CN105869871A - Assembling method for electronic device - Google Patents
Assembling method for electronic device Download PDFInfo
- Publication number
- CN105869871A CN105869871A CN201610204628.2A CN201610204628A CN105869871A CN 105869871 A CN105869871 A CN 105869871A CN 201610204628 A CN201610204628 A CN 201610204628A CN 105869871 A CN105869871 A CN 105869871A
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- CN
- China
- Prior art keywords
- pin
- pedestal
- electronic
- assembling method
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Motors, Generators (AREA)
Abstract
The invention provides an assembling method for an electronic device. The assembling method is used for assembling a plurality of coils, wherein each coil comprises a magnetic ring and a plurality of lead wires; the plurality of lead wires are wound on each magnetic ring; and the assembling method comprises an electronic base manufacturing step, a coil mounting step and a laser welding step; an electronic base is manufactured in the electronic base manufacturing step; the electronic base comprises a base body and a plurality of pins; each pin comprises a connection segment which protrudes on the base body; a clamping groove is formed in each connection segment; the coils are put into the base body in the coil mounting step; and then each lead wire is pulled to the corresponding pin and is oppositely pressed into the clamping groove of the corresponding pin. The connection segment of each pin is irradiated by a laser beam in the laser welding step, so that each connection segment is connected with the corresponding clamped lead wire in a fusing manner. Through the assembling method, the assembly structure of each lead wire and the corresponding pin can be relatively convenient and easy; and the welding effect is relatively excellent.
Description
Technical field
The present invention relates to a kind of assembling method, particularly relate to a kind of for several coils are assembled
The assembling method of the electronic installation in an electronic seat.
Background technology
As shown in Figures 1 and 2, the assembling method of a kind of existing electronic installation, is for by number
Individual coil 1 is assembled in an electronic seat 2.Each coil 1 has a magnet ring 11, and
Several circles are around in the wire 12 of this magnet ring 11.This electronic seat 2 has a described coil of confession 1
The pedestal 21 contained, and the connecing of several the left and right sides being plugged in this pedestal 21 at each interval
Foot 22.Each branch connecting pin 22 has a section of being embedded into being combined in this pedestal 21 221,
The wiring section 222 of the individual end face upwards being stretched out this pedestal 21 by one end of this section of being embedded into 221,
And a lateral surface outwards being stretched out this pedestal 21 by the other end of this section of being embedded into 221 is convex
Foot section 223.This wiring section 222 has a width and collects and be wound around for corresponding wire 12
Wound portion 224.
Shown in as shown in Figure 2, Figure 3 and Figure 4, and the assembling method of this electronic installation comprises an electricity
Stroma manufacturing step 31, one installs coil step 32, a hot dipped tinning step 33, and
One pin bending step 34.In this electronic seat manufacturing step 31, produce described pin
22 these electronic seats 2 combined with this pedestal 21.Then in this installation coil step 32
In, described coil 1 is put into this pedestal 21, more each wire 12 is pulled to corresponding
Pin 22 and be wound in the wound portion 224 of this pin 22.Then in this hot dipped tinning step
In 33, the wound portion 224 of described pin 22 is immersed in the tin soldering liquid of high-temperature fusion, make institute
The wire 12 of the wound portion 224 and corresponding winding of stating pin 22 combines and in surface shape
Become one layer of coating 225, so as to the described pin of electrical connection 22 and described coil 1.Finally connect at this
In foot bending step 34, the more convex foot section 223 of described pin 22 is bent into required form.
Although above-mentioned assembling method, can described coil 1 is grouped together with this electronic seat 2,
But be short-circuited or breaking phenomena in order to avoid described wire 12 gets loose, during so assembling
Must pass through and be manually wrapped in bothersome for each wire 12 on corresponding pin 22, because of
This assembles time-consuming and trouble inconvenience of more taking a lot of work.Additionally, in this hot dipped tinning step, need
To be different from described wire 12 and the tin soldering liquid of described pin 22 furthermore with material, to carry out hot dipping
Weld described wire 12 and described pin 22, will produce thus and change between substantial amounts of metal
Compound, is susceptible to the bad phenomenon such as short circuit or reliability reduction, causes finished product fraction defective to raise,
The most above-mentioned assembling method still haves much room for improvement.
Summary of the invention
It is an object of the invention to provide and a kind of assemble convenient and that yield can be improved electronic installation
Assembling method.
