CN105845605B - Prevent the method and device of wafer bonding die - Google Patents
Prevent the method and device of wafer bonding die Download PDFInfo
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- CN105845605B CN105845605B CN201610166353.8A CN201610166353A CN105845605B CN 105845605 B CN105845605 B CN 105845605B CN 201610166353 A CN201610166353 A CN 201610166353A CN 105845605 B CN105845605 B CN 105845605B
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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Abstract
The invention discloses a kind of method and devices for preventing wafer bonding die, are related to field of semiconductor manufacture, to solve the problems, such as that addition is gone adhesion to be formulated and invented manually.The method comprise the steps that obtaining edited father's formula, which is formulated is made of the son formula of different process and wafer path；Whether added with for executing the target sub- formula for going adhesion to handle in detection father's formula；If being not added with target sub- formula in father's formula, the target sub- formula of preediting is transferred from the function library of backstage；The target sub- formula transferred is automatically added on the predeterminated position in father's formula, modified father formula is obtained.Present invention is mainly applied in semiconductor etching process.
Description
Technical field
The present invention relates to field of semiconductor manufacture more particularly to a kind of method and devices for preventing wafer bonding die.
Background technique
When executing etching technics to wafer (also known as silicon wafer), mechanical arm takes out wafer from film magazine (Cassette),
According to the needs of process flow, wafer is sequentially placed into different technical modules (Process Module) and is processed,
And the wafer after processing is put back into film magazine.Operator can select the computer program of different process (again by console
Referred to as son formula) and wafer path of the wafer after different process module, thus edit out complete wafer process process
(also known as doing father's formula).Computer according to operator select as a result, automatically generating wafer by scheduler module (Scheduler)
Transmission sequence task (Job), mechanical arm executes the sequence task, realizes that automation of the wafer between each technical module passes
It is defeated, it is finally completed entire process flow.
During wafer processing, influenced by mechanical arm absorption or process, crystal column surface can carry one
There is Electrostatic Absorption effect so that generating potential difference between crystal column surface and an electric field in quantitative charge, and this effect will lead to
Other wafers in the dielectric support original part or film magazine of wafer and mechanical arm stick together, and bonding die are led to the problem of, thus shadow
Ring that mechanical arm is subsequent that piece is taken to operate.
To solve the problems, such as wafer bonding die, the prior art would generally carry out bonding die detection after process flow, if
Generation bonding die then carries out adhesion and handles, and continues to carry out that piece is taken to process to next wafer if bonding die does not occur.Currently, going to glue
Even handle mainly includes that artificial treatment and program execute two ways.Wherein, the mode of artificial treatment is mainly by operator's hand
Dynamic to open box and take piece, this mode has higher requirement to the skill level of operator, and cost of labor is very high, is not suitable for industrialization
Production scale；And the mode that program executes then needs operator manually and will be specific to the son formula of adhesion to be added to father's formula
In.The probability that bonding die occurs in actual production process is smaller, requires operator every to solve the problems, such as the bonding die of less generation
Secondary editor father will add adhesion sub- formula when being formulated manually, can greatly increase manual operation, ease for use is poor.
Summary of the invention
The present invention provides a kind of method and device for preventing wafer bonding die, it is able to solve and needs operator to add manually to go
The problem of adhesion is formulated.
To solve the above problems, the present invention provides following technical proposals:
A method of wafer bonding die being prevented, method includes:
Edited father's formula is obtained, father is formulated to be made of the son formula of different process and wafer path；
Whether added with for executing the target sub- formula for going adhesion to handle in detection father's formula；
If being not added with target sub- formula in father's formula, the target sub- formula of preediting is transferred from the function library of backstage；
The target sub- formula transferred is automatically added on the predeterminated position in father's formula, modified father formula is obtained.
A kind of device preventing wafer bonding die, device include:
Acquiring unit, for obtaining edited father's formula, father is formulated by the son formula of different process and wafer path
Composition；
Detection unit goes adhesion processing for executing for whether being added in father's formula of measurement acquisition unit acquisition
Target sub- formula；
Transfer unit, for when detection unit detection father formula in be not added with target formula when, from the function library of backstage
Transfer the target sub- formula of preediting；
Adding unit is automatically added to father's formula that acquiring unit obtains for that will transfer the target sub- formula that unit is transferred
In predeterminated position on, obtain modified father formula.
