CN105866658A - Electronic product single board for testing and testing apparatus - Google Patents
Electronic product single board for testing and testing apparatus Download PDFInfo
- Publication number
- CN105866658A CN105866658A CN201610188038.5A CN201610188038A CN105866658A CN 105866658 A CN105866658 A CN 105866658A CN 201610188038 A CN201610188038 A CN 201610188038A CN 105866658 A CN105866658 A CN 105866658A
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- module
- processor chip
- host processor
- interface module
- test
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention relates to an electronic product single board for testing and a testing apparatus. An integrated electronic product single board is segmented into a plurality of independent modules. Each independent module implements a corresponding function. The electronic product single board can be completely assembled through splicing in order to conduct recycling and testing on main processor chips. A movable main processor chip resting fixture module is adaptive to BGA packaging main processor chips of different spherical distances. A programmable base pin interconnecting module enables other modules to be adapted to the BGA packaging main processor chips of different fans-out through programming so that different main processing chips only need one set of shared electronic product single board for the adaptation and do not require the preparation of a plurality of electronic product single boards, which enables very convenient recycling and testing of the main processor chip and a great reduced cost, and is conducive to the recycling and testing of the main processor chip.
Description
Technical field
The present invention relates to the communications field, particularly relate to a kind of test electronics product single board and test device.
Background technology
In the inscape of electronic product finished product price, the accounting of host processor chip is high, in high added value
Electronic product in, host processor chip cost even can account for the 1/3 of complete machine cost, though some segment
Ripe electronic product in (the most present Set Top Box etc.), the price of host processor chip still can account for
The 1/5 of complete machine cost.So, in product single board production process and in the maintenance of assembling finished product, certainly exist
The recycling of host processor chip.For different host processor chip, even similar electronics produces
Product, between different brands, pin difference is the hugest.At present, especially prominent problem is, primary processor
Chip functions is the most powerful, and processor host frequency is more and more higher, and host processor chip packing forms uses substantially
It is all BGA (BGA Package).The pin difference of the host processor chip of BGA package is also by chip
Difference and difference is huge, if number of pin difference is from 400 to 800 etc., such as package dimension difference, cause
The host processor chip ball of BGA package is obvious away from difference.More design due to the host processor chip of different brands
The difference of team, the fan-out orientation discrepancy of function pin is huge so that even if pin item is identical, it is corresponding
It is huge that function defines also difference, and this BGA pin resulting in different brands host processor chip cannot be accomplished
Completely compatible.
Host processor chip to BGA package, in product single board production process and assemble finished product maintenance
During, the host processor chip for recycling needs to carry out functional test, to confirm that this reclaims
Host processor chip whether function normally, whether can be reused.But, the main process of BGA package
Chip reclaims test and there is a handling process: ball is planted in the process of former soldered ball--> again--> find and this main process
Test fixture installed by device chip functions identical electronic product veneer--> electronic product veneer--> function survey
Examination.This flow process will bring two problems, and one is that the host processor chip difference of different BGA package is huge,
The test fixture of installing causing the host processor chip of BGA package can be because of the difference of host processor chip
Of a great variety, another is exactly that to possess the electronic product veneer of functional test must be specific, is and this master
The electronic product veneer that processor chips are adaptive, must prepare multiple electronics for multiple host processor chip and produce
Product veneer, this is when making to carry out reclaiming the extremely complex inconvenience of test operation to host processor chip, and cost
Greatly, it is unfavorable for carrying out host processor chip reclaiming test.
Summary of the invention
In view of this, it is necessary to that host processor chip carries out reclaiming test operation is extremely complex not for above-mentioned
Just, and the great problem of cost, it is provided that a kind of test electronics product single board and test device.
Electronics product single board is used in a kind of test that the present invention provides, including multiple standalone modules being partitioned into, many
Individual standalone module is connected by connecting method, and the plurality of standalone module includes: functional interface module, storage
Device interface module, power supply module, movable host processor chip test fixture module and programmable
Pin interconnection module, described functional interface module, memory interface module, power supply module and activity
Host processor chip test fixture module respectively by splicing by the way of with described programmable pin interconnection module
It is connected；
Described functional interface module is for realizing the input of network signal and the output of function signal；
Described power supply module is used for providing multiple power supplies；
Program required when described memory interface module is for providing test and intermediate processing data caching；
The host processor chip test fixture module of described activity provide adjustable ball away from probe array, adaptive
Different balls away from BGA package host processor chip；
Described programmable pin interconnection module is for by being programmed to various host processor chip pins
The interconnection of pin corresponding with between other modules, with the BGA package host processor chip of adaptive different fan-outs.