The assembling method of the electronic installation of the present invention, is used for assembling several coil, each coil
There is the magnet ring of a hollow, and several circles are around in the wire that this magnet ring stretches the most outward, this group
The method of connecing comprises the steps of an electronic seat manufacturing step, an installation coil step, and
One laser welding step.This electronic seat manufacturing step produces an electronic seat, this electronic seat
Including the pedestal of a hollow, and several the pins being inserted in this pedestal at each interval, each
Branch connecting pin has a wiring section stretching out this pedestal, and this wiring section has an end face, and
One clip slot being formed at this end face.Described coil is put into this electronic seat by this installation coil step
This pedestal in, more each wire of each coil is pulled to corresponding pin, and
Corresponding this clip slot that is pressed into is to be embedded in this wiring section.This laser welding step irradiates with thunder laser beam
The wiring section of described pin, makes each wiring section melt with the wire of corresponding sandwiched and is connected to one
Rise.
The assembling method of the electronic installation of the present invention, in this electronic seat manufacturing step, prepared
Each wiring section of each branch connecting pin also there is a projection stretching out this pedestal, and
Two adjacent one another are and from this projection toward the prong portion of the direction projection away from this pedestal, described
Prong portion matches with this projection and defines this clip slot, in this laser welding step, each
The described prong portion wire therein with sandwiched of individual wiring section is melt into spherical.
The assembling method of the electronic installation of the present invention, in this electronic seat manufacturing step, prepared
Each clip slot of each branch connecting pin there is an embedding porose area away from this end face, one by this
Embedding porose area toward this end face direction extend profile groove district, and one by this profile groove district away from this embedding hole
The one end in district is communicated to the guide groove district of this end face, and the diameter of this embedding porose area is equal to respective wire
Diameter, the width in this profile groove district is less than the diameter of respective wire, and the width in this guide groove district is by this
Profile groove district gradually opens expansion to this end face, and in this installation coil step, each wire is led by this
Groove district is guided into this profile groove district, and in crowded by this profile groove district after correspondence to be embedded at this embedding
In porose area.
The assembling method of the electronic installation of the present invention, in this electronic seat manufacturing step, prepared
Each branch connecting pin also include that one is embedded in this pedestal and one end connects the embedding of this wiring section
The section of burying, and one connect the other end of this section of being embedded into and stretch out this at intervals with this wiring section
The convex foot section of pedestal, this assembling method also comprises a pin bending step, bends at this pin
The convex foot section of described pin is bent by step and shapes.
The assembling method of the electronic installation of the present invention, in this electronic seat manufacturing step, prepared
The described pin of this electronic seat be the left and right sides being inserted in this pedestal, and this electronic seat is also
Be located at interval at the connection sheet of the left and right sides of this pedestal including two panels, every a piece of connection sheet be positioned at
The described pin consubstantiality of the same side links together, and in this pin bending step, connects when described
After the convex foot section bending of foot shapes, more described connection sheet severing is excised.
The assembling method of the electronic installation of the present invention, in this electronic seat manufacturing step, prepared
This pedestal of this electronic seat there is a piece of basal wall, and two panels is respectively by the left and right sides of this basal wall
Upwardly extending sidewall, every a piece of sidewall all has one and away from this basal wall and is positioned at connecing of top side
Line face, and a lateral surface away from another sidewall, described pin is to be plugged at each interval
In the described sidewall of this pedestal, this wiring section of each branch connecting pin stretches out connecing of corresponding sidewall
Line face, this convex foot section outwards stretches out the lateral surface of this sidewall, and in this pin bending step,
This convex foot section can be bent and be bent by this lateral surface horizontal projection outward again and upwards connect higher than this
After line segment the most horizontal-extending.
The beneficial effects of the present invention is: connect in group and can make each the convenient easily group of wire
It is connected on corresponding pin, and its laser can be welded together, to improve welding yield.
Accompanying drawing explanation
Other the feature of the present invention and effect, by reference to graphic embodiment clearly
Present, wherein:
Fig. 1 is an axonometric chart, illustrates that several coil is installed in an existing electronic seat,
And complete a state installing coil step；
Fig. 2 is an incomplete stereo amplification figure, the local structure of explanatory diagram 1；
Fig. 3 is a block flow diagram, and the manufacture method of existing electronic installation is described；
Fig. 4 is a manufacturing process schematic diagram, illustrates described coil is installed on this electronic seat
Manufacture method；
Fig. 5 is an axonometric chart, illustrates to be installed on by electronic installation of the present invention several coils
In the electronic seat that one embodiment of assembling method is made, and complete an installation coil step
Rapid state；
Fig. 6 is an incomplete stereo amplification figure, the local structure of explanatory diagram 5；
Fig. 7 is an incomplete part section exploded view, illustrates each wire is embedded phase
The bonding state of corresponding pin；
Fig. 8 is a block flow diagram, and the manufacturing step of this embodiment is described；
Fig. 9 is a manufacturing process schematic diagram, and this embodiment is described；And
Figure 10 is an incomplete stereo amplification figure, and made by this embodiment is described
Electronic installation.
