CN105881754A - Compound die-cutting device for ceramic chip for production of notebook computer antennas - Google Patents
Compound die-cutting device for ceramic chip for production of notebook computer antennas Download PDFInfo
- Publication number
- CN105881754A CN105881754A CN201510039337.8A CN201510039337A CN105881754A CN 105881754 A CN105881754 A CN 105881754A CN 201510039337 A CN201510039337 A CN 201510039337A CN 105881754 A CN105881754 A CN 105881754A
- Authority
- CN
- China
- Prior art keywords
- mold
- red needle
- lower mold
- notebook computer
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims abstract description 42
- 238000005520 cutting process Methods 0.000 title claims abstract description 26
- 150000001875 compounds Chemical class 0.000 title claims abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract description 9
- 238000004080 punching Methods 0.000 claims abstract description 9
- 239000002131 composite material Substances 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000007704 transition Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002320 enamel (paints) Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention relates to a compound die-cutting device for a ceramic chip for production of notebook computer antennas. The compound die-cutting device comprises an upper die and a lower die which are arranged in a vertically aligned mode. An upper die punch pin is embedded on the lower surface of the upper die. A lower die punch pin is embedded in the upper surface of the lower die. The upper die punch pin and the lower die punch die are aligned up and down. The surface shape of the upper die punch pin and the surface shape of the lower die punch pin are both the same with that of the ceramic chip. Compared with the prior art, the upper die punch pin and the lower die punch die are arranged to carry out punching, the traditional structure with only one punch pin and one discharging opening is changed, the machining precision is higher, and the periphery of the ceramic chip product is free of burrs and cuttings. In the punching process, the punched ceramic chip is kept adhering to an original film layer, in other words, the original film is layer is kept from being cut through, and the ceramic chip is convenient to transfer without tearing the original film manually, so that one procedure is omitted, and productivity is improved.
Description
Technical field
The present invention relates to a kind of die-cutting apparatus, especially relate to a kind of production notebook computer antenna ceramic paster
Composite mold cutting device.
Background technology
Notebook computer antenna ceramic paster size is less, generally uses die-cutting apparatus to carry out cross cutting, and traditional
Die-cutting apparatus is together with former film excision forming, is then torn by the former film at the ceramic paster back side, then is posted dry
On clean mould release membrance.
The raw material producing notebook computer antenna ceramic paster includes two-layer, and bottom is that former film layer is (the most release
Film), upper strata is ceramic layer.
Common notebook computer antenna ceramic paster production mould as shown in Figure 1 and Figure 2, including mold 1
With lower mold 2, being provided with red needle 3 on the downside of mold 1, lower mold 2 is provided with red needle 3 to corresponding blanking port
4, described red needle 3 is corresponding with blanking port 4 shape, is notebook computer antenna ceramic paster shape.
Wherein, red needle 3 protrudes mold 1 lower surface 6mm, and blanking port 4 is also the edge of a knife position of lower mold 2, for
Hollow out state；Mold 1 surrounding is additionally provided with four guide pillars 5, matches being formed around of lower mold 2 and guide pillar 5
Four the guide pillar holes 6 closed.During use, raw material is placed in lower mold, four guide pillars of mold and lower mold
Four guide pillar holes carry out overlapping position, and then complete the die-cut of product, product, when die-cut, utilizes engraving of lower bolster
Sky rushes position output finished product, and the finished product of output also needs artificial hand again to tear the former film (being also mould release membrance) in gum district, then
It is posted to whole clean mould release membrance.
Weak point with occurring during the hardware dies punching products of this blanking type: 1. product edge has lousiness, powder
Bits；And not of uniform size, and it is difficult to wiping.2. during finished product manual tear former film time inconvenient, affect production capacity.3. go up
The red needle of mould and the blanking port serious wear of lower mold, need to repair a die when die-cut 5W time and have once, and cost is the highest.
Summary of the invention
Defect that the purpose of the present invention is contemplated to overcome above-mentioned prior art to exist and provide a kind of simple in construction,
Product edge does not cuts through without lousiness and break flour, former film, the production notebook computer antenna of length in service life pottery patch
The composite mold cutting device of sheet.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of composite mold cutting device producing notebook computer antenna ceramic paster, including consistency from top to bottom arrange upper
Mould and lower mold, described mold lower surface is embedded with upper mold red needle, and described lower mold upper surface is embedded with
The surface shape of lower mold red needle, described upper mold red needle and lower mold red needle consistency from top to bottom, and upper mold red needle and lower mold red needle
Shape is all identical with ceramic paster shape.