In one of which embodiment, described functional interface module, memory interface module, power supply electricity
Source module, movable host processor chip test fixture module and programmable pin interconnection module pass through phoenix
Terminal or golden finger are connected, and described programmable pin interconnection module four sides is golden finger or phoenix
Terminal.
In one of which embodiment, described power supply module comprises multichannel DC-DC power source, with
Thering is provided multiple power supplies, edge is golden finger female seat or phoenix terminal female seat, described functional interface module and storage
Device interface module edge is golden finger female seat or phoenix terminal female seat.
In one of which embodiment, the host processor chip test fixture module of described activity includes
Pedestal, is provided with probe array below described pedestal, described susceptor edges is provided with golden finger female seat or phoenix
Terminal female seat, probe is connected with female seat pin.
In one of which embodiment, described probe uses the mode of ball to be arranged on pedestal, passes through
Adjust ball angle, adjust stitch away from.
A kind of test device that the present invention provides, includes test electronics product single board, it is characterised in that
Described test electronics product single board includes multiple standalone module being partitioned into, and multiple standalone modules are by splicing
Mode connects, and the plurality of standalone module includes: functional interface module, memory interface module, power supply electricity
Source module, movable host processor chip test fixture module and programmable pin interconnection module, described
The host processor chip test clip of functional interface module, memory interface module, power supply module and activity
Tool module is connected with described programmable pin interconnection module respectively by the way of splicing；
Described functional interface module is for realizing the input of network signal and the output of function signal；
Described power supply module is used for providing multiple power supplies；
Program required when described memory interface module is for providing test and intermediate processing data caching；
The host processor chip test fixture module of described activity provide adjustable ball away from probe array, adaptive
Different balls away from BGA package host processor chip；
Described programmable pin interconnection module is for by being programmed to various host processor chip pins
The interconnection of pin corresponding with between other modules, with the BGA package host processor chip of adaptive different fan-outs.
In one of which embodiment, described functional interface module, memory interface module, power supply electricity
Source module, movable host processor chip test fixture module and programmable pin interconnection module pass through phoenix
Terminal or golden finger are connected, and described programmable pin interconnection module four sides is golden finger or phoenix
Terminal.
In one of which embodiment, described power supply module comprises multichannel DC-DC power source, with
Thering is provided multiple power supplies, edge is golden finger female seat or phoenix terminal female seat, described functional interface module and storage
Device interface module edge is golden finger female seat or phoenix terminal female seat.
In one of which embodiment, the host processor chip test fixture module of described activity includes
Pedestal, is provided with probe array below described pedestal, described susceptor edges is provided with golden finger female seat or phoenix
Terminal female seat, probe is connected with female seat pin.
In one of which embodiment, described probe uses the mode of ball to be arranged on pedestal, passes through
Adjust ball angle, adjust stitch away from.
The present invention tests with electronics product single board and test device, is divided into by the electronic product veneer of integration
Multiple independent modules, each independent module realizes corresponding function, can assemble by the way of splicing
The electronic product veneer becoming complete carries out reclaiming test to host processor chip, and movable host processor chip is surveyed
Examination fixture module can adaptive different balls away from BGA package host processor chip, programmable pin interconnects
Module can make the BGA package host processor chip of other module adaptation difference fan-outs by programming, thus
Make different main process chips is only needed a set of shared electronic product veneer just can be completely adaptive, no
Need to prepare multiple electronic product veneer so that host processor chip carries out reclaim test operation the most convenient,
And cost is substantially reduced, it is beneficial to carry out host processor chip reclaiming test.
Accompanying drawing explanation
Fig. 1 is the structure chart of the test electronics product single board in an embodiment.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and reality
Execute example, the present invention is further elaborated.Only should be appreciated that specific embodiment described herein
In order to explain the present invention, it is not intended to limit the present invention.
Fig. 1 is the structure chart of the test electronics product single board in an embodiment, as it is shown in figure 1, this survey
Electronic product veneer on probation includes multiple standalone module being partitioned into, and multiple standalone modules are by connecting method even
Connecing, multiple standalone modules include: functional interface module 100, power supply module 200, memory interface mould
Block 300, movable host processor chip test fixture module 400 and programmable pin interconnection module 500.
