CN105860141A - Method for carrying out modification treatment on heat conducting powder fillers and heat conducting fillers - Google Patents
Method for carrying out modification treatment on heat conducting powder fillers and heat conducting fillers Download PDFInfo
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- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
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- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention provides a method for carrying out modification treatment on heat conducting powder fillers. The method comprises the following steps: firstly stirring and dispersing the heat conducting powder fillers and simultaneously adding a dispersing agent and stirring the materials to obtain preliminarily dispersed fillers; and adding the preliminarily dispersed fillers to dispersing equipment and adding a modifier to carry out surface modification treatment by a dry method or a wet method. The method has the beneficial effects that the adopted technical scheme of the invention is beneficial to achieving the single particle dispersion state of the fillers and greatly reducing secondary agglomerated large particles; and the compatibility of organic and inorganic matters is improved, the thinnest bonding interface of organic and inorganic phases is ensured, the phase interface heat resistance is reduced, the heat conductivity of the products is maximized, the problems of serious performance attenuation, internal structure damage, and the like are improved, and the problems of dispersion non-uniformity, modification instability, coating incompleteness or multilayer coating, and the like of the powder fillers are effectively solved.
Description
Technical field
The invention belongs to conduction powder filler dispersion technology field, particularly relate to method and the heat filling of the modification of a kind of conduction powder filler.
Background technology
The heat-conducting insulation material such as heat-conducting plastic, heat conductive rubber was always one of focus of field of new research past 10 years, in order to meet electron electric power product height collection degree and lightening growth requirement, each manufacturer constantly releases the product of more high thermal conductivity coefficient to meet the requirements at the higher level of client, exactly because Heat Conduction Material is fast-developing, just promote the high-performance of the product such as electronics, communication, the requirement of collection degree lightening, high to become realization, drive the fast development of whole industry.
Heat-conducting insulation material is to fill inorganic conduction powder filler in organic polymer, realizes improving the heat conductivility of composite by inorganic filler is dispersed in polymer base material with point cantact conduction.Under normal circumstances, filler loading is the highest, volume ratio is the biggest, more be conducive to the lifting of heat conductivity, but, owing to the loading of inorganic filler improves, meeting heavy damage polymer own net structure, the physical property of composite significantly decays, and has a strong impact on the serviceability of product, it is impossible to meet the requirement under various environment.Additionally, development along with industry technology, the heat conductivility of Heat Conduction Material is required more and more higher, need product more Precise control and processing, the surface modification treatment of heat filling is to improve one of loading and the effective ways reducing performance degradation, and the surface modification treatment of heat filling is good, and it can not only improve filler and the organic compatibility, the interface resistance of organic-inorganic critical surface can also be reduced, improve the heat conductivility of product.But technique filler modified to conduction powder mostly is the dry process such as high-speed stirred mixing method, continuous nebulization at present, exist and disperse instability uneven, modified, cladding not exclusively or the problem such as multilayer coating structure, cause product heat conductivility instability maybe cannot meet performance requirement.
Summary of the invention
For above technical problem, the invention discloses method and the heat filling of the modification of a kind of conduction powder filler, heat filling is carried out secondary coating modification process, achieve the individual particle dispersity of filler, substantially reduce the oarse-grained existence of secondary agglomeration, ensure that the thinning of the biphase combination interface of organic-inorganic, interface resistance minimizes so that product heat conductivity maximizes.
To this, the technical solution used in the present invention is:
The method of the modification of a kind of conduction powder filler, comprises the following steps:
Step A: first conduction powder filler is stirred dispersion, is simultaneously introduced dispersant and is stirred, obtain the most scattered filler；
Step B: join in dispersing apparatus by filler the most scattered in step A, adds modifying agent and carries out surface modification treatment by dry or wet.
As a further improvement on the present invention, described step A includes:
First joining in dispersing apparatus by conduction powder filling body, starting device stirs, and rotating speed is 100 ~ 500 revs/min, start simultaneously at the dispersant that dropping organic solvent diluting is good, the content of its dispersant is 5 ~ 50%, controls rate of addition according to amount of filler in dispersing apparatus, within 2 ~ 10 minutes, adds；After dispersant is added dropwise to complete, improving mixing speed, making rotating speed is 500 ~ 3000 revs/min, disperses 2 ~ 10 minutes, and keeps filler temperature at 50 ~ 100 DEG C, shuts down cooling, and once cladding dispersion completes, and obtains the most scattered filler.
