CN105881754A - Compound die-cutting device for ceramic chip for production of notebook computer antennas - Google Patents
Compound die-cutting device for ceramic chip for production of notebook computer antennas Download PDFInfo
- Publication number
- CN105881754A CN105881754A CN201510039337.8A CN201510039337A CN105881754A CN 105881754 A CN105881754 A CN 105881754A CN 201510039337 A CN201510039337 A CN 201510039337A CN 105881754 A CN105881754 A CN 105881754A
- Authority
- CN
- China
- Prior art keywords
- mold
- red needle
- lower mold
- notebook computer
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000919 ceramic Substances 0.000 title claims abstract description 42
- 238000005520 cutting process Methods 0.000 title claims abstract description 26
- 150000001875 compounds Chemical class 0.000 title claims abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract description 9
- 238000004080 punching Methods 0.000 claims abstract description 9
- 239000002131 composite material Substances 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000007704 transition Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002320 enamel (paints) Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510039337.8A CN105881754B (en) | 2015-01-26 | 2015-01-26 | Produce the composite mold cutting device of notebook computer antenna ceramic paster |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510039337.8A CN105881754B (en) | 2015-01-26 | 2015-01-26 | Produce the composite mold cutting device of notebook computer antenna ceramic paster |
Publications (2)
Publication Number | Publication Date |
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CN105881754A true CN105881754A (en) | 2016-08-24 |
CN105881754B CN105881754B (en) | 2017-09-29 |
Family
ID=57001748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510039337.8A Active CN105881754B (en) | 2015-01-26 | 2015-01-26 | Produce the composite mold cutting device of notebook computer antenna ceramic paster |
Country Status (1)
Country | Link |
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CN (1) | CN105881754B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108023013A (en) * | 2016-11-01 | 2018-05-11 | 贝骨新材料科技(上海)有限公司 | Piezoelectric film sensor preparation method |
CN108237582A (en) * | 2016-12-26 | 2018-07-03 | 昊佰电子科技(上海)有限公司 | A kind of cutting part processing Multifunctional hardware mold |
Citations (12)
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JP2001301066A (en) * | 2000-04-25 | 2001-10-30 | Canon Inc | Method for cutting seal member |
CN201063962Y (en) * | 2007-06-25 | 2008-05-21 | 上海埃富匹西电子有限公司 | Flexible circuit board with two-sided glue |
CN201733521U (en) * | 2010-05-10 | 2011-02-02 | 苏州工业园区东晟模具有限公司 | Bump mold with substitute block |
CN102035074A (en) * | 2010-10-19 | 2011-04-27 | 电子科技大学 | Method for manufacturing radio frequency identification (RFID) tag antenna |
KR20120092273A (en) * | 2011-02-11 | 2012-08-21 | (주)크리노 | Rfid antenna structures and rfid antenna manufacturing method thereof |
CN202556485U (en) * | 2012-05-10 | 2012-11-28 | 苏州市飞莱克斯电路电子有限公司 | Punching-cutting die carrier structure for punching-cutting flexible circuit board |
CN202846621U (en) * | 2012-10-24 | 2013-04-03 | 苏州工业园区久泰精密电子有限公司 | Stamping die cutting machine |
CN103050771A (en) * | 2012-12-28 | 2013-04-17 | 东莞市康庄电路有限公司 | Machining tool for ripping position of micro-payment mobile phone antenna |
CN203994062U (en) * | 2014-07-04 | 2014-12-10 | 福建省石狮市通达电器有限公司 | A kind of ring plastic cement mouth of a river die cutting die |
US20150017395A1 (en) * | 2013-07-04 | 2015-01-15 | Skc Co., Ltd. | Cut-out laminated sheet and preparation method thereof |