Detailed description of the invention
Refering to Fig. 5, Fig. 6 and Fig. 7, an embodiment of the assembling method of electronic installation of the present invention,
It is for several coils 4 are assembled in an electronic seat 5.Each coil 4 has one
The magnet ring 41 of hollow, and several circles are around in the wire 42 that this magnet ring 41 stretches the most outward.This electricity
Stroma 5 has a hollow and the pedestal 51 contained for described coil 4, and several are spaced
Be plugged in the pin 52 of the left and right sides of this pedestal 51.The most on the implementation, this electronic seat
Kenel and the setting direction of 5 are not only restricted to the present embodiment, such as, can also spin upside down.Except this
In addition, move, position and bend described pin 52 the most together, should
Electronic seat 5 also has two panels and is located at interval at the left and right sides of this pedestal 51 and consubstantiality connects and is positioned at
The described pin 52 of the same side is away from the connection sheet 53 of one end of this pedestal 51, every a piece of connection
Sheet 53 is all made into integration with the described pin 52 being positioned at the same side, and in described pin 52 with
After this electronic seat 5 is completed, i.e. this connection sheet 53 can be excised separation.
This pedestal 51 is made up of dielectric plastic material, and has the basal wall of sheet of water flat rectangular
511, two panels is respectively by the upwardly extending sidewall in the left and right sides 512 of this basal wall 511, and two panels
Upwardly extended by both sides before and after this basal wall 511 respectively and connect the end wall of described sidewall 512
515.Every a piece of sidewall 512 all has one away from this basal wall 511 and the wiring that is positioned at top side
Face 513, and a lateral surface 514 away from another sidewall 512.
Described pin 52 is to be plugged at each interval in the described sidewall 512 of this pedestal 51,
Each branch connecting pin 52 is all made up of conductive metallic material, and has one and be embedded into and be combined in this seat
The section of being embedded in body 51 521, one is upwards stretched out corresponding by one end of this section of being embedded into 521
This wiring face 513 of sidewall 512 and the wiring section that electrically connects with corresponding wire 42
522, and one outwards stretched out corresponding sidewall 512 by the other end of this section of being embedded into 521
The convex foot section 523 of this lateral surface 514.
Further illustrating this wiring section 522, from the point of view of structure, this wiring section 522 has one
Stretch out the projection 524 of this pedestal 51, and two adjacent one another are and by this projection 524
The upwards prong portion 525 of projection.From the point of view of again with regard to profile, this wiring section 522 has a formation
In the end face 526 on the top in described prong portion 525, and one from this end face 526 toward lower recess
And the clip slot 527 of the boundary that matched with this projection 524 by described prong portion 525.This
This clip slot 527 of embodiment have one away from this end face 526 embedding porose area 528, by
This embedding porose area 528 is toward the profile groove district 529 of the direction extension of this end face 526, and one is cutd open by this
Ditch district 529 is communicated to the guide groove district 520 of this end face 526 away from one end of this embedding porose area 528,
The diameter of this embedding porose area 528 is equal to the diameter of this wire 42, and the width in this profile groove district 529 is little
In the diameter of this wire 42, the width in this guide groove district 520 by this profile groove district 529 to this end face
526 gradually open expansion, and the shape of this clip slot 527 can also change certainly, with the present embodiment is not
Limit.
Refering to Fig. 7, Fig. 8 and Fig. 9, further illustrate the assembling method of the present embodiment, comprise
One electronic seat manufacturing step 61, installs coil step 62, a laser welding step
63, and a pin bending step 64.
In this electronic seat manufacturing step 61, by described connection sheet 53 together with described pin 52
It is placed in the left and right sides of a mould (not shown), and allows the section of being embedded into 521 of described pin 52
Stretch in this mould, in this mould, inject melted dielectric plastic material to shape this seat
Body 51, i.e. completes the manufacture of this electronic seat 5 after demoulding to be cooled, can make described pin 52
Combine with this pedestal 51, owing to this electronic seat manufacturing step 61 is general existing processing procedure,
So no longer describing in detail at this.
In this installation coil step 62, described coil 4 is put into this seat of this electronic seat 5
In body 51, and each wire 42 of each coil 4 is pulled to corresponding pin 52
And guiding hangs in this guide groove district 520, press down this wire 42, make this wire 42 squeeze
After compeling by this profile groove district 529, i.e. can correspondence be embedded and located in this embedding porose area 528, with
Avoid the landing that gets loose.
Then in this laser welding step 63, send thunder by a laser discharger 7
Irradiating light beam irradiates the wiring section 522 of described pin 52, makes each wiring section 522 and corresponding folder
If wire 42 melted link together, allow the described prong portion 525 of this wiring section 522 with
Sandwiched wire therein 42 is melt into spherical.
Finally in this pin bending step 64, by a pin bar folder (not shown) by institute
Convex foot section 523 bending stating pin 52 shapes, and makes this convex foot section 523 of each branch connecting pin 52
It is bent, and is bent the highest again by this lateral surface 514 horizontal projection outward of this pedestal 51
The most horizontal-extending in this wiring section 522, this pin 52 is curved the most on the implementation
Folding shape can also change, and is not only restricted to the present embodiment.And when the convex foot section of described pin 52
After 523 bendings shape, then by the severing excision respectively of described connection sheet 53 (see Fig. 5), to complete
The manufacture of electronic installation as shown in Figure 10.
In sum, the assembling method of electronic installation of the present invention, by this electronic seat manufacturing step
The 61 described pins 52 made have the design of clip slot 527, so walking at this installation coil
The wire 42 being available for described coil 4 in rapid 62 hangs sandwiched rapidly, and group connects the most convenient
Easily, and can have and preferably clamp locking effect, furthermore the present invention is to walk in this laser welding
In rapid 63, make described wiring section 522 direct with the wire 42 of corresponding sandwiched by thunder laser beam
Melt and link together, owing to the most additionally adding tin soldering liquid, intermetallic compound will not be produced,
So electric heating conductivity is good, short circuit chance can be reduced to promote reliability, really can effectively promote
Product yield also reduces cost, and therefore, the present invention is not only unprecedented innovation, is more available for
Utilize in industry, so the purpose of the present invention really can be reached.
Claims (6)
1. an assembling method for electronic installation, is used for assembling several coil, each line
Circle has the magnet ring of a hollow, and several circles are around in the wire that this magnet ring stretches the most outward,
It is characterized in that this assembling method comprises the steps of
One electronic seat manufacturing step, produces an electronic seat, and this electronic seat includes one
The pedestal of individual hollow, and several the pins being inserted in this pedestal at each interval, Mei Yizhi
Pin has a wiring section stretching out this pedestal, and this wiring section has an end face,
And a clip slot being formed at this end face；
Coil step is installed, described coil is put into this pedestal of this electronic seat for one,
Each wire of each coil is pulled to corresponding pin again, and corresponding press-in should
Clip slot is to be embedded in this wiring section；And
One laser welding step, irradiates the wiring section of described pin, makes with thunder laser beam
Each wiring section is melted with the wire of corresponding sandwiched to link together.
The assembling method of electronic installation the most according to claim 1, it is characterised in that:
In this electronic seat manufacturing step, each wiring section of prepared each branch connecting pin also has
There is a projection stretching out this pedestal, and two adjacent one another are and from this projection toward remote
From the prong portion of the direction projection of this pedestal, described prong portion matches with this projection and defines
Go out this clip slot, in this laser welding step, the described prong portion of each wiring section and folder
If wire therein is melt into spherical.
The assembling method of electronic installation the most according to claim 2, it is characterised in that:
In this electronic seat manufacturing step, each clip slot of prepared each branch connecting pin has one
The individual embedding porose area away from this end face, one from this embedding porose area toward the direction of this end face extend cuing open
Ditch district, and a guide groove being communicated to this end face by this profile groove district away from one end of this embedding porose area
District, the diameter of this embedding porose area is equal to the diameter of respective wire, and the width in this profile groove district is less than
The diameter of respective wire, the width in this guide groove district gradually opened expansion by this profile groove district to this end face,
In this installation coil step, each wire is guided into this profile groove district by this guide groove district,
And be embedded in this embedding porose area by this profile groove district correspondence later in crowded.