Functional interface module 100, memory interface module 300, power supply module 200 and the primary processor of activity
Chip test fixture module 400 is connected with programmable pin interconnection module 500 respectively by the way of splicing
Connect.
The output of the functional interface module 100 input and function signal for realizing network signal (such as, exists
In Set Top Box, the decoded TS of RF signaling channel (transmission stream) input and the output of audio frequency and video), by can
The ball that the pin interconnection module 500 of programming defines from different main process chip BGA corresponding functions connects.
Power supply module 200 be used for providing multiple power supplies (such as 5V, 3.3V, 1.5V, 1.1V etc.,
It is respectively the power supplies such as other module storage, kernel, I/O, by programmable pin interconnection module 500
Connect from the ball of different main process chip BGA corresponding functions definition.
Program required when memory interface module 300 is for providing test and intermediate processing data caching are logical
Cross the ball connection that programmable pin interconnection module 500 defines from different main process chip BGA corresponding functions.
Movable host processor chip test fixture module 400 provides adjustable ball away from (the i.e. pin of contact probe
Pin away from) probe array, adaptive different balls away from BGA package host processor chip.
Programmable pin interconnection module 500 is for by being programmed to various host processor chip pins
The interconnection of pin corresponding with between other modules, with the BGA package host processor chip of adaptive different fan-outs
(i.e. number of pins is identical and BGA package host processor chip that function definition is different).
In further mode, functional interface module 100, memory interface module 300, power supply mould
Block 200, movable host processor chip test fixture module 400 and programmable pin interconnection module 500
It is connected by phoenix terminal or golden finger.Programmable pin interconnection module 500 four sides is golden finger
Or phoenix terminal.
Power supply module 200 comprises multichannel DC-DC power source, and to provide multiple power supplies, edge is gold hand
Refer to female seat or phoenix terminal female seat.
Functional interface module 100 and memory interface module 300 edge are golden finger female seat or phoenix terminal mother
Seat.
Movable host processor chip test fixture module 400 includes pedestal, is provided with probe below pedestal
Array, susceptor edges is provided with golden finger female seat or phoenix terminal female seat, and probe is connected with female seat pin.?
Further in mode, for making the stitch of probe array away from adjusting, probe uses the mode of ball to set
Put on pedestal, by adjust ball angle, adjust stitch away from.
This test electronics product single board, is divided into multiple independent module by the electronic product veneer of integration,
Each independent module realizes corresponding function, can be assembled into complete electronic product by the way of splicing
Veneer carries out reclaiming test, movable host processor chip test fixture module 400 energy to host processor chip
Enough adaptive different balls away from BGA package host processor chip, programmable pin interconnection module 500 passes through
Programming can make the BGA package host processor chip of other module adaptation difference fan-outs, to not
With main process chip only need a set of shared electronic product veneer just can be completely adaptive, it is not necessary to preparation
Multiple electronic product veneers so that host processor chip is carried out reclaims test operation the most convenient, Er Qiecheng
Originally it is substantially reduced, is beneficial to carry out host processor chip reclaiming test.
Meanwhile, the present invention also provides for a kind of test device, and this test device includes test electronic product list
Plate.As it is shown in figure 1, this test electronics product single board includes multiple standalone module being partitioned into, multiple solely
Formwork erection block is connected by connecting method, and multiple standalone modules include: functional interface module 100, memory connect
Mouth die block 300, power supply module 200, movable host processor chip test fixture module 400 and can
The pin interconnection module 500 of programming.Functional interface module 100, memory interface module 300, power supply
Module 200 and movable host processor chip test fixture module 400 respectively by the way of splicing with can compile
The pin interconnection module 500 of journey is connected.
The output of the functional interface module 100 input and function signal for realizing network signal (such as, exists
In Set Top Box, the decoded TS of RF signaling channel (transmission stream) input and the output of audio frequency and video), by can
The ball that the pin interconnection module 500 of programming defines from different main process chip BGA corresponding functions connects.
Power supply module 200 be used for providing multiple power supplies (such as 5V, 3.3V, 1.5V, 1.1V etc.,
It is respectively the power supplies such as other module storage, kernel, I/O, by programmable pin interconnection module 500
Connect from the ball of different main process chip BGA corresponding functions definition.
