CN105873356B - A kind of PCB - Google Patents
A kind of PCB Download PDFInfo
- Publication number
- CN105873356B CN105873356B CN201610268467.3A CN201610268467A CN105873356B CN 105873356 B CN105873356 B CN 105873356B CN 201610268467 A CN201610268467 A CN 201610268467A CN 105873356 B CN105873356 B CN 105873356B
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- 239000003990 capacitor Substances 0.000 claims abstract description 64
- 230000008054 signal transmission Effects 0.000 claims abstract description 55
- 230000005540 biological transmission Effects 0.000 claims abstract description 31
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
Abstract
The present invention provides a kind of PCB, including：First reference layer, first medium layer, at least one signal transmission link, wherein, the signal transmission link is mounted on the first side of the first medium layer, and first reference layer is mounted on the second side of the first medium layer；The signal transmission link, including：Two transmission lines and alternating current AC coupled capacitor modules, wherein, it is connected between two transmission lines by the AC coupled capacitors module；At least one impedance hole is provided on first reference layer, at least one impedance hole is corresponded with the AC coupled capacitors module at least one signal transmission link, is not connected mutually between different impedance holes；Opening area of each described impedance hole on first reference layer, including：The corresponding AC coupled capacitors module in present impedance hole is projected in the view field on first reference layer with the projection pattern of orthographic projection.By technical scheme of the present invention, signal integrity can be improved.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed circuit board) technical fields, more particularly to a kind of
PCB。
Background technology
It is also higher and higher to the design requirement of signal transmission link with the continuous improvement of signal transmission rate, it needs to pass
Transmission link has stronger antijamming capability, to ensure the integrality of high speed signal.
At present, in order to ensure the integrality of high speed signal, sender unit is transmitted usually using differential signal link
The high speed signal sent to signal receiving device, meanwhile, in order to prevent because depositing between sender unit and signal receiving device
Cause signal transmission link, sender unit or signal receiving device that short circuit phenomenon occurs in direct voltage difference, usually need
To concatenate a coupled capacitor respectively on each transmission lines of differential pair, it is ensured that sender unit is received with signal and filled
Between putting under the premise of it mutually can transmit AC signal, the direct current between sender unit and signal receiving device is filtered out
Component of voltage.
But in the above-mentioned technical solutions, since the impedance for concatenating coupled capacitor on the transmission line is usually less than transmitted
The impedance of line causes the signal transmission link impedance between sender unit and signal receiving device inconsistent, passes through the letter
The integrality of the signal of number transmission link transmission is affected.
Invention content
An embodiment of the present invention provides a kind of PCB, can improve signal integrity.
An embodiment of the present invention provides a kind of printing board PCB, including：
First reference layer, first medium layer, at least one signal transmission link, wherein, the signal transmission link installation
In the first side of the first medium layer, first reference layer is mounted on the second side of the first medium layer；
The signal transmission link, including：Two transmission lines and alternating current AC coupled capacitor modules, wherein, two transmission
It is connected between line by the AC coupled capacitors module；
Be provided at least one impedance hole on first reference layer, at least one impedance hole with it is described at least one
AC coupled capacitors module in signal transmission link corresponds, and is not connected mutually between different impedance holes；
Opening area of each described impedance hole on first reference layer, including the corresponding AC couplings in present impedance hole
Close the view field that capacitance module is projected in the projection pattern of orthographic projection on first reference layer.
Further,
The number of the signal transmission link is 2n, wherein, n represents positive integer；
Signal transmission link described in each two is mounted on the first of the first medium layer with the cabling mode of difference cabling
Side forms at least one differential signal link.
Further, it further includes：
Sender unit and signal receiving device, wherein, the sender unit is pacified with the signal receiving device
Mounted in the first side of the first medium layer, by described in one between the sender unit and the signal receiving device
Differential signal link is attached.
Further, the AC coupled capacitors module, including：
AC coupled capacitors and two pads, wherein, the AC coupled capacitors are coupled by described two pads with current AC
Corresponding two transmission lines of capacitance module connect one to one.
Further,
The AC coupled capacitors, including：0402AC coupled capacitors.
