CN105778513A - Liquid silicone rubber compound - Google Patents
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Abstract
The present invention relates to a liquid silicone rubber compound, and in particular relates to an electronic grade liquid silicone rubber compound used as diode chip protection glue. The liquid silicone rubber compound comprises 55 ~ 92wt% of polydimethylsiloxane, 0.5 ~ 30wt% of vinyl silicone resin, 1 ~ 8wt% of organohydrogenpolysiloxane, 0.000001 ~ 1wt% of a platinum-based catalyst, 3 ~ 25wt % of hydrophobic silica powder, 0.001 ~ 1wt% of a leveling agent, 0.1 ~ 2wt% of a stabilizer, 0.1 ~ 7wt% of a high temperature resistant filler and 0.1 ~ 3wt% of a tackifier containing a Y group, wherein one polydimethylsiloxane molecule has at least two chain vinyl groups, and one organohydrogenpolysiloxane molecule has at least two Si-H groups. A diode using the liquid silicone rubber compound has excellent operating performance and good electrical properties.
Description
Technical field
The present invention relates to a kind of liquid silastic complex, be related specifically to a kind of electron level liquid silastic complex that can protect glue as diode chip for backlight unit.
Background technology
Liquid silastic complex be by the linear polyorganosiloxane of intermediate degree of polymerisation based on polymer, coordinate filler, various assistants and additives preparation there is self-leveling or thixotropic complex.Liquid silastic complex has the performance of the aspects such as excellent electrical property, low-shrinkage, thermostability and tolerance to cold, is widely used for transportation, electric, machine-building, the field such as Aero-Space.
Bulk strength after liquid silastic solidification is relatively low, can reach the purpose of high intensity by adding reinforcing filler, but there will be the defects such as mobility variation, the normal temperature storage phase shortens, bonding force is poor, electrical property variation.Along with developing rapidly of electronic devices and components Packaging Industry, the demand improving production efficiency and reliability further is more and more higher, has the be heating and curing exploitation of silicone rubber of the one-component of excellent operability and has become as necessity.
Summary of the invention
The purpose of the present invention aims to provide a kind of electrical insulating property with excellence, the liquid silastic complex of good kiss-coating operability and the reliably electron level that can protect glue as diode chip for backlight unit of electrical properties in high temperatures.
The present invention the liquid silastic complex of electron level of glue can be protected to be the raw material by following components as diode chip for backlight unit and content prepares:
The polydimethylsiloxane (A) in a polydimethylsiloxane molecule with at least two chain vinyl is 55～92wt%, it is preferred to 60～90wt%；
Vinyl polysiloxane (B) is 0.5～30wt%；
The organic hydrogen polysiloxanes (C) in an organic hydrogen polysiloxanes molecule with at least two Si--H is 1～8wt%, it is preferred to 3～8wt%；
Platinum-type catalyst (D) is 0.000001～1wt%, it is preferred to 0.0001～0.5%；
Hydrophobic silica powder (E) is 3～25wt%, it is preferred to 3～18wt%；
Levelling agent (F) is 0.001～1wt%, it is preferred to 0.01～0.9wt%；
Stabilizer (G) is 0.1～2wt%, it is preferred to 0.1～1%；
High temperature resistant filler (H) is 0.1～7wt%, it is preferred to 1～6wt%；
Viscosifier (I) containing Y group are 0.1～3wt%, it is preferred to 0.1～2wt%.
The described polydimethylsiloxane (A) in a polydimethylsiloxane molecule with at least two chain vinyl is the key component of the liquid silastic complex of the present invention；The described alkenyl having in a polydimethylsiloxane molecule in the polydimethylsiloxane of at least two chain vinyl can be selected from one or both in vinyl, pi-allyl, is wherein preferably vinyl.Component (A) has the molecular structure of substantially straight chain.Viscosity recommended range to component (A) is that 1～100000mPa s (uses rotating cylinder viscometer, 25 DEG C, 750rpm test), preferably range from 1000～20000mPa s (using rotating cylinder viscometer, 25 DEG C, 750rpm test).
