coating, deposition has high index of refraction alternately and low
The described dielectric layer of refractive index, and wherein said controller is configured to based on described spectrum
Adjust the layer thickness of at least one dielectric layer in described dielectric layer.
20. devices according to claim 18, wherein said sputter tool is configured to use in deposition
When the described dielectric layer of described anti-reflection coating, deposition has high index of refraction alternately and low
The dielectric layer of refractive index, and wherein said controller is configured to adjust based on described spectrum
The layer thickness of two dielectric layers in top in whole described dielectric layer.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2014/016404 WO2015122902A1 (en) | 2014-02-14 | 2014-02-14 | Methods for forming antireflection coatings for displays |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105934692A true CN105934692A (en) | 2016-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480074304.0A Pending CN105934692A (en) | 2014-02-14 | 2014-02-14 | Methods for forming antireflection coatings for displays |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20160102274A (en) |
| CN (1) | CN105934692A (en) |
| WO (1) | WO2015122902A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10288476B2 (en) | 2015-12-21 | 2019-05-14 | Apple Inc. | Ambient light sensor window coatings for electronic devices |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3356523A (en) * | 1964-02-10 | 1967-12-05 | Mc Donnell Douglas Corp | Polystyrene film containing an antireflection coating |
| US20030211755A1 (en) * | 2002-02-21 | 2003-11-13 | Taiwan Semiconductor Manufacturing Company | Adjustment of N and K values in a darc film |
| CN1606705A (en) * | 2001-12-19 | 2005-04-13 | 株式会社尼康 | Film forming device, and production method for optical member |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5326407B2 (en) * | 2008-07-31 | 2013-10-30 | セイコーエプソン株式会社 | Watch cover glass and watch |
-
2014
- 2014-02-14 WO PCT/US2014/016404 patent/WO2015122902A1/en active Application Filing
- 2014-02-14 CN CN201480074304.0A patent/CN105934692A/en active Pending
- 2014-02-14 KR KR1020167019986A patent/KR20160102274A/en not_active Application Discontinuation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3356523A (en) * | 1964-02-10 | 1967-12-05 | Mc Donnell Douglas Corp | Polystyrene film containing an antireflection coating |
| CN1606705A (en) * | 2001-12-19 | 2005-04-13 | 株式会社尼康 | Film forming device, and production method for optical member |
| US20030211755A1 (en) * | 2002-02-21 | 2003-11-13 | Taiwan Semiconductor Manufacturing Company | Adjustment of N and K values in a darc film |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160102274A (en) | 2016-08-29 |
| WO2015122902A1 (en) | 2015-08-20 |
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