As a further improvement on the present invention, in step B, described dry method carries out surface modification treatment, including following sub-step:
Sub-step B1: first filler the most scattered in step A is added in modified device, starting device stirs, rotating speed is 50 ~ 300 revs/min, start simultaneously at the modifying agent that dropping organic solvent diluting is good, wherein the content of modifying agent is 5 ~ 50%, control rate of addition according to amount of filler in equipment, within 2 ~ 5 minutes, drip；
Sub-step B2: modifying agent improves equipment mixing speed after being added dropwise to complete, and makes rotating speed 200 ~ 1000 revs/min, and modification 2 ~ 10 minutes, secondary coating modification has processed；
Described wet method carries out surface modification treatment, including following sub-step:
Sub-step S1: first filler the most scattered in step A is added in modified device, add organic solvent, making the solid-liquid volume ratio in modified device is 0.1 ~ 5, start stirring, rotating speed is 20 ~ 200 revs/min, starts simultaneously at the modifying agent that dropping organic solvent diluting is good, and wherein modifier content is 5 ~ 50%, control rate of addition according to amount of filler in equipment, within 2 ~ 5 minutes, drip；
Sub-step S2: modifying agent continues after being added dropwise to complete to keep mixing speed constant, and modification 10 ~ 60 minutes, discharging is dried or oven drying at low temperature naturally, and secondary coating modification has processed.
As a further improvement on the present invention, the rotating speed in sub-step B1 is 100 ~ 200 revs/min；Described modifying agent content in organic solvent is 10 ~ 30%；
Rotating speed in sub-step B2 is 500 ~ 800 revs/min；
Solid-liquid volume ratio described in sub-step S1 is 1 ~ 3, and described modifying agent content in organic solvent is 10 ~ 30%.
As a further improvement on the present invention, described conduction powder filler is to include at least one in calcium carbonate, aluminium hydroxide, magnesium hydroxide, silicon oxide, aluminium oxide, zinc oxide, boron nitride, aluminium nitride, silicon nitride, graphite powder, Graphene, carbon fiber, CNT, median 0.1 ~ the 50um of described conduction powder filler, the exterior appearance of described conduction powder filler is irregular, spherical, fibrous or bar-shaped.
As a further improvement on the present invention, described dispersant is silane coupler；Described modifying agent is the one in silane coupler, titanate coupling agent or aluminate coupling agent.
As a further improvement on the present invention, at least one during described organic solvent is methanol, ethanol, ethyl ester, toluene, acetone, gasoline.
Present invention also offers a kind of heat filling, it uses the method for modification of conduction powder filler as above to prepare, wherein, described conduction powder filler is at least one in silicon oxide, aluminium oxide, zinc oxide, boron nitride, aluminium nitride, silicon nitride, graphite powder, Graphene, carbon fiber, CNT.