It is solid that described mold includes that the upper bolster set gradually from top to bottom, middle transition plate, the first upper mold position
Determining plate and the second upper mold location fixed plate, the first described upper mold location fixed plate positions in fixed plate with the second upper mold
Offering the upper mold red needle draw-in groove of consistency from top to bottom up/down perforation respectively, described upper mold red needle is embedded in upper mold red needle
In draw-in groove.
The lower surface of described upper mold red needle and the second upper mold location fixed plate lower surface flush.
Being provided with elastic component in described upper mold red needle draw-in groove, the upper surface of described upper mold red needle contacts with elastic component,
Elastic component provides the resilience force after upper mold red needle punching press.
Described lower mold includes die shoe and the lower mold location fixed plate being fixed on die shoe, and described lower mold is fixed
Offer the lower mold red needle draw-in groove of up/down perforation in the fixed plate of position, described die shoe offers and lower mold red needle card
The abutting groove of groove consistency from top to bottom, described lower mold red needle is embedded in lower mold red needle draw-in groove, and is connected to abut in groove.
The upper surface of described lower mold red needle positions fixed plate upper surface flush with lower mold.
Being provided with elastic component in described abutting groove, the lower surface of described lower mold red needle contacts with elastic component, elastic component
Resilience force after lower mold red needle punching press is provided.
Described elastic component is silica gel block.
Described mold is provided with guide pillar, and described lower mold is provided with the guide pillar hole matched with guide pillar.
When using assembly of the invention, four guide pillars of mold and four guide pillar holes of lower mold are utilized to overlap
Position, the upper mold red needle on mold and the lower mold red needle consistency from top to bottom in lower mold, carry out the stamping-out of raw material, molding
For notebook computer antenna ceramic paster shape, elastic component be provided with the fast of beneficially upper mold red needle and lower mold red needle
Speed resilience, and then complete the die-cut of product.
The raw material producing notebook computer antenna ceramic paster includes two-layer, and bottom is former film layer, and upper strata is pottery
Enamel coating.
When being punched out, raw material is placed in the fixed plate of lower mold location, utilize upper mold red needle on mold with under
Lower mold red needle on mould is punched out required ceramic paster, keeps the ceramic paster of stamping-out to be also bonded in former film layer simultaneously
On, i.e. keep former film layer not to be punched, thus product only need to be taken off from former film layer by the finished product of output, then be posted
To whole clean mould release membrance.
Compared with prior art, the present invention has the following advantages and beneficial effect:
(1) carry out stamping-out by arranging upper mold red needle and lower mold red needle, change one red needle of traditional use and
The structure of one blanking port so that machining accuracy is higher, ceramic paster product edge is without lousiness and break flour.
(2) in blanking process, keep the ceramic paster of stamping-out to be also bonded on former film layer, i.e. keep former film layer
It is not cut through, the convenient transfer to ceramic paster, it is not necessary to manually go again to tear former film, save a step operation, improves
Production capacity.
(3) upper mold red needle is substantially reduced with the abrasion of lower mold red needle, and just repairing a die when die-cut more than 100,000 times has once,
Cost reduces.
Accompanying drawing explanation
Fig. 1 is the upper die structure schematic diagram of common notebook computer antenna ceramic paster production mould；
Fig. 2 is the lower die structure schematic diagram of common notebook computer antenna ceramic paster production mould；
Fig. 3 is the decomposition texture schematic diagram of the composite mold cutting device mold of the present invention；
Fig. 4 is the overall structure schematic diagram of the composite mold cutting device mold of the present invention；
Fig. 5 is the decomposition texture schematic diagram of the composite mold cutting device lower mold of the present invention；
Fig. 6 is the overall structure schematic diagram of the composite mold cutting device lower mold of the present invention.
