CN105895828A - Stepping type laser packaging temperature and power detection-control device and method - Google Patents
Stepping type laser packaging temperature and power detection-control device and method Download PDFInfo
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- CN105895828A CN105895828A CN201410198182.8A CN201410198182A CN105895828A CN 105895828 A CN105895828 A CN 105895828A CN 201410198182 A CN201410198182 A CN 201410198182A CN 105895828 A CN105895828 A CN 105895828A
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Abstract
The invention discloses a stepping type laser packaging temperature and power detection-control device. The device comprises a laser, a motion control module, a temperature detection module, and a laser detection and control module, the laser generates a laser beam to heat a glass material, the width of a light spot which is projected on the glass material by the laser beam is greater than the width of the glass material; the motion control module enables the light spot and the glass material to make synchronous stepping motion; the temperature detection module measures the temperature of the glass material in the synchronous stepping motion process; and the laser detection and control module detects the morphology of the laser beam and controls the power of the laser beam in real time.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, particularly relate to a kind of step-by-step movement laser package temperature and power detection and control device and method.
Background technology
Along with current IC(Integrated
Circuit, integrated circuit) the developing rapidly and people's raising day by day to image display technology demand, TFT (Thin Film of technology
Transistor, TFT) etc. LCD(Liquid Crystal Display, liquid crystal display) due to its thickness big, visible angle little (about 120 degree), response time is long, the shortcomings such as shock resistance difference, it is difficult to meet hands machine, the portable consumer electronics products such as MP3 demand high performance to screen, and OLED(Organic Light-Emitted Diode, Organic Light Emitting Diode) display screen is with its self-luminosity, the thinnest coating of organic material and glass substrate, visible angle is big (about 160 degree), many advantages such as power saving and gradually favored by each giant-screen manufacturer.OLED display screen is applied to the portable type electronic product such as mobile phone, MP3 incessantly, and future extensively will be applied in the every field such as TV, illumination.
But, electrode and the organic layer of OLED display screen have the highest sensitivity to hydrone and oxygen, and the oxygen and the hydrone that infiltrate into OLED display screen can make OLED display performance deteriorate rapidly, drastically influence luminescent properties and working life.Thus it is guaranteed that the air-tightness of OLED encapsulation just becomes the key point manufacturing OLED display screen.Hereafter it is briefly described and has caused OLED to be difficult to some factor sealed:
1, air-tightness requires: oxygen (< 10-3cm3/m2/ days) and water (< 10-6g/ m2/ days)；
2, narrow limit design: the live width of general FRIT thin as far as possible (< 2mm), should ensure that and the sensitizing range (such as electrode) of oled layer is not produced heat affecting；
3, temperature controls: the heat affected area of FRIT can not make the relief area of OLED more than 100 DEG C；
4, hermetically sealing should be able to make a connection member (such as thin-film chromium electrodes) enter OLED display；
5, Stress Control: the stress produced during the cooling of air hermetic encapsulating material should not be too large the breakage causing packaged glass plate.
The conventional method of laser package is the method using laser to soften frit, be with presintering after frit (FRIT) be that (this FRIT is doped with the material to specific wavelength of light with high-absorbility for intermediate package solder, there is the characteristic of low melting point), FRIT normally about 0.7-1mm width, 6-100um is thick, utilize the advantage of the wavelength selectivity of specific absorption wavelength (600-1000nm) laser thermal effect, by the laser beam of high-energy laser output controlled power according in the seal line projecting coating FRIT successively, FRIT is heated rapidly between softening point and melting point (softening point temperature is less than melting point), ensure that it obtains good wellability in seal interface.Under molten condition, package interface generation atom level phase counterdiffusion, produce the strongest bonding force, and then form good air-tight packaging after the cooling period.
The mode of said sequence type heated frit, can be internally formed uneven Temperature Distribution at frit.This uneven temperature distribution within FRIT can cause the existence of packaging body stress difference, general packaging body corner stress is more than other regions, this is owing to corner's area is bigger, radiating rate is too fast, thermograde is defined with other regions, this stress difference result in the generation of the problems such as packaging body crackle, delamination, and close laser instrument after heated in sequence immediately and frit cooling can be caused too fast and cause bigger residual mechanical stress thus hinder or the air-tightness that weakens between cover-plate glass and base plate glass is connected.Meanwhile, the selection of the major parameter of seal process such as laser power, scanning speed etc., restricted by this mode, limited the raising of productivity.