Described vinyl polysiloxane (B) is one of important component of liquid silastic complex sagging operating characteristics improving the present invention, and the mechanical strength after solidifying and insulating properties also have the improvement result of excellence simultaneously.Described vinyl polysiloxane is by CH2=CH (CH3)2SiO1/2Unit, (CH3)3SiO1/2Unit and SiO4/2The copolymer of unit composition.The viscosity recommended range of component (B) is 1～100000mPa s (using rotating cylinder viscometer, 25 DEG C, 750rpm test), it is preferable that range for 4000～20000mPa s (using rotating cylinder viscometer, 25 DEG C, 750rpm test).
The described organic hydrogen polysiloxanes (C) in an organic hydrogen polysiloxanes molecule with at least two Si--H be the present invention liquid silastic complex in the presence of the platinum-type catalyst (D) of the following stated, the firming agent reacting and cross-linking with component (A) and component (B).The molecular structure of component (C) can have straight-chain molecular structure, branched molecular structure, ring shaped molecule structure or three-dimensional netted molecular structure.Range of viscosities is recommended to be that 0.1～1000mPa s (uses rotating cylinder viscometer the viscosity of component (C), 25 DEG C, 750rpm test), preferably range from 10～500mPa s (using rotating cylinder viscometer, 25 DEG C, 750rpm test).
Described platinum-type catalyst is that the liquid silastic complex accelerating the present invention solidifies a kind of catalytic component used.Component (D) can be selected from: one or more in the complex of chloroplatinic acid, platinum and the complex of the complex of fowler alkene, platinum and alkenylsiloxane, platinum and carbonyl that chloroplatinic acid, platinum tetrachloride, alcohol modifiy.It is preferably the complex of platinum and alkenylsiloxane.
Described hydrophobic silica powder (E) be improve the present invention liquid silastic complex solidify after physical strength.Component (E) can selected from one or more in the SiO 2 powder that the SiO 2 powder that the SiO 2 powder that pyrolysismethod obtains, the sedimentation method obtain, vapor phase method obtain；Or one or more in the SiO 2 powder that obtains of the SiO 2 powder that obtains of the SiO 2 powder that obtains of the aforementioned pyrolysismethod processed selected from surface monomethyl trichlorosilane, dimethyldichlorosilane, hexamethyldisiloxane, octamethylcy-clotetrasiloxane or dimethyl polysiloxane, the sedimentation method or vapor phase method；Or the mixture selected from above-mentioned hydrophobic silica powder.Recommend the specific surface area of BET of component hydrophobic silica powder (E) at least above 10m2/ g, it is preferable that the specific surface area of BET is at least above 50m2/g。
Described levelling agent (F) is the important component of the liquid silastic complex sagging operability improving the present invention, selected from the organosiloxane of polyethers or polyester modification, alkyl-modified organosiloxane, terminal groups modification organo-silicon compound in one or more.It is preferably the organo-silicon compound that end group type is polyether-modified.
Described stabilizer (G) is storage stability and the operability of improving liquid silastic complex.Described stabilizer (G) in 2-methyl-3-butyne-2-alcohol, 3,5-dimethyl-1-hexin-3-alcohol, 2-phenyl-3-butyne-2-alcohol, 3-Methyl-1-pentene-4-alkynes-3-alcohol, methylpentynol, 3-methyl-3-(trimethyl silica)-ethyl acetylene one or more.
Described high temperature resistant filler (H) is in order to maintain silicone rubber high temperature resistant performance after liquid silicone rubber compound solidifies, it is guaranteed in for after diode chip for backlight unit encapsulation, the reliable important component of electric performance stablity at high temperature, one or more in fine titanium dioxide powder, alumina powder, calcium oxide micropowder, zinc oxide ultra_fine powders, aluminium hydroxide micro powder, montmorillonite of described high temperature resistant filler.
