CN105916297A - Circuit board spliced board - Google Patents
Circuit board spliced board Download PDFInfo
- Publication number
- CN105916297A CN105916297A CN201610380322.2A CN201610380322A CN105916297A CN 105916297 A CN105916297 A CN 105916297A CN 201610380322 A CN201610380322 A CN 201610380322A CN 105916297 A CN105916297 A CN 105916297A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- technique edges
- printed
- panel
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
Abstract
The invention discloses a circuit board spliced board. The circuit board spliced board comprises circuit boards, technology edges and connection ribs. Each circuit board comprises a substrate and electronic devices fixed on the substrate. Each substrate comprises a first side edge. The technology edges are close to the first edges of the substrates. Each technology edge is provided with a groove for partially accommodating the electronic devices. The electronic devices are arranged at the first side edges, are partially accommodated in the grooves and partially protrude out from the first side edges. The connection ribs are fixed between the technology edges and the first edges. According to the invention, the grooves are formed in the technology edges, and the grooves partially accommodate the electronic devices protruding out from the first side edges of the substrates, so that the distance between the technology edges and the substrates is effectively reduced, the collision between the technology edges and the electronic devices is avoided, the integral structure of the circuit board spliced board is more stable, the utilization rate of the circuit board spliced board is higher, and the efficiency of the circuit board spliced board is improved.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of multiple-printed-panel for circuit board.
Background technology
Circuit board in mobile phone is more and more less at present, and in order to improve the efficiency of circuit board paster technique, generally
Being stitched together by multiple little circuit boards and carry out paster, multiple circuit boards are fixed on the housing being made up of technique edges
In.Under normal circumstances, the electronic device that circuit board protrudes near the marginal existence of technique edges, and in order to prevent
This electronic device collides with technique edges, is not damaged by realizing electronic device and technique edges, needs electronics
Device increases with the distance of technique edges.But, under this kind of structure, due to electronic device and technique edges away from
From increase, the overall dimensions of multiple circuit board and technique edges is caused to strengthen, and then at finite region interior circuit board
The number of splicing reduces, i.e. circuit board splicing is inefficient so that the paster efficiency of circuit board reduces.
Summary of the invention
In view of this, the present invention provides a kind of multiple-printed-panel for circuit board improving circuit board utilization rate.
The present invention provides a kind of multiple-printed-panel for circuit board, and wherein, described multiple-printed-panel for circuit board includes circuit board, technique edges
And dowel;Described circuit board includes substrate and is fixed on the electronic device of substrate, and described substrate includes first
Side;Described technique edges presses close to the first side of described substrate, and described technique edges is provided with electricity described in partial receipt
The groove of sub-device;Described electronic device is positioned at described first side, and described electronic device part asylum is stated
In groove and partly protrude described first side;Described dowel is fixed on described technique edges and described first
Between side.
Wherein, described multiple-printed-panel for circuit board also includes multiple fixing muscle, and the number of described circuit board is multiple, many
Individual described channel plate array is arranged, and the substrate of each described circuit board also includes second side, described second side
Limit and the relative or neighbor setting in described first side, each described fixing muscle is fixed on adjacent two described substrates
Second side between.
Wherein, described technique edges is provided with multiple described groove, multiple described grooves respectively with multiple described circuit
The electronic device of plate is corresponding.
Wherein, the number of described technique edges is two, is the first technique edges extended parallel to each other and respectively
Two technique edges, the plurality of circuit board arranges in two separate ranks, and described first technique edges and described second technique edges lead to
Cross described dowel and fix the two described circuit boards of row respectively.
Wherein, each described circuit board also includes the ground electrode being fixed on described substrate, described ground connection electricity
Pole is positioned on the second side relative with described first side, and described ground electrode part protrudes described second side
Limit, laterally two described circuit boards of arrangement are the most reverse, and described ground electrode mutually staggers.
Wherein, described dowel includes the first end being fixed on described technique edges and is fixed on described first side
The second end, and the broken part between described first end and described second end, described broken part width
Width less than described first end Yu described second end.
Wherein, described first end is positioned at described groove.
Wherein, described technique edges is provided with location division, and described location division is in order to position described circuit board.
Wherein, described first side arranges multiple described electronic device.
Wherein, described technique edges, dowel and substrate are formed integrally with one another.
