CN105898982B - A kind of high-voltage flexible wiring board and multi-layer flexible circuit board - Google Patents
A kind of high-voltage flexible wiring board and multi-layer flexible circuit board Download PDFInfo
- Publication number
- CN105898982B CN105898982B CN201610500732.6A CN201610500732A CN105898982B CN 105898982 B CN105898982 B CN 105898982B CN 201610500732 A CN201610500732 A CN 201610500732A CN 105898982 B CN105898982 B CN 105898982B
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- Prior art keywords
- layer
- copper foil
- foil circuit
- circuit layer
- wiring board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to flexible circuit board technical fields, specifically disclose a kind of high-voltage flexible wiring board, including insulated substrate, the side of the insulated substrate is equipped with the first copper foil circuit layer, the other side is successively arranged the second copper foil circuit layer, first PET film layer and third copper foil circuit layer, the first through hole is equipped between the first copper foil circuit layer and insulated substrate to realize the conducting of the first copper foil circuit layer and the second copper foil circuit layer, the first copper foil circuit layer, insulated substrate, the second through hole is equipped between second copper foil circuit layer and the first PET film layer to realize the conducting of the first copper foil circuit layer Yu third copper foil circuit layer.Conventional double wiring board positive and negative anodes are in same layer, and because creepage distance limits, positive and negative anodes copper foil width is affected.Multilayer circuit board is separated in several layers of electrode, is avoided that between electrode and climbs electricity, reduces the width of wiring board to greatest extent in the case where ensuring pressure drop and double-layered circuit board unanimous circumstances, and can reach better heat dissipation effect.
Description
Technical field
Originally practical to be related to flexible circuit board technical field more particularly to a kind of high-voltage flexible wiring board and layer flexible route
Plate.
Background technique
Flexible circuit board referred to as " soft board ", is commonly called as FPC in industry, is the printed circuit made of insulating substrate flexible
Plate has the advantages that many rigid printed circuit boards do not have.Such as it can with free bend, turn around, fold.Utilize flexibility
Circuit board can be substantially reduced the volume of electronic product, be applicable in the need that electronic product develops to high density, miniaturization, highly reliable direction
It wants.Therefore, flexible circuit board is in fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital cameras
Or it is widely used on product.
Light bar is the more popular field of flexible circuit board application.The light bar is referred to LED light with special
Processing technology is welded on flexible circuit board, reconnects electrical source luminescent, has the characteristics that long service life, energy conservation and environmental protection.With
Continuous improvement of people's living standards, LED light strip be widely used in decorative lighting place, such as neon light, large-scale day
Line wiring board, subtitle advertisement, signboard, smallpox illumination etc..But flexible circuit board used by light bar traditionally is single side line
Road, such as application No. is 201010232537.2 patents of invention to disclose a kind of juxtaposed wire producing single-sided circuit board of use
Method, using this method preparation circuit board be single-sided circuit board, this single-sided circuit board, which has a problem that, is exactly, with
After LED light combination forms light bar, in addition which must connect conducting wire single-sided circuit board when powering, and not only increase light bar
Volume, and will increase manually-operated complexity.Since there are errors for manual operation, for a long time not using the contact of rear conducting wire
The good intermittent failure for being easy to cause light bar, so that the service life of light bar declines.
Application No. is 201320405662.8 utility model patents to disclose a kind of double-circuit LED high-voltage light bar, including
Wiring board and the LED assembly being layed on wiring board, the top surface of the wiring board are equipped with top surface electric conductor route, and bottom surface is equipped with bottom
Face electric conductor route, wiring board are Double-side line conductive structure, and LED assembly is set on top surface electric conductor route, bottom surface electric conductor
Route is wire line.The wiring board of double-circuit LED high-pressure lamp band uses the design of double-circuit plate, solves traditional single side
The shortcomings that circuit board, still, the utility model, have ignored a problem, electric conductor route in the case of long-term use,
It is easy to be influenced by surrounding enviroment such as dust, moisture etc. and cause LED light weld short-circuit, to reduce the service life.
Summary of the invention
In view of this, it is an object of the invention to overcome the deficiencies of the prior art and provide one kind can effectively prevent extraneous do
It disturbs, flexible circuit board and multi-layer flexible circuit board suitable for being used under high pressure.
In order to solve the above-mentioned technical problem, the present invention is realized using following scheme:
The side of a kind of high-voltage flexible wiring board, including insulated substrate, the insulated substrate is equipped with the first copper foil circuit layer,
The other side is successively arranged the second copper foil circuit layer, the first PET film layer and third copper foil circuit layer, the first copper foil circuit layer and
The first through hole is equipped between insulated substrate to realize the conducting of the first copper foil circuit layer and the second copper foil circuit layer, described first
The second through hole is equipped between copper foil circuit layer, insulated substrate, the second copper foil circuit layer and the first PET film layer to realize the first bronze medal
The conducting of foil line layer and third copper foil circuit layer.
