CN105754062A - Low-hydroscopicity phenolic resin insulating gel and preparation method thereof - Google Patents

Low-hydroscopicity phenolic resin insulating gel and preparation method thereof Download PDF

Info

Publication number
CN105754062A
CN105754062A CN201610150193.8A CN201610150193A CN105754062A CN 105754062 A CN105754062 A CN 105754062A CN 201610150193 A CN201610150193 A CN 201610150193A CN 105754062 A CN105754062 A CN 105754062A
Authority
CN
China
Prior art keywords
parts
phenolic resin
formalin
resin insulating
preparation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610150193.8A
Other languages
Chinese (zh)
Other versions
CN105754062B (en
Inventor
王伟宏
魏强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northeast Forestry University
Original Assignee
Northeast Forestry University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northeast Forestry University filed Critical Northeast Forestry University
Priority to CN201610150193.8A priority Critical patent/CN105754062B/en
Publication of CN105754062A publication Critical patent/CN105754062A/en
Application granted granted Critical
Publication of CN105754062B publication Critical patent/CN105754062B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/34Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

The invention relates to phenolic resin insulating gel and a preparation method thereof, in particular to low-hydroscopicity phenolic resin insulating gel and a preparation method thereof, and aims to solve the problem of insulativity lowering caused by high hydroscopicity and high water absorbing speed of existing phenolic resin.The low-hydroscopicity phenolic resin is composed of, by weight, 155-190 parts of phenol, 14-20 parts of NaOH solution of 40-50% in mass percentage, 270-345 parts of formaldehyde solution of 37-39% in mass percentage and 4.7-15 parts of gamma-aminopropyl triethoxysilane.In the synthesis process of the modified phenolic resin, a silane coupling agent KH550 is directly added into a reaction system for in-situ polymerization, so that reaction is more sufficient and the process is simple and easy to operate.

Description

A kind of low water absorbable phenolic resin insulating cement and preparation method thereof
Technical field
The present invention relates to a kind of phenolic resin insulating cement and preparation method thereof, particularly relate to a kind of low water absorbable phenolic resin Insulating cement and preparation method thereof.
Background technology
Phenolic resin has excellent heat-resisting, acid and alkali-resistance, the characteristic of resistance to combustion and excellent electrical insulating property.But heat cured phenol Yet suffering from the highest water imbibition after urea formaldehyde solidification, reason is to there is phenolic hydroxyl group and the methylol of polarity on it, according to phase The principle that patibhaga-nimitta is molten, the hydroxyl of polarity runs into the water of polarity, it is easy to combines, causes phenolic resin to absorb water, thus make phenol , there is safety in utilization problem in urea formaldehyde decreasing insulating in humid conditions.Therefore, phenolic resin to be stablized insulation Property be necessary for limit hydroxyl effect, reduce phenolic resin water imbibition, frequently with following two method:
(l) block phenolic hydroxyl group.
(2) introduce other component to mix with phenolic resin generation chemical reaction or part, separate or surround phenolic hydroxyl group.
Generally researcher is often with dimethylbenzene phenol-formaldehyde resin modified, the most modified phenolic resin resistance to water, alkali resistance, toughness All obtain a certain degree of raising with mechanical strength, but dimethylbenzene has severe toxicity, have impact on its popularization and application.
The method of modifying of current existing phenolic resin, it is preferred that emphasis is when improving its fragility, raising bonding strength, shortening solidification Between, but the water imbibition of modified phenolic resin does not vary widely, and water absorption rate is the biggest, and partially modified method Employ toxic agent, poor for applicability.Therefore, the most harmless a kind of method of modifying need to be found to reduce phenolic aldehyde The water imbibition of resin, keeps its insulating properties.
Summary of the invention
By force and absorption speed is fast to the invention aims to solve existing phenolic resin water imbibition, causes decreasing insulating Problem, and provide the preparation method of the excellent phenolic resin insulating cement of a kind of low water absorbable permanent insulation.
A kind of low water absorbable phenolic resin insulating cement is by weight by 155 parts~the phenol of 190 parts, 14 parts~20 parts NaOH solution, 270 parts~the formalin of 345 parts and the gamma-aminopropyl-triethoxy-silane composition of 4.7 parts~15 parts;Institute Stating the NaOH aqueous solution that NaOH solution is mass fraction 40%~50%, described formalin is mass fraction 37% The formalin of 39%%.
The preparation method of a kind of low water absorbable phenolic resin insulating cement, sequentially includes the following steps:
One, weigh by weight 155 parts~the phenol of 190 parts, 14 parts~the NaOH solution of 20 parts, 270 parts~345 The formalin of part and the gamma-aminopropyl-triethoxy-silane (Silane coupling agent KH550) of 4.7 parts~15 parts;By weigh Formalin is divided into two parts of A and B, and wherein the quality of A is the 70%~85% of formalin gross mass, and the quality of B is first The 15%~30% of aldehyde solution gross mass;Described NaOH solution is the NaOH aqueous solution of mass fraction 40%~50%, institute State the formalin that formalin is mass fraction 37% 39%;
Two, take in the phenol addition container that step one weighs, melt at a temperature of 40 DEG C~50 DEG C, be subsequently adding step one title The NaOH solution taken, obtains mixed solution, reacts 8min~12min;
Three, in step 2 mixed liquor, add A, be warmed up to 70 DEG C~75 DEG C, be subsequently adding γ-aminopropyl that step one weighs Triethoxysilane, then heat up, treat that temperature reaches 80 DEG C~85 DEG C, react 1h ± 5min;
Four, after reaction terminates, cooling, wait to cool to 70 DEG C~75 DEG C, add B, then heat up, treat that temperature reaches 80 DEG C~85 DEG C, react 200min ± 10min;
Five, after reaction terminates, it is cooled to less than 40 DEG C and the material in container is poured out, obtain phenolic resin.
The present invention has an advantage in that relative to prior art:
1. being possible not only to after KH550 modification reduces the water imbibition of thermosetting phenolic resin, improves insulating properties, and uses Modified resinoid bond or the goods of dipping, Physical and mechanical properties also has some improvement.Prepared by the present invention The water absorption test front volume resistance of KH550 modification low water absorbable insulating cement is 1.1 × 109—2.38×109Ω, and common not Modified is only 0.27 × 109Ω;After water absorption test, the volume resistance of the low water absorbable insulating cement that KH550 is modified is 0.29 ×109—0.58×109Ω, and common unmodified resin is only 0.068 × 109Ω, the low water absorbable of the present invention is modified absolutely The resistivity of edge glue is higher than the phenolic resin that commonly insulate;The phenolic resin insulating cement bending resistance obtained by preparation method of the present invention is strong Degree improves 3%~5% for prepared by 102.58MPa~149.89MPa, relatively commonsense method;Obtained by preparation method of the present invention To phenolic resin insulating cement composite bending modulus be 5.46GPa~10.02GPa, relatively commonsense method prepare improve 4%~8%.
2. use nontoxic, degradable chemical reagent KH550 modification, environmental protection, and cost is obvious compared with other modifying agent Reduce.
3., in phenol-formaldehyde resin modified building-up process, it is added directly in reaction system by Silane coupling agent KH550 first Row in-situ polymerization, makes reaction more abundant, and technics comparing is simple, easily operates.
Detailed description of the invention
Technical solution of the present invention is not limited to act detailed description of the invention set forth below, also includes appointing between each detailed description of the invention Meaning combination.