The multiple-printed-panel for circuit board of the present invention, by arranging groove on described technique edges, described groove part houses
The electronic device that the first side of described substrate protrudes above, so that the distance of technique edges and substrate can have
Effect reduces, and avoids technique edges to collide with electronic device, so that the overall knot of multiple-printed-panel for circuit board
Structure consolidates, and the jigsaw utilization rate of circuit board is higher, thus improves multiple-printed-panel for circuit board efficiency.
Accompanying drawing explanation
In order to be illustrated more clearly that technical scheme, below by use required in embodiment
Accompanying drawing is briefly described, it should be apparent that, the accompanying drawing in describing below is only some enforcements of the present invention
Mode, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of the multiple-printed-panel for circuit board that the present invention provides;
Fig. 2 is the enlarged diagram of the II part of the multiple-printed-panel for circuit board of Fig. 1.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is entered
Row clearly and completely describes.
Refer to Fig. 1 and Fig. 2, a kind of multiple-printed-panel for circuit board 100 that the present invention provides, described multiple-printed-panel for circuit board 100
Including circuit board 10, technique edges 20 and dowel 30.Described circuit board 10 includes substrate 11 and is fixed on
The electronic device 12 of substrate 11.Described substrate 11 includes that first side 111, described electronic device 12 are positioned at
Described first side 111, and exist part the most described first side 111 protrude.Described technique edges 20 pastes
The first side 111 of nearly described substrate 11.Described technique edges 20 is provided with electronic device 12 described in partial receipt
Groove 21.Described dowel 30 is fixed between described technique edges 20 and described first side 111.Can
To be understood by, described circuit board 10 and described technique edges 20 are spliced into splice plate through described dowel 30,
By this splice plate being positioned over SMT (Surface Mount Technology, surface patch assembles) equipment
On carry out quick paster, and then realize multiple circuit board paster simultaneously.Described circuit board 10 can be used alone
In terminal, this terminal can be mobile phone, panel computer or notebook computer etc..
By arranging groove 21 on described technique edges 20, substrate 11 described in described groove 21 partial receipt
The electronic device 12 that first side 111 protrudes above, so that technique edges 20 is permissible with the distance of substrate 11
Effectively reduce, and avoid technique edges 20 to collide with electronic device 12, so that multiple-printed-panel for circuit board
The overall structure of 100 consolidates, and the jigsaw utilization rate of circuit board 10 is higher, thus improves multiple-printed-panel for circuit board effect
Rate.
In present embodiment, described substrate 11 is rigid rectangular plate, and described substrate 11 uses silicones pressure
Cover and form.Arranging Copper Foil on described substrate 11, this Copper Foil forms the trace arrangements of described circuit board 10.Institute
State first side 111 and can be in the side of described substrate 11 length direction.On described first side 111
One described electronic device 12 is set.Described electronic device 12 can be welded on described substrate 11, and with
Copper Foil electrical connection on described substrate 11, so that described electronic device 12 can be through this Copper Foil transmitting-receiving electricity
Signal.Described electronic device 12 can be adapter or switch key or display lamp or induction apparatus etc..
In other embodiments, described electronic device 12 can also be to be adhered to described substrate 11;Described first side
Limit 111 can also be in the side of described substrate 11 width;On described first side 111 all right
Arrange multiple described electronic device 12.
In present embodiment, described technique edges 20 uses and the described identical material of substrate 11.Described technique edges
20 is bar shaped plate.Described technique edges 20 length direction is parallel to the length direction of described first side 111.
One described technique edges 20 can be oppositely arranged with multiple described substrates 11, thus makes full use of described technique
Multiple described circuit board 10 is spliced on limit 20.Multiple described groove 21 is set on described technique edges 20.Described recessed
Groove 21 is arranged at the described technique edges 20 edge near described substrate 11.Described groove 21 shape is according to institute
Depending on stating the profile that electronic device 12 protrudes from described first side 111.The sidewall of described groove 21 and institute
State electronic device 12 and keep certain distance, thus prevent described electronic device 12 from colliding described technique edges 20,
Also protect described electronic device 12 to be not damaged by simultaneously.Certainly, in other embodiments, it is also possible to be one
Individual described technique edges 20 is oppositely arranged with a described substrate 11.