4. according to the assembling method of the electronic installation described in claim 1,2 or 3, its feature
Being: in this electronic seat manufacturing step, prepared each branch connecting pin also includes that one is buried
In being located at this pedestal and one end connects the section of being embedded into of this wiring section, and one connects this section of being embedded into
The other end and stretch out the convex foot section of this pedestal, this group side of connecing at intervals with this wiring section
Method also comprises pin bending step, convex by described pin in this pin bending step
The bending of foot section shapes.
The assembling method of electronic installation the most according to claim 4, it is characterised in that:
In this electronic seat manufacturing step, the described pin of this prepared electronic seat is to be inserted in this
The left and right sides of pedestal, and this electronic seat also includes that two panels is located at interval at the left and right of this pedestal
The connection sheet of both sides, every a piece of connection sheet and the described pin consubstantiality being positioned at the same side are connected to
Together, in this pin bending step, after the convex foot section of described pin bends and shapes, then
Described connection sheet severing is excised.
The assembling method of electronic installation the most according to claim 5, it is characterised in that:
In this electronic seat manufacturing step, this pedestal of this prepared electronic seat has a piece of basal wall,
And two panels is respectively by the upwardly extending sidewall in the left and right sides of this basal wall, every a piece of sidewall all has
Have one away from this basal wall and the wiring face that is positioned at top side, and outside one away from another sidewall
Side, described pin is to be plugged at each interval in the described sidewall of this pedestal, Mei Yizhi
This wiring section of pin stretches out the wiring face of corresponding sidewall, and this convex foot section outwards stretches out
The lateral surface of this sidewall, and in this pin bending step in, this convex foot section can be bent and by
This lateral surface is the most horizontal-extending after horizontal projection bends upwards more outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610204628.2A CN105869871A (en) | 2016-04-01 | 2016-04-01 | Assembling method for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610204628.2A CN105869871A (en) | 2016-04-01 | 2016-04-01 | Assembling method for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105869871A true CN105869871A (en) | 2016-08-17 |
Family
ID=56627041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610204628.2A Pending CN105869871A (en) | 2016-04-01 | 2016-04-01 | Assembling method for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105869871A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300666A (en) * | 2018-10-15 | 2019-02-01 | 德阳致达精密电子有限公司 | A kind of electronic chip packaging shell and its manufacturing method |
| CN109326425A (en) * | 2018-10-15 | 2019-02-12 | 德阳致达精密电子有限公司 | A kind of network transformer and its manufacturing method |
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| CN101087197A (en) * | 2006-06-07 | 2007-12-12 | 杨先进 | Network communication transformer and its making method |
| CN202042313U (en) * | 2011-02-22 | 2011-11-16 | 东莞市铭普实业有限公司 | Four-mouth MB (mega byte) network transformer with 40PIN packaging structure |
| CN103515083A (en) * | 2013-10-28 | 2014-01-15 | 自贡国铨电子有限公司 | Method for manufacturing network transformer |
| CN203872474U (en) * | 2014-05-30 | 2014-10-08 | 德阳帛汉电子有限公司 | Electronic element base |
| CN104576014A (en) * | 2014-12-31 | 2015-04-29 | 绵阳高新区经纬达科技有限公司 | Network transformer manufacturing method |
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2016
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101087197A (en) * | 2006-06-07 | 2007-12-12 | 杨先进 | Network communication transformer and its making method |
| CN202042313U (en) * | 2011-02-22 | 2011-11-16 | 东莞市铭普实业有限公司 | Four-mouth MB (mega byte) network transformer with 40PIN packaging structure |
| CN103515083A (en) * | 2013-10-28 | 2014-01-15 | 自贡国铨电子有限公司 | Method for manufacturing network transformer |
| CN203872474U (en) * | 2014-05-30 | 2014-10-08 | 德阳帛汉电子有限公司 | Electronic element base |
| CN104576014A (en) * | 2014-12-31 | 2015-04-29 | 绵阳高新区经纬达科技有限公司 | Network transformer manufacturing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300666A (en) * | 2018-10-15 | 2019-02-01 | 德阳致达精密电子有限公司 | A kind of electronic chip packaging shell and its manufacturing method |
| CN109326425A (en) * | 2018-10-15 | 2019-02-12 | 德阳致达精密电子有限公司 | A kind of network transformer and its manufacturing method |
| CN109300666B (en) * | 2018-10-15 | 2024-05-14 | 德阳致达精密电子有限公司 | Electronic chip packaging shell and manufacturing method thereof |
| CN109326425B (en) * | 2018-10-15 | 2024-05-14 | 德阳致达精密电子有限公司 | Network transformer and manufacturing method thereof |
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Application publication date: 20160817 |
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