Further,
The impedance hole includes：Oblong impedance hole, wherein,
Trepanning length of the oblong impedance hole on first reference layer includes：45mil；
Aperture widths of the oblong impedance hole on first reference layer include：24mil.
Further,
At least one mounting hole is provided on the first medium layer；
AC coupled capacitors module at least one signal transmission link is mounted at least one installation one by one
Kong Zhong.
Further, it further includes：
Second dielectric layer and the second reference layer, wherein,
First reference layer is mounted between the first medium layer and the second dielectric layer；
The second dielectric layer is mounted between first reference layer and second reference layer；
The impedance hole includes：Through-hole.
An embodiment of the present invention provides a kind of PCB, by setting at least one impedance hole on the first reference layer, each
The opening area of impedance hole includes the corresponding AC coupled capacitors module in present impedance hole and is projected in the with the projection pattern of orthographic projection
View field on one reference layer to increase the distance between AC coupled capacitors module and reference layer plane, and then increases signal
Characteristic impedance in transmission link at AC coupled capacitors module so that the feature in signal transmission link at AC coupled capacitors module
Impedance and the characteristic impedance of transmission line are consistent, and the signal transmitted by current demand signal transmission link will not reflect, can
Improve signal integrity.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is a kind of structure diagram for PCB that one embodiment of the invention provides；
Fig. 2 is the structure diagram for another PCB that one embodiment of the invention provides；
Fig. 3 is the annexation figure of the AC coupled capacitors module and transmission line in the PCB that one embodiment of the invention provides；
Fig. 4 is the signal return flow path schematic diagram on the first reference layer in the PCB that one embodiment of the invention provides.
Fig. 5 is the structure diagram of another PCB provided in an embodiment of the present invention.
Specific embodiment
Purpose, technical scheme and advantage to make the embodiment of the present invention are clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments, based on the embodiments of the present invention, those of ordinary skill in the art
The all other embodiments obtained under the premise of creative work is not made, shall fall within the protection scope of the present invention.
As shown in Figure 1, an embodiment of the present invention provides a kind of PCB, including：
First reference layer 1, first medium layer 2, at least one signal transmission link 3, wherein, the signal transmission link 3
Mounted on the first side of the first medium layer 2, first reference layer 1 is mounted on the second side of the first medium layer 2；
The signal transmission link 3, including：Two transmission lines 4 and alternating current AC coupled capacitors module 5, wherein, two biographies
It is connected between defeated line 4 by the AC coupled capacitors module 5；
Be provided at least one impedance hole 6 on first reference layer 1, at least one impedance hole 6 with it is described at least
AC coupled capacitors module 5 in one signal transmission link 3 corresponds, and is not connected mutually between different impedance holes 6；
Each opening area of the impedance hole 6 on first reference layer 1, including：Present impedance hole 6 is corresponding
AC coupled capacitors module 5 is projected in the view field on first reference layer 1 with the projection pattern of orthographic projection.
In one embodiment of the invention, by setting at least one impedance hole on the first reference layer, each impedance hole
Opening area is projected in the first reference layer including the corresponding AC coupled capacitors module in present impedance hole with the projection pattern of orthographic projection
On view field, to increase AC coupled capacitors module with the distance between with reference to layer plane, and then increasing signal transmission link
Characteristic impedance at middle AC coupled capacitors module so that the characteristic impedance at AC coupled capacitors module and biography in signal transmission link
The characteristic impedance of defeated line is consistent, and the signal transmitted by current demand signal transmission link will not reflect, and can improve signal
Integrality.
Further, in order to improve the antijamming capability of signal transmission link, as shown in Fig. 2, the present invention one is preferred real
It applies in example, the number of the signal transmission link 3 is 2n, wherein, n represents positive integer；
Signal transmission link 3 described in each two is mounted on the of the first medium layer 2 with the cabling mode of difference cabling
Side forms at least one differential signal link.
Correspondingly, as shown in Fig. 2, in a preferred embodiment of the invention, further include：
Sender unit 7 and signal receiving device 8, wherein, the sender unit 7 and the signal receiving device
8 are mounted on the first side of the first medium layer, pass through one between the sender unit 7 and the signal receiving device 8
A differential signal link is attached.