In present embodiment, described dowel 30 includes the first end 31 and the second end 32 being oppositely arranged.Institute
Stating the first end 31 described technique edges 20 of fixing connection, described second end 32 is fixing connects described substrate 11.Tool
Body, described dowel 30 can be to be shaped in described technique edges 20 and described substrate 11.By right
The silicone sheet of one monoblock carries out stamping-out, thus makes described substrate 11, technique edges 20 and dowel 30 1
The splice plate that body is arranged.Thus utilize described dowel 30 to be stable in described technique edges 20 and described circuit board
Between 10, so that the overall structure of described multiple-printed-panel for circuit board 100 consolidates, thus improve the safety of jigsaw
Performance, reduces defect, and improves jigsaw efficiency.In present embodiment, described first end 31 is positioned at technique
The position being isolated with described groove 21 on limit 20, so that the stress loss of described technique edges 20 reduces.
It is understood that after described multiple-printed-panel for circuit board 100 completes paster technique, by interrupting described dowel
30 so that described technique edges 20 and circuit board 10 separate, so that described circuit board 10 can individually be answered
In terminal.In other embodiments, described first end 31 can also is that and is positioned at described groove 21,
So that the length of described first end 31 increases, and then make described dowel 30 easy to break, thus
Described circuit board 10 is more easily separated with described technique edges 20.
Further, described multiple-printed-panel for circuit board 100 also includes multiple fixing muscle 40, the number of described circuit board 10
Mesh is multiple, multiple described circuit board 10 array arrangements, and each described substrate 11 also includes second side 112,
Relative or neighbor described first side 111, described second side 112, each described fixing muscle 40 is fixed on phase
Between the second side 112 of adjacent two described circuit boards 10.
In present embodiment, described substrate 10 includes three described second sides 112.Three described second sides
Limit 112 is connected with head and the tail successively, and constitutes the surrounding of described substrate 10 with described first side 111.Described
Multiple-printed-panel for circuit board 100 includes four described circuit boards 10.The 10 point of two row two row arrangement of four described circuit boards.
Each two transversely arranged described circuit boards 10 are the most rotationally symmetrical.Thus each described circuit board 10
First side 111 is respectively positioned on the outside of array region.Thus facilitate the institute of described technique edges 20 and four arrays
State circuit board 10 to splice.Described multiple-printed-panel for circuit board 100 includes multiple described fixing muscle 40.Described fixing muscle
40 are fixed between the described circuit board of transversely arranged two 10, and described in being fixed on two of longitudinal arrangement
Between circuit board 10.Described fixing muscle 40 can use identical structure with described dowel 30.Described fixing
Muscle 40 is one-body molded with described substrate 11.Thus increase the robust structure of described circuit board 100.Can manage
Solve, after described multiple-printed-panel for circuit board 100 completes paster technique, described fixing muscle 40 is interrupted, thus
Described circuit board 10 is separated from each other with circuit board 10, thus each described circuit board 10 can individually be answered
In terminal.In other embodiments, described multiple-printed-panel for circuit board 100 can also is that 8 or 10 electricity
Road plate array.
Further, described technique edges 20 is provided with multiple described groove 21, multiple described grooves 21 respectively with
The electronic device of multiple described circuit boards 100 is corresponding.In present embodiment, described technique edges 20 is arranged
Two described grooves 21.Two described grooves 21 are relative with the two of longitudinal arrangement described circuit boards 10 respectively,
And house two described electronic devices 12 on longitudinally respectively.Thus described technique edges 20 can be avoided indulging simultaneously
The upwards electronic device 12 of two described circuit boards 10, thus increase the utilization rate of described technique edges 20.
Further, the number of described technique edges 20 is two, is the first technique extended parallel to each other respectively
Limit 20a and the second technique edges 20b, the plurality of circuit board 10 arranges in two separate ranks, described first technique edges 20a
The two described circuit boards of row 10 are fixed respectively through described dowel 30 with described second technique edges 20b.This enforcement
In mode, owing to the first side 111 of each described circuit board 10 is respectively positioned on the outside of array region.Described
First technique edges 20a and described second technique edges 20b can lay respectively at the both sides of this array region, with institute
State first side 111 parallel.Certainly, in other embodiments, described multiple-printed-panel for circuit board can also set
Putting four described technique edges 20, four described technique edges 20 enclose jointly around the plurality of circuit board 10.
