CN105848416B - 一种基板及移动终端 - Google Patents
一种基板及移动终端 Download PDFInfo
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Abstract
本发明涉及到电子技术领域,公开了一种基板及移动终端。该基板具有电气图案以及多个元器件,基板还包括:树脂层以及薄树脂层,元器件镶嵌在树脂层内且支脚的端面与树脂层的表面齐平;薄树脂层贴附在树脂层上元器件支脚外露的一面,薄树脂层上设置有与每个支脚对应的通孔,电路图案附着在薄树脂层背离树脂层的一面,且电路图案连接有伸入每个通孔内并与支脚电连接的焊盘。在上述技术方案中,通过同向的器件焊盘面都处于在同一个平面,通过压合薄树脂;解决了器件的焊盘到铜层有相同深度需求,同时减少焊盘大小和焊盘间距的要求,方便了加工,进而提高了电路图案在连接时的效果,并且解决模块整体布局合理性和产品小型化、薄型化的问题。
Description
技术领域
本发明涉及到电子技术领域,尤其涉及到一种基板及移动终端。
背景技术
目前业界采用ECP技术的主要目的:提升产品性能、集成度更高;向产品需求更薄、更小的方向发展。埋嵌式基板:根据基板/PCB加工工艺和元器件装配特点,将元器件埋嵌入基板/PCB中的新的封装技术;它提升产品集成度,减少模块外形尺寸;同时能提升产品的可靠性和电热性能。
但是现有技术中的埋设普通正常ECP加工流程中同树脂层埋嵌的器件,当多颗器件应用到埋嵌基板中时,由于多个器件的高度不同,现有技术中的埋设结构难以保障器件的焊盘到基板表面的铜层有相同高度,从而导致器件在连接时,需要开设的孔的深度不同,在生产过程中,造成每个孔的加工深度不同,极大的影响到基板在加工时的工作效率,且由于元器件埋设深度的不同,造成元器件在与电气图案在连接时的焊盘的大小不同,在形成电气图案时,影响到元器件与电气图案的连接效果。
发明内容
本发明提供了一种基板及移动终端,用以提高基板上元器件与电气图案的连接效果。
为了解决上述技术问题,本发明提供了一种基板,所述基板具有电气图案以及多个元器件,所述基板还包括:树脂层以及薄树脂层,所述多个元器件镶嵌在所述树脂层内,且每个元器件的支脚上用于与所述电气图案连接的端面外露出所述树脂层且与所述树脂层的表面齐平;所述薄树脂层贴附在树脂层上元器件支脚外露的一面,所述薄树脂层上设置有与每个支脚对应的通孔,所述电气图案附着在所述薄树脂层背离所述树脂层的一面,且所述电气图案连接有伸入每个通孔内并与支脚电连接的焊盘。
在上述技术方案中,通过将多个元器件埋设在薄树脂层,并且在埋设时,多个元器件的支脚与树脂层的表面齐平,从而使得在基板制备过程中,在薄树脂层进行打孔外露元器件的支脚时,打孔的深度相同,实现了打孔的可控性,方便了加工,并且多个元器件的支脚采用在同一表面设置,提高了焊盘的可能性,进而提高了电气图案在连接时的效果。
在上述具体设置时,该基板还包括覆盖在所述薄树脂层上的保护层,且所述保护层上设置有多个窗口结构,所述多个窗口结构与所述电气图案的外接端口一一对应。通过设置的保护层包裹住基板,从而避免基板上的电气图案线外露造成铜线氧化的情况,提高了整个基板的使用效果。
在一种具体的情况中,基板上的电气图案分布在所述两个薄树脂层,所述两层电气图案之间通过穿过所述树脂层及薄树脂层的金属化通孔连接,且所述多个元器件中,每个元器件的支脚朝向其连接电气图案的一面。即基板上的电气图案采用两层设置的方式,设置在基板上相对的两个表面上,提高了电气图案的分布效率,并且在设置元器件时,元器件的支脚朝向其对应连接的电气图案的连接点,从而简化电气图案的布局,降低走线长度,提高基板的使用率,进而提高基板的整体效果。
在上述设置时,所述薄树脂层的厚度介于20μm~30μm。从而可以有效的控制打孔的深度,以及焊盘的占用的面积,在更具体的设置中,所述薄树脂层的厚度为20μm。
本发明还提供了一种移动终端,该移动终端包括壳体以及设置在所述壳体内的电源模块以及与所述电源模块连接的控制模块,其中,所述电源模块与所述控制模块分别包括上述任一项所述基板。
在上述技术方案中,通过同向的器件焊盘面都处于在同一个平面,通过压合薄树脂;解决了器件的焊盘到铜层有相同深度需求,同时减少焊盘大小和焊盘间距的要求,方便了加工,进而提高了电气图案在连接时的效果,并且解决模块整体布局合理性和产品小型化、薄型化的问题,进而改善电源模块和控制模块等电气连接的产品小型化及薄型化的效果,便于移动终端的加工以及薄型化发展。
该移动终端可以为不同的终端,如手机或穿戴的通讯设备。
附图说明
图1为本发明实施例提供的基板的结构示意图;
图2为本发明实施例提供的另一种基板的结构示意图;
图3a~图3m为本发明实施例提供的基板的流程工艺图。
附图标记:
1-树脂层 2-薄树脂层 21-通孔 3-元器件
31-第二元器件 32-第一元器件 4-电气图案
41-覆铜层 5-保护层 51-窗口结构
6-金属化通孔 10-第一粘性膜 11-第二粘性膜 20-模具
201-镂空结构
具体实施方式
为了使本发明的目的、技术方案和优点更加清楚,下面将结合附图对本发明作进一步地详细描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
如图1所示,图1示出了本发明实施例提供的基板的结构示意图。
为了解决上述技术问题,在本实施例中提供了一种基板,该基板上设置有电气图案4及多个元器件3,该基板还包括:树脂层1以及薄树脂层2,多个元器件3镶嵌在树脂层1内,且每个元器件3的支脚上用于与电气图案4连接的端面外露出树脂层1且与树脂层1的表面齐平;薄树脂层2贴附在树脂层1上元器件3支脚外露的一面,薄树脂层2上述和只有与每个支脚对应的通孔,电气图案4附着在薄树脂层2背离树脂层1的一面,且电路图层4连接有伸入到每个通孔内并与支脚连接的焊盘。
在上述实施例中,通过同向的元器件焊盘面(即元器件3的支脚)都处于在同一个平面,通过压合薄树脂;解决了器件的焊盘到铜层有相同深度需求,从而使得在基板制备过程中,在薄树脂层2进行打孔外露元器件3的支脚时,打孔的深度相同,实现了打孔的可控性;同时减少焊盘大小和焊盘间距的要求,方便了加工,进而提高了电气图案4在连接时的效果,并且解决模块整体布局合理性和产品小型化、薄型化的问题。
为了方便理解本实施例提供的基板的结构,下面结合附图对其结构以及原理进行详细的说明。
如图1及图2所示,本实施例提供的基板由三层层叠而成,包括两层薄树脂层2以及夹设在两层薄树脂层2之间的树脂层1;其中,元器件3埋设在树脂层1,在本实施例中,该元器件3包括第一元器件32和第二元器件31,其中,第一元器件32为元器件3朝向一个方向的元器件3,第二元器件31为元器件3的支脚朝向与第一元器件32支脚相反的方向的元器件3,即第一元器件32和第二元器件31的支脚相背设置。
继续参考图2,本实施例提供的第一元器件32和第二元器件31的个数均为多个,且该第一元器件32和第二元器件31的个数可以根据实际基板的功能进行选择。在具体设置时,如图2所示,基板上的电气图案4分布在两个薄树脂层2,两层电气图案4之间通过穿过树脂层1及薄树脂层2的金属化通孔6连接,且多个元器件3中,每个元器件3的支脚朝向其连接电气图案4的一面。具体的,第一元器件32和第二元器件31埋设在树脂层1内,且第一元器件32和第二元器件31的支脚的端面与树脂层1的表面齐平,该表面为贴附薄树脂层2的表面;并且薄树脂层2上设置了与第一元器件32及第二元器件31的支脚相对应的通孔21,通过在薄树脂层2上设置的通孔21,使得第一元器件32和第二元器件31的支脚外露并与电气图案4连接。此外,两层电气图案4之间通过穿设在两层薄树脂层2及树脂层1的金属化通孔6连接组成一个整体电气图案4。
在采用上述设置时,基板上的电气图案4路径更短,电气图案4布局合理,进而电气图案4的性能得到提升,且电气图案4的面积能够有效的降低。与现有技术中的基板相比,现有技术中的基板上普通ECP(Electronic Circuit Protector,电子电气图案4保护装置)采用器件向上/向下放置的设计,器件放置设计时仅考虑模块空间是否满足需求;焊盘背面的铜层利用率偏低,需要互连信号采用钻孔连接,增加模块的面积。本发明实施例提供的基板在设计放置元器件3时,考虑空间制约条件同时也考量的互连的因素,保障模块的整体利用率提升,减少模块的面积
在具体设置时,多颗元器件3应用到埋嵌的基板中时,同向的元器件3的焊盘到电气图案4层都是相同高度,保障激光钻孔工艺流程。同时本发明采用器件焊盘面都是增加薄树脂,减少钻孔深度,降低钻孔上下偏差,保障芯片采用小焊盘的芯片设计。
此外,在具体的设置过程中,为了提高基板在使用时的安全性,该基板还包括覆盖在薄树脂层2上的保护层5,且保护层5上设置有多个窗口结构51,多个窗口结构51与电气图案4的外接端口一一对应。通过设置的保护层5包裹住基板,从而避免基板上的电气图案4线外露造成铜线氧化的情况,提高了整个基板的使用效果。
在上述实施例中,具体设置时,薄树脂层2的厚度介于20μm~30μm。从而可以有效的控制打孔的深度,以及焊盘的占用的面积,在更具体的设置中,所述薄树脂层2的厚度为20μm。
为了理解本实施例提供的基板的结构,下面结合附图3a~附图3m,详细说明本实施例提供的基板的制备方法。该方法具体为:
放置第一元器件32,且第一元器件32的支脚位于同一平面;
填充树脂形成包裹第一元器件32;且第一元器件32的支脚与树脂的表面齐平;
在树脂的表面贴附薄树脂层2;
在薄树脂层2上形成电气图案4,且该电气图案4与第一元器件32连接。
在上述技术方案中,在上述实施例中,通过同向的器件焊盘面(即元器件3的支脚)都处于在同一个平面,通过压合薄树脂;解决了器件的焊盘到铜层有相同深度需求,从而使得在基板制备过程中,在薄树脂层2进行打孔外露元器件3的支脚时,打孔的深度相同,实现了打孔的可控性;同时减少焊盘大小和焊盘间距的要求,方便了加工,进而提高了电气图案4在连接时的效果,并且解决模块整体布局合理性和产品小型化、薄型化的问题。
为了方便理解上述方法,下面结合具体的附图对其步骤进行详细的描述。
步骤一:如图3a~图3c所示,将模具20放置在第一粘性膜10上,且模具20上具有容纳第一元器件32的镂空结构201;将第一元器件32放入到镂空结构201,且第一元器件32的支脚粘接在第一粘性膜10上;并在模具20的镂空结构201中填充树脂。
具体的,其中的第一粘性膜10的一面具有粘性,模具20设置在第一粘性膜10上具有粘性的一面,该模具20上具有多个镂空结构201,该镂空结构201用于容纳第一元器件32。将第一元器件32放置到镂空结构201中,且在放置时,第一元器件32的支脚朝向第一粘性膜10,并且通过第一粘性膜10的粘性将第一元器件32进行固定。之后,在镂空结构201中填充树脂,使得树脂的表层与镂空结构201的顶面齐平,在上述方法中,通过设置的模具20放置元器件3,方便了元器件3埋设,提高了生产的效率以及产品的合格率。
步骤二:如图3d~图3h,在模具20上与第一粘性膜10相对的一面粘贴第二粘性膜11;取下模具20,并祛除第一粘性膜10;放置第二元器件31,且第二元器件31的支脚粘接在第二粘性膜11;填充树脂包裹第二元器件31。
具体的,如图3d所示,在模具20上与第一粘性膜10相背的一面贴附第二粘性膜11,即通过第二粘性膜11将填充的树脂粘住,之后,如图3e所示,将第一粘性膜10去掉,并如图3f所示,将模具20祛除,此时,填充的树脂粘贴在第二粘性膜11上。
如图3g所示,将第二元器件31放置到第二粘性膜11上,此时,第二元器件31的支脚粘贴在第二粘性膜11上。之后,如图3h所示,填充树脂,将第二元器件31包裹起来。通过采用采用在树脂层1的另一面设置第二元器件31,从而提高了电气图案4的分布效率,并且在设置元器件3时,元器件3的支脚朝向其对应连接的电气图案4的连接点,从而简化电气图案4的布局,降低走线长度,提高基板的使用率,进而提高基板的整体效果。
步骤三、如图3i~图3j,祛除第二粘性膜11,在形成的树脂层1的两面分别粘贴薄树脂层2,在薄树脂层2上开口,露出第一元器件32及第二元器件31的支脚;并根据设计的电气图案4在树脂层1及薄树脂层2上开通孔21。
具体的,如图3i所示,祛除第二粘性膜11,此时,第一元器件32及第二元器件31均埋设在树脂层1中,且第一元器件32及第二元器件31的支脚外露在树脂层1的表面,该表面用于贴附薄树脂层2。继续参考图3i,在树脂层1的两个相对的表面粘贴薄树脂层2,在具体设置时,薄树脂层2的厚度介于20μm~30μm。从而可以有效的控制打孔的深度,以及焊盘的占用的面积,在更具体的设置中,所述薄树脂层2的厚度为20μm。如图3j所示,在粘贴完后两层薄树脂层2后,在粘贴的薄树脂层2中开设通孔21,该通孔21对应第一元器件32和第二元器件31的支脚,并且薄树脂层2及树脂层1上还开设了贯穿的通孔21,该通孔21用于形成金属化通孔6以及使得位于两个薄树脂层2上的电气图案4连接成一个整体的电气图案4。
步骤四、在薄树脂层2上镀铜形成覆铜层41,并将覆铜层41刻蚀形成电气图案4。即在薄树脂层2的两面分别镀铜,并对镀铜进行刻蚀形成电气图案4。
具体的,如图3k所示,在两个薄树脂层2上分别镀铜覆盖,并且在镀铜时,覆铜层41与第一元器件32及第二元器件31的支脚连通,此外,覆铜层41穿过贯穿薄树脂层2及树脂层1的通孔21形成金属化通孔6。如图3l所示,对镀铜层进行刻蚀,形成电气图案4,此时,在基板上形成一个完整的电气图案4,该电气图案4上,第一元器件32及第二元器件31的支脚均朝向其对应连接的电气图案4所在的一面,从而减少了电气图案4的设置,避免过多的使用金属化通孔6,提高了电气图案4布局的合理性。
步骤五、如图3m所示,涂覆保护层5,并在保护层5上开设与电气图案4的外接端口对应的窗口结构51。
具体的如图3m所示,通过设置的保护层5保护电气图案4,避免电气图案4被氧化,提高整个基板的在使用时的安全性。在涂覆保护层5时,保护层5也会填充金属化通孔6,保护金属化通孔6内的金属,从而提高了整个基板的安全性。在具体设置时,该保护层5可以为漆层。
上述实施例提供的基板可以应用到不同的产品上,如通讯设备或电气设备。如:手机、平板电脑、无线路由器、穿戴电子设备、灯具、空调、电热水器、电表、摄像机、电话、电脑等。
在一个具体的实施例中,本发明实施例还提供了一种移动终端,该移动终端包括壳体以及设置在所述壳体内的电源模块以及与所述电源模块连接的控制模块,其中,所述电源模块与所述控制模块分别包括上述任一项所述基板。
在上述实施例中,电源模块和控制模块分别采用上述实施例中的基板,应当理解的是,电源模块与控制模块在采用上述基板时,基板上的电气图案以及埋设的元器件根据电源模块和控制模块的功能进行选择。由上述实施例可以看出,该基板通过同向的器件焊盘面都处于在同一个平面,解决了器件的焊盘到铜层有相同深度需求,同时减少焊盘大小和焊盘间距的要求,方便了加工,进而提高了电气图案在连接时的效果,并且解决模块整体布局合理性和产品小型化、薄型化的问题,通过上述基板的效果,使得本实施例提供的电源模块和控制模块在采用上述基板时,能够有效的改善电源模块和控制模块的加工效率,以及电气连接效果,并且有利于小型化及薄型化的发展,进而改善电源模块和控制模块等采用上述基板的结构的电气连接的产品小型化及薄型化。通过基板改善控制模块及电源模块的效果,进而可以改善移动终端在生产时的加工效率,以及电气连接的效果,同时,还便于移动终端的小型化和薄型化的发展。
在具体设置时,该移动终端可以为不同的终端,如手机或穿戴的通讯设备。
显然,本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样,倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内,则本发明也意图包含这些改动和变型在内。
Claims (6)
1.一种基板,所述基板具有电气图案以及多个元器件,其特征在于,所述基板还包括:树脂层以及薄树脂层,所述多个元器件镶嵌在所述树脂层内,且每个元器件的支脚上用于与所述电气图案连接的端面外露出所述树脂层且与所述树脂层的表面齐平;所述薄树脂层贴附在树脂层上元器件支脚外露的一面,所述薄树脂层上设置有与每个支脚对应的通孔,所述电气图案附着在所述薄树脂层背离所述树脂层的一面,且所述电气图案连接有伸入每个通孔内并与支脚电连接的焊盘;
所述多个元器件的支脚外露到所述树脂层相对的两个表面,所述电气图案分布在两个薄树脂层,所述两层电气图案之间通过穿过所述树脂层及薄树脂层的金属化通孔连接,且所述多个元器件中,每个元器件的支脚朝向其连接电气图案的一面。
2.如权利要求1所述的基板,其特征在于,还包括覆盖在所述薄树脂层上的保护层,且所述保护层上设置有多个窗口结构,所述多个窗口结构与所述电气图案的外接端口一一对应。
3.如权利要求1所述的基板,其特征在于,所述薄树脂层的厚度介于20μm~30μm。
4.如权利要求3所述的基板,其特征在于,所述薄树脂层的厚度为20μm。
5.一种移动终端,其特征在于,包括壳体以及设置在所述壳体内的电源模块以及与所述电源模块连接的控制模块,其中,所述电源模块与所述控制模块分别包括如权利要求1~4任一项所述基板。
6.如权利要求5所述的移动终端,其特征在于,所述移动终端为手机或穿戴的通讯设备。
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