Summary of the invention
In order to overcome defect present in prior art, the present invention provides a kind of step-by-step movement laser package temperature and power detection and control device and method, can effectively solve temperature distributing disproportionation and the problem of bigger residual mechanical stress.
In order to realize foregoing invention purpose, the present invention discloses a kind of step-by-step movement laser package temperature and power detection and control device, including: a laser instrument, for producing laser beam heats one frit, the width of this laser beam projects hot spot on this frit is more than the width of this frit；One motion-control module, is used for making this hot spot and this frit step in synchronization motion；One temperature detecting module, steps in synchronization the temperature of this frit in motor process for measuring this；One laser detection and control module, for detecting the pattern of this laser beam and controlling the power of this laser beam in real time.
Further, this temperature detecting module is a non-contact temperature sensor.
Further, this non-contact temperature sensor is an infrared temperature sensor.
Further, the heating region of this frit is divided into electrode zone, linearity region and corner region.
Further, the internal-and external diameter length of this corner region is different, and the area of this corner region is more than linearity region.
Present invention simultaneously discloses a kind of step-by-step movement laser package temperature and power detection and control method, including: generate laser beam heats one frit, make the width width more than this frit of this laser beam projects hot spot on this frit；This hot spot and this frit is made to step in synchronization motion；Measure this step in synchronization the temperature of this frit in motor process and detect the pattern of this laser beam；According to this temperature recorded and the power of this laser beam of morphology control.
Further, the heating region of this frit is divided into electrode zone, linearity region and corner region, and the internal-and external diameter length of this corner region is different, and the area of this corner region is more than linearity region.
Further, the power of this laser beam uses the mode cancelled step by step to be reduced.
Further, when this frit is heated to a preset temperature, cancel after reducing the power of this laser beam and keeping a period of time.
Further, when this frit is heated to a preset temperature, straight line reduces the power of this laser beam until being zero.
Compared with prior art, the present invention uses laser power to control the method cancelled, and effectively avoids the problem causing residual mechanical stress owing to cancelling laser power to make temperature reduction too fast immediately in conventional method.The present invention uses non-contact infrared temperature detecting sensor, fast and effectively frit temperature information in detection encapsulation process.The present invention is to the monitoring in real time such as frit temperature, laser beam power, shape and control.The present invention can carry out the configuration of frit temperature curve according to user's request.The present invention uses step-by-step movement to replace tradition scan-type encapsulation, more improves productivity while synchronizing uniformly heating.
Accompanying drawing explanation
Can be described in detail by invention below about the advantages and spirit of the present invention and institute's accompanying drawings is further understood.
Fig. 1 is the structural representation of step-by-step movement laser package temperature involved in the present invention and power detection and control device；
Fig. 2 is the motion module control flow chart of step-by-step movement laser package temperature involved in the present invention and power detection and control device；
Fig. 3 is OLED packaging body top view；
Fig. 4 is that packaging body frit area divides schematic diagram；
Fig. 5 is laser beam power spatial distribution curve chart；
Fig. 6 is the temperature control flow figure of step-by-step movement laser package temperature involved in the present invention and power detection and control device；
Fig. 7 is the schematic diagram of ordinary temperature control method；
Fig. 8 is Transient stress and apse rate graph of relation；
Fig. 9 is temperature and power under preset temperature；
Figure 10 is to preset temperature and power under the first power；
Figure 11 is to preset temperature and power under the second power；
Figure 12 is to preset temperature and power under the 3rd power.
Detailed description of the invention
Describe the specific embodiment of the present invention below in conjunction with the accompanying drawings in detail.
The purpose of the present invention is mainly for detection of the temperature of frit, and controls in real time from the result not up to controlled frit temperature with multipair laser beam power.
Present invention is generally directed to step-by-step movement laser package and design, laser beam forms a profile identical with encapsulation pattern after MMA adjusts and is projected on frit, realize the Synchronous Heating of frit pattern, owing to frit area is with the presence of electrode, the heat conductivity of contact conductor, thermal capacitance, reflectance etc. are all inconsistent with frit FRIT, therefore zones of different should use different laser powers, forms the spatial distribution of laser beam power.According to different frit temperature curves, regulation laser beam distribution in time in real time, and keep spatial distribution constant, thus reach the real-time control to laser beam power.