As a further improvement on the present invention, described heat filling uses following steps to be modified processing:
Step A: first conduction powder filling body is joined in dispersing apparatus, starting device stirs, and rotating speed is 100 ~ 500 revs/min, start simultaneously at the dispersant that dropping organic solvent diluting is good, the content of its dispersant is 5 ~ 50%, controls rate of addition according to amount of filler in dispersing apparatus, within 2 ~ 10 minutes, adds；After dispersant is added dropwise to complete, improving mixing speed, making rotating speed is 500 ~ 3000 revs/min, disperses 2 ~ 10 minutes, and keeps filler temperature at 50 ~ 100 DEG C, shuts down cooling, and once cladding dispersion completes, and obtains the most scattered filler；
Step B: join in dispersing apparatus by filler the most scattered in step A, adds modifying agent and carries out surface modification treatment by dry or wet；
Wherein, described dry method carries out surface modification treatment, including following sub-step:
Sub-step B1: first filler the most scattered in step A is added in modified device, starting device stirs, rotating speed is 50 ~ 300 revs/min, start simultaneously at the modifying agent that dropping organic solvent diluting is good, the content of its modifying agent is 5 ~ 50%, control rate of addition according to amount of filler in equipment, within 2 ~ 5 minutes, drip；
Sub-step B2: modifying agent improves equipment mixing speed after being added dropwise to complete, and makes rotating speed 200 ~ 1000 revs/min, and modification 2 ~ 10 minutes, secondary coating modification has processed；
Described wet method carries out surface modification treatment, including following sub-step:
Sub-step S1: first filler the most scattered in step A is added in modified device, add organic solvent, making the solid-liquid volume ratio in modified device is 0.1 ~ 5, start stirring, rotating speed is 20 ~ 200 revs/min, starts simultaneously at the modifying agent that dropping organic solvent diluting is good, and its modifier content is 5 ~ 50%, control rate of addition according to amount of filler in equipment, within 2 ~ 5 minutes, drip；
Sub-step S2: modifying agent continues after being added dropwise to complete to keep speed constant, and modification 10 ~ 60 minutes, discharging is dried or oven drying at low temperature naturally, and secondary coating modification has processed.
As a further improvement on the present invention, the rotating speed in sub-step B1 is 100 ~ 200 revs/min；Described modifying agent content in organic solvent is 10 ~ 30%；
Rotating speed in sub-step B2 is 500 ~ 800 revs/min；
Solid-liquid volume ratio described in sub-step S1 is 1 ~ 3, and described modifying agent content in organic solvent is 10 ~ 30%；
In sub-step S2, modifying agent continues after being added dropwise to complete to keep mixing speed constant.
Compared with prior art, the invention have the benefit that
Use technical scheme, heat filling is carried out secondary coating modification process, and by the control of process conditions, is advantageously implemented the individual particle dispersity of filler, greatly reduce the oarse-grained existence of secondary agglomeration；Owing to using modifying agent to carry out cladding process, improve the compatibility of organic-inorganic thing, ensure that the thinning of the biphase combination interface of organic-inorganic, greatly reduce boundary thermal resistance, product heat conductivity maximizes, and improving the problem such as performance deep fades and internal junction destruction so that the heat conductivity of Heat Conduction Material maximizes, it is possible to efficiently solve powder stuffing dispersion unstable, cladding uneven, modified not exclusively or the problem such as multilayer coating structure.
Use the powder stuffing that present invention process and method prepare, it is adaptable to the goods such as heat-conducting plastic, heat conductive rubber.
Detailed description of the invention
Below by modified heat-shrinkable T bush and modified heat conductive silica gel, the preferably embodiment of the present invention is described in further detail.
Embodiment 1
A kind of modified conductive hot Heat-Shrinkable Tubings, uses following steps to prepare:
Step S1: heat filling disperses；
By the common aluminium oxide of 100 parts of median 5um; 10 parts of median be 0.5 spherical alumina Al filler add mixing plant, starting device rotating speed is 200 revs/min, the dispersant that mass content is 10% of dropping organic solvent diluting; wherein; dispersant is silicone coupling agents, and organic solvent is ethanol, within 3 minutes, is added dropwise to complete; regulation equipment rotating speed 1000 revs/min; disperseing 10 minutes, its filler temperature controls at 50 ~ 100 DEG C, shuts down standing and is cooled to room temperature.
Step S2: heat filling is modified
Powder body step S1 processed adds in dry method modification processing equipment, starting device stirring at low speed, rotating speed 100 revs/min, start simultaneously at the modifying agent that dropping organic solvent diluting is good, its modifier content is 10%, and wherein modifying agent is silicone coupling agents, and organic solvent is ethanol；Controlling rate of addition according to amount of filler in equipment, within 3 minutes, drip, dispersant improves equipment mixing speed, its rotating speed 5000 revs/min, modification 50 minutes after being added dropwise to complete, and secondary coating modification has processed, and prepares functional heat filling.
