CN105856553B - A kind of 3 D semiconductor laser plastic welding system - Google Patents
A kind of 3 D semiconductor laser plastic welding system Download PDFInfo
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- CN105856553B CN105856553B CN201610402715.9A CN201610402715A CN105856553B CN 105856553 B CN105856553 B CN 105856553B CN 201610402715 A CN201610402715 A CN 201610402715A CN 105856553 B CN105856553 B CN 105856553B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000004023 plastic welding Methods 0.000 title claims abstract description 26
- 230000033001 locomotion Effects 0.000 claims abstract description 52
- 238000003466 welding Methods 0.000 claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 230000004886 head movement Effects 0.000 claims abstract description 12
- 230000002441 reversible effect Effects 0.000 claims description 16
- 238000002955 isolation Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 15
- 239000004033 plastic Substances 0.000 abstract description 8
- 229920003023 plastic Polymers 0.000 abstract description 8
- 241000931526 Acer campestre Species 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 11
- 239000013307 optical fiber Substances 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
- B29C65/1641—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding making use of a reflector on the opposite side, e.g. a polished mandrel or a mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
- B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/301—Three-dimensional joints, i.e. the joined area being substantially non-flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Robotics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laser Beam Processing (AREA)
Abstract
A kind of 3 D semiconductor laser plastic welding system, including host computer, single-chip computer control system, allows laser head to do the laser head movement mechanism of D translation movement, reflecting mirror is made to do the mirror body of two-dimension translational movement in X, Y plane and make the rotatable work stage of workpiece clockwise or counterclockwise at Laser Diode System；Host computer issues motor message to laser head movement mechanism by single-chip computer control system, controls the movement of laser head, reflecting mirror and workpiece；Host computer realizes the three-dimensional welding to workpiece to control the switch of laser to Laser Diode System by issuing the signal of laser switch to single-chip computer control system.Optical Maser System and kinematic system are integrated into one by 3 D semiconductor laser plastic welding system of the present invention, it can also be achieved the high efficiency of different plastic devices, the three-dimensional laser welding of high quality simultaneously, solving the problem of the processing breadth of the laser plastic welding equipment generallyd use at present, small processing efficiency is low.
Description
Technical Field
The invention relates to the field of laser transmission welding, in particular to a three-dimensional semiconductor laser plastic welding system which is used for laser transmission welding between thermoplastic plastics.
Background
The laser welding technology is widely applied in the field of processing of metal materials, the excellent performance of the laser welding technology is accepted by various application industries, and the achievement is remarkable. With the implementation of the concept of environmental protection in global industrial production and the consideration of production cost control, plastics are increasingly widely applied to various industries as a renewable non-metallic material with excellent performance.
Laser plastic welding was first introduced in the 70's of the 20 th century, but has been slow in development because it is expensive and does not compete with conventional plastic welding techniques. But since the mid-90 s of the 20 th century, the laser welding technology has gradually gained wide popularity due to the decreasing equipment costs required.
The laser plastic welding utilizes a transmission welding principle, infrared laser is selected as a welding heat source, generally, laser in a wave band of 800nm-1100nm is taken as a main part, the absorptivity of the laser in the wave band is too low for most weldable transparent or colored hot melt plastics, and the energy loss of the laser when the laser passes through the materials is little. An upper layer and a lower layer of materials which are overlapped together during welding need to meet certain requirements; and the lower layer material is used as a heat action area and needs to have higher absorptivity to laser. The laser can be ensured to penetrate through the upper layer material to reach the surface of the lower layer material by meeting the two conditions, and the lower layer material has higher absorptivity, so that the laser is absorbed at the joint surface of the two layers of materials to generate heat, the plastic at the position is melted and is subjected to secondary polymerization under the action of proper pressure, and a welding line is formed between the upper layer material and the lower layer material after cooling so as to connect the upper layer material and the lower layer material together.
The laser plastic welding equipment generally adopted at present is a machine tool type structure, the execution of a laser track is realized through each shaft of the machine tool, and the processing efficiency is low. The applied patent documents are searched through data search,
chinese patent application No. 201410846200.9 discloses a device that uses a robotic arm to perform welding. But only can weld plastic workpieces in a plane, and the welding in a three-dimensional space cannot be realized. Moreover, the robot arm cannot perform large-size welding.