By above-mentioned technical proposal, the method and device provided by the invention for preventing wafer bonding die can automatically detect father
Whether formula matches added with for executing the target sub- formula for going adhesion to handle if not adding target in father's formula
Side, then transfer the target sub- formula of preediting completion from the function library of backstage, and is automatically added in father's formula, holds so as to subsequent
Row is used.Compared with prior art, the present invention can ensure in father's formula added with removing adhesion sub- formula, formula editing process without
Need operator to add manually and remove adhesion sub- formula, can streamline operation, improve formula editor ease for use.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And it can be implemented in accordance with the contents of the specification, and in order to allow above and other objects of the present invention, feature and advantage can
It is clearer and more comprehensible, the followings are specific embodiments of the present invention.
Detailed description of the invention
By reading the following detailed description of the preferred embodiment, various other advantages and benefits are common for this field
Technical staff will become clear.The drawings are only for the purpose of illustrating a preferred embodiment, and is not considered as to the present invention
Limitation.And throughout the drawings, the same reference numbers will be used to refer to the same parts.In the accompanying drawings:
Fig. 1 shows a kind of method flow diagram for preventing wafer bonding die；
Fig. 2 shows another method flow diagrams for preventing wafer bonding die；
Fig. 3, which shows another, prevents the method flow diagram of wafer bonding die；
Fig. 4, which shows another, prevents the method flow diagram of wafer bonding die；
Fig. 5 shows the 5th kind of method flow diagram for preventing wafer bonding die；
Fig. 6 shows a kind of structural schematic diagram of device for preventing wafer bonding die；
Fig. 7 shows the structural schematic diagram of another device for preventing wafer bonding die.
Specific embodiment
Exemplary embodiments of the present disclosure are described in more detail below with reference to accompanying drawings.Although showing the disclosure in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
It is limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
It is fully disclosed to those skilled in the art.
Add the operating procedure for removing adhesion sub- formula manually for simplified operator, the embodiment of the invention provides one kind to prevent
The method of wafer bonding die, as shown in Figure 1, this method comprises:
101, edited father's formula is obtained.
After operator completes father's formula by console manual setting, computer reads the father by preset interface and matches
Side.Father's formula is made of the son formula of different process and wafer path.As previously mentioned, the process flow packet of complete set
Containing the successive execution relationship between multiple techniques and each technique, wherein different process corresponds to different son formulas, in other words not
Realization with technique is described and is limited by the specifying information recorded in corresponding son formula.Illustratively, a technique
Son formula in the design parameter (duration, temperature etc.) of processing means (preheating, dry-cleaning etc.) and various conditions can be set.And
Wafer path is then used to limit successive execution relationship, such as " technique 1-> technique 2-> technique 3 " between different process etc..Have
The process flow of a completion can be depicted in specific process recipe and wafer path.
" father's formula " so-called in the present embodiment refers to the integrated artistic process comprising all sub- formulas and wafer path.It is real
In the application of border, when there is multistage formulation composition, certain level-one father formula can also be used as " the sub- formula " of upper level father formula.For
It is easy to understand, various embodiments of the present invention are illustrated by taking second level formulation composition as an example, i.e., there was only level-one father formula and level-one
It is illustrated for the formulation composition of son formula, it should be clearly that, which can not be used as to the present embodiment in practical applications
Specific restriction.
102, whether added with for executing the target sub- formula for going adhesion to handle in detection father formula.
Get father formula after, detection father formula in whether add target formula in need, the target formula with
It is identical that other technique are formulated rank, but being exclusively used in carrying out adhesion is handled, to solve the problems, such as wafer bonding die.If in father's formula
Being not added with target formula, then sequence executes subsequent step 103 and step 104；It is reached if being added with target formula in father's formula
To set objective, terminate process shown in Fig. 1.
It should be noted that the realization of the present embodiment does not have an impact or limits to the operating habit of operator.It is practical
In, no matter whether operator adds target formula manually, is suitable for process shown in Fig. 1.No matter whether operator forgets
Note addition target formula, process shown in Fig. 1 can guarantee that there are at least one target to match in father's formula after being finished
Side.
If 103, being not added with target sub- formula in father's formula, target that preediting is transferred from the function library of backstage is matched
Side.
Before executing process shown in Fig. 1, target sub- formula can be edited automatically by computer program, or by operator's hand
Dynamic editor's target formula.For editing the target sub- formula of completion in advance, puts it into specific function library and is saved,
So that this step transfers use.In practical application, target sub- formula be can store in the database of manufacturer internal, can also be deposited
Public cloud etc. is stored in across in the cloud platform of manufacturer, the difference of storage location determines the difference of formula method of calling, practical
Can formulate specific formula reading manner based on different situations in, the present embodiment to this with no restriction.
At the same time, the present embodiment to the type of the target sub- formula of storage, quantity equally with no restriction, and in this step
The type and quantity for the target sub- formula transferred and be added in father's formula in rapid are also unrestricted.In practical application, Ke Yicun
It stores up, transfer, adding one or more different-format types, different function or target based on different protocol standards editor and match
Side.
Computer selects the title of at least one target sub- formula according to pre-defined rule, backward by specific access interface
Platform database sends access request.The sub- recipe name of the target of selection is added in access request by computer is sent to data
Library, database root is tabled look-up according to the title in request obtains the file packet of corresponding target formula, then requests computer
Response, will find file packet and returns to computer.
In practical application, on data relationship, database, which can be relevant database, can also be non-relational database,
On data storage format, database can be distributed data base and be also possible to centralized data base, the inhomogeneity of database
Type determines different data search modes, and the present embodiment does not limit the concrete type of database.
104, the target sub- formula transferred is automatically added on the predeterminated position in father's formula, obtains modified father and matches
Side.
Father for being not added with target sub- formula is formulated, and needs to transfer one or more target formulas from function library,
And it is added in father's formula.In the present embodiment, target formula can be added before first non-targeted sub- formula, any two
Between a non-targeted sub- formula or after the last one non-targeted sub- formula, for the point of addition of target sub- formula, this reality
Apply example with no restriction.
Non-targeted sub- formula described in the present embodiment refers to the technique sub- formula in father's formula in addition to target formula, right
It is formulated in the father for being not added with target sub- formula, wherein all son formulas are the non-targeted sub- formula of aforementioned meaning.
Modified father formula is obtained after adding target formula, target is contained at least one in modified father formula
Formula.It is subsequent modified father formula to be generated as transmission sequence task according to existing implementation, and it is based on this in turn
Execute technique processing flow.
In practical application, position of the target formula in father is formulated does not limit the execution opportunity of the sub- formula when
Performance objective formula is to be controlled by computer system by procedural language, in more common implementation, target
Although son formula is not located at the final step of father's formula, just executed after other non-targeted sub- formulas are finished.
The point of addition of target formula executes opportunity with it and has no stringent corresponding relationship in the present embodiment.
Process shown in Fig. 1 can be, but not limited to be applied to wafer etching process in, wherein wafer etching process again include but
It is not limited to dry etching process and wet etching process.Substantially, process shown in Fig. 1 is suitable for all by multiple processing links groups
At, there are necessary processing links and by manually based on computer selecting editor obtain process flow in.
The method provided in an embodiment of the present invention for preventing wafer bonding die can add automatically in father's formula that editor completes
It is exclusively used in the target sub- formula of adhesion processing, the troublesome operation of artificial addition target formula can be saved.In addition, this implementation
Example can also avoid the problem that manual operation omission addition that may be present, can effectively solve on the basis of saving manual operation
It certainly the problem of wafer bonding die, prevents wafer bonding die from production process being caused to be interrupted, improves assembly line yield.
Further, as the improvement to embodiment illustrated in fig. 1, the present invention also provides several improvement embodiments.
In existing implementation, to identify and choosing convenient for operator's antithetical phrase formula, different son formulas can be assigned
Play the recipe name of unique identification.Therefore in a kind of improvement embodiment, target can be detected by recipe name and matched
Side.As shown in Fig. 2, as the specific implementation to Fig. 1 step 102, the process of detection target formula includes:
1021, all sub- formulas in father's formula are obtained.
The document directory structure that computer is formulated by father is searched and is obtained to different son formulas.
1022, the recipe name of son formula is read from the scheduled field of sub- formula.
Recipe name described in the present embodiment can be it is artificially marking, by include letter, Chinese character, number, glissade
The title of one of equal characters or a variety of compositions, for example, S201M_BSM, Dryclean or recipe1, recipe2,
recipe3.Alternatively, recipe name be also possible to it is that computer distributes automatically, by number or the number that forms of character, such as 122,
432,12 etc..In practical application, different vendor or operator can carry out name to formula based on identical or different Naming conventions
Claim distribution, the present embodiment to this with no restriction.
After obtaining son formula, the filename of recipe file is can be read directly in computer, obtains sub- recipe name, can also
To read its recipe name from the program of sub- formula, such as from the reading of the function file-name field of program the first row, the present embodiment is not
The implementation for obtaining sub- recipe name is defined.
If 1023, not including the recipe name of target formula in the recipe name read, it is determined that do not add in father's formula
Add target sub- formula.
The catalogue of target sub- formula is preset in computer, record has the target sub- formula of all preeditings in the catalogue
Title.After obtaining all recipe names, sub- recipe name and the sub- recipe name in the catalogue that computer successively will acquire
It is compared, if finding at least one catalogue neutron recipe name, target formula is added in father's formula, if do not had
Any one sub- recipe name is identical as the sub- recipe name in catalogue, it is determined that is not added with target sub- formula in father's formula.
Illustratively, comprising " text 1 ", " text 2 ", " text 3 " and " text A ", totally 4 sons are formulated in father's formula,
And the title of " text A ", " text B ", " text C " totally 3 target sub- formulas is recorded in predetermined directory.It can by comparing
With determination, target formula " text A " is added in father's formula.And if father formula in comprising " text 1 ", " text 2 " and
" text 3 " 3 son formulas, then can determine that father has been not added with any one target sub- formula in being formulated by comparing.
The present embodiment only illustrates the form that prestores of the sub- recipe name of target by taking catalogue as an example, practical application
The title of middle target formula can also prestore otherwise, such as be recorded in configuration file, and the present embodiment does not make this
Limitation.
Further, it as the refinement to Fig. 1 step 104, is improved in embodiment at another, computer can be under
It states two ways target sub- formula is added in father's formula:
In mode 1, the predeterminated position being automatically added to the file packet that target is formulated in father's formula.
The implementation that the method is added in father's formula with the common process formula for selecting operator is identical, herein
It repeats no more.
Mode 2 adds configuration file in father's formula automatically.
Unlike being added in father's formula from by file packet, in the method computer to father be formulated in add is one
Configuration file (type is not limited to XML format), record has the store path of target sub- formula, and addition in the configuration file
Desired position information.Computer obtains the file packet of target formula according to the store path, and will be literary according to location information
Part packet is added on the specific position of father's formula.
In practical application, common technique formula can also be added in the form of configuration file, in this way, adding
Target can directly be updated configuration file when being formulated, and the store path of target formula is written.
It further, is the operating habit for agreeing with one of ordinary skill in the art, in another improvement embodiment, computer can
Target sub- formula to be added to the final step of father's formula.And when operator when editor father is formulated, matched by added target
Fang Shi, then computer needs to guarantee that the target sub- formula of operator's addition is located at the final step of father's formula.Specifically, such as Fig. 3
Shown, the process of computer addition target formula includes:
301, whether target formula is added in detection father formula.
The implementation of this step is identical as the implementation of process shown in Fig. 2, and details are not described herein again.
If 302, being not added with target sub- formula in father's formula, the target sub- formula that will acquire is added to the last of father's formula
One step.
If being not added with target sub- formula in father's formula, computer adds the target sub- formula obtained from the function library of backstage
It is added to the final step of father's formula, obtains modified father formula.Step 103 and step 104 in the implementation and Fig. 1 of this step
Implementation it is identical, details are not described herein again.
If 303, father formula in be added with target formula, judge target formula whether be father formula last
Step.
304, if the determination result is YES, then terminate process.
If 305, judging result is no, target sub- formula is adjusted to the final step of father's formula, obtains modified father
Formula.
Computer by father be formulated in target formula existing for script from original position be adjusted to the final step that father is formulated, obtain
Obtain modified father formula.
