CN105891608A - Circuit board inductance test device and method - Google Patents
Circuit board inductance test device and method Download PDFInfo
- Publication number
- CN105891608A CN105891608A CN201610485500.8A CN201610485500A CN105891608A CN 105891608 A CN105891608 A CN 105891608A CN 201610485500 A CN201610485500 A CN 201610485500A CN 105891608 A CN105891608 A CN 105891608A
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- CN
- China
- Prior art keywords
- test
- inductance
- lower mold
- wiring board
- inductance measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2611—Measuring inductance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
The invention discloses a circuit board inductance test device and method, wherein the test method comprises the following steps: putting an inductance test product on a test lower mould, and enabling a contact pin of the inductance test product to be in corresponding contact with a test needle point; controlling a pressure bed to descend to close a test upper mould and the test lower mould; and carrying out inductance test on an inductance tester. According to the circuit board inductance test device, four-wire test principle is utilized and is combined with a conventional test machine table, so that the precise and batch test of the circuit board inductance are realized on the basis of not increasing the production cost, and therefore, the problems that current manually tested inductance data have lots of errors and the efficiency is low are solved very well, and the product quality requirements are guaranteed.
Description
Technical field
The invention belongs to PCB technical field of measurement and test, particularly relate to a kind of wiring board inductance measurement device and
Method of testing.
Background technology
Along with electronic product is to small size, highdensity development so that electronics units such as electric capacity, resistance, inductance
Device is inside wiring board, the development of surface.It is designed to loop construction in PCB surface and internal layer can realize
Inductive function, can be converted into inductance component solid space plane space or reduce components and parts volume, it is achieved
The high densification development of components and parts.
Wiring board inductive data can be changed, inductance number to be ensured by thickness of slab, live width, coil number change
According to accurate, this inductance value need to be carried out early stage detection, examination, current wiring board inductance measurement is to pass through
The measuring instrument of inductance component DATA REASONING is tested, and uses manual mode to measure single product.By
Moving etc. in the method for testing that the smart sensitivity of inductance value is higher, the most current, even p-wire all will be right
Test result has considerable influence, so that test data fluctuations is bigger, it is impossible to effectively screen product quality, and
And existing manual testing can only carry out single measurement to product, testing efficiency is low, low precision, it is impossible to formed batch
Measure examination.
Summary of the invention
It is an object of the invention to provide one and can realize wiring board inductance batch testing, and improve test number
Device according to accuracy.
It is an object of the invention to be achieved through the following technical solutions.
A kind of wiring board inductance measurement device, including board, described board is provided with operating board and inductance is surveyed
Examination instrument, described operating board upper surface is provided with a test lower mold and a test bracket, and this test bracket is pacified
Equipped with a press that can move up and down along test bracket, the downside of described press is installed with a corresponding position
Test mold directly over test lower mold, described test lower mold includes lower mold base, described under
Being provided with some test pin marks on mold base, described test pin mark connects wire and described inductance by test
Tester connects.
Preferably, described test bracket is made up of some support columns being fixedly mounted on operating board upper surface.
Preferably, described lower mold base is provided with the lower mold limit for placing inductance wiring board to be tested
Frame, described test pin mark correspondence is positioned in described lower mold frame, and described test pin mark is to be tested with inductance
The test foot correspondence contact of wiring board.
Preferably, described test mold includes mold base, described mold base is provided with one with
The described mold frame that lower mold frame is in the same size and position is corresponding.
The present invention also aims to provide one can realize wiring board inductance batch testing, and improve test
The method of accurate data.
A kind of wiring board inductance test method, including:
Inductance measurement product is placed on test lower mold, and makes inductance measurement product contact feet and test
Pin mark correspondence contacts；
Control press to decline, make test mold and test lower mold Guan Bi；
Inductance measurement is carried out by electric inductance measuring-testing instrument.
Preferably, inductance measurement product contact feet with test pin mark is corresponding contact after, successively will test pin mark,
Test connects wire, connection winding displacement is connected with electric inductance measuring-testing instrument, forms loop.
Preferably, carry out inductance measurement by electric inductance measuring-testing instrument, corresponding in instrument display screen display test result,
As tested display result beyond setting requirement, then it represents that do not pass through；It is positioned at setting requirement as tested display result
In the range of, then electric inductance measuring-testing instrument is pointed out, and expression is passed through.
Preferably, control to make press increase, make test mold separate with test lower mold, take out test board,
Change next inductance measurement product, repeat above step, carry out inductance measurement by electric inductance measuring-testing instrument.
The present invention compared with prior art, has the beneficial effects that: the wiring board inductance measurement dress that the present invention provides
Put and method of testing, utilize four line test philosophies, in conjunction with traditional test board, do not increasing production cost
On the basis of, it is achieved that wiring board inductance is accurate, batch testing, well solves existing manual testing's inductance
Error in data problem big, inefficient, ensures that product quality requirement.
Accompanying drawing explanation
Fig. 1 is that the present invention tests device front view；
Fig. 2 is that the present invention tests device rearview；
Fig. 3 is front view and the rearview of electric inductance measuring-testing instrument of the present invention；
Fig. 4 is the upper and lower mode host visual pattern of inductance measurement of the present invention；
Fig. 5 is inductance measurement product positive and negative figures.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and reality
Execute example, the present invention is further elaborated.Only should be appreciated that specific embodiment described herein
Only in order to explain the present invention, it is not intended to limit the present invention.
Referring to shown in Fig. 1, Fig. 1 is that the present invention tests device front view.The invention provides one can be real
Existing wiring board inductance batch testing, and improve the device of test accurate data.This device includes board,
Electric inductance measuring-testing instrument 1 and operating board 9 are installed on described board.
The front of electric inductance measuring-testing instrument 1 is correspondingly arranged on instrument display screen 2, instrument button 3 and on and off switch 4；
Be correspondingly arranged on the downside of the back side 17 of electric inductance measuring-testing instrument 1 electric inductance measuring-testing instrument winding displacement interface (see in Fig. 2 16 or
See in Fig. 3 18).
Operating board 9 side is provided with test start left button 10, rises button 11, decline button 12 and survey
The right button of experimental starting 13.
The upper surface of operating board 9 is provided with an equipment test bracket 6, and equipment test bracket 6 includes four
The support column being arranged at operating board 9 upper surface edge is constituted, and these four support columns are provided with press 5,
Press 5 controls to move up and down along four support columns by motor.
The downside of press 5 is installed with mold base 19, and mold base 19 is provided with one
Mold frame 20, in this mold frame 20, correspondence is installed with test mold 7 (left see Fig. 4).
When press 5 moves up and down along four support columns, corresponding drive test mold 7 moves up and down.
In the middle of the upper surface of operating board 9, correspondence is provided with lower mold base 21, and lower mold base 21 is arranged
There is a lower mold frame 22, lower mold frame 22 is correspondingly arranged on test pin mark 25 (see in Fig. 4
A, B, C, D) and test lower mold winding displacement interface 23, and be connected with test lower mold winding displacement interface 23
Test connect wire 24.Wherein test connection wire 24 is connected with electric inductance measuring-testing instrument winding displacement interface 18, instrument
Device display screen 2 is by carrying out inductance measurement parameter by instrument button 3 and test scope is set, and leads to
Cross display screen to carry out test result and show.
In lower mold frame 22, correspondence is provided with test lower mold 8, and described test lower mold 8 is positioned in test
The underface of mould 7, and the bottom of test lower mold 8 is provided with test lower mold winding displacement interface (in Fig. 2
14 or Fig. 4 right 23), inductance measurement can be connected by test lower mold winding displacement interface and connection winding displacement 15
Instrument winding displacement interface 16 (18).
As showing inductance measurement product front description 26 on the left of Fig. 5, it show inductance measurement as on the right side of Fig. 5
Product reverse side pattern 27.Inductance measurement product contains inductance measurement product A foot 28, inductance measurement product B
Foot 29, inductance measurement product A foot 28 and A, B two-point contact testing pin mark 25, inductance measurement product
B foot 29 and C, D two-point contact of test pin mark 25, then connect wire 24 by test and be connected to survey
Examination lower mold winding displacement interface 23, then be connected with electric inductance measuring-testing instrument winding displacement interface by connecting winding displacement 15.
It is above the explanation to wiring board inductance measurement device of the present invention, below in conjunction with specific embodiment to this
Invention wiring board inductance test method is further described.
Present invention also offers a kind of wiring board inductance measurement device and method of testing, it specifically includes following step
Rapid:
First inductance measurement product is placed on test lower mold 8, and makes the A foot of inductance measurement product
28 with A, B two-point contact of test pin mark 25, the B foot 29 of inductance measurement product and test pin mark 25
C, D two-point contact.
Then the press 5 of the push platform 9 left and right button of test start 10,13 control simultaneously declines, and makes survey
Examination mold 7 closes with test lower mold 8, and test product A, B foot test pin mark 25, test after tested
Connect wire 24, connection winding displacement 15 is connected with electric inductance measuring-testing instrument 1, forms loop and completes test.
By electric inductance measuring-testing instrument 1, inductance measurement product is carried out inductance measurement；In test process, test result
Display is on instrument display screen 2, and inductive data result shows that this numerical value heightens the color aobvious beyond setting requirement
Showing, if data are in claimed range, instrument then can send the sound of " dripping " and represent and pass through.
After having tested, then push platform 9 rises button 11, makes press 5 increase, now tests upper mold
Tool 7 separates with test lower mold 8, and operator takes out test board, changes next inductance measurement product afterwards,
Repeat above step.
The present invention utilizes four line test philosophies, in conjunction with traditional test board, on the basis not increasing production cost
On, it is achieved that wiring board inductance is accurate, batch testing, well solves existing manual testing's inductive data
Error problem big, inefficient, ensures that product quality requirement.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all at this
Any amendment, equivalent and the improvement etc. made within bright spirit and principle, should be included in the present invention
Protection domain within.