Further, each described circuit board 100 also includes the ground electrode 13 being fixed on described substrate 11,
Described ground electrode 13 is positioned on described second side, and exist part relatively with described first side 111 phase
To second side 112 on, laterally two described circuit boards 10 of arrangement are the most reverse, and described ground connection electricity
Mutually stagger in pole 13.In present embodiment, two the described circuit boards 10 utilizing laterally arrangement are rotationally symmetrical
Arranging, so that the second side 112 of two described circuit boards 10 is mutually drawn close, and described ground connection is electric
Pole 13 is positioned at the inner side of described multiple-printed-panel for circuit board 100.Ground electrode on two described circuit boards 10 simultaneously
13 can also mutually stagger, so that two described circuit boards 10 draw closer together.And then make described
The overall dimensions of multiple-printed-panel for circuit board 100 reduces further, and the use space of described multiple-printed-panel for circuit board 100 enters one
Step ground reduces, and improves the SMT paster utilization rate of described multiple-printed-panel for circuit board 100.
Further, described dowel 30 also includes between described first end 31 and described second end 32
Broken part 33, described broken part 33 width is less than the width of described first end 31 with described second end 32.
Described broken part 33 width is utilized to be less than described first end 31 width, and less than described second end 32 width,
Thus described broken part 33 is easy to break.Thus after described multiple-printed-panel for circuit board 100 completes paster technique, institute
State technique edges 20 to be easier to separate with described circuit board 10, and then labour force in the production process of circuit board 10
Reduce, improve production efficiency.Same, described fixing muscle 40 can use identical with described dowel 30
Structure, and then described circuit board 10 is relatively easy to separate with circuit board 10.
Further, described technique edges 20 is provided with location division (not shown), and described location division is in order to described
Circuit board 10 positions.Concrete, described location division can be groove or boss, or through hole, or location
Any location structure such as post.Utilize and described location division is positioned, thus obtain the position of described circuit board 10
Put, such that it is able to precisely carry out paster on described circuit board 10.
The multiple-printed-panel for circuit board of the present invention, by arranging groove on described technique edges, described groove part houses
The electronic device that the first side of described substrate protrudes above, so that the distance of technique edges and substrate can have
Effect reduces, and avoids technique edges to collide with electronic device, so that the overall knot of multiple-printed-panel for circuit board
Structure consolidates, and the jigsaw utilization rate of circuit board is higher, thus improves multiple-printed-panel for circuit board efficiency.
It is above the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For Yuan, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these change
Enter and retouching is also considered as protection scope of the present invention.
Claims (10)
1. a multiple-printed-panel for circuit board, it is characterised in that described multiple-printed-panel for circuit board includes circuit board, technique edges and company
Connect muscle;Described circuit board includes substrate and is fixed on the electronic device of substrate, and described substrate includes first side;
Described technique edges presses close to the first side of described substrate, and described technique edges is provided with electronic device described in partial receipt
Groove;Described electronic device is positioned at described first side, and described electronic device part asylum is stated in groove
And part protrudes described first side;Described dowel be fixed on described technique edges and described first side it
Between.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that described multiple-printed-panel for circuit board also wraps
Including multiple fixing muscle, the number of described circuit board is multiple, and multiple described channel plate arrays are arranged, Mei Yisuo
The substrate stating circuit board also includes second side, and described second side is relative or neighbor with described first side to be set
Putting, each described fixing muscle is fixed between the second side of adjacent two described substrates.
Multiple-printed-panel for circuit board the most according to claim 2, it is characterised in that described technique edges is provided with multiple
Described groove, multiple described grooves are corresponding with the electronic device of multiple described circuit boards respectively.
Multiple-printed-panel for circuit board the most according to claim 3, it is characterised in that the number of described technique edges is
Two, be the first technique edges and the second technique edges extended parallel to each other respectively, and the plurality of circuit board divides two
Row arrangement, described first technique edges and described second technique edges fix two row institutes respectively by described dowel
State circuit board.
Multiple-printed-panel for circuit board the most according to claim 4, it is characterised in that each described circuit board also wraps
Including the ground electrode being fixed on described substrate, described ground electrode is positioned at relative with described first side
On dual side-edge, described ground electrode part protrudes described second side, laterally two described circuit boards of arrangement
Mutually overturn, and described ground electrode mutually staggers.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that described dowel includes fixing
In the first end of described technique edges be fixed on the second end of described first side, and it is positioned at described first end
And the broken part between described second end, described broken part width is less than described first end and described second end
Width.