In one embodiment of the invention, two signal transmission links in differential signal link may be used in close proximity to and put down
The cabling mode of walking line so that external interference signal is acted on simultaneously on two signal transmission links, external interference signals
It is identical for the interference effect of high speed signal transmitted respectively on two signal transmission links, and differential signal link actual transmissions
The signal of targeted cache all the way depend on the difference of two high speed signals that receives of signal receiving device, interference signal is made respectively
It can mutually be supported during signal receiving device calculates the difference of two high speed signals for the effect of differential signal chain road
Disappear, therefore, a differential signal link is built using two signal transmission links, signal is sent using differential signal link and is filled
During the targeted cache signal transmission to signal receiving device for putting transmission, differential signal link has stronger anti-interference energy
Power is not easily susceptible to interfere by the targeted cache signal of differential signal link transmission.
Further, the AC coupled capacitors being commonly used on PCB are usually patch type AC coupled capacitors, and patch type AC couplings are electric
Hold no pin, need through corresponding pad to connect transmission line, therefore, as shown in figure 3, a preferred embodiment of the invention
In, the AC coupled capacitors module 5, including：
AC coupled capacitors 10 and two pads 9, wherein, the AC coupled capacitors 10 are by described two pads 9 and currently
5 corresponding two transmission lines 4 of AC coupled capacitors module connect one to one.
Specifically, in a preferred embodiment of the invention, the AC coupled capacitors 10, including：0402AC coupled capacitors.
In one embodiment of the invention, the sizes of 0402AC coupled capacitors is 0.4mm*0.2mm, to 0402AC coupled capacitors into
Row encapsulation, during connecting corresponding transmission line respectively by two pads, pad is generally elliptical, and the long axis of pad can wrap
22mil is included, short axle can include 18mil, and the short axle of same AC coupled capacitor moulds two pads in the block is mutually parallel,
The distance in the center of circle of two pads can include 27mil；At this point, the AC of encapsulation 0402AC coupled capacitors and two pads to form
Opening area of the corresponding impedance hole of coupled capacitor module on the first reference layer, including coupled capacitor module with the throwing of orthographic projection
Shadow mode is projected in the view field on the first reference layer, on the first reference layer during actual setting impedance hole, impedance
The opening area in hole can be slightly larger than view field, for example, along the range of view field extension 1mil outward as opening area；
Correspondingly, as shown in figure 4, in a preferred embodiment of the invention, the impedance hole 6 includes：Oblong impedance hole, wherein,
Trepanning length of the oblong impedance hole on first reference layer includes：45mil；
Aperture widths of the oblong impedance hole on first reference layer include：24mil.
In one embodiment of the invention, when signal transmission link transmits high speed signal, need to select on reference layer most short time
Flow path, as shown in figure 4, on the first reference layer set impedance hole A and impedance hole B when, due to reference layer integrality by
It destroys, arrow shown in Fig. 4 is directed toward the signal transmitted in characterization impedance hole A and the corresponding signal transmission links of impedance hole B
Reflux direction, it is seen then that setting impedance hole A and impedance hole B after, impedance hole A and the corresponding signal transmission links of impedance hole B
Unit element return flow path destroyed, returned signal is when reaching impedance hole A or impedance hole B, it may occur that turn to, increase letter
Number return flow path；From fig. 4, it can be seen that when impedance hole A and impedance hole B is interconnected, corresponding signal return flow path will continue to increase
Greatly, and opening area of the impedance hole on reference layer is excessive, when causing return flow path excessive, will lead to impedance hole A and impedance hole B
The loss increase of transmission line in corresponding signal transmission link, the impedance for causing transmission line is relatively low so that impedance hole A and
The characteristic impedance of the corresponding signal transmission links of impedance hole B is discontinuous；Therefore, it when setting impedance hole, needs rationally to set
The opening area of impedance hole is put, the impedance hole of corresponding different AC coupled capacitors modules should not connect mutually.
Further, in order to save the space of the routing layer of PCB, AC coupled capacitor modules may be mounted at adjacent dielectric
In, specifically, in a preferred embodiment of the invention, at least one mounting hole is provided on the first medium layer (in attached drawing
It is not shown)；
AC coupled capacitors module at least one signal transmission link is mounted at least one installation one by one
Kong Zhong.