Copper foil circuit layer is respectively set in the two sides of insulated substrate in flexible circuit board of the invention, and the second copper foil circuit layer can
Think that positive or negative pole, third copper foil circuit layer are cathode or anode accordingly, the two passes through the first through hole and second respectively
Through hole and the first copper foil circuit layer, which are realized, to be connected.Second through hole cuts off one bigger through the position of the second copper foil circuit layer
The circle of area, to prevent the first copper foil circuit layer to be connected by the second through hole with the second copper foil circuit layer.
The route of insulated substrate side is divided into two sides copper foil layer, respectively the second copper foil circuit layer and third copper by the present invention
Foil line layer, therefore can increase in the insulated substrate of one fixed width the transversal of the second copper foil circuit layer and third copper foil circuit layer
Area, so that it is more suitable for hyperbaric environment.
Three layers of copper foil circuit layer form conducting wire, and therefore, the present invention is not needed additionally to connect and be led when being applied to light bar
Line reduces the manufacture difficulty of light bar so that the light bar of preparation is primary encapsulated, moreover, copper is arranged in the two sides of insulated substrate
Foil line layer can make the integral thickness of wiring board substantially reduce, more compact.Copper foil circuit layer is cut using continuous physical
Form, thus can continuous continual production, overcome the wiring board length for etching route in the prior art at most there was only 1 ~
2m is prepared into the shortcomings that light bar needs a plurality of splicing, can greatly improve production efficiency.Each interlayer can be by bonding.
The first copper foil circuit layer is equipped with the second PET film layer.
When preparing light bar, lamp bead is set on the first copper foil circuit layer, it is after prolonged use, especially larger in dust
Or the heavier place of moisture, it is easy to happen short circuit between lamp bead and the first copper foil circuit layer, causes failure, therefore, in the present invention
The first copper foil circuit layer on cover the second PET film layer, by the first copper foil circuit layer and external environment isolation come, provide
Good electronic isolation function.
Since the scene of light bar application greatly needs to be bent, hold after prolonged use at traditional circuit plate benging
It easily breaks or separates, in the present invention, the stress in knee is reduced using the first PET film layer and the second PET film layer, so that
More preferably, the wiring board service life is more lasting for the weatherability of wiring board, anti-aging property, furthermore, just because of the superperformance of PET,
It can accomplish sufficiently thin and be not easily separate and shrink in the case where light bar is emitted light and heat, and integrate its cost and spy
Property, this is that other materials cannot compare.
The second PET film layer is equipped with through-hole.Through-hole on second PET film layer is that can allow be arranged in the first copper foil circuit
Lamp bead on layer appears, and tin cream when patch can be made not to be lost to other positions.
The first PET film layer and the second PET film layer with a thickness of 0.05 ~ 0.2mm.Although present invention employs first
PET film layer and the second PET film layer ensure the bending resistance of wiring board, still, PET film layer be not it is more thicker better, to control
System could bring superior performance in certain thickness range to wiring board.If PET film layer is blocked up, although its electronic protection
During function is enhanced, but wiring board is in bending, PET film layer forms copper foil circuit layer and insulated substrate and squeezes, and holds
It is easier that the two is broken;If PET film layer is excessively thin, cannot play anti-around ability and electronic protection ability well.
The insulated substrate with a thickness of 0.5 ~ 1mm.The insulated substrate is pet layer.Intermediate pet layer cooperates three layers of copper
Foil line layer and two layers of PET film layer, may make its thickness to become thinner.
The second PET film layer is equipped with the annular protrusion around through-hole.
Flexible circuit board prepared by the present invention is for when manufacturing light bar, and light bar needs to carry out encapsulated, and therefore, the present invention is the
Annular protrusion is arranged in the through holes of two PET film layers, when it is encapsulated press lamp bead when, annular protrusion and encapsulated close contact can
Through-hole is entered to obstruct extraneous dust to a certain extent, and when assist side is in bending, annular protrusion can be with
It prevents the stress mutation of through hole and ruptures.
The prominent second PET film layer of the annular protrusion with a thickness of 0.5 ~ 3.5mm, and the edge of its inner distance through-hole
0.5~3mm.When it is encapsulated press lamp bead when, lamp bead it is corresponding it is encapsulated form micro- standing shape, the slightly lower annular protrusion of cooperation thickness,
It can combine closely.