Based on MMA(Micro-Mirror Array) step-by-step movement laser package whole detection with control framework as shown in Fig. 1, including PC 100, motion-control module 1, temperature detecting module 2, laser detection and control module 3, laser instrument 4.
Wherein, PC 100 is mainly used in man-machine interaction.User will order with data (maximum that allows such as the start and stop of laser instrument, temperature parameter, speed, position data etc.) by Ethernet 5 to send to motion-control module 1, temperature detecting module 2, laser detection and control module 3, laser instrument 4, to realize the control to each module；When needs acquisition information, in the way of interrupt requests, the information such as position, temperature, laser beam pattern and power can be obtained from motion-control module 1, temperature detecting module 2, laser detection with control module 3 respectively.
Wherein, motion-control module 1 is mainly used in mechanical hand, work stage, the motor control of the first-class parts of laser.Receive the order and parameter issued from PC 100, this is explained and performs, control mechanical hand type fluctuating plate, the motion of work stage and laser head and be directed at, simultaneously by feedback information to the movement rate during each component movement, whether reach target location and accurately adjust, to solve motion and the orientation problem of each assembly.As shown in Fig. 2, the information of setting is contrasted with feedback information, error signal is transformed into voltage/current to H (s), H (s) by comparing result transmission, and after amplifying device amplifies, control executor's (generally motor) execution, to reach target.
Wherein, FRIT(frit during temperature detecting module 2 is mainly used in laser package) 12 accurate temperature measurement.Being sent the temperature information of FRIT to temperature detecting module 2 by infra-red radiation ripple 9, the temperature jointly completing FRIT with laser detection and control module 3 controls.
Wherein, the power of detection and laser instrument 4 that laser detection and control module 3 are mainly used in laser beam shape controls, laser detection and control module 3 receive the temperature information of temperature detecting module 2, the power (improving, reduce or keep constant) of laser instrument 4 is controlled by optical fiber 7, simultaneously, laser detection can control the pattern of laser beam with control module 3 by laser beam detector, is monitored the power of laser beam in real time by power detector.
Wherein, laser instrument 4 is mainly used in the generation of laser beam in encapsulation process, the wavelength of laser beam is 800 ~ 1000nm, the infrared laser beam 8 produced projects on frit 12, laser beam 8 has the hot spot 15 of specific pattern, certain power on frit 12, typically requires that the width of hot spot 15 is slightly larger than FRIT
12 width, to reach optimal heats.
Described frit 12 is positioned on the base plate glass 11 of glass packages 6, and described glass packages 6 representative instance is OLED display screen, and its primary structure includes: base plate glass 11, cover-plate glass 10, frit 12, oled layer 14 and electrode 13.Its sectional view is as it is shown in figure 1, top view such as Fig. 3.Frit by the step precuring such as silk screen printing, presintering, is formed and has certain thickness round rectangle seal line on cover-plate glass 10.Oled layer on base plate glass 11 is positioned at the inner side of frit-sealed line, there is the electrode connecting OLED display inside and outside on glass substrate simultaneously.
In packaging body, having contact conductor to draw in OLED organic layer, the heat conductivity of contact conductor, thermal capacitance, reflectance etc. are all inconsistent with frit FRIT, therefore this region can be caused to be heated uneven；Corner region area is relatively big, and internal-and external diameter length is different, and in the thus like time, obtained energy is bigger and uneven.For reducing situation in above two as far as possible, the modes such as general employing FRIT region divides, zones of different laser beam power difference, as shown in Figure 4 and Figure 5.
After OLED has encapsulated, conventional way, for directly closing laser instrument, stops heating packaging body, as shown in Figure 7.Due to the rapid decrease of temperature, residual mechanical stress (Transient stress &
Residual stress) it is present in packaging body, cause the crackle of packaging body to affect product yield.Transient
Stress(temporary stress) exist only in temperature decline during, its computing formula is summarized as σ=E α (Δ T) 2, and with temperature gradient curve relation as shown in Figure 8, wherein E is the coefficient of elasticity of Frit to stress, α is thermal coefficient of expansion, and Δ T is the decline number of temperature in the unit time.Final residual mechanical stress Residual stress(residual stress) with Transient stress(temporary stress), the thermal coefficient of expansion of upper lower glass substrate and coefficient of elasticity, Frit environment temperature etc. relevant.Directly closing the another aspect of laser instrument: owing to Frit cools down simultaneously, corner is owing to area is more than other regions, and radiating rate is fast, produces thermograde with other regions, thus produces stress gradient, causes the easy fragmentation of packaging body corner.