Step S3: pyrocondensation masterbatch pelletize
Following raw material being sequentially added into mixed processing in banbury, prepares conductive hot compression material masterbatch, processing temperature is 100～150 DEG C, 20 minutes mixer mixing time；Its ratio is as follows: the functional heat filling that ethylene-vinyl acetate copolymer 50 parts, step S2 prepare 45 parts, the polynary hindered phenol of antioxidant 0.5～2 parts, lubricant polyethylene wax 0.5～2 parts, compatilizer maleic anhydride graft copolymer 0.5 ~ 2 part.
Step S4: heat-shrinkable T bush molding
The masterbatch prepared prepares conductive hot Heat-Shrinkable Tubings by extrusion molding, cross-linking radiation, expanding and shaping.
Above-mentioned conductive hot Heat-Shrinkable Tubings is carried out performance measuring and evaluating, and its result is as follows: the conductive hot Heat-Shrinkable Tubings the highest expansion multiplying power of this processes is 5 times, and its heat conductivity is 0.9W/m K.
Embodiment 2
A kind of conductive hot Heat-Shrinkable Tubings, uses following steps to prepare:
Step S1: by the common aluminium oxide of 100 parts of median 5um; 10 parts of median are the spherical alumina Al filler addition mixing plant of 0.5um, and starting device rotating speed is 500 revs/min, the dispersant that mass content is 10% of dropping organic solvent diluting; wherein; dispersant is silicone coupling agents, and organic solvent is acetone, within 3 minutes, is added dropwise to complete; regulation equipment rotating speed 3000 revs/min; disperseing 5 minutes, its filler temperature controls at 50 ~ 100 DEG C, shuts down standing and is cooled to room temperature.
Step S2: powder body step S1 processed adds in dry process equipment, add organic solvent, making its solid-liquid volume ratio is 1, start stirring, rotating speed 200 revs/min, is simultaneously added dropwise the modifying agent that organic solvent diluting is good, and its modifier content is 20%, modifying agent is silicone coupling agents, and organic solvent is ethanol；Root controls rate of addition according to amount of filler in equipment, within 4 minutes, drips, and modifying agent continues after being added dropwise to complete to keep speed constant, and modification is after 30 minutes, and discharging is dried or oven drying at low temperature naturally, and secondary coating modification has processed, and prepares functional heat filling.
Step S3: following raw material is sequentially added into mixed processing in kneader, prepares conductive hot compression material masterbatch, and processing temperature is 100～150 DEG C, mixing time 20 minutes；Its ratio is as follows: functional heat filling 45 parts, antioxidant monothioester class complex 0.5～2 parts that ethylene-vinyl acetate copolymer 50 parts, step S2 prepare, lubricant silicon base lubricant 0.5～2 parts, compatilizer maleic anhydride grafting polyarylene block copolymer 0.5 ~ 2 part.
Step S4: heat-shrinkable T bush molding
The masterbatch prepared prepares conductive hot Heat-Shrinkable Tubings by extrusion molding, cross-linking radiation, expanding and shaping.
Above-mentioned conductive hot Heat-Shrinkable Tubings is carried out performance measuring and evaluating, and its result is as follows: the conductive hot Heat-Shrinkable Tubings the highest expansion multiplying power of this processes is 5 times, and its heat conductivity is 1.0W/m K.
Embodiment 3
A kind of conductive hot Heat-Shrinkable Tubings, uses following steps to prepare:
Step S1: by the common aluminium oxide of 100 parts of median 5um; 10 parts of median are the spherical alumina Al filler addition mixing plant of 0.5um, and starting device rotating speed is 500 revs/min, the dispersant that mass content is 20% of dropping organic solvent diluting; wherein; dispersant is silicone coupling agents, and organic solvent is acetone, within 5 minutes, is added dropwise to complete; regulation equipment rotating speed 2000 revs/min; disperseing 8 minutes, its filler temperature controls at 50 ~ 100 DEG C, shuts down standing and is cooled to room temperature.
Step S2: powder body step S1 processed adds in dry process equipment, add organic solvent, making its solid-liquid volume ratio is 3, start stirring, rotating speed 100 revs/min, is simultaneously added dropwise the modifying agent that organic solvent diluting is good, and its modifier content is 30%, modifying agent is titanate coupling agent, and organic solvent is ethyl ester；Root controls rate of addition according to amount of filler in equipment, within 5 minutes, drips, and after modifying agent is added dropwise to complete, continues to keep speed constant, and modification is after 60 minutes, and discharging is dried or oven drying at low temperature naturally, and secondary coating modification has processed, and prepares functional heat filling.