Further, PCB can also use multi-layer framework, by the neighboring reference layer of signal transmission link, AC couplings
It closes capacitance module and setting through-hole at the view field of neighboring reference layer is projected to the projection pattern of orthographic projection, it will be apart from current
Another reference layer of signal transmission link farther out as new reference layer, increase in signal transmission link AC coupled capacitors module with
The distance between reference layer, to increase the characteristic impedance in signal transmission link at AC coupled capacitors module；Specifically, such as Fig. 5
It is shown, in a preferred embodiment of the invention, further include：
11 and second reference layer 12 of second dielectric layer, wherein,
First reference layer 1 is mounted between the first medium layer 2 and the second dielectric layer 11；
The second dielectric layer 11 is mounted between first reference layer 1 and second reference layer 12；
The impedance hole 6 includes：Through-hole.
The each embodiment of the present invention at least has the advantages that：
1st, by setting at least one impedance hole on the first reference layer, the opening area of each impedance hole is included currently
The corresponding AC coupled capacitors module of impedance hole is projected in the view field on the first reference layer with the projection pattern of orthographic projection, to increase
The distance between big AC coupled capacitors module and reference layer plane, and then increase in signal transmission link at AC coupled capacitor modules
Characteristic impedance so that the characteristic impedance of characteristic impedance and transmission line in signal transmission link at AC coupled capacitors module is kept
Unanimously, the signal transmitted by current demand signal transmission link will not reflect, and can improve signal integrity.
2nd, it is not connected mutually between each impedance hole, prevent in the first reference layer opening area excessive and signal is caused to pass
The corresponding signal return flow path of transmission link is long, the loss increase of transmission line, and the impedance for causing transmission line is relatively low so that signal passes
The characteristic impedance of transmission link is discontinuous.
3rd, using multi-layer framework, by the neighboring reference layer of signal transmission link, AC coupled capacitors module is just to throw
The projection pattern of shadow, which projects to, sets through-hole at the view field of neighboring reference layer, will be apart from current demand signal transmission link farther out
Another reference layer as new reference layer, increase the act between AC coupled capacitors module and reference layer in signal transmission link
Example, to increase the characteristic impedance in signal transmission link at AC coupled capacitors module.
It should be noted that herein, such as first and second etc relational terms are used merely to an entity
Or operation is distinguished with another entity or operation, is existed without necessarily requiring or implying between these entities or operation
Any actual relationship or order.Moreover, term " including ", " including " or its any other variant be intended to it is non-
It is exclusive to include, so that process, method, article or equipment including a series of elements not only include those elements,
But also it including other elements that are not explicitly listed or further includes solid by this process, method, article or equipment
Some elements.In the absence of more restrictions, the element limited by sentence " include one ... ", it is not excluded that including
Also there is other identical factor in the process of the element, method, article or equipment.
One of ordinary skill in the art will appreciate that：Realizing all or part of step of above method embodiment can pass through
The relevant hardware of program instruction is completed, and aforementioned program can be stored in computer-readable storage medium, the program
When being executed, step including the steps of the foregoing method embodiments is performed；And aforementioned storage medium includes：ROM, RAM, magnetic disc or light
In the various media that can store program code such as disk.
It is last it should be noted that：The foregoing is merely presently preferred embodiments of the present invention, is merely to illustrate the skill of the present invention
Art scheme, is not intended to limit the scope of the present invention.Any modification for being made all within the spirits and principles of the present invention,
Equivalent replacement, improvement etc., are all contained in protection scope of the present invention.
Claims (8)
1. a kind of PCB, which is characterized in that including：
First reference layer, first medium layer, at least one signal transmission link, wherein, the signal transmission link is mounted on institute
The first side of first medium layer is stated, first reference layer is mounted on the second side of the first medium layer；
The signal transmission link, including：Two transmission lines and alternating current AC coupled capacitor modules, wherein, two transmission lines it
Between pass through the AC coupled capacitors module connect；
At least one impedance hole, at least one impedance hole and at least one signal are provided on first reference layer
AC coupled capacitors module in transmission link corresponds, and is not connected mutually between different impedance holes；
Opening area of each described impedance hole on first reference layer, including the corresponding AC couplings electricity in present impedance hole
Molar block is projected in the view field on first reference layer with the projection pattern of orthographic projection.