Coefficient of elasticity E of Frit and coefficient of expansion α are fixed value, Transient stress to be reduced, and can only reduce the temperature decline amount Δ T in the unit interval.Integrated temperature controls time and Transient stress, can use the method the most directly closing laser instrument and reduce laser power step by step, as shown in Figure 9.By temperature detecting module 2 and laser detection and control module 3, detecting temperature in real time and power adjusts in real time, to control the temperature of FRIT, make the temperature of FRIT change according to the temperature curve of user preset, control flow is as shown in Figure 6.This uses pid algorithm to realize the real-time control of temperature.Sampled FRIT temperature by temperature detecting module 2, with preset temperature curve comparison after DA converts, by pid algorithm, temperature is controlled, the control of temperature realizes by adjusting laser beam power in real time, therefore, temperature is adjusted result and is converted into the power curve of laser beam by power control card, and to laser control, it is achieved a closed loop controlling structure.During control, power space distribution curve keeps constant, changes the size of power, as shown in Figure 9 (solid line is temperature pre-programmed curve, and dotted line is for controlling power curve in real time) the most in time according to preset temperature curve.Equally, the most directly cancelling of laser power can be to packaging body continuous heating, and holding corner and the hygral equilibrium in other regions reduce the stress gradient even eliminating corner.
In the technical program, the control of FRIT temperature decline phase may be used without presetting the mode of laser beam power curve and realizes (requiring the strictest to the real-time monitoring of temperature because temperature declines the phase).Detection in real time and adjustment laser beam power, make laser beam power keep consistent with predetermined power；Do not carry out the real-time sampling of temperature, user prior FRIT rate of heat dispation, make laser beam power drop the phase at temperature less than this rate of heat dispation, using power against time curve as input value, and then control FRIT temperature.
First laser beam power is promoted to a higher value, in order to make FRIT fast softening；(temperature Th=Tsoft+50 DEG C is set, and Th is that temperature arranges peak, and Tsoft is frit softening point) when frit absorbs enough energy and reached Th, starts laser power is adjusted.The method that industry generally uses is for directly closing laser instrument, make frit natural cooling, but thermal stress difference that is different due to the radiating rate in each region shown in Fig. 4 and that cause, and natural cooling can cause too fast the scattering and disappearing and cause the stress between frit and upper lower glass plate to increase thus the problem that causes cracking, delamination etc. to affect productivity of heat.
The technical program have employed three kinds of methods cancelling power step by step, such as Figure 10 to 12, in order to avoid above-mentioned thermal stress issues:
Power reduces step by step: as shown in Figure 10, and when frit is heated to preset temperature Th, laser instrument starts to reduce output, and the percentage ratio that output reduces is determined by the energy dissipation N in the unit interval.The energy Q1=Pt(P that frit absorbs is laser power, and t is the time), frit heat is lost to Q2=Nt, therefore the energy Q=Q1 Q2 of the actual acquisition of frit=(P-N) t.The relation Q=mc △ T(m obtaining energy and temperature of material is the quality of material, and c is specific heat capacity, and △ T is the variable quantity of temperature), the change of temperature T to be controlled, it is only necessary to change laser power P.Temperature T presents a smooth decline curve along with declining step by step of power P.
Power keeps: as shown in figure 11, when frit is heated to preset temperature Th, reduces some value of laser power levels (this value be less than N), and when keeping one section after cancel, its temperature curve is the near linear that a slope is bigger；
Power slope K reduces: as shown in figure 12, when frit is heated to preset temperature Th, and the curve that power is reduced to after some value in slope K declines, until being reduced to zero, and temperature curve presents the parabolical form of class.