It is illustrative:
1, father be formulated F1 include son formula e1, e2, addition target formula ex after improved father be formulated F1 be then e1,
e2,ex；
2, it only includes target formula ex that father, which is formulated F1, then it is ex that improved father, which is formulated F1,；
3, it includes son formula e1, ex, e2 that father, which is formulated F1, and wherein ex is the target sub- formula that operator adds manually before this,
It is e1, e2, ex that then improved father, which is formulated F1,；
4, it includes son formula e1, e2, ex that father, which is formulated F1, then it is still e1, e2, ex that improved father, which is formulated F1,.
Further, as the improvement to the various embodiments described above, it is formulated complexity to simplify, only allows to exist in father's formula
One target sub- formula guarantees that the target sub- formula is located at father's formula if itself is there are a target sub- formula in father's formula
Final step；If computer deletes extra target sub- formula, and guarantees there are multiple target formulas in father's formula
Remaining target sub- formula is located at father and is formulated final step；If being not added with target sub- formula in father's formula, computer will
The target sub- formula of acquisition is added to the final step of father's formula.
In practical application, the son formula including target sub- formula is generally only performed once, but in the present embodiment
In a kind of improved procedure, the target formula added in father's formula can be repeatedly executed.In going adhesion treatment process, if
Single treatment does not solve bonding die problem, then can be by the way that repeating for target sub- formula is continued to attempt to adhesion and handled, directly
Until bonding die Resolving probiems.The number that the present embodiment does not repeat target sub- formula limits.
Further, as another improvement embodiment, the present embodiment is given comprising the technique including going adhesion to handle
Execute process.As shown in figure 4, the process further comprises after having executed Fig. 1 step 104:
401, it is formulated according to modified father and generates transmission sequence task.
402, transmission sequence task is executed.
403, after having executed all non-targeted sub- formulas in order, judge whether that bonding die occurs.
The non-targeted sub- formula is the common process formula that operator adds manually.
In practical application, judges whether that the mode that bonding die occurs can be and judges whether mechanical arm can rise needle and take piece,
If piece can not be taken, bonding die occurs.Or can also be judged by way of detecting crystal column surface capacitance, work as wafer
Surface can conclude that generation bonding die, or at least there is bonding die risk there are when the capacitance of big Mr. Yu's predetermined threshold.The present embodiment is not
The judgment mode of bonding die is limited.
If bonding die 404, does not occur, terminate process.
Wafer after processing is put into film magazine by mechanical arm, and take out from film magazine lower wafer repeat it is above-mentioned
Process flow.
If bonding die 405, occurs, performance objective formula carries out adhesion and handles.
406, judge whether that there are still bonding die problems after performance objective formula again.
If 407, being alerted there are still bonding die problem.
In the present embodiment, if can also repeat target sub- formula there are still bonding die problem and continue at adhesion
Reason, until bonding die Resolving probiems.
Further, the target sub- formula in the various embodiments described above can be dechuck formula.Actual production process
In, bonding die problem uses following three kinds of modes to be solved substantially: low-voltage build-up of luminance blows back He and backward voltage electric discharge is added to remove
Residual charge is removed, and dechuck_pick formula is formulated as a kind of dechuck, then is the combination of above-mentioned three kinds of modes.As
A kind of application to the various embodiments described above provides an application scenarios of the invention by taking dechuck_pick as an example.Such as Fig. 5 institute
Show, which includes following below scheme:
501, father's formula is obtained；
502, all sub- formulas in father's formula are obtained；
503, whether judge in the son formula obtained comprising dechuck_pick formula；
If not including, 504 are thened follow the steps, if thening follow the steps 505 comprising it.
504, dechuck_pick formula is added in the final step of father's formula；
505, judge whether dechuck_pick formula is located at the final step of father's formula；
506 are thened follow the steps, if not if so then execute step 507.
506, dechuck_pick formula is adjusted to the final step of father's formula；
Step 507 is executed after adjustment.
507, father's formula is saved, transmission sequence task is generated；
508, transmission sequence task is executed；
509, after having executed all non-dechuck_pick formulas, judge whether that bonding die occurs；
If bonding die 510, occurs, executes dechuck_pick formula and carry out adhesion and handle；
511, judge whether that bonding die occurs again；
If bonding die problem has solved, terminate process, if bonding die problem is unresolved, repeats step 510.
In process shown in Fig. 5, when dechuck_pick formula, which is not located at father, is formulated final step, as to step
506 replacement, computer can also issue warning information, be manually adjusted by operator；It is similar, in step 511, if still
So there are problems that bonding die, alternatively, computer can also issue warning information, take piece manually by operator.
It should be noted that the end process referred in process shown in above-mentioned each figure refers to, terminate shown in current process figure
Process, rather than terminate entire process flow.Such as end process described in Fig. 3 refers to that terminating father is formulated process flow, stream
There is still a need for carry out such as Fig. 4 or processing flow shown in fig. 5 after journey；End process described in such as Fig. 4 or Fig. 5 again
Refer to the processing flow terminated to current wafer.Usual wafer processing is the constantly duplicate process of a process flow, practical feelings
20 to 25 wafers would generally be housed in a film magazine in condition.After the processing flow for terminating current wafer, mechanical arm is also needed
Lower wafer is taken out from film magazine, continue to repeat in Fig. 5 step 508 to the process of step 511.Certainly, what father was formulated changes
Into and transmission sequence task generation be it is disposable, without all being repeated when processing every wafer.
Further, as the realization to above-mentioned each method embodiment, the present invention also provides one kind to prevent wafer bonding die
Device, as shown in fig. 6, the device includes: acquiring unit 61, detection unit 62, transfers unit 63 and adding unit 64,
In,
Acquiring unit 61, for obtaining edited father's formula, father is formulated by the son formula of different process and wafer road
Diameter composition；
Whether detection unit 62 goes at adhesion for being added in father's formula of the acquisition of measurement acquisition unit 61 for executing
The target sub- formula of reason；
Transfer unit 63, for when detection unit 62 detect father formula in be not added with target formula when, from backstage function
The target sub- formula of preediting is transferred in library；
Adding unit 64 is automatically added to what acquiring unit 61 obtained for will transfer the target sub- formula that unit 63 is transferred
On predeterminated position in father's formula, modified father formula is obtained.
Further, as shown in fig. 7, detection unit 62, comprising:
Module 621 is obtained, for obtaining all sub- formulas in father's formula；
Read module 622, for reading the formula of son formula from the scheduled field for obtaining the son formula that module 621 obtains
Title；
Determining module 623, for when the formula name for not including target formula in the recipe name that read module 622 is read
Claim, it is determined that be not added with target sub- formula in father's formula.
Further, as shown in fig. 7, adding unit 64, comprising:
First adding module 641, the file packet for target to be formulated are automatically added to the predeterminated position in father's formula
On；
Second adding module 642, for adding configuration file automatically in father is formulated, record has target sub in configuration file
The store path of formula, and addition desired position information.
Further, adding unit 64 is used to for target sub- formula being automatically added to the final step of father's formula.
Further, as shown in fig. 7, the device further comprises:
Processing unit 65, for judging target when detection unit 62 detects in father's formula added with target formula
Formula whether be father formula final step, when target formula for father formula final step when, by target sub- formula tune
The whole final step to father's formula obtains modified father formula.
Further, as shown in fig. 7, the device further comprises:
Execution unit 66, for being formulated according to modified father after adding unit 64 adds and obtains modified father formula
Transmission sequence task is generated, and executes transmission sequence task；
Execution unit 66 is also used to after having executed all non-targeted sub- formulas in order, judges whether that bonding die occurs, if
Bonding die occurs, then performance objective formula carries out adhesion and handles.
Further, the target sub- formula that adding unit 64 is added is repeatable to be executed.
Further, the target sub- formula that adding unit 64 is added is dechuck formula.
Whether the device provided in this embodiment for preventing wafer bonding die can automatically detect father's formula added with for executing
The target sub- formula for going adhesion to handle is transferred from the function library of backstage if not adding the target sub- formula in father's formula
The target sub- formula that preediting is completed, and be automatically added in father's formula, so that subsequent execution is used.Compared with prior art,
The present invention can add target sub- formula automatically, it is ensured that exist in father's formula and remove adhesion sub- formula, formula editing process is without behaviour
Work person adds manually removes adhesion sub- formula, can streamline operation, improve formula editor ease for use.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, there is no the portion being described in detail in some embodiment
Point, reference can be made to the related descriptions of other embodiments.
It is understood that the correlated characteristic in the above method and device can be referred to mutually.In addition, in above-described embodiment
" first ", " second " etc. be and not represent the superiority and inferiority of each embodiment for distinguishing each embodiment.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
Algorithm and display are not inherently related to any particular computer, virtual system, or other device provided herein.
Various general-purpose systems can also be used together with teachings based herein.As described above, it constructs required by this kind of system
Structure be obvious.In addition, the present invention is also not directed to any particular programming language.It should be understood that can use various
Programming language realizes summary of the invention described herein, and the description done above to language-specific is to disclose this hair
Bright preferred forms.
In the instructions provided here, numerous specific details are set forth.It is to be appreciated, however, that implementation of the invention
Example can be practiced without these specific details.In some instances, well known method, structure is not been shown in detail
And technology, so as not to obscure the understanding of this specification.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of the various inventive aspects,
Above in the description of exemplary embodiment of the present invention, each feature of the invention is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the disclosed method should not be interpreted as reflecting the following intention: i.e. required to protect
Shield the present invention claims features more more than feature expressly recited in each claim.More precisely, as following
Claims reflect as, inventive aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim itself
All as a separate embodiment of the present invention.
Those skilled in the art will understand that can be carried out adaptively to the module in the equipment in embodiment
Change and they are arranged in one or more devices different from this embodiment.It can be the module or list in embodiment
Member or component are combined into a module or unit or component, and furthermore they can be divided into multiple submodule or subelement or
Sub-component.Other than such feature and/or at least some of process or unit exclude each other, it can use any
Combination is to all features disclosed in this specification (including adjoint claim, abstract and attached drawing) and so disclosed
All process or units of what method or apparatus are combined.Unless expressly stated otherwise, this specification is (including adjoint power
Benefit require, abstract and attached drawing) disclosed in each feature can carry out generation with an alternative feature that provides the same, equivalent, or similar purpose
It replaces.
In addition, it will be appreciated by those of skill in the art that although some embodiments described herein include other embodiments
In included certain features rather than other feature, but the combination of the feature of different embodiments mean it is of the invention
Within the scope of and form different embodiments.For example, in the following claims, embodiment claimed is appointed
Meaning one of can in any combination mode come using.
Various component embodiments of the invention can be implemented in hardware, or to run on one or more processors
Software module realize, or be implemented in a combination thereof.It will be understood by those of skill in the art that can be used in practice
Microprocessor or digital signal processor (DSP) realize the denomination of invention according to an embodiment of the present invention (as determined in website
The device of Hyperlink rank) in some or all components some or all functions.The present invention is also implemented as being used for
Some or all device or device programs of method as described herein are executed (for example, computer program and calculating
Machine program product).It is such to realize that program of the invention can store on a computer-readable medium, or can have one
Or the form of multiple signals.Such signal can be downloaded from an internet website to obtain, or be provided on the carrier signal,
Or it is provided in any other form.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and ability
Field technique personnel can be designed alternative embodiment without departing from the scope of the appended claims.In the claims,
Any reference symbol between parentheses should not be configured to limitations on claims.Word "comprising" does not exclude the presence of not
Element or step listed in the claims.Word "a" or "an" located in front of the element does not exclude the presence of multiple such
Element.The present invention can be by means of including the hardware of several different elements and being come by means of properly programmed computer real
It is existing.In the unit claims listing several devices, several in these devices can be through the same hardware branch
To embody.The use of word first, second, and third does not indicate any sequence.These words can be explained and be run after fame
Claim.
Claims (11)
1. a kind of method for preventing wafer bonding die, which is characterized in that the described method includes:
Edited father's formula is obtained, father's formula is made of the son formula of different process and wafer path；
It whether detects in father's formula added with for executing the target sub- formula for going adhesion to handle；
If being not added with the target formula in father's formula, the target of preediting is transferred from the function library of backstage
Formula；
The target formula transferred is automatically added on the predeterminated position in father's formula, modified father is obtained and matches
Side；
It is formulated according to the modified father and generates transmission sequence task, executing the transmission sequence task further comprises: pressing
After sequence has executed all non-targeted sub- formulas, judges whether that bonding die occurs, if bonding die occurs, execute the target formula
Adhesion is carried out to handle.
2. the method according to claim 1, wherein whether added with for holding in detection father's formula
The target sub- formula that row goes adhesion to handle, comprising:
Obtain all sub- formulas in father's formula；
The recipe name of the sub- formula is read from the scheduled field of the sub- formula；
If not including the recipe name of the target formula in the recipe name read, it is determined that be not added in father's formula
The target formula.
3. the method according to claim 1, wherein the target formula that will be transferred is automatically added to
On predeterminated position in father's formula, comprising:
The file packet of the target formula is automatically added on the predeterminated position in father's formula；Alternatively,
Add configuration file automatically in father formula, record has the storage road of the target formula in the configuration file
Diameter, and addition desired position information.
4. the method according to claim 1, wherein the target formula that will be transferred is automatically added to
On predeterminated position in father's formula, comprising:
The target formula is automatically added to the final step of father's formula.
5. the method according to claim 1, wherein if the father formula in be added with the target formula,
Then the method further includes:
Judge the target formula whether be father formula final step；
If the target formula is not the final step of father formula, the target formula is adjusted to the father and is matched
The final step of side obtains modified father formula.
6. being executed the method according to claim 1, wherein the target formula is repeatable.
7. a kind of device for preventing wafer bonding die, which is characterized in that described device includes:
Acquiring unit, for obtaining edited father's formula, father's formula is by the son formula of different process and wafer path
Composition；
Whether detection unit goes at adhesion for detecting to be added in the father formula that the acquiring unit obtains for executing
The target sub- formula of reason；
Unit is transferred, for when the detection unit detects and is not added with target formula in father formula, from backstage
The target formula of preediting is transferred in function library；
Adding unit, for by it is described transfer the target formula that unit is transferred and be automatically added to the acquiring unit obtain
The father formula in predeterminated position on, obtain modified father formula；
Execution unit is used for after the adding unit adds the acquisition modified father formula, according to the modified father
Formula generates transmission sequence task, and executes the transmission sequence task；
The execution unit is also used to after having executed all non-targeted sub- formulas in order, judges whether that bonding die occurs, if hair
Raw bonding die, then execute the target formula and carry out adhesion and handle.
8. device according to claim 7, which is characterized in that the detection unit, comprising:
Module is obtained, for obtaining all sub- formulas in father's formula；
Read module, for reading matching for the sub- formula from the scheduled field for the sub- formula that the acquisition module obtains
Square title；
Determining module, for when the formula name for not including the target formula in the recipe name that the read module is read
Claim, it is determined that be not added with the target formula in father's formula.
9. device according to claim 7, which is characterized in that the adding unit, comprising:
First adding module, the predeterminated position for being automatically added to the file packet of the target formula in father's formula
On；
Second adding module, for adding configuration file automatically in father formula, there is described record in the configuration file
The store path of target sub- formula, and addition desired position information.
10. device according to claim 7, which is characterized in that the adding unit is used for target formula certainly
The dynamic final step for being added to father's formula.
11. device according to claim 7, which is characterized in that described device further comprises:
Processing unit, for judging institute when the detection unit detects in father's formula added with target formula
State target formula whether be father formula final step, when target formula for father formula last
When step, the target formula is adjusted to the final step of father's formula, obtains modified father formula.
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| CN201610166353.8A CN105845605B (en) | 2016-03-22 | 2016-03-22 | Prevent the method and device of wafer bonding die |
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| CN201610166353.8A CN105845605B (en) | 2016-03-22 | 2016-03-22 | Prevent the method and device of wafer bonding die |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103365709A (en) * | 2012-04-01 | 2013-10-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Recipe management method and system and semiconductor device control system |
| CN103779165A (en) * | 2012-10-19 | 2014-05-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma device and workpiece position detection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| ITMI20071525A1 (en) * | 2007-07-27 | 2009-01-28 | Fond Bruno Kessler | A METHOD AND RELATIVE DEVICE FOR THE STORAGE AND USE OF HELPFUL INFORMATION FOR THE DEFINITION OF PROCESS FLOWS, IN PARTICULAR FOR THE DEVELOPMENT AND PRODUCTION OF MICROELECTRONIC AND NANO-MICRO-MECHANICAL DEVICES IN CLEAN ROOM |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103365709A (en) * | 2012-04-01 | 2013-10-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Recipe management method and system and semiconductor device control system |
| CN103779165A (en) * | 2012-10-19 | 2014-05-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma device and workpiece position detection method |
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