Label in figure: 1 is mold, 2 is lower mold, and 3 is red needle, and 4 is blanking port, and 5 is guide pillar, and 6 are
Guide pillar hole, 11 is upper bolster, and 12 is middle transition plate, and 13 is the first upper mold location fixed plate, and 14 is on second
Mould location fixed plate, 15 is upper mold red needle, and 16 is upper mold red needle draw-in groove, and 21 is die shoe, and 22 position for lower mold
Fixed plate, 23 is lower mold red needle, and 24 is lower mold red needle draw-in groove, and 25 for abutting groove.
Detailed description of the invention
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
Embodiment
A kind of composite mold cutting device producing notebook computer antenna ceramic paster, including consistency from top to bottom arrange upper
Mould 1 and lower mold 2, mold 1 is provided with guide pillar, and lower mold 2 is provided with the guide pillar hole matched with guide pillar.
As shown in Figure 3, Figure 4, mold 1 includes upper bolster 11, the middle transition plate set gradually from top to bottom
12, the first upper mold location fixed plate 13 and the second upper mold location fixed plate 14, the first upper mold location fixed plate 13
The upper mold red needle draw-in groove 16 offering consistency from top to bottom up/down perforation in fixed plate 14 respectively is positioned with the second upper mold,
Upper mold red needle 15 is embedded in upper mold red needle draw-in groove 16.The lower surface of upper mold red needle 15 and the second upper mold location are solid
Determine plate 14 lower surface to flush.Elastic component, the upper surface of upper mold red needle 15 and bullet it is provided with in upper mold red needle draw-in groove 16
Property part contact, elastic component provides the resilience force after upper mold red needle 15 punching press.Elastic component is silica gel block.
As shown in Figure 5, Figure 6, lower mold 2 includes die shoe 21 and the lower mold location being fixed on die shoe 21
Fixed plate 22, lower mold location fixed plate 22 offers the lower mold red needle draw-in groove 24 of up/down perforation, die shoe 21
On offer and the abutting groove 25 of lower mold red needle draw-in groove 24 consistency from top to bottom, lower mold red needle 23 is embedded in lower mold red needle
In draw-in groove 24, and it is connected to abut in groove 25.The upper surface of lower mold red needle 23 positions fixed plate 22 with lower mold
Upper surface flush.Being provided with elastic component in abutting groove 25, the lower surface of lower mold red needle 23 contacts with elastic component, elastic
Part provides the resilience force after lower mold red needle 23 punching press.Elastic component is silica gel block.
Upper mold red needle 15 and lower mold red needle 23 consistency from top to bottom, and the surface shape of upper mold red needle 15 and lower mold red needle 23
Shape is all identical with ceramic paster shape.
When using this device, four guide pillars of mold and four guide pillar holes of lower mold are utilized to carry out overlapping position, upper mold
Upper mold red needle 15 on tool 1 and lower mold red needle 23 consistency from top to bottom in lower mold 2, carry out the stamping-out of raw material, become
Type is notebook computer antenna ceramic paster shape, elastic component be provided with beneficially upper mold red needle 15 and bottom punch
The quick resilience of pin 23, and then complete the die-cut of product.
The raw material producing notebook computer antenna ceramic paster includes two-layer, and bottom is the former i.e. mould release membrance of film layer,
Upper strata is ceramic layer.When being punched out, raw material is placed in the fixed plate 22 of lower mold location, utilizes mold 1
On upper mold red needle 15 be punched out required ceramic paster with the lower mold red needle 23 in lower mold 2, keep stamping-out simultaneously
Ceramic paster be also bonded on former film layer, i.e. keep former film layer not to be punched, thus the finished product of output only need to will produce
Product take off from former film layer, then are posted to whole clean mould release membrance.
The above-mentioned description to embodiment is to be understood that for ease of those skilled in the art and use to send out
Bright.These embodiments obviously easily can be made various amendment by person skilled in the art, and at this
The General Principle illustrated is applied in other embodiments without through performing creative labour.Therefore, the present invention does not limits
In above-described embodiment, those skilled in the art are according to the announcement of the present invention, without departing from changing that scope is made
Entering and revise all should be within protection scope of the present invention.
Claims (9)
1. produce a composite mold cutting device for notebook computer antenna ceramic paster, arrange including consistency from top to bottom
Mold (1) and lower mold (2), it is characterised in that described mold (1) lower surface is embedded with upper mold
Red needle (15), described lower mold (2) upper surface is embedded with lower mold red needle (23), described upper mold red needle (15)
With lower mold red needle (23) consistency from top to bottom, and the surface configuration of upper mold red needle (15) and lower mold red needle (23) all with
Ceramic paster shape is identical.