The side of a kind of high pressure multi-layer flexible circuit board, including insulated substrate, the insulated substrate is equipped with upper copper tinsel cord
Road floor, the other side be equipped with multilayer lower copper foil line layer, and between every layer of lower copper foil line layer be equipped with insulating film layer, it is described on
Layer copper foil circuit layer and lower copper foil line layer are realized by the through hole through insulated substrate to be connected.Multilayer lower layer described here
Multilayer in copper foil circuit layer is at least two layers or more.The connection of upper copper line layer and lower copper foil line layer, which passes through, to be run through
Hole is realized, by the way that corresponding through hole is through to corresponding position.It further, also can be such as above-mentioned high-voltage flexible route
Plate is the same, covers PET film layer and annular protrusion in upper copper line layer.Multi-layer flexible circuit board is suitable for relative complex
Route, such as RGB lamp belt circuit, multilayered structure, which can be realized, is respectively distributed in one layer for four electrodes (one positive three is negative) of RGB, solution
Route board width certainly need to be done to big disadvantage because of reserved creepage distance.
Compared with prior art, the invention has the following beneficial effects: conventional double wiring board positive and negative anodes in same layer, because
Creepage distance limitation, positive and negative anodes copper foil width are affected.Multilayer circuit board is separated in several layers of electrode, is avoided that electrode
Between climb electricity, reduce the width of wiring board to greatest extent in the case where ensuring pressure drop and double-layered circuit board unanimous circumstances, and can reach
Better heat dissipation effect.
Detailed description of the invention
Fig. 1 is 1 structural schematic diagram of embodiment;
Fig. 2 is A-A cross-sectional view in Fig. 1;
Fig. 3 is 2 structural schematic diagram of embodiment.
Specific embodiment
In order to allow those skilled in the art to more fully understand technical solution of the present invention, with reference to the accompanying drawing to the present invention
It is further elaborated.
Embodiment 1
As illustrated in fig. 1 and 2, a kind of high-voltage flexible wiring board, including insulated substrate 100, the side of the insulated substrate 100
Equipped with the first copper foil circuit layer 200, the other side is successively arranged the second copper foil circuit layer 400, the first PET film layer 500 and third copper
Foil line layer 600 is equipped with the first through hole 800 to realize first between the first copper foil circuit layer 200 and insulated substrate 100
The conducting of copper foil circuit layer 200 and the second copper foil circuit layer 400, the first copper foil circuit layer 200, insulated substrate 100, second
The second through hole 900 is equipped between copper foil circuit layer 400 and the first PET film layer 500 to realize the first copper foil circuit layer 200 and the
The conducting of three copper foil circuit layers 600.
The first copper foil circuit layer 200 is equipped with the second PET film layer 300.The second PET film layer 300 is equipped with logical
Hole 310.The first PET film layer 500 and the second PET film layer 300 with a thickness of 0.1mm.The insulated substrate 100 with a thickness of
0.8mm.The insulated substrate 100 is pet layer.The second PET film layer 300 is equipped with the annular protrusion around through-hole 310
320.The prominent second PET film layer 300 of the annular protrusion 320 with a thickness of 2mm, and the edge of its inner distance through-hole 310
1mm。
Embodiment 2
As shown in figure 3, a kind of high pressure multi-layer flexible circuit board, including insulated substrate 100, the one of the insulated substrate 100
Side is equipped with upper copper line layer 200, and the other side is equipped with three lower layers copper foil circuit layer, respectively the first lower copper foil line layer
400, the second lower copper foil line layer 600 and third lower copper foil line layer 700, and be equipped between three lower layers copper foil circuit layer
PET film layer 500, the upper copper line layer 200 and lower copper foil line layer are realized by the through hole through insulated substrate
Conducting, through hole is through the principle of connection upper copper line layer and lower copper foil line layer with embodiment 1.
Above-described embodiment is only wherein specific implementation of the invention, and the description thereof is more specific and detailed, but can not
Therefore limitations on the scope of the patent of the present invention are interpreted as.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these obvious alternative forms are equal
It belongs to the scope of protection of the present invention.
Claims (10)
1. a kind of high-voltage flexible wiring board, which is characterized in that including insulated substrate, the side of the insulated substrate is equipped with the first bronze medal
Foil line layer, the other side are successively arranged the second copper foil circuit layer, the first PET film layer and third copper foil circuit layer, the second copper foil line
Road floor is positive or negative pole, and third copper foil circuit layer is accordingly cathode or anode, the first copper foil circuit layer and insulated substrate
Between be equipped with the first through hole to realize the conducting of the first copper foil circuit layer and the second copper foil circuit layer, first copper foil circuit
The second through hole is equipped between layer, insulated substrate, the second copper foil circuit layer and the first PET film layer to realize the first copper foil circuit layer
With the conducting of third copper foil circuit layer, the position excision one that the second through hole runs through the second copper foil circuit layer is greater area of
Circle, to prevent the first copper foil circuit layer to be connected by the second through hole with the second copper foil circuit layer.
2. high-voltage flexible wiring board according to claim 1, which is characterized in that the first copper foil circuit layer is equipped with the
Two PET film layers.
3. high-voltage flexible wiring board according to claim 2, which is characterized in that the second PET film layer is equipped with through-hole.
4. high-voltage flexible wiring board according to claim 2 or 3, which is characterized in that the first PET film layer and second
PET film layer with a thickness of 0.05 ~ 0.2mm.
5. high-voltage flexible wiring board according to claim 4, which is characterized in that the insulated substrate with a thickness of 0.5 ~
1mm。
6. high-voltage flexible wiring board according to claim 5, which is characterized in that the insulated substrate is pet layer.
7. high-voltage flexible wiring board according to claim 2 or 3, which is characterized in that the second PET film layer, which is equipped with, to be enclosed
Around the annular protrusion of through-hole.
8. high-voltage flexible wiring board according to claim 7, which is characterized in that prominent 2nd PET of the annular protrusion
Film layer with a thickness of 0.5 ~ 3.5mm, and 0.5 ~ 3mm of edge of its inner distance through-hole.
9. a kind of high pressure multi-layer flexible circuit board, which is characterized in that including insulated substrate, the side of the insulated substrate is equipped with upper
Layer copper foil circuit layer, the other side are equipped with multilayer lower copper foil line layer, and insulating film is equipped between every layer of lower copper foil line layer
Layer, respectively by being through to corresponding lower copper foil line layer between the upper copper line layer and every layer of lower copper foil line layer
Through hole realize conducting;Through hole is disposed through other between upper copper line layer and corresponding lower copper foil line layer
The position of lower copper foil line layer cuts off a greater area of circle, to prevent upper copper line layer and other lower copper foil lines
The conducting of road floor.
10. high pressure multi-layer flexible circuit board according to claim 9, which is characterized in that the insulating film layer is PET film
Layer.
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CN201610500732.6A CN105898982B (en) | 2016-06-30 | 2016-06-30 | A kind of high-voltage flexible wiring board and multi-layer flexible circuit board |
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CN201610500732.6A CN105898982B (en) | 2016-06-30 | 2016-06-30 | A kind of high-voltage flexible wiring board and multi-layer flexible circuit board |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106287260B (en) * | 2016-09-29 | 2022-08-05 | 东莞市善时照明科技有限公司 | LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure |
CN106455300B (en) * | 2016-11-10 | 2023-09-12 | Oppo广东移动通信有限公司 | Circuit board and mobile terminal |
CN107072044B (en) * | 2017-06-05 | 2024-04-12 | 广东顺德施瑞科技有限公司 | Double-sided flexible circuit board |
CN107278024B (en) * | 2017-08-02 | 2019-12-17 | 常熟东南相互电子有限公司 | Flexible circuit board assembly |
CN108087745A (en) * | 2017-12-16 | 2018-05-29 | 中山市富大照明科技有限公司 | A kind of flexible LED circuit board module |
CN109435369A (en) * | 2018-11-20 | 2019-03-08 | 鹤山市众晟科技有限公司 | The manufacturing method and LED light bar of LED light bar |
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CN105101685A (en) * | 2015-09-02 | 2015-11-25 | 广东欧珀移动通信有限公司 | Fabrication method of multi-layer printed circuit board (PCB) and multi-layer PCB |
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US3436819A (en) * | 1965-09-22 | 1969-04-08 | Litton Systems Inc | Multilayer laminate |
US5191174A (en) * | 1990-08-01 | 1993-03-02 | International Business Machines Corporation | High density circuit board and method of making same |
JP2011029385A (en) * | 2009-07-24 | 2011-02-10 | Murata Mfg Co Ltd | Flexible multilayered substrate and method of manufacturing the same |
CN204721710U (en) * | 2015-05-07 | 2015-10-21 | 深圳市星之光实业发展有限公司 | A kind of multi-layer flexible circuit board |
CN205693971U (en) * | 2016-06-30 | 2016-11-16 | 广东顺德施瑞科技有限公司 | A kind of high-voltage flexible wiring board and multi-layer flexible circuit board |
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- 2016-06-30 CN CN201610500732.6A patent/CN105898982B/en active Active
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Publication number | Priority date | Publication date | Assignee | Title |
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CN105101685A (en) * | 2015-09-02 | 2015-11-25 | 广东欧珀移动通信有限公司 | Fabrication method of multi-layer printed circuit board (PCB) and multi-layer PCB |
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Address after: 528325 Guangdong 1 Foshan town Shunde District, Longtan Village, Qi Long Road, Da she 9, No. 1 Applicant after: Guangdong Shunde Siry Technology Co., Ltd. Address before: 528325 one of 2 hundred road sections in the North Water Village Committee Industrial Zone, Shunde District, Foshan City, Guangdong Province Applicant before: Guangdong Shunde Siry Technology Co., Ltd. |
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