2. PCB according to claim 1, which is characterized in that
The number of the signal transmission link is 2n, wherein, n represents positive integer；
Signal transmission link described in each two is mounted on the first side of the first medium layer, structure with the cabling mode of difference cabling
Into at least one differential signal link.
3. PCB according to claim 2, which is characterized in that further include：
Sender unit and signal receiving device, wherein, the sender unit is mounted on the signal receiving device
First side of the first medium layer passes through a difference between the sender unit and the signal receiving device
Signal link is attached.
4. according to the PCB any in claims 1 to 3, which is characterized in that the AC coupled capacitors module, including：
AC coupled capacitors and two pads, wherein, the AC coupled capacitors pass through described two pads and current AC coupled capacitors
Corresponding two transmission lines of module connect one to one.
5. PCB according to claim 4, which is characterized in that
The AC coupled capacitors, including：0402AC coupled capacitors.
6. PCB according to claim 5, which is characterized in that
The impedance hole includes：Oblong impedance hole, wherein,
Trepanning length of the oblong impedance hole on first reference layer includes：45mil；
Aperture widths of the oblong impedance hole on first reference layer include：24mil.
7. PCB according to claim 1, which is characterized in that
At least one mounting hole is provided on the first medium layer；
AC coupled capacitors module at least one signal transmission link is mounted at least one mounting hole one by one.
8. PCB according to claim 1, which is characterized in that further include：
Second dielectric layer and the second reference layer, wherein,
First reference layer is mounted between the first medium layer and the second dielectric layer；
The second dielectric layer is mounted between first reference layer and second reference layer；
The impedance hole includes：Through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610268467.3A CN105873356B (en) | 2016-04-27 | 2016-04-27 | A kind of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610268467.3A CN105873356B (en) | 2016-04-27 | 2016-04-27 | A kind of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105873356A CN105873356A (en) | 2016-08-17 |
| CN105873356B true CN105873356B (en) | 2018-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610268467.3A Active CN105873356B (en) | 2016-04-27 | 2016-04-27 | A kind of PCB |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106341948B (en) * | 2016-09-09 | 2018-11-20 | 郑州云海信息技术有限公司 | A kind of PCB design method and PCB |
| CN106646777B (en) * | 2016-12-14 | 2019-05-28 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module and its design method |
| CN106658953A (en) * | 2017-03-13 | 2017-05-10 | 深圳天珑无线科技有限公司 | PCB of mobile terminal, and mobile terminal |
| CN110662346A (en) * | 2019-09-30 | 2020-01-07 | 歌尔股份有限公司 | PCB board |
| CN115023026B (en) * | 2021-10-27 | 2023-04-14 | 荣耀终端有限公司 | Circuit board and electronic device |
| CN116209136B (en) * | 2021-11-30 | 2023-12-01 | 荣耀终端有限公司 | Signal transmission structure, electronic equipment and PCB |
| CN114302554B (en) * | 2021-12-17 | 2023-11-28 | 上海御渡半导体科技有限公司 | PCB (printed circuit board) capable of improving integrity of cross-split signals based on capacitance and layout method thereof |
| CN114501778B (en) * | 2021-12-25 | 2023-05-23 | 苏州浪潮智能科技有限公司 | PCB and server for high-speed differential signal coupling transmission |
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|---|---|---|---|---|
| CN1870852A (en) * | 2005-05-28 | 2006-11-29 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board with improved differential via |
| JP2011165910A (en) * | 2010-02-10 | 2011-08-25 | Nec Corp | Wiring board |
| CN104219870A (en) * | 2013-06-04 | 2014-12-17 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4012040B2 (en) * | 2002-10-31 | 2007-11-21 | キヤノン株式会社 | Center tap termination circuit and printed wiring board having center tap termination circuit |
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- 2016-04-27 CN CN201610268467.3A patent/CN105873356B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1870852A (en) * | 2005-05-28 | 2006-11-29 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board with improved differential via |
| JP2011165910A (en) * | 2010-02-10 | 2011-08-25 | Nec Corp | Wiring board |
| CN104219870A (en) * | 2013-06-04 | 2014-12-17 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
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| CN105873356A (en) | 2016-08-17 |
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