A kind of composite mold cutting dress producing notebook computer antenna ceramic paster the most according to claim 1
Put, it is characterised in that described mold (1) includes upper bolster (11), the centre set gradually from top to bottom
Rebound (12), the first upper mold location fixed plate (13) and the second upper mold location fixed plate (14), described the
Offer respectively in one upper mold location fixed plate (13) and the second upper mold location fixed plate (14) consistency from top to bottom and on
Under through upper mold red needle draw-in groove (16), described upper mold red needle (15) is embedded in upper mold red needle draw-in groove (16)
In.
A kind of composite mold cutting dress producing notebook computer antenna ceramic paster the most according to claim 2
Put, it is characterised in that under the lower surface of described upper mold red needle (15) and the second upper mold location fixed plate (14)
Surface flushes.
A kind of composite mold cutting dress producing notebook computer antenna ceramic paster the most according to claim 2
Put, it is characterised in that in described upper mold red needle draw-in groove (16), be provided with elastic component, described upper mold red needle (15)
Upper surface contact with elastic component, elastic component provides the resilience force after upper mold red needle (15) punching press.
A kind of composite mold cutting dress producing notebook computer antenna ceramic paster the most according to claim 1
Put, it is characterised in that described lower mold (2) includes die shoe (21) and is fixed on die shoe (21)
Lower mold location fixed plate (22), described lower mold location fixed plate (22) offers the lower mold of up/down perforation
Red needle draw-in groove (24), described die shoe (21) offers and lower mold red needle draw-in groove (24) consistency from top to bottom
Abut groove (25), described lower mold red needle (23) is embedded in lower mold red needle draw-in groove (24), and be connected to
In access slot (25).
A kind of composite mold cutting dress producing notebook computer antenna ceramic paster the most according to claim 5
Put, it is characterised in that the upper surface of described lower mold red needle (23) positions fixed plate (22) upper surface with lower mold
Flush.
A kind of composite mold cutting dress producing notebook computer antenna ceramic paster the most according to claim 5
Put, it is characterised in that be provided with elastic component in described abutting groove (25), under described lower mold red needle (23)
Surface contacts with elastic component, and elastic component provides the resilience force after lower mold red needle (23) punching press.
8. according to a kind of compound die producing notebook computer antenna ceramic paster described in claim 4 or 7
Cutting apparatus, it is characterised in that described elastic component is silica gel block.
A kind of composite mold cutting dress producing notebook computer antenna ceramic paster the most according to claim 1
Putting, it is characterised in that described mold (1) is provided with guide pillar, described lower mold (2) is provided with and leads
The guide pillar hole that post matches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510039337.8A CN105881754B (en) | 2015-01-26 | 2015-01-26 | Produce the composite mold cutting device of notebook computer antenna ceramic paster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510039337.8A CN105881754B (en) | 2015-01-26 | 2015-01-26 | Produce the composite mold cutting device of notebook computer antenna ceramic paster |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105881754A true CN105881754A (en) | 2016-08-24 |
| CN105881754B CN105881754B (en) | 2017-09-29 |
Family
ID=57001748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510039337.8A Active CN105881754B (en) | 2015-01-26 | 2015-01-26 | Produce the composite mold cutting device of notebook computer antenna ceramic paster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105881754B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108023013A (en) * | 2016-11-01 | 2018-05-11 | 贝骨新材料科技（上海）有限公司 | Piezoelectric film sensor preparation method |
| CN108237582A (en) * | 2016-12-26 | 2018-07-03 | 昊佰电子科技（上海）有限公司 | A kind of cutting part processing Multifunctional hardware mold |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108023013A (en) * | 2016-11-01 | 2018-05-11 | 贝骨新材料科技（上海）有限公司 | Piezoelectric film sensor preparation method |
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| CN108237582A (en) * | 2016-12-26 | 2018-07-03 | 昊佰电子科技（上海）有限公司 | A kind of cutting part processing Multifunctional hardware mold |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105881754B (en) | 2017-09-29 |
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Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee after: Shanghai Haobai Zhizao Precision Electronics Co.,Ltd. Address before: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |