CN105761855A - High-thermal conductivity ultrathin mica tape and preparation method thereof - Google Patents
High-thermal conductivity ultrathin mica tape and preparation method thereof Download PDFInfo
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- CN105761855A CN105761855A CN201610060634.5A CN201610060634A CN105761855A CN 105761855 A CN105761855 A CN 105761855A CN 201610060634 A CN201610060634 A CN 201610060634A CN 105761855 A CN105761855 A CN 105761855A
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- mica tape
- aramid fiber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/60—Composite insulating bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/66—Joining insulating bodies together, e.g. by bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
- H01B19/02—Drying; Impregnating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
- H01B3/50—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials fabric
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Insulating Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high-thermal conductivity ultrathin mica tape production method. The method comprises the following steps of: 1) modification of nano alumina, 2) impregnation of poly aramid fiber non-woven fabric, 3) composition, 4) baking and 5) cooling and cutting. Surface modification is carried out on a nano inorganic filler, various processing problems caused by the nano filler can be overcome, the dry mica tape is reinforced on the signal surface of the prepared poly aramid fiber non-woven fabric, the wrapping processing property is good, the resin is more easier to impregnate in the case of vacuum pressure impregnation, motor non-air gap insulation is realized, the electric heating aging life of the motor is ensured, and the cost of the motor is reduced.
Description
Technical field
The invention belongs to low resin mica tape manufacturing technology field, few ultra-thin mica tape of glue of single-side reinforced particularly relating to high heat conduction and preparation method thereof.
Background technology
Mica tape is irreplaceable the most key insulant in motor particularly large-scale, high-voltage motor, but the mechanical strength of Muscovitum is too low, can not meet in motor manufacturing process and requirement to mechanical strength in motor actual motion, it is necessary to use supporting material to be strengthened.At present, supporting material used in the company standard of national standard, industry standard, each mica tape manufacturing enterprise is all electrician with alkali-free glass fiber cloth, insulating paper, plastic sheeting.
From the VPI technology birth fifties in last century, Ge great Motor Corporation of the world and insulant manufacturing company just never stop the research to low resin mica tape.The company in the world at present with low resin mica tape production capacity is more, relatively more famous includes Switzerland Von-Roll-ISOLA, Switzerland Micafil, Belgium COGEBI, Germany Krempel, Brazil DMI etc., and Japan, Korea S etc. are also owned by numerous company possessing low resin mica tape production capacity.
Low resin mica tape has multiple kind, wherein high heat conduction low resin mica tape just grows up recently, such few adhesive tape except with epoxy resin or polyester resin as adhesive outside, in adhesive, also add the inorganic particles such as the aluminium sesquioxide of high-termal conductivity, boron nitride, the insulating barrier heat conductivity making formation improves, the temperature rise of motor can be reduced, reduce motor volume, but due to relatively costly, complete machine temperature rise and thermolysis is limited, and the application on motor of the current high heat conduction low resin mica tape is not also very extensive.
External Vonroll company just have developed high heat conduction low resin mica tape in the nineties in last century, is applied to the electromotor of ABB and Toshiba, it is possible to significantly reduces the temperature rise of stator coil.While it is true, be widely used not yet at present, mainly the heat conductivity of existing high heat conduction low resin mica tape is still not as high, only rises to 0.5W/ (m K) from original 0.3W/ (m K)；Although two is the temperature rise that can reduce stator coil, but the heat-sinking capability of complete machine is contributed limited；Three is the restriction of Costco Wholesale.Domestic high heat conduction resin-rich mica tape was done some researchs, but also fails to obtain batch and apply, high heat conduction low resin mica tape then especially few people set foot in.But as following developing direction, or some basic research works can be done in this respect, as added heat conducting fiber or granule, use high-heat-conductivity glue stick, even exploitation high heat-conduction reinforcement material in manufacturing paper with pulp process at mica paper and there is the matched use of impregnating resin of high-termal conductivity, to improve the heat conductivity of whole major insulation system comprehensively, this wherein has a lot of underlying issue needing and solving.
Summary of the invention
Owing to needing higher heat conduction requirement in high-power generator, therefore beginning one's study already both at home and abroad joins in ordinary mica tape by high heat filling, is most commonly that addition nano aluminium oxide, but owing to its alkalescence is bigger, the time making gel shortens, and affects the storage phase of mica tape；This external mica tape adds solid packing also can make the problems such as sedimentation, layering occur in the course of processing of mica tape.For these problems existed in prior art, nano aluminium oxide has been carried out special surface modification by the present invention, and has improved in processing technique so that mica tape had both met good heat conductivility, service life will not be reduced, there is again good processing characteristics.