CN104290134A (en) * | 2014-09-01 | 2015-01-21 | 东莞市飞新达精密机械科技有限公司 | Die cutting machining device and method |
CN204505581U (en) * | 2015-01-26 | 2015-07-29 | 上海景奕电子科技有限公司 | Produce the composite mold cutting device of notebook computer antenna ceramic paster |
-
2015
- 2015-01-26 CN CN201510039337.8A patent/CN105881754B/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001301066A (en) * | 2000-04-25 | 2001-10-30 | Canon Inc | Method for cutting seal member |
CN201063962Y (en) * | 2007-06-25 | 2008-05-21 | 上海埃富匹西电子有限公司 | Flexible circuit board with two-sided glue |
CN201733521U (en) * | 2010-05-10 | 2011-02-02 | 苏州工业园区东晟模具有限公司 | Bump mold with substitute block |
CN102035074A (en) * | 2010-10-19 | 2011-04-27 | 电子科技大学 | Method for manufacturing radio frequency identification (RFID) tag antenna |
KR20120092273A (en) * | 2011-02-11 | 2012-08-21 | (주)크리노 | Rfid antenna structures and rfid antenna manufacturing method thereof |
CN202556485U (en) * | 2012-05-10 | 2012-11-28 | 苏州市飞莱克斯电路电子有限公司 | Punching-cutting die carrier structure for punching-cutting flexible circuit board |
CN202846621U (en) * | 2012-10-24 | 2013-04-03 | 苏州工业园区久泰精密电子有限公司 | Stamping die cutting machine |
CN103050771A (en) * | 2012-12-28 | 2013-04-17 | 东莞市康庄电路有限公司 | Machining tool for ripping position of micro-payment mobile phone antenna |
US20150017395A1 (en) * | 2013-07-04 | 2015-01-15 | Skc Co., Ltd. | Cut-out laminated sheet and preparation method thereof |
CN203994062U (en) * | 2014-07-04 | 2014-12-10 | 福建省石狮市通达电器有限公司 | A kind of ring plastic cement mouth of a river die cutting die |
CN104290134A (en) * | 2014-09-01 | 2015-01-21 | 东莞市飞新达精密机械科技有限公司 | Die cutting machining device and method |
CN204505581U (en) * | 2015-01-26 | 2015-07-29 | 上海景奕电子科技有限公司 | Produce the composite mold cutting device of notebook computer antenna ceramic paster |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108023013A (en) * | 2016-11-01 | 2018-05-11 | 贝骨新材料科技(上海)有限公司 | Piezoelectric film sensor preparation method |
CN108023013B (en) * | 2016-11-01 | 2021-02-26 | 苏州贝骨新材料科技有限公司 | Preparation method of piezoelectric film sensor |
CN108237582A (en) * | 2016-12-26 | 2018-07-03 | 昊佰电子科技(上海)有限公司 | A kind of cutting part processing Multifunctional hardware mold |
CN108237582B (en) * | 2016-12-26 | 2024-04-02 | 上海昊佰智造精密电子股份有限公司 | Die-cutting spare processing is with multi-functional hardware mould |
Also Published As
Publication number | Publication date |
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CN105881754B (en) | 2017-09-29 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20170828 Address after: 201108, Minhang District, Shanghai Road, No. 2, 2059, 1, 1F101 room Applicant after: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. Address before: 201108 Shanghai Guanghua Road, Minhang District, No. 13, building 4, building 888 Applicant before: SHANGHAI JINGYI ELECTRONIC TECHNOLOGY Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180207 Address after: 201108 No. 103, room 2059, Shanghai City Road, Minhang District, Shanghai Patentee after: Elione Industry (Shanghai) Co.,Ltd. Address before: 201108, Minhang District, Shanghai Road, No. 2, 2059, 1, 1F101 room Patentee before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180504 Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee after: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. Address before: 201108 No. 103, room 2059, Shanghai City Road, Minhang District, Shanghai Patentee before: Elione Industry (Shanghai) Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee after: Shanghai Haobai Zhizao Precision Electronics Co.,Ltd. Address before: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |