CN105899063A

CN105899063A - Electronic Component Mounting Apparatus And Method

Info

Publication number: CN105899063A
Application number: CN201610087547.9A
Authority: CN
Inventors: 高桥和义; 高桥雅志; 齐藤乐
Original assignee: Juki Corp
Current assignee: Juki Corp
Priority date: 2015-02-16
Filing date: 2016-02-16
Publication date: 2016-08-24
Anticipated expiration: 2036-02-16
Also published as: JP6479497B2; CN105899063B; JP2016152245A

Abstract

The invention provides an electronic component mounting apparatus. The apparatus can be used for managing protruding amount and installing an axial component on a substrate. The apparatus comprises the following components: an electronic component supply device, which is used for supplying the axial component with a lead; a mounting head, which has nozzles capable of hoding the axial component; a mounting head moving device, which is used for ensuring movement of the mounting head in a regulated surface including a component supply position relative to the axial component and an installing position relative to the substrate; a nozzle moving device, which is used for ensuring movements of the nozzles at a regulated direction which is perpendicular to the regulated surface relative to the mounting head; a detection device, which is arranged on the mounting head for detecting the positions of the nozzles at the regulated direction in the initial condition and the positions of the axial component mantained by the nozzles; a calculating part, which is used for calculating protruding amount of the lead protruding from the tip of the nozzle; a correction unit, which is used for outputting a correction amount of the position of the nozzle at the time of holding the axial component based on the calculation of the calculating part at the component supply position.

Description

Electronic component mounting apparatus and electronic component mounting method

Technical field

The present invention relates to a kind of electronic component mounting apparatus and electronic component mounting method.

Background technology

In the manufacturing process of electronic equipment, use the electronics installed by electronic unit to substrate Apparatus for mounting component.As the electronic unit installed to substrate, it is known that lead-type electronic-part, This lead-type electronic-part has the lead-in wire inserted in the hole of substrate.Public affairs in patent documentation 1 Having an example of electronic component mounting apparatus, its length based on lead-in wire is to by wire type electricity The condition that subassembly is installed to substrate determines.Electronic unit is had disclosed in patent documentation 2 One example of automatic insertion machine, it is using a kind of axial members as lead-type electronic-part Install to substrate.So-called axial members, refer to have article body and from article body two The electronic unit of the pair of lead wires that end extends laterally.Pair of lead wires is arranged on same axle.

Patent documentation 1: Japanese Unexamined Patent Publication 2013-162105

Patent documentation 2: Japanese Patent No. 2850388

Axial members is kept by the suction nozzle of mounting head and installs to substrate.Suction nozzle so that lead-in wire Axial members is kept by the mode that a part is protruded from the leading section of suction nozzle, is gone between and inserts Enter to the hole of substrate.In the situation that the bulge quantity of the lead-in wire protruded from the leading section of suction nozzle is bigger Under, thus it is for example possible to due to the elastic deformation of lead-in wire, the interval of pair of lead wires is unable to maintain that as uncommon The size hoped, lead-in wire cannot be inserted in the hole of substrate smoothly.Convex from the leading section of suction nozzle In the case of the bulge quantity of the lead-in wire gone out is less, lead-in wire likely cannot be fully inserted into substrate Hole in.Accordingly, it would be desirable to the bulge quantity of the lead-in wire protruded from the leading section of suction nozzle is managed. On the other hand, in an installation, the axial members of the lead-in wire with various length can be used.Therefore, Wish to use a kind of technology, i.e. though the length change of lead-in wire, it is also possible to before suction nozzle The bulge quantity of the lead-in wire that end is protruded is managed well.

Summary of the invention

The purpose of the mode of the present invention is, it is provided that a kind of can to lead-in wire bulge quantity carry out Management, the electronic component mounting apparatus that axial members is installed well to substrate and electronic unit Installation method.

The 1st mode according to the present invention, it is provided that a kind of electronic component mounting apparatus, this electronics Apparatus for mounting component possesses: electronic part feeder, and the axial members with lead-in wire is entered by it Row supply；Mounting head, it has the suction nozzle that can keep described axial members；Mounting head moves Device, it can make described mounting head comprise and supply from described electronic part feeder Parts supply position that described axial members is relative and with the substrate phase installing described axial members To installation site predetermined surface in move；Suction nozzle mobile device, it can make described suction nozzle phase Described mounting head is moved along the prescribed direction orthogonal with described predetermined surface；Detection device, It is arranged at described mounting head, the position to the described suction nozzle of the described prescribed direction under initial condition The position of the described lead-in wire of the described axial members put and kept by described suction nozzle is detected； Calculating part, its testing result based on described detection device, to convex from the leading section of described suction nozzle The bulge quantity of the described lead-in wire gone out calculates；And correction unit, it is based on described calculating part Result of calculation, exports for described axially by the holding of described suction nozzle at described parts supply position The correcting value of the position of described suction nozzle during parts.

The 1st mode according to the present invention, the position to the suction nozzle of the prescribed direction under initial condition The position of the prescribed direction of the lead-in wire of the axial members put and kept by suction nozzle is detected, base In its testing result, the bulge quantity of the lead-in wire protruded from the leading section of suction nozzle is calculated, base In its result of calculation, export and kept suction during axial members in parts supply position by suction nozzle The correcting value of the prescribed direction position of mouth, therefore by the suction nozzle pair being configured at the position after this correction Axial members keeps, and it is possible to the bulge quantity management of lead-in wire is desired value.Therefore, Axial members can be installed well to substrate.It addition, according to present embodiment, even if drawing The length change of line, it is also possible to the bulge quantity of the lead-in wire protruded from the leading section of suction nozzle well It is managed.

Can be in the 1st mode of the present invention, described correction unit exports described correcting value, with Make described axial members leading section from described suction nozzle when being kept by described suction nozzle Difference between bulge quantity and the aim parameter of the described lead-in wire protruded diminishes.

Thereby, it is possible to make bulge quantity and aim parameter coincide, it is possible to axial members is good to substrate Install well.

Can possess control portion in the 1st mode of the present invention, this control portion is based on from institute State the correcting value of correction unit output, export control signal to described suction nozzle mobile device, so that The described lead-in wire of the described axial members kept by described suction nozzle at described parts supply position Bulge quantity become aim parameter, described suction nozzle is described in after adjusting based on described control signal The position of prescribed direction, protects the described axial members of described electronic part feeder Hold, install to described substrate.

Thereby, it is possible to the lead-in wire of desired bulge quantity is inserted in the hole of substrate, will be axially Parts are installed well to substrate.

Can possess storage part in the 1st mode of the present invention, this storage part to represent by Suction nozzle position data and the expression of the position of the described suction nozzle that described detection device detects are described The wire locations data of the position of lead-in wire store, and described calculating part is based on described suction nozzle position Difference between data and described wire locations data, calculates described bulge quantity.

Thus, the suction nozzle position data that calculating part can be stored based on storage part and lead-in wire position Put the difference between data, successfully calculate bulge quantity.

Can possess: detection unit in the 1st mode of the present invention, it is to by described calculating Whether the bulge quantity of the described lead-in wire that portion calculates is in permissible range judges；And retry Portion, it makes described detection device when being judged to that described bulge quantity is not at described permissible range To based on described correcting value, the described suction nozzle after the position adjustment of described prescribed direction is kept The position of described lead-in wire of described axial members, again detect.

Thus, even if the difference between bulge quantity and the aim parameter of lead-in wire becomes big, it is also possible to will Detection is again performed by detection device under state after this subtractive is little, therefore, it is possible to the most defeated Go out correcting value.

The 2nd mode according to the present invention, it is provided that a kind of electronic component mounting method, this electronics Component mounting method comprises following step: in an initial condition, by the detection being arranged at mounting head The position of suction nozzle is detected by device, and this mounting head can supply with from electronic unit comprising Parts supply position that the axial members of unit feeding is relative and with the substrate installing axial members Moving in the predetermined surface of relative installation site, this suction nozzle is arranged at described mounting head, it is possible to edge The direction orthogonal with described predetermined surface is moved；Under described initial condition, by described detection device The position of the described lead-in wire of the described axial members kept by described suction nozzle is detected；Based on The position of the described suction nozzle detected by described detection device and the position of described lead-in wire, to from institute The bulge quantity of the described lead-in wire stating the leading section protrusion of suction nozzle calculates；Based on the institute calculated State the bulge quantity of lead-in wire, export and kept institute at described parts supply position by described suction nozzle The correcting value of the position of described suction nozzle when stating axial members；Based on described correcting value, in institute State the position by described suction nozzle during the described suction nozzle described axial members of holding at parts supply position Put and be corrected, described suction nozzle described axial members is kept；And will be by described suction The described axial members that mouth keeps is installed to substrate.

The 2nd mode according to the present invention, by by the suction nozzle pair being configured at the position after correction Axial members keeps such that it is able to manage the bulge quantity of lead-in wire for desired value.Therefore, Axial members can be installed well to substrate.It addition, according to present embodiment, even if drawing The length change of line, it is also possible to the bulge quantity of the lead-in wire protruded from the leading section of suction nozzle well It is managed.

The effect of invention

Mode according to the present invention, it is provided that a kind of can to lead-in wire bulge quantity be managed, Electronic component mounting apparatus axial members installed well to substrate and electronic unit are installed Method.

Accompanying drawing explanation

Fig. 1 is the example representing the electronic component mounting apparatus involved by present embodiment Oblique view.

Fig. 2 is the example schematically showing the mounting head involved by present embodiment Figure.

Fig. 3 is the figure of the example representing the electronic unit involved by present embodiment.

Fig. 4 is the example representing the electronic part feeder involved by present embodiment Side view.

Fig. 5 is to represent the lead processing mechanism involved by present embodiment and the one of conveying mechanism The oblique view of individual example.

Fig. 6 is the sectional view of the example representing the conveying mechanism involved by present embodiment.

Fig. 7 is an example whole representing the lead processing mechanism involved by present embodiment Body structure chart.

Fig. 8 is the oblique view wanting portion representing the lead processing mechanism involved by present embodiment.

Fig. 9 is the bowing an of example representing the lead processing mechanism involved by present embodiment View.

Figure 10 is just to represent an example of the lead processing mechanism involved by present embodiment View.

Figure 11 is the decomposition of the part representing the lead processing mechanism involved by present embodiment Oblique view.

Figure 12 is the example representing movable cutting knife and fixed cutting tool involved by present embodiment The figure of son.

Figure 13 is to represent the shaping mould involved by present embodiment and be fixed into an example of pattern The figure of son.

Figure 14 is to represent the shaping mould involved by present embodiment and be fixed into the action of pattern The figure of one example.

Figure 15 is to represent the shaping mould involved by present embodiment and be fixed into the action of pattern The figure of one example.

Figure 16 is the facing an of part representing the lead processing mechanism involved by present embodiment Figure.

Figure 17 is the side view of the example representing the suction nozzle involved by present embodiment.

Figure 18 is the figure observing the suction nozzle involved by present embodiment from below.

Figure 19 is the sectional view of the example representing the suction nozzle involved by present embodiment.

Figure 20 is to represent at the lead-in wire of the electronic part feeder involved by present embodiment Reason mechanism is by the figure of electronic unit supply a to example of the state of suction nozzle.

Figure 21 is the side-looking of the example representing the detection device involved by present embodiment Figure.

Figure 22 is the vertical view of the example representing the detection device involved by present embodiment Figure.

Figure 23 is to represent the detection device position to the leading section of suction nozzle involved by present embodiment Put the schematic diagram of an example of the state detected.

Figure 24 is to represent the detection device axle to being kept involved by present embodiment by suction nozzle The schematic diagram of one example of the state detected to the position of the leading section of the lead-in wire of parts.

Figure 25 is the figure of the example representing axial members.

Figure 26 is to represent the state that the suction nozzle involved by present embodiment maintains axial members The figure of one example.

Figure 27 is the figure of the example representing axial members.

Figure 28 is to represent the state that the suction nozzle involved by present embodiment maintains axial members The figure of one example.

Figure 29 is the functional block representing the example controlling device involved by present embodiment Figure.

Figure 30 is the example representing the electronic component mounting method involved by present embodiment Flow chart.

Figure 31 is to represent that the mobile suction nozzle to elemental height maintains electronic part feeder The figure of the state of axial members.

Figure 32 is between the height of the leading section of the height of the leading section representing suction nozzle and lead-in wire The schematic diagram of relation.

Figure 33 is to represent the suction nozzle axial members to electronic part feeder in installation process Carry out the figure of the state kept.

The explanation of label

10 detection devices

30 suction nozzles

100 electronic component mounting apparatus

106 mounting heads

107 mounting head mobile devices

120 control device

122 calculating parts

123 correction units

124 control portions

125 storage parts

126 detection units

127 retry portion

140 suction nozzle mobile devices

200 electronic part feeders

C axial members

L goes between

P substrate

PJa parts supply position

PJb installation site

Detailed description of the invention

Below, referring to the drawings, embodiment involved in the present invention is illustrated, but this Invention is not limited to this.The structural element of embodiment described below can suitable group Close.The most do not use the structural element of a part.

In the following description, set the orthogonal coordinate system of XYZ, orthogonal with reference to this XYZ Coordinate system the position relationship in each portion is illustrated.By parallel with the 1st axle in predetermined surface Direction is set to X-direction (the 1st direction of principal axis), in predetermined surface will with and the 1st axle orthogonal The parallel direction of the 2nd axle be set to Y direction (the 2nd direction of principal axis), will with and the 1st axle And the 2nd the parallel direction of the most orthogonal the 3rd axle of axle be set to Z-direction (the 3rd direction of principal axis). Direction of rotation (incline direction) centered by the 1st axle (X-axis) is set to θ X-direction, Direction of rotation (incline direction) centered by the 2nd axle (Y-axis) is set to θ Y-direction, Direction of rotation (incline direction) centered by the 3rd axle (Z axis) is set to θ Z-direction. Predetermined surface is X/Y plane.In the present embodiment, it is stipulated that face is set to and plane-parallel.Z Direction of principal axis is the direction orthogonal with predetermined surface.In the present embodiment, Z-direction is vertical side To (above-below direction).

[summary of electronic component mounting apparatus]

Fig. 1 is represent electronic component mounting apparatus 100 involved by present embodiment one The oblique view of example.As it is shown in figure 1, electronic component mounting apparatus 100 possesses: pedestal 114； Electronic part feeder 200, it supplies electronic unit C；Setting unit 102, it is used for setting Put electronic part feeder 200；Substrate transfer apparatus 103, substrate P is carried by it； Substrate clamp system 104, it is arranged at the transport path of substrate transfer apparatus 103, to substrate P keeps；Mounting head 106, it has the suction nozzle 30 that can keep electronic unit C；Peace Dress head moving device 107, it can make mounting head 106 move in X/Y plane；Suction nozzle moves Dynamic device 140, it is arranged at mounting head 106, it is possible to make suction nozzle 30 relative to mounting head 106 And move along Z-direction and θ Z-direction；Detecting device 10, it is arranged at mounting head 106, The position of the suction nozzle 30 of Z-direction is detected；And controlling device 120, it is to electricity Subassembly erecting device 100 is controlled.

Electronic part feeder 200 also referred to as feeder.Setting unit 102 also referred to as supply Device receptacle.Setting unit 102, substrate transfer apparatus 103, substrate clamp system 104, peace Dress 106 and mounting head mobile device 107 etc. are supported by pedestal 114.

[substrate transfer apparatus]

Substrate transfer apparatus 103 has: base plate 400；And carry strap, it is at base plate The top of 400 can carrying substrate P.In the present embodiment, substrate P is filled by board carrying The carry strap putting 103 is carried along X-direction.Substrate clamp system 104 fills at board carrying Put in the transport path of 103 and substrate P is kept.Substrate clamp system 104 is by Y-axis The both ends clamping of the substrate P in direction.

Substrate P is fixed on the installation site of installation process to be implemented by substrate clamp system 104 PJb.Installation site PJb is the installation process that electronic unit C installs to substrate P to be carried out Position.Installation site PJb comprises the position that the substrate P mounted with electronic unit C is relative Put.

Electronic component mounting apparatus 100 has support pin 300, and this support pin 300 is to by substrate The back side of the substrate P that clamp system 104 keeps is supported.Support pin 300 and be supported in base Seat board 400.Utilize and support pin 300, the flexure of suppression substrate P.

[mounting head]

Mounting head 106 by the electronic unit C that supplies from electronic part feeder 200 to by The front of the substrate P that substrate clamp system 104 keeps is installed.Mounting head 106 can be at bag Containing implementing the parts supply position PJa that parts supply processes and the installation position implementing installation process Put PJb to move in interior X/Y plane.Parts supply position PJa is to implement electronic unit C supplies the position of the parts supply process to mounting head 106 from electronic part feeder 200 Put.Parts supply position PJa comprises at least some of phase with electronic part feeder 200 To position, comprise relative with the electronic unit C supplied from electronic part feeder 200 Position.

Mounting head mobile device 107 makes mounting head 106 above substrate P and electronic unit The top of feedway 200 is moved.Mounting head mobile device 107 can make mounting head 106 Supply at the parts relative for electronic unit C comprised with supply from electronic part feeder 200 To including position PJa and installation site PJb relative with the substrate P installing electronic unit C X/Y plane in move.By mounting head mobile device 107 realize mounting head 106 can Dynamic scope, comprises the operating area of mounting head 106.Work by mounting head mobile device 107 Make, it is possible to make mounting head 106 move in X/Y plane.

Mounting head mobile device 107 possesses: X-axis guide rail 107a, and it guides along X-direction Mounting head 106；Y-axis guide rail 107b, it guides X-axis guide rail 107a along Y direction；X Drive division 109, it produces the power for making mounting head 106 move along X-direction；And Y drive division 110, it produces the power for making mounting head 106 move along Y direction.

In the present embodiment, mounting head 106 is supported by X-axis guide rail 107a.X drive division 109 actuators comprising such as motor, produce for making by X-axis guide rail 107a support The power that mounting head 106 moves along X-direction.By the work of X drive division 109, peace Dress 106 is while being moved by X-axis guide rail 107a guiding, an edge X-direction.

X-axis guide rail 107a is supported by Y-axis guide rail 107b.Y drive division 110 comprises such as The actuator of motor, produces for making the X-axis guide rail 107a supported by Y-axis guide rail 107b The power moved along Y direction.By the work of Y drive division 110, X-axis guide rail 107a While being moved by Y-axis guide rail 107b guiding, an edge Y direction.If X is guide rail 107a Move along Y direction, then the mounting head 106 supported by this X guide rail 107a is led with X-axis Rail 107a moves along Y direction together.In the present embodiment, Y drive division 110 via X-axis guide rail 107a, makes mounting head 106 move along Y direction.

Fig. 2 is the example schematically showing the mounting head 106 involved by present embodiment The figure of son.Mounting head 106 has the suction nozzle 30 detachably keeping electronic unit C.Peace Dress 106 can move, so that suction nozzle 30 is respectively arranged at parts in X/Y plane Supply position PJa and installation site PJb.Mounting head 106 utilizes suction nozzle 30 to from the ministry of electronics industry The electronic unit C of part feedway 200 supply carries out keeping and installs to substrate P.

Suction nozzle 30, at the PJa of parts supply position, supplies from electronic part feeder 200 The electronic unit C given keeps.Suction nozzle 30 keeps electronics at the PJa of parts supply position After parts C, it is carried to installation site PJb, installs to substrate P.At installation site PJb By electronic unit C after substrate P is installed, electronic unit C is decontroled by suction nozzle 30.Thus, Electronic unit C is mounted to substrate P.

Mounting head 106 can support suction nozzle 30 movably along Z-direction and θ Z-direction.Peace Dress 106 has the suction nozzle that suction nozzle 30 can be made to move along Z-direction and θ Z-direction and moves Device 140.Suction nozzle mobile device 140 comprises: Z drive division 150, and it makes suction nozzle 30 along Z Direction of principal axis moves；And θ Z drive division 160, it makes suction nozzle 30 move (rotation along θ Z-direction Turn).Z drive division 150 comprises the actuator of such as motor, produces and is used for making suction nozzle 30 The power moved along Z-direction.θ Z drive division 160 comprises the actuator of such as motor, Produce the power for making suction nozzle 30 move along θ Z-direction.

I.e., in the present embodiment, suction nozzle 30 utilizes mounting head mobile device 107 and arranges Suction nozzle mobile device 140 in mounting head 106, it is possible to along X-axis, Y-axis, Z axis and θ Z These 4 directions move.Additionally, suction nozzle 30 can also along X-axis, Y-axis, Z axis, θ X, These 6 directions of θ Y and θ Z move.

Mounting head 106 possesses: head photographing unit 170, and it can obtain the view data of object； Range sensor 180, its to and relative object between distance detect；And detection Device 10, the position of the suction nozzle 30 of Z-direction is detected by it.By making mounting head 106 move, so that head photographing unit 170, range sensor 180 and detection device 10 Move together with mounting head 106.

Head photographing unit 170 can obtain the figure of the view data of electronic unit C, substrate P As data and the view data of the electronic unit C being installed on substrate P.Head photographing unit 170 The view data of electronic unit C can be obtained at the PJa of parts supply position.Head is taken a picture Machine 170 can obtain the view data of substrate P at installation site PJb and be installed on substrate The view data of the electronic unit C of P.Based on the view data obtained by head photographing unit 170, Relative position, substrate P to the electronic unit C of X-direction and Y direction and suction nozzle 30 Position relative with suction nozzle 30 and substrate P are adjusted with the relative position of electronic unit C.

Range sensor 180 is to the position of the electronic unit C of Z-direction and the position of substrate P Put and detect.Range sensor 180 to electronic unit C and substrate P irradiating and detecting light, The detection light reflecting this electronic unit C and substrate P carries out light, thus to Z-direction The position of electronic unit C and the position of substrate P detect.Based on range sensor 180 Testing result, relative position, the substrate to the electronic unit C of Z-direction and suction nozzle 30 P position relative with suction nozzle 30 and substrate P are adjusted with the relative position of electronic unit C Whole.

Detection device 10 to the position of the suction nozzle 30 of Z-direction and is kept by suction nozzle 30 The position of electronic unit C is detected.Detection device 10 comprises line sensor.Detection device 10 are supported by the frame parts 11 of the bottom being arranged at mounting head 106.Detection device 10 has Have: light source 12, its injection detection light；And photo detector 13, it can be to from light source 12 At least some of light of the detection light of injection.In the present embodiment, make as detection light Use laser.Light source 12 comprises the light-emitting component that can penetrate laser.Photo detector 13 is configured at The position relative with light source 12.The position of the light source 12 of Z-direction and photo detector 13 Position is substantially the same.Detection device 10 is to suction nozzle 30 irradiating and detecting light, to Z-direction The position of suction nozzle 30 detect.Detection device 10 is to the ministry of electronics industry kept by suction nozzle 30 Part C irradiating and detecting light, detects the position of the electronic unit C of Z-direction.

[electronic unit]

Fig. 3 is the figure of the example representing the electronic unit C involved by present embodiment. In the present embodiment, electronic unit C is axial members C with lead-in wire C.Axial part Part C has: article body M；And pair of lead wires L, they are from the two of article body M End extends laterally.Pair of lead wires L is arranged on same axle.In the following description, Electronic unit C is properly termed as axial members C.

Axial members C is held in holding band T.Keep band T that the leading section of lead-in wire L is carried out Keep.Keep band T comprise the side that the L that goes between side keeps holding band T, And the holding band T of opposite side that the L that goes between opposite side keeps.By being kept band T The multiple axial members C component parts union body K kept.Axial members C is along keeping band T Length direction arrange multiple.

[electronic part feeder]

Axial members C is supplied by electronic part feeder 200.Electronic unit supplies Device 200 is arranged at setting unit 102.Additionally, in fig. 1 it is illustrated that go out 1 electronic unit Feedway 200.Multiple electronic part feeders 200 can be arranged at setting unit 102.

