CN105829996A - Electronic device - Google Patents
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- Publication number
- CN105829996A CN105829996A CN201680000098.8A CN201680000098A CN105829996A CN 105829996 A CN105829996 A CN 105829996A CN 201680000098 A CN201680000098 A CN 201680000098A CN 105829996 A CN105829996 A CN 105829996A
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- China
- Prior art keywords
- bio
- electronic equipment
- identification chip
- cover sheet
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010410 layer Substances 0.000 claims description 80
- 239000004020 conductor Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 18
- 239000010408 film Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 7
- HTATZUOVCDVBPP-UHFFFAOYSA-N [Mo].[Li].[Mo] Chemical compound [Mo].[Li].[Mo] HTATZUOVCDVBPP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052594 sapphire Inorganic materials 0.000 claims description 5
- 239000010980 sapphire Substances 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000008280 blood Substances 0.000 claims description 3
- 210000004369 blood Anatomy 0.000 claims description 3
- 230000010247 heart contraction Effects 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008512 biological response Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/011—Arrangements for interaction with the human body, e.g. for user immersion in virtual reality
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- General Engineering & Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Telephone Set Structure (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses an electronic device which includes: a protection cover plate which includes a first surface and a second surface which is opposite to the first surface; a wire layer which is arranged on the second surface of the protection cover plate; an anisotropic conductive layer which is arranged on the wire layer; and a bio-identification chip which is arranged on the anisotropic conductive layer, is connected to the wire layer via the anisotropic conductive layer, and is intended for sensing bio-information input from the first surface of the protection cover plate by a user.
Description
Technical field
The present invention relates to a kind of electronic equipment, particularly relate to the electronic equipment with biological sensing function.
Background technology
Bio-identification chip (as; fingerprint sensor) become increasing electronic equipment (as; mobile phone) standard configuration; at present; it is positioned over the bio-identification chip in electronic equipment front; it is typically employed on the cover sheet of electronic equipment and carries out perforate, bio-identification chip is combined with physical button (Home key), is placed in described perforate.
So, at present increasing electronic equipment does not use physical button in front, but uses virtual touch button, arranges bio-identification chip in front but bio-identification chip electronic equipment without combining with physical button again is the most necessary therefore it provides a kind of.
Summary of the invention
In order to solve above-mentioned technical problem, the present invention provides the electronic equipment arranging biological response identification chip under a kind of cover sheet.
For achieving the above object, the present invention provides following technical scheme:
A kind of electronic equipment, including:
Cover sheet, including first surface and the second surface relative with first surface；
Conductor layer, is arranged on the second surface of cover sheet；
Anisotropy conductive layer, is arranged on described conductor layer；With
Bio-identification chip, is arranged on described anisotropy conductive layer, is electrically connected with described conductor layer by described anisotropy conductive layer, and described bio-identification chip is for sensing the bio information that user inputs from the first surface of cover sheet.
Alternatively, described electronic equipment farther includes color layers, and described color layers is formed between described cover sheet and described conductor layer.
Alternatively, described cover sheet is glass cover-plate or sapphire cover plate, and described bio-identification chip is bundled on the second surface of described cover sheet by COG technique.
Alternatively, described cover sheet is thin film cover plate, and described bio-identification chip is bundled on the second surface of described cover sheet by COF technique.
Alternatively, described bio-identification chip is nude film, or, described bio-identification chip is nude film to be formed via wafer stage chip packaged type, or, described bio-identification chip is nude film to be formed encapsulating a protective layer on the surface of cover sheet.
Alternatively, described electronic equipment farther includes mainboard and flexible circuit board, and described mainboard is connected with described conductor layer by described flexible circuit board, and described mainboard controls to perform corresponding function according to the bio information correspondence that described bio-identification chip is sensed.
Alternatively, described conductor layer is starched by silver or molybdenum lithium molybdenum is made.
Alternatively, described cover sheet is provided with groove, described groove part or all described bio-identification chip of covering; wherein; described groove is that the first surface of cover sheet is formed to second surface depression, or/and, described groove is that the second surface of cover sheet is formed to first surface depression.