Claims (8)
1. a wiring board inductance measurement device, including board, it is characterised in that be provided with on described board
Operating board and electric inductance measuring-testing instrument, described operating board upper surface is provided with a test lower mold and a test bracket,
Being provided with a press that can move up and down along test bracket on this test bracket, the downside of described press is fixed
Being provided with a correspondence and be positioned at the test mold directly over test lower mold, described test lower mold includes lower mold
Tool base, described lower mold base is provided with some test pin marks, and described test pin mark is connected by test
Wire is connected with described electric inductance measuring-testing instrument.
2. wiring board inductance measurement device as claimed in claim 1, it is characterised in that described test bracket
It is made up of some support columns being fixedly mounted on operating board upper surface.
3. wiring board inductance measurement device as claimed in claim 1, it is characterised in that at the bottom of described lower mold
Being provided with the lower mold frame for placing inductance wiring board to be tested on seat, described test pin mark correspondence is positioned at
In described lower mold frame, and the test foot of described test pin mark wiring board to be tested with inductance is corresponding contacts.
4. wiring board inductance measurement device as claimed in claim 3, it is characterised in that described test upper mold
Tool include mold base, described mold base is provided with one with described lower mold frame in the same size and
The mold frame that position is corresponding.
5. use a wiring board inductance test method for device, its feature as described in Claims 1 to 4 is arbitrary
It is, including:
Inductance measurement product is placed on test lower mold, and makes inductance measurement product contact feet and test
Pin mark correspondence contacts；
Control press to decline, make test mold and test lower mold Guan Bi；
Inductance measurement is carried out by electric inductance measuring-testing instrument.
6. wiring board inductance test method as claimed in claim 5, it is characterised in that inductance measurement product
Contact feet with test pin mark is corresponding contact after, successively will test pin mark, test connect wire, connection winding displacement
It is connected with electric inductance measuring-testing instrument, forms loop.
7. wiring board inductance test method as claimed in claim 6, it is characterised in that pass through inductance measurement
Instrument carries out inductance measurement, corresponding in instrument display screen display test result, if test display result is beyond setting
Requirement, then it represents that do not pass through；Be positioned at setting claimed range as tested display result, then electric inductance measuring-testing instrument enters
Row prompting, expression is passed through.
8. wiring board inductance test method as claimed in claim 7, it is characterised in that control to make on press
Rise, make test mold separate with test lower mold, take out test board, change next inductance measurement product,
Repeat above step, carry out inductance measurement by electric inductance measuring-testing instrument.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610485500.8A CN105891608A (en) | 2016-06-28 | 2016-06-28 | Circuit board inductance test device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610485500.8A CN105891608A (en) | 2016-06-28 | 2016-06-28 | Circuit board inductance test device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105891608A true CN105891608A (en) | 2016-08-24 |
Family
ID=56719163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610485500.8A Pending CN105891608A (en) | 2016-06-28 | 2016-06-28 | Circuit board inductance test device and method |
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| Country | Link |
|---|---|
| CN (1) | CN105891608A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108362948A (en) * | 2018-03-10 | 2018-08-03 | 葛理想 | Full-automatic LCR inductance measurements device and its test method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070128076A1 (en) * | 2005-12-05 | 2007-06-07 | Gunther Bohm | Electrical test apparatus |
| CN101458297A (en) * | 2007-12-12 | 2009-06-17 | 康佳集团股份有限公司 | Printed circuit board test system and test method |
| CN101576571A (en) * | 2008-05-06 | 2009-11-11 | 深圳麦逊电子有限公司 | Density conversion method and density conversion device for PCB test machine |
| CN101887101A (en) * | 2010-06-09 | 2010-11-17 | 深圳市深联电路有限公司 | High withstand voltage testing device of single-sided aluminum-base printed circuit board and testing method |
| CN102608429A (en) * | 2011-01-19 | 2012-07-25 | 昆山万正电路板有限公司 | Inductance testing die for planar transformer |
-
2016
- 2016-06-28 CN CN201610485500.8A patent/CN105891608A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070128076A1 (en) * | 2005-12-05 | 2007-06-07 | Gunther Bohm | Electrical test apparatus |
| CN101458297A (en) * | 2007-12-12 | 2009-06-17 | 康佳集团股份有限公司 | Printed circuit board test system and test method |
| CN101576571A (en) * | 2008-05-06 | 2009-11-11 | 深圳麦逊电子有限公司 | Density conversion method and density conversion device for PCB test machine |
| CN101887101A (en) * | 2010-06-09 | 2010-11-17 | 深圳市深联电路有限公司 | High withstand voltage testing device of single-sided aluminum-base printed circuit board and testing method |
| CN102608429A (en) * | 2011-01-19 | 2012-07-25 | 昆山万正电路板有限公司 | Inductance testing die for planar transformer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108362948A (en) * | 2018-03-10 | 2018-08-03 | 葛理想 | Full-automatic LCR inductance measurements device and its test method |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20160824 |