The technical scheme is that and be accomplished by:
The production method of a kind of ultra-thin low resin mica tape of high heat conduction, comprises the following steps: 1), nano aluminium oxide modified；2) poly-aramid fiber non-woven fabrics dipping；3) compound；4), bakee；5), cooling cutting；It is characterized in that:
1) nano aluminium oxide is modified: organic acid and cationic surfactant, butyl titanate mixes according to the mass ratio of 1:1-2:0.1-0.5, it is immersed in mixed liquor by nano aluminium oxide 1-10h, with dry after deionized water wash, modified nano-alumina can be obtained；
2), poly-aramid fiber non-woven fabrics dipping；The poly-aramid fiber non-woven fabrics uncoiling thick by 0.025～0.060mm, cross the glue groove equipped with dipping adhesive, described dipping adhesive includes main glue, organic solvent, modifying agent, modified nano-alumina, described main glue is epoxy type adhesive or polyester epoxy type adhesive, organic solvent is dimethyl carbonate or Polyethylene Glycol, and modifying agent is barium mahogany sulfonate or has sodium sulfonate；Wherein main glue, organic solvent, modifying agent, the mass ratio of modified nano-alumina is 1:0.05-0.2:0.01-0.05:0.01-0.1, it is preferred to 1:0.1-0.2:0.02-0.04:0.03-0.05；
3) compound: by mica paper uncoiling and be compounded on the poly-aramid fiber non-woven fabrics being coated with adhesive, presses together formation mica tape germ band with cylinder by the two；
4), bakee: by above-mentioned mica tape germ band by oven-baked, the temperature from ambient of baking oven is gradually increased to 40 DEG C～80 DEG C, bakee 3～8min；
5), cooling cutting: go out and cool down 2～3min after bakeing in air at room temperature, after cooling, the mica tape stock made is carried out rolling；By mica tape stock device on cutting machine, undertaken cutting into banding rolling by the width of customer requirement, namely obtain product
Step 1) described in organic acid be acetic acid or ethanedioic acid；Described cationic surfactant is imidazolines or triazines surfactant；Organic acid and cationic surfactant, the mass ratio of butyl titanate is preferably the mass ratio mixing of 1:1:0.3.
Step 2) described in main glue be epoxy type adhesive or polyester epoxy type adhesive, organic solvent is dimethyl carbonate or Polyethylene Glycol, and modifying agent is barium mahogany sulfonate or has sodium sulfonate；
The poly-aramid fiber non-woven fabrics single-side reinforced low resin mica tape prepared, Wrapping technical is good, and during vacuum pressure impregnation, resin is easier to soak into, and is more conducive to realize the insulation of motor air-gap-free, it is ensured that in the thermal-electrical aging life-span of motor, reduce motor cost simultaneously.
Product properties of the present invention all reaches and exceeds the relevant requirement of " GB/T5019-2009 ", and also is higher than electrician's performance with alkali-free glass fiber cloth reinforcement one side low resin mica tape.
Detailed description of the invention
Below in conjunction with specific embodiment, the technical scheme of invention is described in detail.
Embodiment 1
The ultra-thin low resin mica tape of high heat conduction, produces according to following steps: 1), nano aluminium oxide modified；2) poly-aramid fiber non-woven fabrics dipping；3) compound；4), bakee；5), cooling cutting；
1) nano aluminium oxide is modified: acetic acid and imidazoline type cationic surfactant, butyl titanate mixes according to the mass ratio of 1:2:0.5, it is immersed in mixed liquor by nano aluminium oxide 10h, with dry after deionized water wash, modified nano-alumina can be obtained；
2), poly-aramid fiber non-woven fabrics dipping；The poly-aramid fiber non-woven fabrics uncoiling thick by 0.025mm, crosses the glue groove equipped with dipping adhesive, and described dipping adhesive includes main glue, organic solvent, modifying agent, modified nano-alumina, described main glue is epoxy type adhesive, and organic solvent is dimethyl carbonate, and modifying agent is barium mahogany sulfonate；Wherein main glue, organic solvent, modifying agent, the mass ratio 1:0.1:0.05:0.04 of modified nano-alumina；
3) compound: by mica paper uncoiling and be compounded on the poly-aramid fiber non-woven fabrics being coated with adhesive, presses together formation mica tape germ band with cylinder by the two；
4), bakee: by above-mentioned mica tape germ band by oven-baked, the temperature from ambient of baking oven is gradually increased to 40 DEG C～80 DEG C, bakee 3～8min；
5), cooling cutting: go out and cool down 2～3min after bakeing in air at room temperature, after cooling, the mica tape stock made is carried out rolling；By mica tape stock device on cutting machine, undertaken cutting into banding rolling by the width of customer requirement, obtain product.
Embodiment 2
The ultra-thin low resin mica tape of high heat conduction, produces according to following steps: 1), nano aluminium oxide modified；2) poly-aramid fiber non-woven fabrics dipping；3) compound；4), bakee；5), cooling cutting；
1) nano aluminium oxide is modified: ethanedioic acid and triazines cationic surfactant, butyl titanate mixes according to the mass ratio of 1:2:0.1, it is immersed in mixed liquor by nano aluminium oxide 10h, with dry after deionized water wash, modified nano-alumina can be obtained；
2), poly-aramid fiber non-woven fabrics dipping；The poly-aramid fiber non-woven fabrics uncoiling thick by 0.050mm, crosses the glue groove equipped with dipping adhesive, and described dipping adhesive includes main glue, organic solvent, modifying agent, modified nano-alumina, described main glue is polyester epoxy type adhesive, and organic solvent is Polyethylene Glycol, and modifying agent is barium mahogany sulfonate；Wherein main glue, organic solvent, modifying agent, the mass ratio 1:0.2:0.04:0.05 of modified nano-alumina；
3) compound: by mica paper uncoiling and be compounded on the poly-aramid fiber non-woven fabrics being coated with adhesive, presses together formation mica tape germ band with cylinder by the two；
4), bakee: by above-mentioned mica tape germ band by oven-baked, the temperature from ambient of baking oven is gradually increased to 40 DEG C～80 DEG C, bakee 3～8min；
5), cooling cutting: go out and cool down 2～3min after bakeing in air at room temperature, after cooling, the mica tape stock made is carried out rolling；By mica tape stock device on cutting machine, undertaken cutting into banding rolling by the width of customer requirement, obtain product.
The present invention can summarizing without prejudice to the spirit of the present invention or the concrete form of principal character with other.All embodiments of the present invention all can only think the description of the invention rather than restriction, every any trickle amendment done by the technology contents of the present invention or equivalent replace, and broadly falls within technical scheme.
Claims (4)
1. a production method for the ultra-thin mica tape of high heat conduction, comprises the following steps: 1), nano aluminium oxide modified；2) poly-aramid fiber non-woven fabrics dipping；3) compound；4), bakee；5), cooling cutting；It is characterized in that:
1) nano aluminium oxide is modified: organic acid and cationic surfactant, butyl titanate mixes according to the mass ratio of 1:1-2:0.1-0.5, it is immersed in mixed liquor by nano aluminium oxide 1-10h, with dry after deionized water wash, modified nano-alumina can be obtained；
2), poly-aramid fiber non-woven fabrics dipping；The poly-aramid fiber non-woven fabrics uncoiling thick by 0.025～0.060mm, cross the glue groove equipped with dipping adhesive, described dipping adhesive includes main glue, organic solvent, modifying agent, modified nano-alumina, wherein main glue, organic solvent, modifying agent, the mass ratio of modified nano-alumina is 1:0.05-0.2:0.01-0.05:0.01-0.1；
3) compound: by mica paper uncoiling and be compounded on the poly-aramid fiber non-woven fabrics being coated with adhesive, presses together formation mica tape germ band with cylinder by the two；
4), bakee: by above-mentioned mica tape germ band by oven-baked, the temperature from ambient of baking oven is gradually increased to 40 DEG C～80 DEG C, bakee 3～8min；
5), cooling cutting: go out and cool down 2～3min after bakeing in air at room temperature, after cooling, the mica tape stock made is carried out rolling；By mica tape stock device on cutting machine, undertaken cutting into banding rolling by the width of customer requirement, namely obtain product.
2. the method for claim 1, it is characterised in that step 1) described in organic acid be acetic acid or ethanedioic acid；Described cationic surfactant is imidazolines or triazines surfactant；Organic acid and cationic surfactant, the mass ratio of butyl titanate is preferably 1:1:0.3.
3. the method for claim 1, it is characterised in that step 2) described in main glue be epoxy type adhesive or polyester epoxy type adhesive, organic solvent is dimethyl carbonate or Polyethylene Glycol, and modifying agent is barium mahogany sulfonate or has sodium sulfonate.
4. the method for claim 1, it is characterised in that: described step 2) in main glue, organic solvent, modifying agent, modified nano-alumina mass ratio be preferably 1:0.1-0.2:0.02-0.04:0.03-0.05.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610060634.5A CN105761855B (en) | 2016-01-29 | 2016-01-29 | A kind of ultra-thin mica tape of high heat conduction and preparation method thereof |
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| CN201610060634.5A CN105761855B (en) | 2016-01-29 | 2016-01-29 | A kind of ultra-thin mica tape of high heat conduction and preparation method thereof |
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| CN105761855B CN105761855B (en) | 2017-12-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109454970A (en) * | 2018-11-08 | 2019-03-12 | 哈尔滨电机厂有限责任公司 | A kind of manufacturing method of the more glue epoxy fibreglass mica paper tapes of high thermal conductivity |
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| CN102820110A (en) * | 2012-09-03 | 2012-12-12 | 中国船舶重工集团公司第七一二研究所 | Glass cloth reinforcing high-thermal conductivity mica tape and preparation method thereof |
| CN104409187A (en) * | 2011-12-12 | 2015-03-11 | 江苏冰城电材股份有限公司 | Mica tape manufacturing method suitable for energy conservation, emission reduction and reduction of environmental pollution |
| CN105027689A (en) * | 2013-02-28 | 2015-11-04 | 3M创新有限公司 | High thermal conductivity prepreg, printed wiring board and multilayer printed wiring board using the prepreg, and semiconductor device using the multilayer printed wiring board |
-
2016
- 2016-01-29 CN CN201610060634.5A patent/CN105761855B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012013543A2 (en) * | 2010-07-30 | 2012-02-02 | Siemens Aktiengesellschaft | Insulation system having improved partial discharge strength |
| CN104409187A (en) * | 2011-12-12 | 2015-03-11 | 江苏冰城电材股份有限公司 | Mica tape manufacturing method suitable for energy conservation, emission reduction and reduction of environmental pollution |
| CN102693791A (en) * | 2012-05-29 | 2012-09-26 | 苏州巨峰电气绝缘***股份有限公司 | High-heat conducting high-air permeability less-glue mica tape and preparing method thereof |
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| CN102820110A (en) * | 2012-09-03 | 2012-12-12 | 中国船舶重工集团公司第七一二研究所 | Glass cloth reinforcing high-thermal conductivity mica tape and preparation method thereof |
| CN105027689A (en) * | 2013-02-28 | 2015-11-04 | 3M创新有限公司 | High thermal conductivity prepreg, printed wiring board and multilayer printed wiring board using the prepreg, and semiconductor device using the multilayer printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109454970A (en) * | 2018-11-08 | 2019-03-12 | 哈尔滨电机厂有限责任公司 | A kind of manufacturing method of the more glue epoxy fibreglass mica paper tapes of high thermal conductivity |
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| CN105761855B (en) | 2017-12-08 |
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Effective date of registration: 20171116 Address after: 401320 Chongqing city Banan District Yudong textile village three Applicant after: Chongqing Yue Yue Machinery Manufacturing Co., Ltd. Address before: 266000 Shandong province Qingdao City, Inner Mongolia Road No. 30 Building No. 5 Applicant before: Hao Fu |
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Effective date of registration: 20180119 Address after: 401344 Chongqing city Banan District of the town of Huai village Solitaire force Zi Wan Group No. 1043 Patentee after: Li Qingdi Address before: 401320 Chongqing city Banan District Yudong textile village three Patentee before: Chongqing Yue Yue Machinery Manufacturing Co., Ltd. |
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Effective date of registration: 20200521 Address after: 437400 Xianning City, Hubei Province Tongcheng Yuli juanyong Road No. 226 Building 1 Patentee after: PAMICA ELECTRIC MATERIAL (HUBEI) Co.,Ltd. Address before: 401344 Chongqing city Banan District of the town of Huai village Solitaire force Zi Wan Group No. 1043 Patentee before: Li Qingdi |
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