The described viscosifier (I) containing Y group are in order to keep the important component of the adhesive property of the liquid silastic complex of the present invention, being the modified organo-silicon compound of a kind of Y group, Y group therein is the group of one or more in epoxy radicals, ether, ester group, vinyl, acrylic, phenyl.Y group is preferably epoxy radicals.
nullThe preparation method of the liquid silastic complex of the present invention is: use conventional twin-roll machine、Kneader-mixer etc.，The polydimethylsiloxane in a polydimethylsiloxane molecule with at least two chain vinyl by 55～92wt% (being preferably 60～90wt%)、The vinyl polysiloxane of 0.5～30wt%、The organic hydrogen polysiloxanes in an organic hydrogen polysiloxanes molecule with at least two Si--H that 1～8wt% (is preferably 3～8wt%)、The platinum-type catalyst that 0.000001～1wt% (is preferably 0.0001～0.5%)、The hydrophobic silica powder that 3～25wt% (is preferably 3～18wt%)、The levelling agent that 0.001～1wt% (is preferably 0.01～0.9wt%)、The stabilizer that 0.1～2wt% (is preferably 0.1～1%)、The high temperature resistant filler of 0.1～7wt% (preferably 1～6wt%) and the viscosifier mix homogeneously containing Y group of 0.1～3wt% (being preferably 0.1～2wt%)，Namely described liquid silastic complex is prepared.
Various raw materials involved in the liquid silastic complex of the present invention all commercially obtain.The liquid silastic complex of the present invention is coated on diode chip for backlight unit surface, through segmented high-temperature solidify after, re-use epoxy-plastic packaging material be packaged, solidify after test.The diode operation of the liquid silastic complex encapsulation employing the present invention is good, and can obtain the electrical property of excellence.
The present invention is further illustrated below in conjunction with embodiment.
Detailed description of the invention
The specific embodiment provided by following mode can further appreciate that the present invention; but they are not intended that limitation of the invention; for some nonessential change and adjustment that those skilled in the art does according to the present invention, it is accordingly to be regarded as and is within the scope of the present invention.
Embodiment 1
nullAccurately weigh 5000mPa s vinyl-terminated silicone fluid 600g，6000mPa s Vinyl MQ silicon resin 300g，The silicon oil of low hydrogen content 50.6g of 100mPa s，The complex 0.2g of platinum and alkenylsiloxane，SiO 2 powder 50g (AerosilR972，DEGUSSA company produces)，Levelling agent 10.2g (" the levelling agent LP-2 " that Beijing Kehua New Material Science and Technology Co., Ltd. produces，It is prepared from the polydimethylsiloxane of Si-H base end-blocking and allyl polyethenoxy ether for raw material)，Methylpentynol 2.3g，(mean diameter is the titanium dioxide of 0.8 μm to titanium dioxide，Shanghai, river, Shanghai titanium white heavy chemicals company limited produces) 8g，(mean diameter is the spherical silica of 1.0 μm to ball-shaped silicon micro powder，Anhui Xin Lei powder body scientific & technical corporation produces) 12g，Viscosifier 8.5g (" the viscosifier ZJ-3 " that Beijing Kehua New Material Science and Technology Co., Ltd. produces containing epoxide group，It is prepared from γ-glycidyl ether oxygen propyl trimethoxy silicane and methyl vinyl diethoxysilane for raw material)；Then take off from double; two roll mills after mix homogeneously on double; two roll mills and natural cooling deaeration, obtain to protect as diode chip for backlight unit the liquid silastic complex of the electron level of glue, bottling, store for future use at 0～5 DEG C.
Embodiment 2
nullAccurately weigh 3000mPa s vinyl-terminated silicone fluid 750g，8000mPa s Vinyl MQ silicon resin 250g，The silicon oil of low hydrogen content 45.5g of 100mPa s，The complex 0.25g of platinum and alkenylsiloxane，SiO 2 powder 50g (AerosilR972，DEGUSSA company produces)，Levelling agent 5.5g (" the levelling agent LP-2 " that Beijing Kehua New Material Science and Technology Co., Ltd. produces，It is prepared from the polydimethylsiloxane of Si H base end-blocking and allyl polyethenoxy ether for raw material)，Methylpentynol 2.5g，(mean diameter is the titanium dioxide of 0.8 μm to titanium dioxide，Shanghai, river, Shanghai titanium white heavy chemicals company limited produces) 6.5g，(mean diameter is the spherical silica of 1.0 μm to ball-shaped silicon micro powder，Anhui Xin Lei powder body scientific & technical corporation produces) 14g，Viscosifier 8.5g (" the viscosifier ZJ-3 " that Beijing Kehua New Material Science and Technology Co., Ltd. produces containing epoxide group，It is prepared from γ-glycidyl ether oxygen propyl trimethoxy silicane and methyl vinyl diethoxysilane for raw material)，Then take off from double; two roll mills after mix homogeneously on double; two roll mills and natural cooling deaeration，Obtain to protect the liquid silastic complex of the electron level of glue as diode chip for backlight unit，Bottling，Store for future use at 0～5 DEG C.
Embodiment 3
nullAccurately weigh 3000mPa s vinyl-terminated silicone fluid 700g，6000mPa s Vinyl MQ silicon resin 200g，The silicon oil of low hydrogen content 40.7g of 80mPa s，The complex 0.2g of platinum and alkenylsiloxane，SiO 2 powder 50g (AerosilR106，DEGUSSA company produces)，" the levelling agent LP-2 " that levelling agent 10.2g Beijing Kehua New Material Science and Technology Co., Ltd. produces，It is prepared from the polydimethylsiloxane of Si-H base end-blocking and allyl polyethenoxy ether for raw material)，Methylpentynol 2.3g，(mean diameter is the titanium dioxide of 0.8 μm to titanium dioxide，Shanghai, river, Shanghai titanium white heavy chemicals company limited produces) 6g，(mean diameter is the spherical silica of 1.0 μm to ball-shaped silicon micro powder，Anhui Xin Lei powder body scientific & technical corporation produces) 15g，Viscosifier 5.5g (" the viscosifier ZJ-3 " that Beijing Kehua New Material Science and Technology Co., Ltd. produces containing epoxide group，It is prepared from γ-glycidyl ether oxygen propyl trimethoxy silicane and methyl vinyl diethoxysilane for raw material)，Then take off from double; two roll mills after mix homogeneously on double; two roll mills and natural cooling deaeration，Obtain to protect the liquid silastic complex of the electron level of glue as diode chip for backlight unit，Bottling，Store for future use at 0～5 DEG C.
Embodiment 4
nullAccurately weigh 5000mPa s vinyl-terminated silicone fluid 650g，6000mPa s Vinyl MQ silicon resin 350g，The silicon oil of low hydrogen content 60.2g of 80mPa s，The complex 0.21g of platinum and alkenylsiloxane，SiO 2 powder 50g (AerosilR972，DEGUSSA company produces)，" the levelling agent LP-2 " that levelling agent 8.2g Beijing Kehua New Material Science and Technology Co., Ltd. produces，It is prepared from the polydimethylsiloxane of Si-H base end-blocking and allyl polyethenoxy ether for raw material)，Methylpentynol 2.4g，(mean diameter is the titanium dioxide of 0.8 μm to titanium dioxide，Shanghai, river, Shanghai titanium white heavy chemicals company limited produces) 8g，(mean diameter is 1.2 μm to zinc oxide，Shanghai edge titanizing chemical product company limited produces) 12g；Viscosifier 8.5g (" the viscosifier ZJ-3 " that Beijing Kehua New Material Science and Technology Co., Ltd. produces containing epoxide group; it is prepared from γ-glycidyl ether oxygen propyl trimethoxy silicane and methyl vinyl diethoxysilane for raw material); then take off from double; two roll mills after mix homogeneously on double; two roll mills and natural cooling deaeration; obtain to protect the liquid silastic complex of the electron level of glue as diode chip for backlight unit; bottling, stores for future use at 0～5 DEG C.
Embodiment 5
nullAccurately weigh 3000mPa s vinyl-terminated silicone fluid 750g，8000mPa s Vinyl MQ silicon resin 250g，The silicon oil of low hydrogen content 55.8g of 60mPa s，The complex 0.3g of platinum and alkenylsiloxane，SiO 2 powder 40g (AerosilR972，DEGUSSA company produces)，" the levelling agent LP-2 " that levelling agent 9.5g Beijing Kehua New Material Science and Technology Co., Ltd. produces，It is prepared from the polydimethylsiloxane of Si-H base end-blocking and allyl polyethenoxy ether for raw material)，Methylpentynol 2.3g，(mean diameter is the titanium dioxide of 0.8 μm to titanium dioxide，Shanghai, river, Shanghai titanium white heavy chemicals company limited produces) 8g，(mean diameter is 1.0 μm to ball-type aluminium oxide，DENKA produces) 10g，Viscosifier 8.5g (" the viscosifier ZJ-3 " that Beijing Kehua New Material Science and Technology Co., Ltd. produces containing epoxide group，It is prepared from γ-glycidyl ether oxygen propyl trimethoxy silicane and methyl vinyl diethoxysilane for raw material)，Then take off from double; two roll mills after mix homogeneously on double; two roll mills and natural cooling deaeration，Obtain to protect the liquid silastic complex of the electron level of glue as diode chip for backlight unit，Bottling，Store for future use at 0～5 DEG C.
Comparative example
The product that Dow Corning Corporation produces, model DC4195, lot number 0007088104,0～5 DEG C stores for future use.
The product Dow Corning Corporation of embodiment 1～5 and above-mentioned comparative example produced takes out, and simultaneously with following 5 kinds of method evaluations, result is in Table 1.
Test one: sagging operability is tested
Sample preparation: by the product of the liquid silastic complex of above-described embodiment 1～5 and comparative example respectively at diode chip for backlight unit (model 1N4007, Chongqing Pingwei Enterprise Co., Ltd.) upper coating is uniformly, stage curing (solidify 2 hours at 150 DEG C of temperature, then solidify 6.5 hours afterwards at 225 DEG C of temperature) takes out the phenomenon seeing whether colloid sagging afterwards.Each embodiment and comparative example 100 samples of test, whether observing colloid is good to the parcel of diode chip for backlight unit, and when sample size sagging occur is n, steaming and decocting under high pressure test result is expressed as " n/100 ".
Test two: bonding force is tested
Sample preparation: the copper sheet using specification to be long 80mm, wide 20mm, thick 0.65mm, between two copper sheets, even spread thickness is the product of the liquid silastic complex of above-described embodiment 1～5 of 1mm and comparative example respectively, and two copper sheet laid parallels and the mutually lap of splice are 20mm.Solidify 2 hours afterwards at 150 DEG C of temperature subsequently, then solidify 6.5 hours afterwards at 225 DEG C of temperature, bonding force test after being cooled to room temperature, can be carried out.Along two copper sheet surface negative drawings under the speed of 5mm/min, the maximum of tensile force in test drawing process.Bonding force test tests 5 samples with each embodiment and comparative example, averages 5 test results as the bonding force test result of this embodiment and comparative example.
Test three: high temperature reverse bias leakage current is tested
Sample preparation: by the product of the liquid silastic complex of above-described embodiment 1～5 and comparative example respectively at diode chip for backlight unit (model 1N4007, Chongqing Pingwei Enterprise Co., Ltd.) upper coating is uniformly, stage curing (at 150 DEG C of temperature solidify 2 hours, again at 225 DEG C of temperature after solidify 6.5 hours) afterwards use low pressure Transfer molding machine be 185 DEG C in mold temperature, injection pressure is 4.8MPa, when hardening time is 60s, use epoxy-plastic packaging material (model KH9200-2F, Beijing Shouke Microelectronics Co., Ltd produces) by diode chip for backlight unit plastic packaging molding, solidify 8 hours after subsequently at 175 DEG C of temperature.
By gained diode chip for backlight unit Opposite direction connection 1000V voltage at 125 DEG C of temperature, little test reverse leakage current constantly placing 1.22 test results are averaged as the high temperature reverse bias leakage current test result of this embodiment and comparative example by each embodiment and comparative example 22 samples of test.
Test four: steaming and decocting under high pressure is tested
Sample preparation: the liquid silastic complex of use above-described embodiment 1～5 and the product of comparative example are identical with the sample preparation that the reverse-biased leakage current of afore-said hot is tested at the sample making course of diode chip for backlight unit gluing-plastic packaging respectively.
By gained diode chip for backlight unit temperature be 121 DEG C, pressure be place 24 hours under 15psi, sample naturally cools to after room temperature in 30 minutes, and closure voltage 1200V tests reverse breakdown quantity.Each embodiment and comparative example 77 samples of test, when reverse breakdown sample size is n, steaming and decocting under high pressure test result is expressed as " n/77 ".
Test five: electrical conductivity is tested
Test instrunment: DDS-11A type electric conductivity instrument, DJS-1C type electrode, HY-5 Clothoid type oscillator.
Method of testing: 1. use toluene, deionized water to clean conical flask respectively, pour deionized water conductivity meter test bottle internal conductance value into；2. using two conical flasks respectively, one of them weighs 20g sample, pours in 250ml conical flask, and another is then as blank；It is separately added into into 40ml normal hexane and 100ml deionized water；3. it is placed on HY-5 Clothoid type oscillator, shakes 1 hour, then stand 24 hours；4., after pouring the wait layering of separatory funnel sample into, the liquid of lower floor after layering is leaked into 250ml beaker and tests, take about about the 100ml stillness of night, use DDS-11A type electric conductivity instrument and DJS-1C type electrode to carry out test and obtain a result.
Computing formula: actual conductance value=sample electric conductivity value-blank electric conductivity value
Embodiment and comparative example test result are in Table 1.
Table 1 embodiment and comparative example test result
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Comparative example | |
| Sagging operability | 1/100 | 5/100 | 0/100 | 2/100 | 0/100 | 2/100 |
| Bonding force/MPa | 2.21 | 1.89 | 1.68 | 2.55 | 1.97 | 2.32 |
| High temperature reverse bias leakage current/μ A | 6.3 | 7.1 | 6.5 | 7.9 | 11.6 | 6.2 |
| Steaming and decocting under high pressure | 0/77 | 1/77 | 5/77 | 2/77 | 0/77 | 0/77 |
| Electrical conductivity/μ s/cm | 0.40 | 0.16 | 0.22 | 0.23 | 0.33 | 1.47 |
Claims (12)
1. protect the liquid silastic complex of electron level for glue as diode chip for backlight unit, it is characterized in that: described liquid silastic complex is the raw material by following components and content prepares:
The polydimethylsiloxane in a polydimethylsiloxane molecule with at least two chain vinyl is 55～92wt%；
Vinyl polysiloxane is 0.5～30wt%；
The organic hydrogen polysiloxanes in an organic hydrogen polysiloxanes molecule with at least two Si--H is 1～8wt%；
Platinum-type catalyst is 0.000001～1wt%；
Hydrophobic silica powder is 3～25wt%；
Levelling agent is 0.001～1wt%；
Stabilizer is 0.1～2wt%；
High temperature resistant filler is 0.1～7wt%；
Viscosifier containing Y group are 0.1～3wt%.
2. liquid silastic complex according to claim 1, is characterized in that: the described alkenyl having in the polydimethylsiloxane of at least two chain vinyl in a polydimethylsiloxane molecule is selected from one or both in vinyl, pi-allyl.
3. liquid silastic complex according to claim 1 and 2, is characterized in that: the range of viscosities of the described polydimethylsiloxane in a polydimethylsiloxane molecule with at least two chain vinyl is 1～100000mPa s.
4. liquid silastic complex according to claim 1, is characterized in that: described vinyl polysiloxane is by CH2=CH (CH3)2SiO1/2Unit, (CH3)3SiO1/2Unit and SiO4/2The copolymer of unit composition.
5. liquid silastic complex according to claim 1, is characterized in that: the range of viscosities of the described organic hydrogen polysiloxanes in an organic hydrogen polysiloxanes molecule with at least two Si--H is 0.1～1000mPa s.
6. liquid silastic complex according to claim 1, is characterized in that: described platinum-type catalyst is selected from: one or more in the complex of chloroplatinic acid, platinum and the complex of the complex of fowler alkene, platinum and alkenylsiloxane, platinum and carbonyl that chloroplatinic acid, platinum tetrachloride, alcohol modifiy.
7. liquid silastic complex according to claim 1, is characterized in that: the specific surface area of the BET of described hydrophobic silica powder is at least above 10m2/g。
8. the liquid silastic complex according to claim 1 or 7, is characterized in that: one or more in the SiO 2 powder that SiO 2 powder that SiO 2 powder that described hydrophobic silica powder obtains selected from pyrolysismethod, the sedimentation method obtain, vapor phase method obtain；Or one or more in the SiO 2 powder that obtains of the SiO 2 powder that obtains of the SiO 2 powder that obtains of the aforementioned pyrolysismethod processed selected from surface monomethyl trichlorosilane, dimethyldichlorosilane, hexamethyldisiloxane, octamethylcy-clotetrasiloxane or dimethyl polysiloxane, the sedimentation method or vapor phase method；Or the mixture selected from above-mentioned hydrophobic silica powder.
9. liquid silastic complex according to claim 1, is characterized in that: described levelling agent selected from polyethers or the organosiloxane of polyester modification, alkyl-modified organosiloxane, terminal groups modification organosiloxane in one or more.
10. liquid silastic complex according to claim 1, it is characterized in that: described stabilizer in 2-methyl-3-butyne-2-alcohol, 3,5-dimethyl-1-hexin-3-alcohol, 2-phenyl-3-butyne-2-alcohol, 3-Methyl-1-pentene-4-alkynes-3-alcohol, methylpentynol, 3-methyl-3-(trimethyl the silica)-ethyl acetylene one or more.
11. liquid silastic complex according to claim 1, it is characterized in that: one or more in fine titanium dioxide powder, alumina powder, calcium oxide micropowder, zinc oxide ultra_fine powders, aluminium hydroxide micro powder, montmorillonite of described high temperature resistant filler.
12. liquid silastic complex according to claim 1, it is characterized in that: the described viscosifier containing Y group are the organo-silicon compound that Y group is modified, and Y group therein is the group of one or more in epoxy radicals, ether, ester group, vinyl, acrylic, phenyl.
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| CN109111896A (en) * | 2018-07-05 | 2019-01-01 | 常州思宇知识产权运营有限公司 | A kind of preparation method of high-intensity weather-proof high casting glue |
| CN112444717A (en) * | 2019-08-29 | 2021-03-05 | 珠海格力电器股份有限公司 | Verification method for matching degree of plastic package material and chip |
| CN110845988A (en) * | 2019-11-06 | 2020-02-28 | 安晟技术(广东)有限公司 | Shading adhesive, preparation method and application thereof |
| CN111592764A (en) * | 2020-05-29 | 2020-08-28 | 浙江新安化工集团股份有限公司 | Silicone resin reinforced organosilicon elastomer aqueous dispersion liquid and preparation method and application thereof |
| CN112569642A (en) * | 2020-11-23 | 2021-03-30 | 杭州崇耀科技发展有限公司 | Emulsion type organic silicon defoaming agent composition and preparation method thereof |
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