The preferred embodiment of the simply present invention described in this specification, above example is only in order to illustrate technical scheme rather than limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (10)
1. a step-by-step movement laser package temperature and power detection and control device, it is characterised in that including:
One laser instrument, for producing laser beam heats one frit, the width of described laser beam projects hot spot on described frit
Degree is more than the width of described frit；
One motion-control module, is used for making described hot spot and described frit step in synchronization motion；
One temperature detecting module, is used for stepping in synchronization described in measuring the temperature of frit described in motor process；
One laser detection and control module, for detecting the pattern of described laser beam and controlling the power of described laser beam in real time.
2. step-by-step movement laser package temperature as claimed in claim 1 and power detection and control device, it is characterised in that temperature detection
Module is a non-contact temperature sensor.
3. step-by-step movement laser package temperature as claimed in claim 2 and power detection and control device, it is characterised in that described non-connect
Touch temperature sensor is an infrared temperature sensor.
4. step-by-step movement laser package temperature as claimed in claim 1 and power detection and control device, it is characterised in that described glass
The heating region of material is divided into electrode zone, linearity region and corner region.
5. step-by-step movement laser package temperature as claimed in claim 4 and power detection and control device, it is characterised in that described turning
The internal-and external diameter length in region is different, and the area of described corner region is more than linearity region.
6. a step-by-step movement laser package temperature and power detection and control method, it is characterised in that including: generate a laser beam heats
One frit, makes the width width more than described frit of described laser beam projects hot spot on described frit；Make described
Hot spot and described frit step in synchronization motion；Temperature and the detection institute of frit described in motor process is stepped in synchronization described in measurement
State the pattern of laser beam；Power according to laser beam described in the described temperature recorded and morphology control.
7. step-by-step movement laser package temperature as claimed in claim 6 and power detection and control method, it is characterised in that described glass
The heating region of material is divided into electrode zone, linearity region and corner region, and the internal-and external diameter length of described corner region is different,
The area of described corner region is more than linearity region.
8. step-by-step movement laser package temperature as claimed in claim 6 and power detection and control method, it is characterised in that described laser
The power of bundle uses the mode cancelled step by step to be reduced.
9. step-by-step movement laser package temperature as claimed in claim 6 and power detection and control method, it is characterised in that when described glass
When glass material is heated to a preset temperature, cancel after reducing the power of described laser beam and keeping a period of time.
10. step-by-step movement laser package temperature as claimed in claim 6 and power detection and control method, it is characterised in that when described
When frit is heated to a preset temperature, straight line reduces the power of described laser beam until being zero.
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| CN201410198182.8A CN105895828A (en) | 2014-05-12 | 2014-05-12 | Stepping type laser packaging temperature and power detection-control device and method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109626847A (en) * | 2018-12-25 | 2019-04-16 | 大族激光科技产业集团股份有限公司 | A kind of OLED weld seam form monitoring method |
| CN115446455A (en) * | 2022-09-22 | 2022-12-09 | 山东大学 | Corner laser welding method based on power follow-up control |
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| CN101501808A (en) * | 2005-12-06 | 2009-08-05 | 康宁股份有限公司 | System and method for frit sealing glass packages |
| CN102690045A (en) * | 2011-03-21 | 2012-09-26 | 上海微电子装备有限公司 | Packaging device and packaging method |
| CN103464900A (en) * | 2013-08-09 | 2013-12-25 | 上海大学 | Laser sealing method and system |
| CN103474587A (en) * | 2013-09-30 | 2013-12-25 | 上海大学 | OLED packaging device |
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| JP3676748B2 (en) * | 2001-10-09 | 2005-07-27 | 翰立光電股▲分▼有限公司 | Encapsulation of display element and method for forming the same |
| CN101501808A (en) * | 2005-12-06 | 2009-08-05 | 康宁股份有限公司 | System and method for frit sealing glass packages |
| CN102690045A (en) * | 2011-03-21 | 2012-09-26 | 上海微电子装备有限公司 | Packaging device and packaging method |
| CN103464900A (en) * | 2013-08-09 | 2013-12-25 | 上海大学 | Laser sealing method and system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109626847A (en) * | 2018-12-25 | 2019-04-16 | 大族激光科技产业集团股份有限公司 | A kind of OLED weld seam form monitoring method |
| CN115446455A (en) * | 2022-09-22 | 2022-12-09 | 山东大学 | Corner laser welding method based on power follow-up control |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Applicant after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Applicant before: Shanghai Micro Electronics Equipment Co., Ltd. |
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Application publication date: 20160824 |