Chinese patent application No. 201410066447.5 discloses a similar three-dimensional laser plastic welding device, but in the patent, the fiber head is rotated 360 degrees in the ZY surface and the XY surface simultaneously by the reversible rotating table, so as to realize the movement of the laser head in the Z direction, which cannot be realized in the practical engineering.
Disclosure of Invention
The invention aims to design a three-dimensional semiconductor laser plastic welding system, which integrates a laser system and a motion system into a whole, can realize high-efficiency and high-quality three-dimensional laser welding of different plastic devices, and solves the problems of small processing breadth and low processing efficiency of the currently and generally adopted laser plastic welding equipment.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a three-dimensional semiconductor laser plastic welding system comprises an upper computer, a semiconductor laser system and a single chip microcomputer control system; the laser head motion mechanism enables the laser head to do three-dimensional translational motion, the reflecting mirror mechanism enables the reflecting mirror to do two-dimensional translational motion in the X, Y plane, and the rotatable workpiece table enables the workpiece to rotate clockwise or anticlockwise; the upper computer sends a motion signal to the laser head motion mechanism by sending a single chip microcomputer control system, so that the motion of the laser head, the reflecting mirror and the workpiece is controlled; the upper computer sends a signal of a laser switch to the semiconductor laser system through a single chip microcomputer control system, so that the laser switch is controlled; the laser head, the reflector and the workpiece table move in a matched mode to achieve three-dimensional welding of the workpiece.
Furthermore, the three-dimensional semiconductor laser plastic welding system comprises a workbench; the laser head movement mechanism is arranged on one side of the workbench; the two Y-direction guide rails are respectively arranged on the workbench in parallel through two Y-direction stand columns, and a first sliding block, a second sliding block and a corresponding driving device are arranged on the two Y-direction guide rails; the two ends of the X-direction guide rail are respectively connected with the first sliding block and the second sliding block on the two Y-direction guide rails, so that the X-direction guide rail is vertical to the Y-direction guide rail; a third slide block and a corresponding driving device are arranged on the X-direction guide rail; the two Z-direction upright columns are arranged on the upper end surface and the lower end surface of the third sliding block and are vertical to the X-direction guide rail; two ends of the Z-direction guide rail are respectively connected with the outer end parts of the two Z-direction upright posts through a connecting block, so that the Z-direction guide rail is perpendicular to the X-direction guide rail; the laser head clamp and the corresponding driving device are arranged on the Z-direction guide rail in a sliding manner; the reflecting mirror mechanism is arranged on the other side of the workbench; the two Y-direction rails are arranged on the workbench in parallel, and a fourth sliding block, a fifth sliding block and a corresponding driving device are arranged on the two Y-direction rails; the two ends of the X-direction track are connected with the fourth sliding block and the fifth sliding block and are vertical to the Y-direction track; a sixth sliding block and a corresponding driving device are arranged on the X-direction track; the reflector bracket is arranged on the sixth sliding block; the reflector is arranged on the reflector frame, and the reflector forms an angle of 45 degrees with the horizontal direction; the rotatable workpiece table and the reversible motor for controlling the rotation of the rotatable workpiece table are arranged in the center of the workbench of the laser head movement mechanism; the semiconductor laser system comprises a laser head, wherein the laser head is arranged on the laser head clamp; and the driving device and the reversible motor corresponding to each sliding block are respectively and electrically connected with the single chip microcomputer control system.
Preferably, the driving device corresponding to each sliding block comprises a servo motor, a pulley and a transmission belt connected to the servo motor and the pulley, and the sliding block is connected to the transmission belt.
Further, the single chip microcomputer control system comprises a single chip microcomputer supporting plate, an isolation column, a single chip microcomputer and a peripheral circuit thereof; the single chip microcomputer supporting plate is fixed on the workbench; the single chip microcomputer is fixed on the single chip microcomputer supporting plate through the isolation column; the laser plastic welding control is realized through an upper computer, wherein the upper computer presets the movement track of the laser head, then transmits the movement track to the singlechip, and controls the movement of the corresponding driving device and the reversible motor of each slide block after the movement track is processed by the singlechip control system, so that the laser head moves according to the set track.
Preferably, the semiconductor laser system is a laser system which outputs a collimated laser light source, and the output collimated light is focused on the workpiece processing surface through the laser head.
Preferably, the semiconductor laser system is a laser system of a laser light source with optical fiber output, and laser output by the optical fiber is focused on the processing surface of the workpiece through the laser head.
When the laser needs to be switched on and off, the upper computer sends a signal to the single chip microcomputer, the signal is processed by the relay and then is transmitted to the semiconductor laser system, and therefore the on-off control of the laser is achieved. The laser output by the semiconductor laser system is transmitted through the optical fiber, and the laser output by the laser can adapt to a long-distance working environment after being transmitted through the optical fiber. The laser at the tail end of the optical fiber is collimated by the collimating lens and finally focused on the processing surface of the workpiece through the laser head.
According to the three-dimensional semiconductor laser plastic welding system, the laser head clamp can move in the X, Y, Z direction under the control of the slide block and the servo motor. When the side face of a workpiece needs to be welded, the reflector which forms a 45-degree angle with the horizontal direction can ensure that vertical downward laser is vertically and vertically irradiated on the side face of the workpiece through reflection. The reflector can move in X, Y direction under the control of a servo motor. Meanwhile, the movement of the reflector in the X direction and the movement of the laser head clamp in the Z direction can be matched for focusing. The workpiece rotating table can rotate under the control of the reversible motor so as to ensure that the side surface of the workpiece can be completely welded. Namely, the three-dimensional welding of the plastic workpiece is realized. The servo motor and the reversible motor F are respectively connected with the single chip microcomputer control system and are finally controlled by the upper computer.
The plastic welding system can be matched with the X axis of the workpiece motion reflector or the Z axis of the motion laser head to focus when welding the side surface. Wherein the included angle between the reflector and the emergent light of the laser head is 45 degrees. When the bottom of the workpiece is welded as required, the angle of emergent light of the reflector and the laser head can be changed, and the laser head, the reflector and the workbench move in a matched manner to complete the welding of the bottom of the workpiece.
The laser head clamp is connected with the Z-direction guide rail and can slide on the Z-direction guide rail. The laser head is fixed on the laser head clamp. The servo motors are used for respectively controlling the movement of the sliding blocks on the X-direction guide rail, the Y-direction guide rail and the Z-direction guide rail, so that the laser head clamp can move in X, Y, Z directions.
Compared with the prior art, the invention has the beneficial effects that:
1. the system realizes the large-amplitude three-dimensional welding of the workpiece by combining the reflector and the two-dimensional motion platform.
2. The system integrates the laser system and the motion system together, and realizes the function of controlling the laser switch by the upper computer.
Drawings
FIG. 1 is a perspective view of a first embodiment of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic structural diagram of a laser head movement mechanism according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a laser head movement mechanism according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a two-dimensional movement structure of a reflector according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a three-dimensional motion system according to a second embodiment of the present invention;
FIG. 7 is a schematic view of a laser head movement mechanism according to a second embodiment of the present invention;
FIG. 8 is a schematic diagram of a two-dimensional moving structure of a mirror according to a second embodiment of the present invention;
FIG. 9 is a schematic view of a bottom surface weld of an embodiment of the present invention.
Detailed Description
Referring to fig. 1 to 9, the three-dimensional semiconductor laser plastic welding system of the invention comprises an upper computer 1, a semiconductor laser system 2 and a single chip microcomputer control system 3; the laser head movement mechanism 4 enables the laser head to do three-dimensional translational movement, the reflecting mirror mechanism 5 enables the reflecting mirror to do two-dimensional translational movement in a X, Y plane, and the rotatable workpiece table 6 enables the workpiece to rotate clockwise or anticlockwise; the upper computer sends a motion signal to the laser head motion mechanism by sending a single chip microcomputer control system, so that the motion of the laser head, the reflecting mirror and the workpiece is controlled; the upper computer sends a signal of a laser switch to the semiconductor laser system through a single chip microcomputer control system, so that the laser switch is controlled; the laser head, the reflector and the workpiece table move in a matched mode to guarantee the realization of three-dimensional welding of the workpiece.
Further, the three-dimensional semiconductor laser plastic welding system comprises,
a work table 100;
a laser head movement mechanism 4 disposed at one side of the table 100; comprises the steps of (a) preparing a mixture of a plurality of raw materials,
two Y-direction guide rails 401 and 401 'are respectively arranged on the workbench 100 in parallel through two Y-direction upright posts 402 and 402', and a first sliding block 403 and a second sliding block 404 as well as corresponding driving devices 405 and 405 'are arranged on the two Y-direction guide rails 401 and 401';
an X-direction guide rail 406, both ends of which are connected to the first and second sliders 403 and 404 on the two Y-direction guide rails 401 and 401 ', respectively, so that the X-direction guide rail 406 is perpendicular to the Y-direction guide rails 401 and 401'; a third slide block 407 and a corresponding driving device 408 are arranged on the X-direction guide rail 406;
two Z-direction vertical posts 409 disposed on the upper and lower end surfaces of the third slider 407, the Z-direction vertical posts 409 being perpendicular to the X-direction guide rail 406;
two ends of the Z-direction guide rail 410 are respectively connected with the outer end parts of two Z-direction upright posts 409 through a connecting block 411, so that the Z-direction guide rail 410 is vertical to the X-direction guide rail 406;
a laser head clamp 412 and a corresponding driving device 413 which are arranged on the Z-direction guide rail 410 in a sliding mode;
a mirror mechanism 5 provided on the other side of the table 100; comprises the steps of (a) preparing a mixture of a plurality of raw materials,
two Y-direction rails 51 and 51 ' are arranged on the workbench 100 in parallel, and a fourth slide block 52, a fifth slide block 53 and corresponding driving devices 54 and 54 ' are arranged on the two Y-direction rails 51 and 51 ';
an X-direction track 55, both ends of which are connected to the fourth and fifth sliders 52 and 53 and which is perpendicular to the Y-direction tracks 51 and 51'; a sixth slide block 56 and a corresponding driving device 57 are arranged on the X-direction track 55;
a mirror holder 58 provided on the sixth slider 56;
a reflector 59 disposed on the reflector frame 58, the reflector 59 forming an angle of 45 degrees with the horizontal direction;
a rotatable workpiece table 6 and a reversible motor 61 for controlling the rotation thereof, which are arranged in the center of the worktable 100 of the laser head movement mechanism 4;
the semiconductor laser system 2 comprises a laser head 21, and the laser head 21 is arranged on the laser head clamp 412; and the driving device and the reversible motor corresponding to each sliding block are respectively and electrically connected with the single chip microcomputer control system 3.
In the present embodiment, the semiconductor laser system 2 further includes a power supply 22, a MOSFET23, a current divider 24, a control power supply 25, a cooling power supply 26, and an L-type laser 27.
The upper computer sends a signal of a laser switch to the single chip microcomputer control system and controls the switch of the laser by combining a potentiometer and a driving power supply to send the signal to the semiconductor laser system; the laser head, the reflector and the workpiece table move in a matched manner to realize three-dimensional welding of the workpiece 200.
Referring to fig. 6, the driving device 405 (taking the first block 403 as an example, the same applies hereinafter) for the first block 403 according to the present invention includes a servo motor 4051, a pulley 4052 and a belt 4053 connected to the servo motor 4051 and the pulley 4052, and the first block 403 is connected to the belt 4053.
Further, the single chip microcomputer control system 3 comprises a single chip microcomputer support plate 31, an isolation column 32, a single chip microcomputer 33 and peripheral circuits (a relay 34 and a driving power supply 35) thereof; the single chip microcomputer supporting plate 31 is fixed on the workbench 100; the single chip microcomputer 33 is fixed on the single chip microcomputer supporting plate 31 through an isolation column 32; the control of laser plastic welding is realized through the upper computer 1, wherein, the upper computer 1 presets the track of laser head motion, then transmits to the singlechip 33, after the processing of singlechip control system 3, controls the motion of the corresponding drive arrangement of each slider and reversible motor to make the laser head 21 move according to the established track.
The upper computer sends a signal of a laser switch to the single chip microcomputer system, and the signal is transmitted to the semiconductor laser system by combining the potentiometer and the driving power supply, so that the laser switch is controlled.
Preferably, the semiconductor laser system is a laser system which outputs a collimated laser light source, and the output collimated light is focused on the workpiece processing surface through the laser head.
Preferably, the semiconductor laser system is a laser system of a laser light source with optical fiber output, and laser output by the optical fiber is focused on the processing surface of the workpiece through the laser head.
When the laser needs to be switched on and off, the upper computer sends a signal to the single chip microcomputer, the signal is processed by the relay and then is transmitted to the semiconductor laser system, and therefore the on-off control of the laser is achieved. The laser output by the semiconductor laser system is transmitted through the optical fiber, and the laser output by the laser can adapt to a long-distance working environment after being transmitted through the optical fiber. The laser at the tail end of the optical fiber is collimated by the collimating lens and finally focused on the processing surface of the workpiece through the laser head.
The invention relates to a three-dimensional semiconductor laser plastic welding system.A laser head clamp moves in the direction of X, Y, Z under the control of each slide block and a corresponding servo motor. When the side face of a workpiece needs to be welded, the reflector which forms a 45-degree angle with the horizontal direction can ensure that vertical downward laser is vertically and vertically irradiated on the side face of the workpiece through reflection. The reflector can move in X, Y direction under the control of the servo motor; meanwhile, the movement of the reflector in the X direction and the movement of the laser head clamp in the Z direction can be matched for focusing. The workpiece rotating table can rotate under the control of the reversible motor so as to ensure that the side surface of the workpiece can be completely welded. Namely, the three-dimensional welding of the plastic workpiece is realized. The servo motor and the reversible motor are respectively connected with the single chip microcomputer control system and are finally controlled by the upper computer. And the pattern set in the upper computer is transmitted to the single-chip microcomputer control system through the double-head USB to control the motion track of the laser head. The laser system and the motion system are integrated together, the laser can be always perpendicular to the workpiece processing surface, and the large-amplitude three-dimensional welding of the workpiece can be completed.
The singlechip is provided with a USB interface and is connected with an upper computer through a double-head USB line. In the upper computer, the figure to be welded is led in, the welding speed is set, and then the figure is input into the singlechip control system for processing. The single chip microcomputer control system mainly has two functions, on one hand, the function is to control the servo motor and the reversible motor to control the movement of the laser head in a three-dimensional space, the movement of the reflector and the movement of the workpiece table; another aspect is the switching of the control laser.
When the upper surface of a workpiece is welded, only welding is needed in an XY plane according to a welding track, a signal is output by the single chip microcomputer to enable the reflector to move leftwards to the leftmost side of the guide rail in the Y direction, so that the welding process is not influenced; and simultaneously controls the laser head to move on the XY plane.
When the side surface of the workpiece is welded, the single chip outputs a signal to enable the reflecting mirror to move rightwards according to the welding track requirement, and meanwhile the laser head moves in the Z-axis direction according to the required welding track. The reflector and the horizontal plane always form an angle of 45 degrees, so that when the laser head is positioned in the vertical direction, the output laser can vertically and directly irradiate on the surface to be welded of the workpiece. Meanwhile, the single chip controls the reversible motor according to the requirement of the welding track, so that the workpiece table rotates to drive the workpiece to rotate, and the whole side surface of the workpiece is ensured to be welded in a matching manner. Along with the change of the welding track, the singlechip controls the movement of the reflector in the X-axis direction to be matched with the movement of the laser head in the Z-axis direction to focus or ensure constant defocusing amount, thereby ensuring the welding effect. When the welding track is downward, the single chip controls the laser head to move downward and controls the reflector to move leftward, so that focusing or defocusing amount is not changed.
When the bottom surface of a workpiece is welded, the angle between the reflector and the laser emergent light is changed according to the requirement of a welding track, so that the emergent light which vertically faces downwards changes direction and hits the bottom surface of the workpiece (see fig. 9). Because the laser does not vertically hit the surface of the workpiece at the moment, the size of a light spot can be changed, and the defocusing amount needs to be adjusted or a lens needs to be replaced to ensure the uniform size of the welding seam.
Wherein the switching of the control laser is realized by:
when the LASER is turned on, two pins of the LASER ENABLE are required to be conducted, otherwise, only the two pins of the LASER ENABLE are required to be disconnected; meanwhile, according to the set welding track, the output voltage difference of two lead wires on the single chip microcomputer is controlled to be 5V by the upper computer at the position where the laser is required to be opened, and on the contrary, the output voltage of the two lead wires is 0. Thus, the two leads are connected to a 5V relay and then to those two pins on the LASER ENABLE. The function of controlling the laser switch through the upper computer can be realized.
In this embodiment, the purpose of the drive power supply and relay is to integrate the motion system with the laser system. The driving power supply simultaneously provides 5V and 24V voltage; the relay is a 5V relay. The single chip microcomputer control system needs 24V power supply voltage, and the single chip microcomputer is powered by a driving power supply; meanwhile, when the laser needs to be turned on, an interface of the single chip microcomputer is pulled down to 0V from 5V output. In addition, the other interface of the singlechip always keeps the voltage output of 5V. Therefore, the two interfaces are connected to a 5V relay and then connected to a LASER ENABLE interface on a LASER by utilizing the phenomenon, so that the function of controlling the LASER switch through an upper computer is realized.
When the LASER system outputs LASER, two pins on the LASER ENABLE interface need to be short-circuited, and on the contrary, the two interfaces are in an open circuit state.
The invention can carry out three-dimensional welding with larger breadth, the maximum working range is 5m by 5m, and the maximum scanning speed is 200 mm/s.
The parts not involved in the present invention are the same as or can be implemented using the prior art.
Any modifications, simplifications, or other alternatives made without departing from the principles of the invention are intended to be included within the scope of the invention.
Claims (4)
1. A three-dimensional semiconductor laser plastic welding system comprises an upper computer, a semiconductor laser system and a single chip microcomputer control system; the laser head motion mechanism is characterized by further comprising a laser head motion mechanism which enables the laser head to do three-dimensional translational motion, a reflecting mirror mechanism which enables the reflecting mirror to do two-dimensional translational motion in an X, Y plane, and a rotatable workpiece table which enables a workpiece to rotate clockwise or anticlockwise; the upper computer sends a motion signal to the laser head motion mechanism by sending a single chip microcomputer control system, so that the motion of the laser head, the reflecting mirror and the workpiece is controlled; the upper computer sends a signal of a laser switch to the semiconductor laser system through a single chip microcomputer control system, so that the laser switch is controlled; the laser head, the reflector and the workpiece table move in a matched manner to realize three-dimensional welding of the workpiece; wherein,
the laser head movement mechanism is arranged on one side of a workbench; comprises the steps of (a) preparing a mixture of a plurality of raw materials,
the two Y-direction guide rails are respectively arranged on the workbench in parallel through the two Y-direction stand columns, and a first sliding block, a second sliding block and a corresponding driving device are arranged on the two Y-direction guide rails;
the two ends of the X-direction guide rail are respectively connected with the first sliding block and the second sliding block on the two Y-direction guide rails, so that the X-direction guide rail is vertical to the Y-direction guide rail; a third slide block and a corresponding driving device are arranged on the X-direction guide rail;
the two Z-direction upright columns are arranged on the upper end surface and the lower end surface of the third sliding block and are vertical to the X-direction guide rail;
two ends of the Z-direction guide rail are respectively connected with the outer end parts of the two Z-direction upright posts through a connecting block, so that the Z-direction guide rail is perpendicular to the X-direction guide rail;
the laser head clamp and the corresponding driving device are arranged on the Z-direction guide rail in a sliding manner;
the reflecting mirror mechanism is arranged on the other side of the workbench; comprises the steps of (a) preparing a mixture of a plurality of raw materials,
the two Y-direction rails are arranged on the workbench in parallel, and a fourth sliding block, a fifth sliding block and a corresponding driving device are arranged on the two Y-direction rails;
the two ends of the X-direction track are connected with the fourth sliding block and the fifth sliding block and are vertical to the Y-direction track; a sixth sliding block and a corresponding driving device are arranged on the X-direction track;
the reflector bracket is arranged on the sixth sliding block;
the reflector is arranged on the reflector frame, and the reflector forms an angle of 45 degrees with the horizontal direction;
the rotatable workpiece table and the reversible motor for controlling the rotation of the rotatable workpiece table are arranged in the center of the workbench of the laser head movement mechanism;
the semiconductor laser system comprises a laser head, wherein the laser head is arranged on the laser head clamp;
the driving device and the reversible motor corresponding to each sliding block are respectively and electrically connected with the single chip microcomputer control system;
the single chip microcomputer control system comprises a single chip microcomputer supporting plate, an isolation column, a single chip microcomputer and a peripheral circuit thereof; the single chip microcomputer supporting plate is fixed on the workbench; the single chip microcomputer is fixed on the single chip microcomputer supporting plate through the isolation column; the laser plastic welding control is realized through an upper computer, wherein the upper computer presets the movement track of the laser head, then transmits the movement track to the singlechip, and controls the movement of the corresponding driving device and the reversible motor of each slide block after the movement track is processed by the singlechip control system, so that the laser head moves according to the set track.
2. The system of claim 1 wherein the drive means associated with each slide comprises a servo motor, a pulley, and a belt connected to the servo motor and the pulley, the slide being connected to the belt.
3. A three dimensional semiconductor laser plastic welding system as defined in claim 1 wherein said semiconductor laser system is a laser system that outputs a collimated laser light source that is focused onto the work surface by said laser head.
4. A three dimensional semiconductor laser plastic welding system as defined in claim 1 wherein said semiconductor laser system is a fiber output laser source laser system, said fiber output laser being focused onto the work surface by said laser head.
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| CN106273415B (en) * | 2016-08-19 | 2018-06-01 | 上海三束实业有限公司 | A kind of plastics laser-beam welding machine |
| CN107225330A (en) * | 2017-07-19 | 2017-10-03 | 云南电网有限责任公司电力科学研究院 | A kind of high voltage alive equipment laser rust-removing device |
| CN109367028A (en) * | 2018-10-15 | 2019-02-22 | 武汉博联特科技有限公司 | A kind of laser soldering automatic processing apparatus for plastics welding |
| CN112828467A (en) * | 2020-12-29 | 2021-05-25 | 孙永超 | Intelligent laser spot welding equipment for chip processing and chip processing technology |
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| CN101342637A (en) * | 2008-03-05 | 2009-01-14 | 上海海事大学 | Multi-shaft, numerical control, double-workbench laser processing system |
| CN205705288U (en) * | 2016-06-08 | 2016-11-23 | 嘉兴九硕激光科技有限公司 | A kind of 3 D semiconductor laser plastic welding system |
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| JPH05131282A (en) * | 1991-11-11 | 1993-05-28 | Amada Co Ltd | Method and device for laser beam welding |
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| CN101342637A (en) * | 2008-03-05 | 2009-01-14 | 上海海事大学 | Multi-shaft, numerical control, double-workbench laser processing system |
| CN201164931Y (en) * | 2008-03-14 | 2008-12-17 | 中国科学院上海光学精密机械研究所 | Numerical control radiator laser welding machine |
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Effective date of registration: 20240708 Address after: Zone G, 3rd Floor, Building 5, No. 2201 Yongsheng Road, Jiading District, Shanghai, 201821 Patentee after: OPPTON, Inc. Country or region after: China Address before: 315400 Yuyao City Economic Development Zone, Ningbo City, Zhejiang Province Patentee before: NINGBO JIUTIAN LASER TECHNOLOGY Co.,Ltd. Country or region before: China |