Program required when memory interface module 300 is for providing test and intermediate processing data caching are logical
Cross the ball connection that programmable pin interconnection module 500 defines from different main process chip BGA corresponding functions.
Movable host processor chip test fixture module 400 provides adjustable ball away from (the i.e. pin of contact probe
Pin away from) probe array, adaptive different balls away from BGA package host processor chip.
Programmable pin interconnection module 500 is for by being programmed to various host processor chip pins
The interconnection of pin corresponding with between other modules, with the BGA package host processor chip of adaptive different fan-outs
(i.e. number of pins is identical and BGA package host processor chip that function definition is different).
In further mode, functional interface module 100, memory interface module 300, power supply mould
Block 200, movable host processor chip test fixture module 400 and programmable pin interconnection module 500
It is connected by phoenix terminal or golden finger.Programmable pin interconnection module 500 four sides is golden finger
Or phoenix terminal.
Power supply module 200 comprises multichannel DC-DC power source, and to provide multiple power supplies, edge is gold hand
Refer to female seat or phoenix terminal female seat.
Functional interface module 100 and memory interface module 300 edge are golden finger female seat or phoenix terminal mother
Seat.
Movable host processor chip test fixture module 400 includes pedestal, is provided with probe below pedestal
Array, susceptor edges is provided with golden finger female seat or phoenix terminal female seat, and probe is connected with female seat pin.?
Further in mode, for making the stitch of probe array away from adjusting, probe uses the mode of ball to set
Put on pedestal, by adjust ball angle, adjust stitch away from.
This test electronics product single board, is divided into multiple independent module by the electronic product veneer of integration,
Each independent module realizes corresponding function, can be assembled into complete electronic product by the way of splicing
Veneer carries out reclaiming test, movable host processor chip test fixture module 400 energy to host processor chip
Enough adaptive different balls away from BGA package host processor chip, programmable pin interconnection module 500 passes through
Programming can make the BGA package host processor chip of other module adaptation difference fan-outs, to not
With main process chip only need a set of shared electronic product veneer just can be completely adaptive, it is not necessary to preparation
Multiple electronic product veneers so that host processor chip is carried out reclaims test operation the most convenient, Er Qiecheng
Originally it is substantially reduced, is beneficial to carry out host processor chip reclaiming test.
The present invention tests with electronics product single board and test device, is divided into by the electronic product veneer of integration
Multiple independent modules, each independent module realizes corresponding function, can assemble by the way of splicing
The electronic product veneer becoming complete carries out reclaiming test to host processor chip, and movable host processor chip is surveyed
Examination fixture module can adaptive different balls away from BGA package host processor chip, programmable pin interconnects
Module can make the BGA package host processor chip of other module adaptation difference fan-outs by programming, thus
Make different main process chips is only needed a set of shared electronic product veneer just can be completely adaptive, no
Need to prepare multiple electronic product veneer so that host processor chip carries out reclaim test operation the most convenient,
And cost is substantially reduced, it is beneficial to carry out host processor chip reclaiming test.
These are only presently preferred embodiments of the present invention, not in order to limit the present invention, all the present invention's
Any amendment, equivalent and the improvement etc. made within spirit and principle, should be included in the guarantor of the present invention
Within the scope of protecting.
Claims (10)
1. electronics product single board is used in a test, it is characterised in that include multiple standalone module being partitioned into,
Multiple standalone modules are connected by connecting method, and the plurality of standalone module includes: functional interface module, deposit
Memory interface module, power supply module, movable host processor chip test fixture module and able to programme
Pin interconnection module, described functional interface module, memory interface module, power supply module and activity
Host processor chip test fixture module respectively by splicing by the way of with the described mutual gang mould of programmable pin
Block is connected；
Described functional interface module is for realizing the input of network signal and the output of function signal；
Described power supply module is used for providing multiple power supplies；
Program required when described memory interface module is for providing test and intermediate processing data caching；
The host processor chip test fixture module of described activity provide adjustable ball away from probe array, adaptive
Different balls away from BGA package host processor chip；
Described programmable pin interconnection module is for by being programmed to various host processor chip pins
The interconnection of pin corresponding with between other modules, with the BGA package host processor chip of adaptive different fan-outs.
Test electronics product single board the most according to claim 1, it is characterised in that described function connects
Mouth die block, memory interface module, power supply module, movable host processor chip test fixture module
And programmable pin interconnection module is connected by phoenix terminal or golden finger, described programmable pin
Interconnection module four sides is golden finger or phoenix terminal.
Test electronics product single board the most according to claim 2, it is characterised in that described power supply electricity
Source module comprises multichannel DC-DC power source, and to provide multiple power supplies, edge is golden finger female seat or phoenix end
Son and mother seat, described functional interface module and memory interface module edge are golden finger female seat or phoenix terminal mother
Seat.
Test electronics product single board the most according to claim 2, it is characterised in that described activity
Host processor chip test fixture module includes pedestal, is provided with probe array below described pedestal, described
Susceptor edges is provided with golden finger female seat or phoenix terminal female seat, and probe is connected with female seat pin.
Test electronics product single board the most according to claim 4, it is characterised in that described probe is adopted
Be arranged on pedestal by the mode of ball, by adjust ball angle, adjust stitch away from.
6. a test device, includes test electronics product single board, it is characterised in that described test is used
Electronic product veneer includes multiple standalone module being partitioned into, and multiple standalone modules are connected by connecting method,
The plurality of standalone module includes: functional interface module, memory interface module, power supply module, work
Dynamic host processor chip test fixture module and programmable pin interconnection module, described functional interface mould
The host processor chip test fixture module of block, memory interface module, power supply module and activity is respectively
It is connected with described programmable pin interconnection module by the way of splicing；
Described functional interface module is for realizing the input of network signal and the output of function signal；
Described power supply module is used for providing multiple power supplies；
Program required when described memory interface module is for providing test and intermediate processing data caching；
The host processor chip test fixture module of described activity provide adjustable ball away from probe array, adaptive
Different balls away from BGA package host processor chip；
Described programmable pin interconnection module is for by being programmed to various host processor chip pins
The interconnection of pin corresponding with between other modules, with the BGA package host processor chip of adaptive different fan-outs.
Test device the most according to claim 6, it is characterised in that described functional interface module, deposit
Memory interface module, power supply module, movable host processor chip test fixture module and programmable
Pin interconnection module is connected by phoenix terminal or golden finger, described programmable pin interconnection module four
Face is golden finger or phoenix terminal.
Test device the most according to claim 7, it is characterised in that described power supply module comprises
Multichannel DC-DC power source, to provide multiple power supplies, edge is golden finger female seat or phoenix terminal female seat, institute
State functional interface module and memory interface module edge is golden finger female seat or phoenix terminal female seat.
Test device the most according to claim 7, it is characterised in that the primary processor core of described activity
Built-in testing fixture module includes pedestal, is provided with probe array below described pedestal, and described susceptor edges sets
Being equipped with golden finger female seat or phoenix terminal female seat, probe is connected with female seat pin.
Test device the most according to claim 9, it is characterised in that described probe uses ball
Mode is arranged on pedestal, by adjust ball angle, adjust stitch away from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610188038.5A CN105866658B (en) | 2016-03-29 | 2016-03-29 | A kind of test electronics product single board and test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610188038.5A CN105866658B (en) | 2016-03-29 | 2016-03-29 | A kind of test electronics product single board and test device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105866658A true CN105866658A (en) | 2016-08-17 |
| CN105866658B CN105866658B (en) | 2019-02-15 |
Family
ID=56626340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610188038.5A Expired - Fee Related CN105866658B (en) | 2016-03-29 | 2016-03-29 | A kind of test electronics product single board and test device |
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| CN107589920A (en) * | 2017-07-31 | 2018-01-16 | 杭州旗捷科技有限公司 | For the repositioning method of chip, electronic equipment, storage medium and equipment |
| CN108595991A (en) * | 2018-04-12 | 2018-09-28 | 南宁磁动电子科技有限公司 | A kind of reading equipment of eMMC chip datas |
| CN111308317A (en) * | 2019-12-16 | 2020-06-19 | 华南理工大学广州学院 | Method for detecting whether multivibrator circuit connection is correct or not through jigsaw |
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| CN111308317B (en) * | 2019-12-16 | 2022-08-16 | 华南理工大学广州学院 | Method for detecting whether multivibrator circuit connection is correct or not through jigsaw |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105866658B (en) | 2019-02-15 |
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