Alternatively, described electronic equipment farther includes to be positioned at the touch screen of the second surface side of cover sheet, and described touch screen is for sensing the touch operation whether having user on the first surface of described cover sheet；Described touch screen includes substrate and the touch sensing layer arranged on the substrate；Described substrate includes that through hole, described bio-identification chip are positioned at described through hole.
Alternatively, described electronic equipment farther includes back cover and display device, and described display device is used for showing picture, and described cover sheet matches with described back cover formation receiving space, to house described bio-identification chip with described display device in receiving space.
Alternatively, described anisotropy conductive layer is anisotropic conductive film or anisotropic conductive.
Alternatively, one or more during described bio-identification chip is fingerprint recognition chip, blood oxygen identification chip, heart beating identification chip.
Alternatively, described electronic equipment is portable electronic product or household formula electronic product.
Owing to bio-identification chip is connected with the conductor layer being formed on cover sheet by anisotropy conductive layer, so that the connection between other element in bio-identification chip and electronic equipment becomes simple and more firm.It addition, described bio-identification chip is formed on the second surface of cover sheet, so that described bio-identification chip is closer to user, the intensity of its sensing signal is more by force and more stable.
Although disclosing multiple embodiment, changing including it, but by illustrate and describing the following detailed description of illustrative embodiment disclosed by the invention, other embodiments disclosed by the invention will be readily apparent to those skilled in the art.Can revise at various obvious aspects it will be recognized that the present invention is open, all modifications is all without departing from the spirit and scope of the present invention.Correspondingly, accompanying drawing and detailed description substantially should be considered illustrative and not restrictive.
Accompanying drawing explanation
Describe its example embodiment, inventive feature and advantage in detail by referring to accompanying drawing will be apparent from.
Fig. 1 is the decomposed structural representation of an embodiment of electronic equipment of the present invention.
Fig. 2 is the part part assembling structure schematic diagram of electronic equipment shown in Fig. 1.
Fig. 3 is the partial sectional schematic view of electronic equipment shown in Fig. 2.
Fig. 4 is the partial sectional schematic view of a change embodiment of electronic equipment shown in Fig. 2.
Fig. 5 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 2.
Fig. 6 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 2.
Detailed description of the invention
It is described more fully with example embodiment referring now to accompanying drawing.But, example embodiment can be implemented in a variety of forms, and is not understood as limited to embodiment set forth herein；On the contrary, it is provided that these embodiments make the present invention will fully and completely, and the design of example embodiment is conveyed to those skilled in the art all sidedly.For convenience or clear, the thickness of every layer shown in accompanying drawing and size may be exaggerated, omit or be schematically illustrated in and schematically illustrate the quantity of related elements.It addition, the size of element not exclusively reflects actual size, and the quantity incomplete reaction actual quantity of related elements.
Additionally, described feature, structure can be combined in one or more embodiment in any suitable manner.In the following description, it is provided that many details thus be given and embodiments of the present invention fully understood.But, one of ordinary skill in the art would recognize that, do not have in described specific detail is one or more, or uses other structure, constituent element etc., it is also possible to put into practice technical scheme.In other cases, known features or operation are not shown in detail or describe to avoid the fuzzy present invention.
In describing the invention, it will be appreciated that, term " thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", the orientation of the instruction such as " outward " or position relationship be based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than instruction or hint indication position or element must have specific method, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
Further, in describing the invention, it is to be understood that: " multiple " include two and two or more, unless the present invention separately has the most concrete restriction.
Seeing also Fig. 1-3, Fig. 1 is the decomposed structural representation of an embodiment of electronic equipment of the present invention.Fig. 2 is the part part assembling structure schematic diagram of electronic equipment shown in Fig. 1.Fig. 3 is the partial sectional schematic view of electronic equipment shown in Fig. 2.Described electronic equipment 100 is such as portable electronic product or household formula electronic product.Wherein, portable electronic product is as various mobile terminals, such as, and all kinds of suitable electronic products such as mobile phone, panel computer, notebook computer and Wearable product；Household formula electronic product is such as all kinds of suitable electronic products such as intelligent door lock, TV, refrigerator, desktop computers.It should be noted that electronic equipment 100 can increase the element not shown in diagram further or reduce some element shown in diagram, according to different electronic product corresponding selection.Described electronic equipment 100 includes cover sheet 10, bio-identification chip 12, conductor layer 13 and anisotropy conductive layer 14.
Described cover sheet 10 includes first surface 101 and the second surface 103 relative with first surface 101.Described first surface 101 is the outer surface of electronic equipment 100, and described second surface 103 is positioned at the inside of described electronic equipment 100.In the present embodiment, described cover sheet 10 is glass cover-plate.So, the material of described cover sheet 10 is alternatively other suitable material, is not limited to glass, and described cover sheet 10 is such as alternatively sapphire cover plate or thin film cover plate etc..Further, described cover sheet 10 is alternatively translucent or nontransparent cover plate, and it is transparent cover plate that the application is not limiting as cover sheet 10, can be according to the corresponding cover sheet of situation corresponding selection of product.
Described conductor layer 13 is arranged on the second surface 103 of cover sheet 10.Described conductor layer 13 such as includes a plurality of wire 131.Described conductor layer 13 is such as made up of conductive silver paste or molybdenum lithium molybdenum.So, changing ground, described conductor layer 13 also can be made up of the conductive material such as metal or tin indium oxide.
Described anisotropy conductive layer 14 is arranged on described conductor layer 13.Described anisotropy conductive layer 14 for example, anisotropic conductive film (AnisotropicConductiveFilm, ACF) or anisotropic conductive (Anisotropicconductiveadhesive/paste, ACA/ACP).So, the application is not limited to ACF, ACA, ACA, it is possible to be capable of the material of anisotropic conductive for other.
Described bio-identification chip 12 is arranged on described anisotropy conductive layer 14, is electrically connected with described conductor layer 13 by described anisotropy conductive layer.Described bio-identification chip 12 is for sensing the bio information that user inputs from the first surface of cover sheet 10.One or more in described bio-identification chip 12 for example, fingerprint recognition chip, blood oxygen identification chip, heart beating identification chip.So, the application is not limited thereto, and described bio-identification chip 12 is alternatively the identification chip of other suitable type.
Described bio-identification chip 12 is formed on second surface 103 for example with flip (Flip-Chip) technology.In the present embodiment, described bio-identification chip 12 binds (bonding) on the second surface 103 of cover sheet 10 by COG (ChipOnGlass, glass flip chip) technique.So, ground is changed, in other embodiments; during described cover sheet 10 for example, thin film cover plate; correspondingly, described bio-identification chip 12 also can pass through COF (ChipOnFilm, membrane of flip chip) technique and is bundled on the second surface 103 of cover sheet 10.Further, described bio-identification chip 12 also can be arranged on described anisotropy conductive layer 14 by other suitable technique, it is not limited to this described COG Yu COF technique.
Owing to bio-identification chip 12 is bundled on the second surface 103 of cover sheet 10, so that described bio-identification chip 12 is more securely fixed on electronic equipment 100, it is difficult to come off in electronic equipment 100.Further, described bio-identification chip 12 is bundled on the second surface 103 of cover sheet 10, so that described bio-identification chip 12 is closer to user, the intensity of the sensing signal of described bio-identification chip 12 is more by force and more stable.
Described electronic equipment 100 can farther include mainboard (Motherboard, or Mainboard) 15 and connector 16.
Described mainboard 15, also known as motherboard, system board, logic card, motherboard or base plate etc., is the core parts of electronic equipment 100.Described mainboard 15 generally comprises the devices such as processor, memorizer, chipset.Described mainboard 15 is for being transmitted various types of signal and processing, and controls electronic equipment 100 and perform corresponding function.
Described mainboard 15 is connected with described conductor layer 13 by described connector 16.By described conductor layer 13 and described anisotropy conductive layer 14, between described mainboard 15 and described bio-identification chip 12, carry out signal transmission.The bio information correspondence that described mainboard 15 is sensed according to described bio-identification chip 12 controls whether electronic equipment 100 performs corresponding function or start corresponding application program, such as, screen function, payment function, startup wechat application program, file opening folder etc. are solved.Such as, when the bio information that bio-identification chip 12 detects is consistent with the bio information prestored in electronic equipment 100 or meets predetermined condition, electronic equipment 100 is then corresponding to be performed corresponding function or starts corresponding application program.
Described connector 16 for example, flexible circuit board.So, described connector 16 is alternatively other suitable element.
Further, described bio-identification chip 12 is nude film or is formed via wafer stage chip encapsulation (WaferLevelChipScalePackaging, WLCSP) mode for nude film.Form it addition, described bio-identification chip 12 alternatively nude film encapsulates a protective layer on the surface back to cover sheet 10.
Compared to quad flat non-pin package (QuadFlatNo-LeadPackage; or BGA Package (BallGridArrayPackage QFN); etc. BGA) the bio-identification chip that mode is formed; the structure of the bio-identification chip 12 of the application becomes simpler; thickness is thinner; thus it is more beneficial for electronic equipment 100 ultralight thinning development, the relatively large inner space of electronic equipment 100 will not be taken because of being placed on by bio-identification chip 12 below cover sheet 10.Additionally, when being connected with bio-identification chip compared to flexible circuit board, need to arrange the mode the most accurately connection bio-identification chip of reinforcing plate in the position of corresponding bio-identification chip on flexible circuit board, the connected mode between connector 16 and the conductor layer 13 of the application is relatively simple and relatively stablizes firm, cost-effective.
Described electronic equipment 100 can farther include light shield layer 17.Described light shield layer 17 is arranged between described cover sheet 10 and described conductor layer 13.Described light shield layer 17 covers described bio-identification chip 12.Described light shield layer 17 also can have the effect indicating described bio-identification chip 12 region.It addition, described light shield layer 17 is also used for limiting the transmission region on cover sheet 10 or viewing area.It addition, described light shield layer 17 can cover described conductor layer 13 and described connector 16 further.The light shield layer 17 covering described conductor layer 13 and described connector 16 is same or different from the light shield layer covering described bio-identification chip 12.
After on the second surface 103 that light shield layer 17 is formed at described cover sheet 10, on described light shield layer 17, form described conductor layer 13 by coating or brush silver slurry or molybdenum lithium molybdenum.Then, wire 131 is formed in operations such as conductor layer 13 are carried out such as etching.Change ground, it is possible to directly form wire 131 on described light shield layer 17.Inventor passes through a large amount of creative works, and carries out discovery after lot of experiments, and compared to other conductive material, the stability that conductive silver paste is attached on light shield layer 17 with molybdenum lithium molybdenum is higher, and conductive effect is more preferable.
Please continue to refer to Fig. 1-3, described electronic equipment 100 can farther include display device 18 and back cover 20.Described display device 18 is used for showing picture.Described display device 18 is the most also connected with described mainboard 15, receives the display signal from mainboard 15, thus realizes picture and show.Described cover sheet 10 matches with described back cover 20 formation receiving space, to house described bio-identification chip 12 with described display device 18 element such as grade in receiving space.
Refer to the partial sectional schematic view of the change embodiment that Fig. 4, Fig. 4 are electronic equipment 100.It is provided with groove 105 on the first surface 101 of described cover sheet 10.Described groove 105 is caved in second surface 103 by first surface 101 and is formed.Wherein, described groove 105 partly or entirely covers described bio-identification chip 12.Described groove 105 is set, on the one hand can improve the intensity of the sensing signal of bio-identification chip 12, on the other hand also can point out the position at bio-identification chip 12 place.
Refer to the partial sectional schematic view of the another change embodiment that Fig. 5, Fig. 5 are electronic equipment 100.Described cover sheet 10 arranges groove 105 on second surface 103, and described groove 105 is caved in first surface 101 by second surface 103 and formed.Wherein, described groove 105 partly or entirely covers described bio-identification chip 12.Described groove 105 is set, the intensity of the sensing signal of bio-identification chip 12 can be improved.
Further, it is possible to the position of the first surface 101 bio-identification chip 12 corresponding with second surface 103 at cover sheet 10 is each formed with groove 105.
It should be noted that; owing to bio-identification chip 12 is bundled in described groove 105 by the application; the thickness of described bio-identification chip 12 is the most relatively thin; thus described groove 105 can be corresponding relatively thin; when described bio-identification chip 12 is bundled in described groove 105; back to the surface of cover sheet 10, described bio-identification chip 12 can accomplish that second surface 103 is concordant, thus save space, can reduce again cover sheet 10 because forming groove 105 and the most chipping situation at second surface 103.
It addition, described conductor layer 13 can extend to outside described groove 105 from described groove 105, thus, described connector 16 is more preferably connected with described bio-identification chip 12 by described conductor layer 13, the most convenient and reliable.
Further; the application uses flip (Flip-Chip) technology to be bundled in by bio-identification chip 12 in described groove 105; described bio-identification chip 12 can also protrude from described second surface 103 back to the surface of cover sheet 10, or described bio-identification chip 12 is fully located in described groove 105.The size degree of depth of described groove 105 can the most dynamically adjust, and limitation ot it diminishes.
Refer to Fig. 6, Fig. 6 be electronic equipment 100 the partial sectional schematic view of another change embodiment.Described electronic equipment farther includes touch sensing layer 191.Described touch sensing layer 191 is for sensing the touch operation whether having user on the first surface 101 of described cover sheet 10.Described touch sensing layer 191 is formed on the second surface of described cover sheet 10 or is formed on a substrate 193, thus forms touch screen 19.
Described substrate 193 is such as provided with through hole 194 in the region at corresponding described bio-identification chip 12 place.Described bio-identification chip 12 is positioned at described through hole 194.
Glass that described substrate 193 is the most transparent or sapphire substrate, so, the material of described substrate 193 is alternatively other suitable material, is not limited to glass or sapphire substrate, the most alternatively film substrate.Further, described substrate 193 is alternatively translucent or nontransparent cover plate, and it is transparency carrier that the application is not limiting as substrate 193.
In the present embodiment, described touch sensing layer 191 is one layer, and described touch sensing layer 191 is positioned at described substrate 193 in the face of the side of described cover sheet 10.So, changing ground, described touch sensing layer 191 is alternatively two-layer, is separately positioned on the opposite sides of substrate 193.Described touch sensing layer 191 includes touch-sensing electrode (not shown), whether has the touch operation of user for sensing.
Further, described touch sensing layer 191 can be self-capacitance touch sensing layer, it is possible to for mutual capacitance type touch sensing layer.
In this embodiment, the first surface 101 of described cover sheet 10 is or/and may also set up groove 105 on second surface 103.
It should be noted that; when forming groove 105 on second surface 103; the thinner thickness of described bio-identification chip 12; when described bio-identification chip 12 is bound in described groove 105; it can be concordant with the second surface of cover sheet 10 back to the surface of cover sheet 10, thus correspondence can be not provided with through hole 194 on described substrate 193.
In the present embodiment, described touch sensing layer 191 is arranged with described cover sheet 10 stacking.Described touch sensing layer stacking can arrange display device 18 (see Fig. 1) 191 times further.So, described touch sensing layer 19 also may be formed in display device 18, becomes an embedded touch display unit.
Open despite describing the present invention with reference to each embodiment, it will be appreciated that these embodiments are illustrative, and the scope of the present invention is not limited only to them.Many changes, revises, adds and improves is all possible.More generally, describe in the context of specific embodiments according to each embodiment disclosed by the invention.Function in each embodiment disclosed by the invention the most separately or in combination, or can utilize different terms to describe.These and other change, revise, add and improve can be in scope disclosed by the invention as defined in subsequent claim.
Claims (13)
1. an electronic equipment, including:
Cover sheet, including first surface and the second surface relative with first surface；
Conductor layer, is arranged on the second surface of cover sheet；
Anisotropy conductive layer, is arranged on described conductor layer；With
Bio-identification chip, is arranged on described anisotropy conductive layer, is electrically connected with described conductor layer by described anisotropy conductive layer, and described bio-identification chip is for sensing the bio information that user inputs from the first surface of cover sheet.
2. electronic equipment as claimed in claim 1, it is characterised in that: described electronic equipment farther includes color layers, and described color layers is formed between described cover sheet and described conductor layer.
3. electronic equipment as claimed in claim 1, it is characterised in that: described cover sheet is glass cover-plate or sapphire cover plate, and described bio-identification chip is bundled on the second surface of described cover sheet by COG technique.
4. electronic equipment as claimed in claim 1, it is characterised in that: described cover sheet is thin film cover plate, and described bio-identification chip is bundled on the second surface of described cover sheet by COF technique.
5. electronic equipment as claimed in claim 1; it is characterized in that: described bio-identification chip is nude film, or, described bio-identification chip is that nude film is formed via wafer stage chip packaged type; or, described bio-identification chip is nude film to be formed encapsulating a protective layer on the surface of cover sheet.
6. electronic equipment as claimed in claim 1, it is characterized in that: described electronic equipment farther includes mainboard and flexible circuit board, described mainboard is connected with described conductor layer by described flexible circuit board, and the bio information correspondence that described mainboard is sensed according to described bio-identification chip controls whether electronic equipment performs corresponding function.
7. electronic equipment as claimed in claim 1, it is characterised in that: described conductor layer is starched by silver or molybdenum lithium molybdenum is made.
8. electronic equipment as claimed in claim 1; it is characterized in that: on described cover sheet, be provided with groove; described groove part or all described bio-identification chip of covering; wherein; described groove is that the first surface of cover sheet is formed to second surface depression; or/and, described groove is that the second surface of cover sheet is formed to first surface depression.
9. the electronic equipment as described in claim 1 or 8; it is characterized in that: described electronic equipment farther includes to be positioned at the touch screen of the second surface side of cover sheet, described touch screen is for sensing the touch operation whether having user on the first surface of described cover sheet；Described touch screen includes substrate and the touch sensing layer arranged on the substrate；Described substrate includes that through hole, described bio-identification chip are positioned at described through hole.
10. electronic equipment as claimed in claim 1; it is characterized in that: described electronic equipment farther includes back cover and display device; described display device is used for showing picture; described cover sheet matches with described back cover formation receiving space, to house described bio-identification chip with described display device in receiving space.
11. electronic equipments as claimed in claim 1, it is characterised in that: described anisotropy conductive layer is anisotropic conductive film or anisotropic conductive.
12. electronic equipments as claimed in claim 1, it is characterised in that: described bio-identification chip is one or more in fingerprint recognition chip, blood oxygen identification chip, heart beating identification chip.
13. electronic equipments as claimed in claim 1, it is characterised in that: described electronic equipment is portable electronic product or household formula electronic product.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2016/077153 WO2017161525A1 (en) | 2016-03-23 | 2016-03-23 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105829996A true CN105829996A (en) | 2016-08-03 |
| CN105829996B CN105829996B (en) | 2019-10-01 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680000098.8A Active CN105829996B (en) | 2016-03-23 | 2016-03-23 | Electronic equipment |
| CN201620572628.3U Active CN205983294U (en) | 2016-03-23 | 2016-06-14 | Electronic equipment |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620572628.3U Active CN205983294U (en) | 2016-03-23 | 2016-06-14 | Electronic equipment |
Country Status (2)
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| WO (1) | WO2017161525A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106462753A (en) * | 2016-08-09 | 2017-02-22 | 深圳信炜科技有限公司 | Biological information sensing device and electronic device |
| CN108519794A (en) * | 2018-03-23 | 2018-09-11 | 维沃移动通信有限公司 | A kind of mobile terminal |
| WO2018227973A1 (en) * | 2017-06-16 | 2018-12-20 | 京东方科技集团股份有限公司 | Display panel and manufacturing method therefor, and display device |
| CN110210273A (en) * | 2018-02-28 | 2019-09-06 | 深圳富泰宏精密工业有限公司 | Portable electronic device |
| TWI715831B (en) * | 2017-11-07 | 2021-01-11 | 日商Ｓｍｋ股份有限公司 | Touch panel and wearable device |
| US11860708B2 (en) | 2018-03-23 | 2024-01-02 | Vivo Mobile Communication Co., Ltd. | Application processor and mobile terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017161525A1 (en) * | 2016-03-23 | 2017-09-28 | 深圳信炜科技有限公司 | Electronic device |
| KR20210044943A (en) | 2019-10-15 | 2021-04-26 | 삼성디스플레이 주식회사 | display apparatus and method manufacturing the same |
| KR20210077813A (en) | 2019-12-17 | 2021-06-28 | 삼성디스플레이 주식회사 | Display device and method of haptic feedback of the same |
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Also Published As
| Publication number | Publication date |
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| CN205983294U (en) | 2017-02-22 |
| WO2017161525A1 (en) | 2017-09-28 |
| CN105829996B (en) | 2019-10-01 |
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