Fig. 4 is represent electronic part feeder 200 involved by present embodiment one The side view of example.Electronic part feeder 200 possesses: framework 210；Tep reel maintaining part 220, it is supported by framework 210, keeps the tep reel R being rolled into by parts union body K； Transport path 211, its parts union body K to extracting out from the tep reel R of tep reel maintaining part 220 Carry；Lead processing mechanism 230, it implements to keep from tep reel via transport path 211 The cut-out of the lead-in wire L of axial members C of the parts union body K of portion 220 supply and molding； Conveying mechanism 260, parts union body K is delivered to lead processing along transport path 211 by it Mechanism 230；And discharge path 212, its will be cut off by lead processing mechanism 230 after draw The leading section of line L and carrying at the holding band T accompanying by the leading section of this lead-in wire L.

Framework 210 comprises pair of side plates.It addition, framework 210 has positioning convex 213.Profit With positioning convex 213, carry out the location relative to setting unit 102.

Tep reel maintaining part 220 has the support shaft 221 being supported tep reel R.Tep reel is protected Hold portion 220 and can pivotally support tep reel R.

The parts union body K being wound in tep reel R is delivered to lead processing by conveying mechanism 260 Mechanism 230.Parts union body K is handled upside down along transport path 211.

The leading section of lead-in wire L is cut off by lead processing mechanism 230, will with article body M even The lead-in wire L bending connect.By the leading section of lead-in wire L is cut off, thus by before lead-in wire L End and the holding band T accompanying by the leading section of this lead-in wire L from article body M separate. Leading section and the holding band T of lead-in wire L are discharged via discharge path 212.

Parts supply position PJa comprises the position relative with lead processing mechanism 230.Electronics Assembly supply device 200 will be processed by lead processing mechanism 230 after electronic unit C to shifting The suction nozzle 30 moving the top to lead processing mechanism 230 supplies.

[conveying mechanism]

Fig. 5 is to represent the lead processing mechanism 230 involved by present embodiment and conveying mechanism The oblique view of one example of 260.Fig. 6 is to represent the conveying mechanism involved by present embodiment The sectional view of one example of 260.

In the following description, direction parts union body K carried by conveying mechanism 260 It is properly termed as conveyance direction downstream side, by the direction contrary with conveyance direction downstream side suitably It is referred to as conveying direction upstream side.

Conveying mechanism 260 possesses: cylinder 261, and it produces for by defeated for parts union body K The power sent；Base 262, cylinder 261 is supported by it；Transport platform 264, it can Guided by sliding guide portion 263, back and forth move along conveying direction relative to base 262 Dynamic；Conveying arm 265, it is arranged at transport platform 264；Keep band roller 266 and keep band to guide Portion 267, they are arranged at transport platform 264, draw the holding band T of parts union body K Lead；Arm of ratchet 268, it links with conveying arm 265；Retainer 269, it is to conveying mechanism The conveying stroke of 260 specifies；And release lever 270, there is conveying arm 265 in it Forcibly parts union body K is decontroled from conveying arm 265 when carrying bad.

The cylinder main body of cylinder 261 is fixed on base 262.The plunger portion of cylinder 261 and conveying Platform 264 links.Transport platform 264 has abutting plate 264a.If, with cylinder 261 by defeated Send platform 264 to move to conveyance direction downstream side, then abut plate 264a and contact with retainer 269. Thus, the conveying stroke of the conveying mechanism 260 of conveyance direction downstream side is prescribed.

Retainer 269 is fixed on base 262.The position of the retainer 269 of conveying direction can Adjust.By the position of retainer 269 is adjusted, thus defeated to conveying mechanism 260 Journey of seeing off is adjusted.The conveying stroke of conveying mechanism 260 is adjusted to, with parts union body The interval of multiple axial members C of K is consistent.

Conveying arm 265 links with transport platform 264 via rotary shaft 271.Conveying arm 265 Being supported by rotary shaft 271, thus the leading section of the conveying arm 265 of conveyance direction downstream side can Swing along the vertical direction.

Arm of ratchet 268 links with framework 210 via rotary shaft 272.Arm of ratchet 268 by Rotary shaft 272 supports, and thus the leading section of the arm of ratchet 268 of conveying direction upstream side can edge Above-below direction swings.

Conveying arm 265 has the multiple conveying tooth 265a being arranged at conveying direction.Arm of ratchet 268 There are the multiple conveying tooth 268a being arranged at conveying direction.In the carrying of parts union body K, The lead-in wire L of axial members C is configured at conveying tooth 265a and conveying tooth 268a.

Conveying tooth 265a and conveying tooth 268a is respectively facing conveyance direction downstream side, has and Z The vertical that axle is almost parallel and the inclined plane towards conveyance direction downstream side inclination.By portion Part union body K is when conveyance direction downstream side carries, and the lead-in wire L of parts union body K is with defeated The inclined plane sending tooth 265a contacts.At the shape that the inclined plane of lead-in wire L with conveying tooth 265a contacts Under state, parts union body K moves to conveyance direction downstream side, thus before conveying arm 265 End is moved upward.Similarly, by defeated to conveyance direction downstream side for parts union body K When sending, lead-in wire L contacts with the inclined plane of conveying tooth 268a.At lead-in wire L and conveying tooth 268a Inclined plane contact state under, parts union body K moves to conveyance direction downstream side, by The leading section of this arm of ratchet 268 is moved upward.Thus, parts union body K can be smooth Ground is mobile.

When conveying arm 265 moves to conveying direction upstream side via transport platform 264, conveying The inclined plane of the conveying tooth 265a of arm 265 is boosted by the lead-in wire L of parts union body K, conveying The leading section of arm 265 is moved upward.On the other hand, the lead-in wire L of parts union body K and The vertical contact of the conveying tooth 268a of arm of ratchet 268, therefore parts union body K is to conveying Direction upstream side moves and is restricted.As previously discussed, by utilizing the work of cylinder 261 Transport platform 264 is made to move back and forth such that it is able to make parts union body K with 1 time Conveying path increment moves to conveyance direction downstream side.

Release lever 270 links with transport platform 264 via rotary shaft 273.At release lever 270 Place has pin 270a, and this pin 270a inserts in the elongated hole 265b be formed at conveying arm 265. By the leading section of release lever 270 is operated, thus the leading section of conveying arm 265 via Pin 270a is moved upward.Thus, conveying tooth 265a and the lead-in wire L of parts union body K Engagement be released from.

[lead processing mechanism]

Fig. 7 is the example representing the lead processing mechanism 230 involved by present embodiment Overall structure figure.Fig. 8 is to represent the lead processing mechanism 230 involved by present embodiment The oblique view wanting portion.Fig. 9 is the top view of the example representing lead processing mechanism 230. Figure 10 is just to represent an example of the lead processing mechanism 230 involved by present embodiment View.Figure 11 is the part representing the lead processing mechanism 230 involved by present embodiment Exploded perspective view.

As shown in Fig. 7 to Figure 11, lead processing mechanism 230 possesses: side of sidewall portion 231, its Comprise fixed cutting tool 234 and be fixed into pattern 235；Movable cutting knife 232, it is arranged at sidewall The outside in portion 231；Shaping mould 233, it is arranged at the inner side of side of sidewall portion 231；Framework 239, It is to movable cutting knife 232, fixed cutting tool 234, shaping mould 233 and is fixed into pattern 235 and enters Row keeps；And actuating mechanism 250, it can make movable cutting knife 232 and shaping mould 233 edge Above-below direction moves.

Fixed cutting tool 234 and movable cutting knife 232 is utilized to be cut off by lead-in wire L.Movable cutting knife 232 There is the blade cut off by lead-in wire L.Utilization is fixed into pattern 235 and shaping mould 233 will draw Line L bends.Shaping mould 233 has the forming part of lead-in wire L bending.

Fixed cutting tool 234 is supported by cutting knife holding frame 236, and this cutting knife holding frame 236 has The guiding groove 236a that movable cutting knife 232 is guided along the vertical direction.It is fixed into pattern 235 Being supported by mould holding frame 237, this mould holding frame 237 has by shaping mould 233 along the vertical direction The guiding groove 237a guided.Cutting knife holding frame 236 and mould holding frame 237 are via bar 238 Link.

Fixed cutting tool 234 has lead-in wire introduction part 234a accepting lead-in wire L.It is fixed into pattern 235 have lead-in wire introduction part 235a accepting lead-in wire L.Lead-in wire introduction part 234a and lead-in wire are led Enter portion 235a, towards conveying direction upstream side, there is opening.The portion carried by conveying mechanism 260 The lead-in wire L of initial axial members C of part union body K is inserted into lead-in wire introduction part 234a And lead-in wire introduction part 235a.

Figure 12 is to represent the movable cutting knife 232 involved by present embodiment and fixed cutting tool 234 The figure of an example.As shown in figure 12, movable cutting knife 232 has blade 232a.Fixing Cutting knife 234 has the blade 234b being arranged at lead-in wire introduction part 234a.Movable cutting knife 232 energy Enough move along the vertical direction relative to fixed cutting tool 234.By being inserted into lead-in wire at lead-in wire L Under the state of introduction part 234a, movable cutting knife 232 rises, thus by the leading section of lead-in wire L Cut off.

Figure 13 is to represent the shaping mould 233 involved by present embodiment and be fixed into pattern 235 The figure of an example.As shown in figure 13, it is fixed into pattern 235 and has: relief portion 235b, It is arranged at the lower edge of lead-in wire introduction part 235a；Recess 235d, it is arranged at lead-in wire and imports The rising wood of portion 235a；And guiding groove 235c, it is connected with recess 235d.

Figure 14 and Figure 15 is to represent the shaping mould 233 involved by present embodiment and be fixed into The figure of one example of the action of pattern 235.As shown in figure 14, it is inserted into draws at lead-in wire L Under the state of line introduction part 235a, shaping mould 233 rises, thus as shown in figure 15, to draw The mode that the leading section of line L is moved downwards will lead-in wire L bending.Lead-in wire L's after bending Leading section is configured at relief portion 235b.It addition, a part of the lead-in wire L after Wan Zhe is configured at Guiding groove 235c.

Actuating mechanism 250 possesses: cylinder 251；Base body 252, it is fixed on framework 210, Cylinder 251 is kept；Drive rod 253, one part can be supported in pedestal rotationally Body 252, a part links with the plunger of cylinder 251；Crank 254, it can rotate twelve Earthly Branches Support in mould holding frame 237；Connecting rod 255, drive rod 253 and crank 254 are linked by it； Drive shaft 256, its through hole 232b being inserted into movable cutting knife 232 and shaping mould 233 Through hole 233b (with reference to Figure 11), is held in crank 254；And retainer 257, it sets It is placed in base body 252, the stroke of the plunger of cylinder 251 is limited.

If the plunger work of cylinder 251, then connecting rod 255 advances via drive rod 253, Crank 254 rotates.Thus, drive shaft 256 is moved upward, with drive shaft 256 link Movable cutting knife 232 and shaping mould 233 rise.Thus, cut-out and the bending of lead-in wire L are implemented Molding.

Figure 16 is the front view of the part representing lead processing mechanism 230.Such as Figure 16 institute Showing, the upper end of movable cutting knife 232 is configured at the position higher than the upper end of shaping mould 233. Thus, if cylinder 251 works, then movable cutting knife 232 first arrives compared with shaping mould 233 The lead-in wire L of axial members C, utilize shaping mould 233 carry out go between L bending forming it The front cut-out implementing lead-in wire L.

Retainer 257 can adjust the position of conveying direction.Thus, the post to cylinder 251 The stroke of plug is adjusted, to the movable cutting knife 232 of rising and up to reaching of shaping mould 233 Point is adjusted.

[suction nozzle]

Below, with reference to Figure 17 to Figure 19, the suction nozzle 30 involved by present embodiment is carried out Explanation.Figure 17 is the side view of the example representing the suction nozzle 30 involved by present embodiment. Figure 18 is the figure observing the suction nozzle 30 involved by present embodiment from below.Figure 19 is to represent The sectional view of one example of the suction nozzle 30 involved by present embodiment.

As noted above, suction nozzle 30 can be relative to mounting head 106 along Z-direction and θ Z Direction is moved.

Suction nozzle 30 possesses: main part 31；A pair arm 32, they are arranged at main part 31 Bottom, it is possible to keep axial members C；Plunger part 33, it can be along the vertical direction It is supported in main part 31 movably, by arm 32, the holding of axial members C will be released； Back-moving spring 34, it is configured at the inner side of main part 31, produces and make plunger part 33 upwards The power of Fang Yidong；And piston rod 35, it is configured at the inner side of main part 31, and generation is used for Make the power that plunger part 33 moves downwards.

Arm 32 is set to extend downwards from main part 31.Arm 32 has side of sidewall portion 36. Pair of sidewalls portion 36 is relative.Medial surface at side of sidewall portion 36 is formed and accepts axial members C The guiding groove 37 of lead-in wire L.Guiding groove 37 is vertically extending.The arm 32 of side The inner face of guiding groove 37 and opposite side arm 32 guiding groove 37 inner face between away from From W, less than the distance between the lead-in wire L and the lead-in wire L of opposite side of the side after bending.

It addition, arm 32 has when maintaining axial members C relative with axial members C Opposite face 32a.Opposite face 32a does not contacts with axial members C, across gap and axial part Part C is relative.

Plunger part 33 is moved downwards by the work of piston rod 35.Pass through plunger portion Part 33 moves downwards, thus is configured at by plunger part 33 between a pair arm 32.Logical The lower section to opposite face 32a is at least moved in the bottom crossing plunger part 33, thus will be by arm Article body M that portion 32 keeps presses downwards.Thus, will be by arm 32 to axial part The holding of part C releases.

Back-moving spring 34 produces the power making plunger part 33 be moved upward.At piston rod 35 In the case of idle, back-moving spring 34 applies power to plunger part 33, so that by plunger The bottom of parts 33 is configured at the top of opposite face 32a.

Figure 20 is to represent electronic unit C from the lead processing of electronic part feeder 200 Mechanism 230 supplies the figure of an example of the state to suction nozzle 30.As shown in figure 20, suction nozzle 30 move the parts supply position PJa to electronic part feeder 200.By suction nozzle 30 Decline, thus axial members C is kept by suction nozzle 30.That is, if suction nozzle 30 declines, Then the lead-in wire L of axial members C is inserted into the guiding groove 37 of arm 32.A pair guiding groove 37 Distance W be slightly smaller than the distance of pair of lead wires L, therefore arm 32 can stably holding shaft To parts C.

When axial members C is kept by arm 32, the opposite face 32a of arm 32 Relative with axial members C across gap.

It addition, suction nozzle 30 is so that the lead-in wire L of axial members C is from the leading section of side of sidewall portion 36 The mode that (bottom) 36a protrudes downwards keeps axial members C.In the present embodiment, By lead-in wire L in the way of the leading section 36a of suction nozzle 30 is according to the bulge quantity H protrusion of regulation, By suction nozzle 30, axial members C is kept.

[detection device]

Below, the detection device 10 involved by present embodiment is illustrated.Figure 21 is The side view of one example of the detection device 10 involved by expression present embodiment.Figure 22 It it is the top view of the example representing the detection device 10 involved by present embodiment.

Detection device 10 is arranged at mounting head 106, it is possible to the suction nozzle 30 of Z-direction Position and the position of the lead-in wire L of the Z-direction of axial members C kept by suction nozzle 30 are entered Row detection.Detection device 10 is fixed on mounting head 106.Mounting head 106 and comprise light source 12 And the relative invariant position that photo detector 13 is between interior detection device 10.On the other hand, Suction nozzle 30 can move along Z-direction relative to mounting head 106.Mounting head 106 and suction nozzle The relative change in location of the Z-direction between 30.Similarly, mounting head 106 and by suction nozzle The relative change in location of the Z-direction between 30 axial members C kept.Detection device 10 Suction nozzle 30 can be detected relative to the position of the Z-direction of mounting head 106.Detection Device 10 can be to the lead-in wire L of axial members C kept by suction nozzle 30 relative to mounting head The position of the Z-direction of 106 is detected.

As shown in Figure 21 and Figure 22, detection device 10 possesses: frame parts 11, it is fixed In the bottom of mounting head 106, configure in the way of surrounding suction nozzle 30；Light source 12, it is arranged In the wall portion 11a of the side of frame parts 11, along Y direction injection detection light；And be subject to Optical element 13, it is arranged at another of, frame parts 11 relative with the wall portion 11a of side The wall portion 11b of side, carries out light to the detection light from light source 12.Light source 12 comprises along X Multiple light-emitting components of direction of principal axis configuration.Multiple light-emitting components penetrate detection light respectively.Detection light Comprise laser.Light source 12 penetrates multiple detection light of the wire along X-direction configuration.

Pair of lead wires L configures along X-direction.Pair of sidewalls portion 36 also joins along X-direction Put.From the size of the X-direction of the irradiation area of the detection light of light source 12 injection more than side Lead-in wire L and the lead-in wire L of opposite side between distance and the side of sidewall portion 36 of side and another Distance between the side of sidewall portion 36 of side.That is, pair of lead wires L and pair of sidewalls portion 36 falls into In the irradiation area of detection light.

Figure 23 is to represent the detection device 10 Z-direction to the leading section 36a of suction nozzle 30 The schematic diagram of one example of the state that position is being detected.While making suction nozzle 30 relative to peace Dress 106 moves along Z-direction, while detecting light from light source 12 injection.Suction nozzle moves dress Put 140 with from detection light light path in be configured with suction nozzle 30 at least one of state and The state being configured without in the state of suction nozzle 30 in the light path of detection light is changed to another Suction nozzle 30 is moved by the mode of individual state along Z-direction.The light path of detection light is configured with At least one of state of suction nozzle 30 and be configured without suction nozzle 30 in the light path of detection light State under, photo detector 13 the detection light obtained different by light state.At detection light Light path in be configured with under at least one of state of suction nozzle 30, at least of detection light Point be blocked, the detection light in photo detector 13 become by light state that light income reduces low Light income state.When being configured without suction nozzle 30 in the light path detecting light, detect light Be not blocked, in photo detector 13 detection light become the height that light income increases by light state Light income state.Detection device 10 make suction nozzle 30 move along Z-direction while from Light source 12 injection detection light, by obtained by photo detector 13 detection light by light state from low A state in light income state and high light income state is changed to suction during another state The position of the Z-direction of mouth 30, is set to the Z-direction of the leading section 36a of suction nozzle 30 Position.

Figure 24 is to represent drawing of the detection device 10 axial members C to being kept by suction nozzle 30 The one of the state that the position of the Z-direction of leading section (bottom) La of line L is being detected The schematic diagram of individual example.While making the suction nozzle 30 maintaining axial members C relative to mounting head 106 move along Z-direction, while detecting light from light source 12 injection.Suction nozzle mobile device 140 To be configured with at least one of state of lead-in wire L from the light path at detection light and in detection The state being configured without in the state of lead-in wire L in the light path of light is changed to another state Mode the suction nozzle 30 maintaining axial members C is moved along Z-direction.At detection light Light path is configured with at least one of state of lead-in wire L and does not has in the light path of detection light Under the state of configuration lead-in wire L, what photo detector 13 obtained detect the different by light state of light. The light path of detection light is configured with under at least one of state of lead-in wire L, detection light Be blocked at least partially, in photo detector 13 detection light become light income by light state The low light income state reduced.When being configured without lead-in wire L in the light path detecting light, Detection light is not blocked, being become light income by light state and increase of the detection light in photo detector 13 Big high light income state, detection device 10 makes to maintain the suction nozzle 30 of axial members C Move along Z-direction, while from light source 12 injection detection light, will be obtained by photo detector 13 To detection light by a light state shape from low light income state and high light income state The position of the Z-direction of lead-in wire L when state is changed to another state, is set to go between L's The position of the Z-direction of leading section La.

[example of the axial members kept by suction nozzle]

In the present embodiment, suction nozzle 30 so that axial members C and opposite face 32a across Axial members C is kept by the relative mode of gap.Thus, suction nozzle 30 can draw Line L is adjusted to constant basis from the bulge quantity H of leading section 36a, while to having various length Axial members C of lead-in wire L keep.

Figure 25 is the figure of the example representing axial members C1.Figure 26 is to represent suction nozzle The figure of one example of 30 states maintaining axial members C1.Figure 27 is to represent axial part The figure of one example of part C2.Figure 28 represents that suction nozzle 30 maintains axial members C2 The figure of one example of state.

Such as, to shown in Figure 25, there is the axial part of the lead-in wire L of the 1st length A1 In the case of part C1 keeps, as shown in figure 26, suction nozzle 30 can be to axial members The dimension D 1 in the gap between C1 and opposite face 32a is adjusted, and the L that will go between is from front end The bulge quantity H of portion 36a is set to aim parameter.

It addition, to shown in Figure 27, there is 2nd length A2 longer than the 1st length A1 Axial members C2 of lead-in wire L keep in the case of, as shown in figure 28, suction nozzle 30 The dimension D 2 in the gap between axial members C2 and opposite face 32a can be adjusted, Lead-in wire L is set to aim parameter R from the bulge quantity H of leading section 36a.Dimension D 2 is less than size D1。

When axial members C being installed to substrate P, suction nozzle 30 is so that lead-in wire one of L The mode protruded from the leading section 36a of suction nozzle 30 is divided axial members C to be kept, by it Lead-in wire L is inserted in the hole of substrate P.The convex of the L leading section 36a from suction nozzle 30 that go between In the case of output H is relatively big, thus it is for example possible to due to the elastic deformation of the L that goes between, draw for a pair The interval of line L is unable to maintain that as desired size, and lead-in wire L cannot be inserted into substrate P smoothly Hole in.In the case of the bulge quantity H of the lead-in wire L leading section 36a from suction nozzle 30 is less, Lead-in wire L likely cannot be fully inserted into the hole of substrate P.Therefore, will tool at needs There is axial members C of lead-in wire L of various length in the case of substrate P is installed, be preferably Length A making lead-in wire L changes, the bulge quantity H of the lead-in wire L leading section 36a from suction nozzle 30 Also it is constant basis.In the present embodiment, side of sidewall portion 36 is the longest, by suction nozzle 30 to tool In the case of axial members C having the lead-in wire L of any length A keeps, all with relatively Face 32a and the discontiguous state of axial members C, be managed its bulge quantity H, so that Obtain bulge quantity H and be maintained steady state value.

[control device]

In the present embodiment, control device 120 the bulge quantity H of lead-in wire L is managed. Figure 29 is the functional block representing the example controlling device 120 involved by present embodiment Figure.Control device 120 and comprise computer system.Computer system comprises such as that CPU is so Processor and the such memorizer of such as ROM or RAM.

The testing result of detection device 10 is output to control device 120.As with reference to Figure 23 Illustrating described, detection device 10 can be to the Z-direction of the leading section 36a of suction nozzle 30 Position is detected.As described in illustrate with reference to Figure 24, detection device 10 can be to by suction nozzle The position of the Z-direction of the leading section La of the lead-in wire L of 30 axial members C kept is carried out Detection.

It addition, control device 120 testing result based on detection device 10, mounting head is moved Dynamic device 107 and suction nozzle mobile device 140 are controlled.Mounting head mobile device 107 comprises X drive division 109 and Y drive division 110.Suction nozzle mobile device 140 comprises Z drive division 150 And θ Z drive division 160.

Controlling device 120 to possess: data acquisition 121, it obtains table from detection device 10 Show the position of the Z-direction of the leading section 36a of the suction nozzle 30 detected by detection device 10 Suction nozzle position data and represent the leading section La of lead-in wire L detected by detection device 10 The wire locations data of position of Z-direction；Calculating part 122, it obtains based on by data The testing result of the detection device 10 that portion 121 obtains, to from the leading section 36a of suction nozzle 30 The bulge quantity H of the lead-in wire L protruded calculates；Correction unit 123, it is based on calculating part 122 Result of calculation, output kept axial part at the PJa of parts supply position by suction nozzle 30 The correcting value of the position of the Z-direction of the suction nozzle 30 during part C；Control portion 124, its based on From the correcting value of correction unit 123 output, control signal is exported to suction nozzle mobile device 140； And storage part 125.

Possess it addition, control device 120: detection unit 126, it calculates by calculating part 122 Whether the bulge quantity H of the lead-in wire L gone out is in permissible range judges；And retry portion 127, It will be used for making detection device 10 again when being judged to that bulge quantity H is not at permissible range Perform the control signal output of detection.

[electronic component mounting method]

Below, with reference to Figure 30 to the electronic component mounting method involved by present embodiment one Individual example illustrates.Figure 30 is to represent the electronic unit installation side involved by present embodiment The flow chart of one example of method.As shown in figure 30, the ministry of electronics industry involved by present embodiment Part installation method comprises the process from step S10 to step S130.From step S10 to step S90, step S120 and step S130 are to carrying out for implementing the operating condition of installation process The product that changes determined processes (adjustment process, output with conditions process).Step S100 and step S110 It it is the installation process installing electronic unit C to substrate P.

(changing product to process)

First, exchange product processes and illustrates.Z to the leading section 36a representing suction nozzle 30 The height Zn of axial position carries out detecting (step S10).As institute being described with reference to Figure 23 Stating, highly Zn is detected by detecting device 10.

The height Zn detected is obtained by data acquisition 121, is stored to storage part 125 (step S20).

Below, mounting head 106 is made to move, so that suction nozzle 30 is configured at parts supply position Put PJa (step S30).

Implement the para-position substantially of suction nozzle 30, enable to by suction nozzle 30 by the ministry of electronics industry Electronic unit C after the lead processing mechanism 230 of part feedway 200 processes keeps. Suction nozzle 30 moves the elemental height Zns of the position to the Z-direction represented under initial condition. Elemental height Zns is set by controlling portion 124.Additionally, elemental height Zns can also be by operation Person sets.The mobile suction nozzle 30 to elemental height Zns is to electronic part feeder 200 Axial members C carries out keeping (step S40).

Figure 31 is to represent that the mobile suction nozzle 30 to elemental height Zns maintains electronic unit and supplies Figure to the state of axial members C of device 200.As shown in figure 31, suction nozzle 30 is to draw Axial members C is kept by the mode that line L protrudes from the leading section 36a of suction nozzle 30.

Below, to representing by the mobile axial part kept to the suction nozzle 30 of elemental height Zns The height ZI of the position of the Z-direction of the leading section La of the lead-in wire L of part C carries out detecting (step Rapid S50).As described in illustrate with reference to Figure 24, highly ZI is detected by detecting device 10.

The height ZI detected is obtained by data acquisition 121, is stored to storage part 125 (step S60).

Calculating part 122 is based on the height Zn detected by detection device 10 and height ZI, right Carry out calculating (step from the bulge quantity H of the lead-in wire L of the leading section 36a protrusion of suction nozzle 30 S70)。

Figure 32 is to represent between the height Zn of leading section 36a and the height ZI of leading section La The schematic diagram of relation.As shown in figure 32, the bulge quantity H of lead-in wire L is equal to by detection device Height Zn that 10 detect and the difference of height ZI detected by detection device 10.Calculating part 122 implement computing (Zn-ZI), calculate bulge quantity H.

The bulge quantity H of the detection unit 126 lead-in wire L to being calculated by calculating part 122 relative to Whether aim parameter R is in permissible range carries out judging (step S80).In other words, it is determined that portion Between the bulge quantity H and aim parameter R of the lead-in wire L that 126 couples are calculated by calculating part 122 Whether difference Δ h is in permissible range judges.

As an example, the aim parameter R of bulge quantity H is 1.0 [mm].Difference Δ h table Show the bulge quantity H departure relative to aim parameter R.

In the present embodiment, permissible range is further divided into the permissible range of 2 grades.1st Permissible range is that the difference between the bulge quantity H and aim parameter R calculated by calculating part 122 is The scope of Δ ha.1st permissible range comprise the bulge quantity H that calculated by calculating part 122 with The situation that aim parameter R is consistent, comprises the feelings that the difference between bulge quantity H and aim parameter R is zero Condition.As an example, in the case of aim parameter R is 1 [mm], the 1st allows model Enclose for being less than or equal to the scope of 1.1 [mm] more than or equal to 0.9 [mm].That is, Difference Δ ha is ± 0.1 [mm] relative to aim parameter R.

2nd permissible range be the bulge quantity H calculated by calculating part 122 and aim parameter R it Between the scope that difference is Δ hb.2nd permissible range, as an example, is greater than or equal to 0.5 [mm] and less than or equal to the scope of 1.5 [mm].That is, Δ hb is differed from relative to mesh Scalar R is ± 0.5 [mm].

In the case of more than the 2nd permissible range, i.e. calculated by calculating part 122 In the case of difference between bulge quantity H and aim parameter R is the Δ hc bigger than Δ hb, it is determined that for Bulge quantity H is not at permissible range.In this example, it is shorter than 0.5 [mm] at bulge quantity H In the case of or in the case of being longer than 1.5 [mm], it is determined that be not at allowing for bulge quantity H Scope.

In step S80, it is in the feelings of permissible range at the bulge quantity H being judged to lead-in wire L Under condition (step S80:Yes), correction unit 123 result of calculation based on calculating part 122, Output is kept suction nozzle during axial members C at the PJa of parts supply position by suction nozzle 30 The correcting value (step S90) of the position of the Z-direction of 30.

In the present embodiment, in step S80, it is judged to that bulge quantity H is the 1st to allow model In the case of enclosing, correction unit 123 exports zero as correcting value.

In the case of being judged to that in step S80 bulge quantity H is the 2nd permissible range, correction Portion 123 output calibration amount so that axial members C when being kept by suction nozzle 30 from Difference between the bulge quantity H and aim parameter R of the lead-in wire L that the leading section 36a of suction nozzle 30 protrudes Δ hb diminishes.

(installation process)

In changing product process, kept axial by the mobile suction nozzle 30 to elemental height Zns distinguishing In the case of the bulge quantity H of lead-in wire L during parts C is the 2nd permissible range, i.e. sentencing In the case of difference between bright bulge quantity H and aim parameter R is Δ hb, in installation process The Z axis of the suction nozzle 30 when suction nozzle 30 keeps axial members C at the PJa of parts supply position The position in direction is corrected.

Figure 33 represents that suction nozzle 30 is to electronic part feeder 200 in installation process Axial members C carries out the figure of the state kept.Control portion 124 is based on defeated from correction unit 123 The correcting value gone out, exports control signal to suction nozzle mobile device 140, so that supplying at parts The bulge quantity H of the lead-in wire L of axial members C kept by suction nozzle 30 at the PJa of position becomes mesh Scalar R.

Such as, change product process in, distinguish bulge quantity H than aim parameter R big poor Δ hb In the case of (H=R+ Δ hb), if suction nozzle 30 is moved to based on difference Δ hb correction after Calibrated altitude Znr and axial members C is kept, then bulge quantity H is close to aim parameter R.As shown in figure 33, if from elemental height Zns decline difference Δ hb value after correction Axial members C is kept by suction nozzle 30, then can by highly Znr (=Zns-Δ hb) place Bulge quantity H and aim parameter R is enough made to coincide.

Control portion 124, based on the correcting value exported from correction unit 123, obtains in installation process The calibrated altitude Znr of suction nozzle 30, will be kept by suction nozzle 30 at the PJa of parts supply position The position adjustment of the Z-direction of the suction nozzle 30 during axial members C is calibrated altitude Znr, makes Axial members C is kept (step S100) by this suction nozzle 30.Suction nozzle 30 is at correction height At degree Znr, axial members C to electronic part feeder 200 keeps, this correction Highly Znr represents based on the controlled Z-direction of control signal exported from control portion 124 Position.Thereby, it is possible to when bulge quantity H is adjusted to aim parameter R, by inhaling Axial members C is kept by mouth 30.

Control device 120 to move mounting head 106 to installation site PJb, will be by suction nozzle 30 Axial members C kept installs (step S110) to substrate P.Thus, axial members C Lead-in wire L be inserted into smoothly in the hole of substrate P.

(changing other actions that product processes)

Additionally, in changing step S80 that product processes, be judged to that bulge quantity H is the 1st appearance Permitted in the case of scope, the suction nozzle 30 when suction nozzle 30 keeps axial members C in installation process Height be controlled as, with change product process in elemental height Zns become identical.That is, with " school Positive height Znr=elemental height Zns " mode, export from control portion 124 by control signal.

In step S80, it is not at permissible range at the bulge quantity H being judged to lead-in wire L In the case of (step S80:No), correction unit 123 output calibration amount, so that axial members The lead-in wire L that C protrudes from the leading section 36a of suction nozzle 30 when being kept by suction nozzle 30 Bulge quantity H and aim parameter R between poor Δ h (Δ hc) diminish (step S120).

Such as, calculate in the case of bulge quantity H is 2.0 [mm] in calculating part 122, Correcting value is exported in the way of diminishing by the poor Δ hc between its bulge quantity H and aim parameter R. Based on the correcting value being output, the elemental height Zns resetting with setting out in step s 40 Elemental height Zns ' for different value.

Suction nozzle 30 is moved to the elemental height Zns ' reset out.Mobile to elemental height The suction nozzle 30 of Zns ', keeps (step to axial members C of electronic part feeder 200 Rapid S130).

Afterwards, return step S50, again perform to change product and process.That is, device 120 is controlled The portion that retries 127 by based on the correcting value exported in the step s 120 by the position of Z-direction It is adjusted to the suction nozzle 30 after elemental height Zns ' axial members C is kept, makes detection The position of the lead-in wire L of the device 10 axial members C to being kept by this suction nozzle 30 is carried out again Detection.

As it has been described above, drawing in axial members C kept by the suction nozzle 30 of elemental height Zns In the case of poor Δ h (Δ hc) between the bulge quantity H and aim parameter R of line L is relatively big, then Secondary execution is changed product and is processed.By by the suction nozzle 30 being in the elemental height Zns ' reset out Axial members C is kept, thus between the bulge quantity H and aim parameter R of lead-in wire L The state that diminishes of poor Δ h under again perform to change product and process.

[effect]

As described above, according to present embodiment, in changing product process, at the beginning of representing The elemental height Zns of the position of the suction nozzle 30 of the Z-direction under the conditions of the beginning and expression are by inhaling The height ZI of the position of the lead-in wire L of axial members C that mouth 30 keeps detects, based on Its testing result, enters the bulge quantity H of the lead-in wire L protruded from the leading section 36a of suction nozzle 30 Row calculate, based on its result of calculation, in installation process, will with at parts supply position PJa Place is kept the position of the Z-direction of suction nozzle 30 during axial members C relevant by suction nozzle 30 Correcting value exports, and obtains calibrated altitude Zns, therefore, it is possible to by the bulge quantity H pipe of lead-in wire L Reason is desired value.Therefore, it is possible to axial members C is installed well to substrate P.Separately Outward, according to present embodiment, though the length change of lead-in wire L, it is also possible to from suction nozzle 30 The bulge quantity H of lead-in wire L that protrudes of leading section 36a be managed well.

It addition, according to present embodiment, correction unit 123 output calibration amount, so that axially Parts C is drawing from the leading section 36a of suction nozzle 30 protrusion when being kept by suction nozzle 30 Poor Δ h between the bulge quantity H and aim parameter R of line L diminishes.Thereby, it is possible to make protrusion Amount H and aim parameter R coincide.Therefore, it is possible to it is further that axial members C is good to substrate P Install well.

It addition, in the present embodiment, based on the correcting value exported from correction unit 123, from Control portion 124 exports control signal to suction nozzle mobile device 140, so that in installation process The protrusion of the lead-in wire L of axial members C kept by suction nozzle 30 at the PJa of parts supply position Amount H becomes aim parameter R.Thereby, it is possible to the lead-in wire L of desired bulge quantity H is inserted into In the hole of substrate P, it is possible to axial members C is installed well to substrate P.

It addition, in the present embodiment, would indicate that the suction nozzle 30 detected by detection device 10 The suction nozzle position data of position of Z-direction and represent the position of Z-direction of lead-in wire L The wire locations data put store to storage part 125.Therefore, calculating part 122 can be based on suction Difference between mouth position data and wire locations data, successfully calculates bulge quantity H.

It addition, in the present embodiment, utilize detection unit to being calculated by calculating part 122 Whether the bulge quantity H of lead-in wire L is in permissible range judges, is being judged to bulge quantity H When being not at permissible range, the elemental height Zns ' reset out based on correcting value is derived, After utilizing detection device 10 to being adjusted to elemental height Zns ' by the position of Z-direction The position of the Z-direction of the lead-in wire L of axial members C that suction nozzle 30 is kept is examined again Survey.Thus, by the poor Δ h reduction between the bulge quantity H and aim parameter R of lead-in wire L Under state, again performing to change product and process, the product that changes of the output therefore comprising correcting value processes Precision improve.

Claims

1. an electronic component mounting apparatus, it possesses:

Electronic part feeder, the axial members with lead-in wire is supplied by it；

Mounting head, it has the suction nozzle that can keep described axial members；

Mounting head mobile device, it can make described mounting head comprise and from the described ministry of electronics industry The relative parts supply position of described axial members of part feedway supply and described with installing Move in the predetermined surface of the installation site that the substrate of axial members is relative；

Suction nozzle mobile device, its can make described suction nozzle relative to described mounting head along and institute The prescribed direction stating predetermined surface orthogonal moves；

Detection device, it is arranged at described mounting head, to the described regulation side under initial condition To the position of described suction nozzle and the described lead-in wire of described axial members that kept by described suction nozzle Position detect；

Calculating part, its testing result based on described detection device, to before described suction nozzle The bulge quantity of the described lead-in wire that end is protruded calculates；And

Correction unit, its result of calculation based on described calculating part, output is at described parts By the school of the position of described suction nozzle during the described suction nozzle described axial members of holding at supply position Positive quantity.

Electronic component mounting apparatus the most according to claim 1, wherein,

Described correction unit exports described correcting value, so that described axial members is by described suction The bulge quantity of the described lead-in wire protruded from the leading section of described suction nozzle under the state that mouth keeps and mesh Difference between scalar diminishes.

Electronic component mounting apparatus the most according to claim 1 and 2, wherein,

Possessing control portion, this control portion is based on the correcting value exported from described correction unit, to institute State suction nozzle mobile device output control signal, so that described at described parts supply position The bulge quantity of the described lead-in wire of the described axial members that suction nozzle keeps becomes aim parameter,

The position of the described suction nozzle described prescribed direction after adjusting based on described control signal Place, keeps the described axial members of described electronic part feeder, to described substrate Install.

Possesses storage part, the described suction that expression is detected by this storage part by described detection device The suction nozzle position data of the position of mouth and represent that the wire locations data of position of described lead-in wire are entered Row storage,

Described calculating part is based between described suction nozzle position data and described wire locations data Difference, calculates described bulge quantity.

Electronic component mounting apparatus the most according to claim 3, wherein,

Electronic component mounting apparatus the most according to claim 1 and 2, wherein, possesses:

Detection unit, whether the bulge quantity of its described lead-in wire to being calculated by described calculating part Judge in permissible range；And

Retrying portion, it, when being judged to that described bulge quantity is not at described permissible range, makes institute State detection device to based on described correcting value by described in after the position adjustment of described prescribed direction The position of the described lead-in wire of the described axial members that suction nozzle is kept, detects again.

Electronic component mounting apparatus the most according to claim 3, wherein, possesses:

Electronic component mounting apparatus the most according to claim 4, wherein, possesses:

Electronic component mounting apparatus the most according to claim 5, wherein, possesses:

10. an electronic component mounting method, it comprises following step:

In an initial condition, the detection device being arranged at mounting head the position of suction nozzle is carried out Detection, this mounting head can be in the axial members phase comprised with supply from electronic part feeder To parts supply position and with the regulation of the relative installation site of substrate installing axial members Moving in face, this suction nozzle is arranged at described mounting head, it is possible to along the side orthogonal with described predetermined surface To movement；

Under described initial condition, by described detection device to described in being kept by described suction nozzle The position of the described lead-in wire of axial members is detected；

Position based on the described suction nozzle detected by described detection device and the position of described lead-in wire Put, the bulge quantity of the described lead-in wire protruded from the leading section of described suction nozzle is calculated；

Bulge quantity based on the described lead-in wire calculated, exports and supplies position at described parts Put place's correcting value by the position of described suction nozzle during the described suction nozzle described axial members of holding；

Based on described correcting value, kept institute at described parts supply position by described suction nozzle The position of described suction nozzle when stating axial members is corrected, by described suction nozzle to described axial part Part keeps；And

The described axial members kept by described suction nozzle is installed to substrate.