Step S3: following raw material is sequentially added into mixed processing in kneader, prepares conductive hot compression material masterbatch, and processing temperature is 100～150 DEG C, mixing time 20 minutes；Its ratio is as follows: functional heat filling 45 parts, antioxidant monothioester class complex 0.5～2 parts that ethylene-vinyl acetate copolymer 50 parts, step S2 prepare, lubricant silicon base lubricant 0.5～2 parts, compatilizer maleic anhydride grafting polyarylene block copolymer 0.5 ~ 2 part.
Step S4: heat-shrinkable T bush molding
The masterbatch prepared prepares conductive hot Heat-Shrinkable Tubings by extrusion molding, cross-linking radiation, expanding and shaping.
Above-mentioned conductive hot Heat-Shrinkable Tubings is carried out performance measuring and evaluating, and its result is as follows: the conductive hot Heat-Shrinkable Tubings the highest expansion multiplying power of this processes is 5 times, and its heat conductivity is 1.05W/m K.
Comparative example 1
Step (1): following raw material is sequentially added in mixing apparatus banbury mixing, prepare conductive hot compression material masterbatch, its ratio is as follows: ethylene-vinyl acetate copolymer 50 parts, the common aluminium oxide of median 5um 40 parts, the common aluminium oxide of median 0.5um 5 parts, the polynary hindered phenol of antioxidant 0.5～2 parts, lubricant polyethylene wax 0.5～2 parts, compatilizer maleic anhydride graft copolymer 0.5 ~ 2 part.
Step (2): the masterbatch that step (1) prepares extruded is shaped to tubing semi-finished product；
Step (3): by electron accelerator to tubing cross-linking radiation, and control crosslinking degree；
Step (4): by semi-finished product after irradiation by expansion patterning process, prepare conductive hot Heat-Shrinkable Tubings product.
Above-mentioned conductive hot Heat-Shrinkable Tubings is carried out performance measuring and evaluating, and its result is as follows: the conductive hot Heat-Shrinkable Tubings the highest expansion multiplying power of this processes is 2 times, and its heat conductivity is 0.5W/m K.
Result by embodiment 1 ~ 3 with comparative example 1, after using technical scheme that heat filling is processed, improve the compatibility of organic-inorganic thing, heat-conducting effect is more preferable, and greatly reduce the decay adding mechanical performance own to material of heat filling, making conductive hot Heat-Shrinkable Tubings the highest expansion multiplying power can reach the multiplying power added before heat filling, meanwhile, heat conductivility is greatly improved.
Embodiment 4
A kind of modified heat-conducting silicon rubber, uses following steps to prepare:
Step S1: heat filling disperses；
Ball-aluminium oxide by 100 parts of median 40um; 50 parts of median are the ball-aluminium oxide of 5um; the ball-aluminium oxide of 2 parts of median 1um; filler adds mixing plant; starting device rotating speed is 200 revs/min; the dispersant that mass content is 10% of dropping organic solvent diluting; wherein; dispersant is silicone coupling agents, and organic solvent is ethanol, within 3 minutes, is added dropwise to complete; regulation equipment rotating speed 1000 revs/min; disperseing 10 minutes, its filler temperature controls at 50 ~ 100 DEG C, shuts down standing and is cooled to room temperature.
Step S2: heat filling is modified
Powder body step S1 processed adds in wet processing apparatus, adds organic solvent so that it is solid-liquid volume ratio is 1, start stirring, rotating speed 50 revs/min, be simultaneously added dropwise the modifying agent that organic solvent diluting is good, its modifier content is 5%, and modifying agent is silicone coupling agents, and organic solvent is ethanol；Root controls rate of addition according to amount of filler in equipment, within 3 minutes, drips, and modifying agent continues after being added dropwise to complete to keep speed constant, and modification is after 30 minutes, and discharging is dried or oven drying at low temperature naturally, and secondary coating modification has processed, and prepares functional heat filling.