Multiple-printed-panel for circuit board the most according to claim 6, it is characterised in that described first end is positioned at described
In groove.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that described technique edges is provided with location
Portion, described location division is in order to position described circuit board.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that arrange on described first side
Multiple described electronic devices.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that described technique edges, dowel
It is formed integrally with one another with substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610380322.2A CN105916297A (en) | 2016-05-31 | 2016-05-31 | Circuit board spliced board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610380322.2A CN105916297A (en) | 2016-05-31 | 2016-05-31 | Circuit board spliced board |
Publications (1)
Publication Number | Publication Date |
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CN105916297A true CN105916297A (en) | 2016-08-31 |
Family
ID=56742868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610380322.2A Pending CN105916297A (en) | 2016-05-31 | 2016-05-31 | Circuit board spliced board |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107708301A (en) * | 2017-09-27 | 2018-02-16 | 广东欧珀移动通信有限公司 | A kind of preparation method of circuit board, multiple-printed-panel for circuit board and electronic equipment |
CN110896592A (en) * | 2018-09-12 | 2020-03-20 | 胜宏科技(惠州)股份有限公司 | 3D (three-dimensional) switching type PCB (printed circuit board) and manufacturing method thereof |
CN112203406A (en) * | 2019-07-08 | 2021-01-08 | 相互股份有限公司 | Soft and hard composite circuit board framework manufactured in whole piece mode |
CN114745868A (en) * | 2021-12-29 | 2022-07-12 | 龙南骏亚电子科技有限公司 | Board splicing process and device for circuit board production |
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CN201797652U (en) * | 2010-09-21 | 2011-04-13 | 磊鑫达电子(深圳)有限公司 | Structure for splicing multiple different types of PCB boards |
CN203340424U (en) * | 2013-07-04 | 2013-12-11 | 上海市共进通信技术有限公司 | PCB splicing structure with SIM card holder |
CN104144564A (en) * | 2014-07-25 | 2014-11-12 | 江苏联康电子有限公司 | PCB jointed board |
CN204090276U (en) * | 2014-07-28 | 2015-01-07 | 常州海弘电子有限公司 | There is the pcb board of edge protection structure |
CN204906861U (en) * | 2015-09-15 | 2015-12-23 | 东莞翔国光电科技有限公司 | Four blocks of cell -phone circuit boards ally oneself with shape structure of preapring for an unfavorable turn of events of piece plate |
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2016
- 2016-05-31 CN CN201610380322.2A patent/CN105916297A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN201797652U (en) * | 2010-09-21 | 2011-04-13 | 磊鑫达电子(深圳)有限公司 | Structure for splicing multiple different types of PCB boards |
CN203340424U (en) * | 2013-07-04 | 2013-12-11 | 上海市共进通信技术有限公司 | PCB splicing structure with SIM card holder |
CN104144564A (en) * | 2014-07-25 | 2014-11-12 | 江苏联康电子有限公司 | PCB jointed board |
CN204090276U (en) * | 2014-07-28 | 2015-01-07 | 常州海弘电子有限公司 | There is the pcb board of edge protection structure |
CN204906861U (en) * | 2015-09-15 | 2015-12-23 | 东莞翔国光电科技有限公司 | Four blocks of cell -phone circuit boards ally oneself with shape structure of preapring for an unfavorable turn of events of piece plate |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107708301A (en) * | 2017-09-27 | 2018-02-16 | 广东欧珀移动通信有限公司 | A kind of preparation method of circuit board, multiple-printed-panel for circuit board and electronic equipment |
CN110896592A (en) * | 2018-09-12 | 2020-03-20 | 胜宏科技(惠州)股份有限公司 | 3D (three-dimensional) switching type PCB (printed circuit board) and manufacturing method thereof |
CN112203406A (en) * | 2019-07-08 | 2021-01-08 | 相互股份有限公司 | Soft and hard composite circuit board framework manufactured in whole piece mode |
CN114745868A (en) * | 2021-12-29 | 2022-07-12 | 龙南骏亚电子科技有限公司 | Board splicing process and device for circuit board production |
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