Step S3: heat-conducting silicon rubber goods
Following raw material is sequentially added into mixed processing in mixing apparatus, prepares heat-conducting silica gel sheet by compression molding；Its ratio is as follows: the functional heat filling that vinyl silicone oil 100 parts, step S2 prepare 900 parts, cross-linking agent 0.5～2 parts, catalyst 0.5～2 parts.
Testing above-mentioned heat conductive silica gel heat conductivility, its heat conductivity is 3.5W/m K.
Comparative example 2
Following raw material is sequentially added into mixed processing in mixing apparatus, prepares heat-conducting silica gel sheet by compression molding；Its ratio is as follows: vinyl silicone oil 100 parts, the ball-aluminium oxide of median 40um, 600 parts, median be the ball-aluminium oxide 288 parts of 5um, the ball-aluminium oxide of median 1um 12 parts, cross-linking agent 0.5～2 parts, catalyst 0.5～2 parts.
Testing above-mentioned heat conductive silica gel heat conductivility, its heat conductivity is 2.8W/m K.
The most visible by heat conduction heat-shrinkable T bush and the embodiment of heat-conducting silicon rubber and comparative example, use the functional conduction powder filler that present invention process and method prepare, it is remarkably improved the dispersibility of filler, improve the compatibility of organic-inorganic thing, reduce boundary thermal resistance, the heat conductivity effect of being significantly increased to composite.
Above content is to combine concrete preferred implementation further description made for the present invention, it is impossible to assert the present invention be embodied as be confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, it is also possible to make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. the method for the modification of a conduction powder filler, it is characterised in that comprise the following steps:
Step A: first conduction powder filler is stirred dispersion, is simultaneously introduced dispersant and is stirred, obtain the most scattered filler；
Step B: join in dispersing apparatus by filler the most scattered in step A, adds modifying agent and carries out surface modification treatment by dry or wet.
The method of the modification of conduction powder filler the most according to claim 1, it is characterised in that: described step A includes:
First joining in dispersing apparatus by conduction powder filling body, starting device stirs, and rotating speed is 100 ~ 500 revs/min, start simultaneously at the dispersant that dropping organic solvent diluting is good, the content of its dispersant is 5 ~ 50%, controls rate of addition according to amount of filler in dispersing apparatus, within 2 ~ 10 minutes, adds；After dispersant is added dropwise to complete, improving mixing speed, making rotating speed is 500 ~ 3000 revs/min, disperses 2 ~ 10 minutes, and keeps filler temperature at 50 ~ 100 DEG C, shuts down cooling, and once cladding dispersion completes, and obtains the most scattered filler.
The method of the modification of conduction powder filler the most according to claim 2, it is characterised in that: in step B, described dry method carries out surface modification treatment, including following sub-step:
Sub-step B1: first filler the most scattered in step A is added in modified device, starting device stirs, rotating speed is 50 ~ 300 revs/min, start simultaneously at the modifying agent that dropping organic solvent diluting is good, wherein the content of modifying agent is 5 ~ 50%, control rate of addition according to amount of filler in equipment, within 2 ~ 5 minutes, drip；
Sub-step B2: modifying agent improves equipment mixing speed after being added dropwise to complete, and makes rotating speed 200 ~ 1000 revs/min, and modification 2 ~ 10 minutes, secondary coating modification has processed；
Described wet method carries out surface modification treatment, including following sub-step:
Sub-step S1: first filler the most scattered in step A is added in modified device, add organic solvent, making the solid-liquid volume ratio in modified device is 0.1 ~ 5, start stirring, rotating speed is 20 ~ 200 revs/min, starts simultaneously at the modifying agent that dropping organic solvent diluting is good, and wherein modifier content is 5 ~ 50%, control rate of addition according to amount of filler in equipment, within 2 ~ 5 minutes, drip；
Sub-step S2: modifying agent continues after being added dropwise to complete to keep mixing speed constant, and modification 10 ~ 60 minutes, discharging is dried or oven drying at low temperature naturally, and secondary coating modification has processed.
The method of the modification of conduction powder filler the most according to claim 3, it is characterised in that:
Rotating speed in sub-step B1 is 100 ~ 200 revs/min；Described modifying agent content in organic solvent is 10 ~ 30%；
Rotating speed in sub-step B2 is 500 ~ 800 revs/min；
Solid-liquid volume ratio described in sub-step S1 is 1 ~ 3, and described modifying agent content in organic solvent is 10 ~ 30%.
The method of the modification of conduction powder filler the most according to claim 4, it is characterized in that: described conduction powder filler is to include at least one in calcium carbonate, aluminium hydroxide, magnesium hydroxide, silicon oxide, aluminium oxide, zinc oxide, boron nitride, aluminium nitride, silicon nitride, graphite powder, Graphene, carbon fiber, CNT, median 0.1 ~ the 50um of described conduction powder filler, the exterior appearance of described conduction powder filler is irregular, spherical, fibrous or bar-shaped.
The method of the modification of conduction powder filler the most according to claim 5, it is characterised in that: described dispersant is silane coupler；Described modifying agent is the one in silane coupler, titanate coupling agent or aluminate coupling agent.
The method of the modification of conduction powder filler the most according to claim 6, it is characterised in that: described organic solvent is at least one in methanol, ethanol, ethyl ester, toluene, acetone, gasoline.
8. a heat filling, it is characterized in that: use the method for the modification of the conduction powder filler described in claim 1 ~ 7 any one to prepare, wherein, described conduction powder filler is at least one in silicon oxide, aluminium oxide, zinc oxide, boron nitride, aluminium nitride, silicon nitride, graphite powder, Graphene, carbon fiber, CNT.
Heat filling the most according to claim 8, it is characterised in that: described heat filling uses following steps to be modified processing:
Step A: first conduction powder filling body is joined in dispersing apparatus, starting device stirs, and rotating speed is 100 ~ 500 revs/min, start simultaneously at the dispersant that dropping organic solvent diluting is good, the content of its dispersant is 5 ~ 50%, controls rate of addition according to amount of filler in dispersing apparatus, within 2 ~ 10 minutes, adds；After dispersant is added dropwise to complete, improving mixing speed, making rotating speed is 500 ~ 3000 revs/min, disperses 2 ~ 10 minutes, and keeps filler temperature at 50 ~ 100 DEG C, shuts down cooling, and once cladding dispersion completes, and obtains the most scattered filler；
Step B: join in dispersing apparatus by filler the most scattered in step A, adds modifying agent and carries out surface modification treatment by dry or wet；
Wherein, described dry method carries out surface modification treatment, including following sub-step:
Sub-step B1: first filler the most scattered in step A is added in modified device, starting device stirs, rotating speed is 50 ~ 300 revs/min, start simultaneously at the modifying agent that dropping organic solvent diluting is good, the content of its modifying agent is 5 ~ 50%, control rate of addition according to amount of filler in equipment, within 2 ~ 5 minutes, drip；
Sub-step B2: modifying agent improves equipment mixing speed after being added dropwise to complete, and makes rotating speed 200 ~ 1000 revs/min, and modification 2 ~ 10 minutes, secondary coating modification has processed；
Described wet method carries out surface modification treatment, including following sub-step:
Sub-step S1: first filler the most scattered in step A is added in modified device, add organic solvent, making the solid-liquid volume ratio in modified device is 0.1 ~ 5, start stirring, rotating speed is 20 ~ 200 revs/min, starts simultaneously at the modifying agent that dropping organic solvent diluting is good, and its modifier content is 5 ~ 50%, control rate of addition according to amount of filler in equipment, within 2 ~ 5 minutes, drip；
Sub-step S2: modifying agent continues after being added dropwise to complete to keep speed constant, and modification 10 ~ 60 minutes, discharging is dried or oven drying at low temperature naturally, and secondary coating modification has processed.
Heat filling the most according to claim 9, it is characterised in that: the rotating speed in described sub-step B1 is 100 ~ 200 revs/min；Described modifying agent content in organic solvent is 10 ~ 30%；Rotating speed in sub-step B2 is 500 ~ 800 revs/min, and solid-liquid volume ratio described in sub-step S1 is 2 ~ 4, and described modifying agent content in organic solvent is 10 ~ 30%；In sub-step S2, modifying agent continues after being added dropwise to complete to keep mixing speed constant.
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