Detailed description of the invention one: a kind of low water absorbable phenolic resin insulating cement of present embodiment is by weight by 155 parts ~the γ of the phenol of 190 parts, 14 parts~the NaOH solution of 20 parts, 270 parts~the formalin of 345 parts and 4.7 parts~15 parts- Aminopropyl triethoxysilane forms;Described NaOH solution is the NaOH aqueous solution of mass fraction 40%~50%, described Formalin is the formalin of mass fraction 37% 39%.
Detailed description of the invention two: the preparation method of a kind of low water absorbable phenolic resin insulating cement of present embodiment, by following step Suddenly carry out:
One, weigh by weight 155 parts~the phenol of 190 parts, 14 parts~the NaOH solution of 20 parts, 270 parts~345 The formalin of part and 4.7 parts~the gamma-aminopropyl-triethoxy-silane of 15 parts;The formalin weighed is divided into two parts of A and B, wherein the quality of A is the 70%~85% of formalin gross mass, and the quality of B is formalin gross mass 15%~30%;Described NaOH solution is the NaOH aqueous solution of mass fraction 40%~50%, and described formalin is quality The formalin of mark 37% 39%;
Two, take in the phenol addition container that step one weighs, melt at a temperature of 40 DEG C~50 DEG C, be subsequently adding step one title The NaOH solution taken, obtains mixed solution, reacts 8min~12min;
Three, in step 2 mixed liquor, add A, be warmed up to 70 DEG C~75 DEG C, be subsequently adding γ-aminopropyl that step one weighs Triethoxysilane, then heat up, treat that temperature reaches 80 DEG C~85 DEG C, react 1h ± 5min;
Four, after reaction terminates, cooling, wait to cool to 70 DEG C~75 DEG C, add B, then heat up, treat that temperature reaches 80 DEG C~85 DEG C, react 200min ± 10min;
Five, after reaction terminates, it is cooled to less than 40 DEG C and the material in container is poured out, obtain phenolic resin.
Detailed description of the invention three: present embodiment is unlike detailed description of the invention two, and step one weighs benzene by weight 172 parts of phenol.Other steps are identical with detailed description of the invention two with parameter.
Detailed description of the invention four: present embodiment is unlike detailed description of the invention two, and step one weighs by weight NaOH solution 17 parts.Other steps are identical with detailed description of the invention two with parameter.
Detailed description of the invention five: present embodiment is unlike detailed description of the invention two, and step one weighs first by weight Aldehyde solution 310 parts.Other steps are identical with detailed description of the invention two with parameter.
Detailed description of the invention six: present embodiment unlike detailed description of the invention two, step one weigh by weight γ- Aminopropyl triethoxysilane 7.2 parts.Other steps are identical with detailed description of the invention two with parameter.
Detailed description of the invention seven: present embodiment unlike detailed description of the invention two, NaOH solution described in step one The NaOH aqueous solution for mass fraction 40%.Other steps are identical with detailed description of the invention two with parameter.
Detailed description of the invention eight: present embodiment is unlike detailed description of the invention two, and the quality of step one A is formaldehyde The 80% of solution gross mass.Other steps are identical with detailed description of the invention two with parameter.
Detailed description of the invention nine: present embodiment is unlike detailed description of the invention two, and the quality of step one B is formaldehyde The 20% of solution gross mass.Other steps are identical with detailed description of the invention two with parameter.
Embodiment 1
The preparation method of a kind of low water absorbable phenolic resin insulating cement, sequentially includes the following steps:
One, taking 172.4g phenol and add in container, melt at a temperature of 40 DEG C, being subsequently adding 17.3g mass fraction is 40% NaOH solution, obtain mixed solution, react 10min;
Two, adding the formaldehyde that mass fraction is 37% 39% in step one mixed liquor, its quality added is whole reaction During formaldehyde total inventory 80%, be warmed up to 72 DEG C, treat that temperature reaches 82 DEG C, react 1h;
Three, after reaction terminates, cooling, wait to cool to 72 DEG C, add the formaldehyde that mass fraction is 37% 39%, add The quality entered is the 20% of total inventory of formaldehyde in whole course of reaction, then heats up, and treats that temperature reaches 82 DEG C, reaction 200min;Total inventory of described formaldehyde is 310.4g;
Four, after reaction terminates, it is cooled to less than 40 DEG C and the material in container is poured out, obtain phenolic resin.
The resin drying prepared removes volatile matter, then according to the mensuration of GBT 1034-2008 plastic ink absorption processes To water absorption rate.
Embodiment 2
The preparation method of a kind of low water absorbable phenolic resin insulating cement, sequentially includes the following steps:
One, taking 172.4g phenol and add in container, melt at a temperature of 40 DEG C, being subsequently adding 17.3g mass fraction is 40% NaOH solution, obtain mixed solution, react 10min;
Two, adding the formaldehyde that mass fraction is 37% 39% in step one mixed liquor, its quality added is whole reaction During formaldehyde total inventory 80%, be warmed up to 72 DEG C, add gamma-aminopropyl-triethoxy-silane 5.15g and (account for overall The 3% of system), then heat up, treat that temperature reaches 82 DEG C, react 1h;
Three, after reaction terminates, cooling, wait to cool to 72 DEG C, add the formaldehyde that mass fraction is 37% 39%, add The quality entered is the 20% of total inventory of formaldehyde in whole course of reaction, then heats up, and treats that temperature reaches 82 DEG C, reaction 200min;Total inventory of described formaldehyde is 310.4g;
Four, after reaction terminates, it is cooled to less than 40 DEG C and the material in container is poured out, obtain phenolic resin.
The resin drying prepared removes volatile matter, then according to the mensuration of GBT 1034-2008 plastic ink absorption processes To water absorption rate.
Embodiment 3
The preparation method of a kind of low water absorbable phenolic resin insulating cement, sequentially includes the following steps:
One, taking 172.4g phenol and add in container, melt at a temperature of 40 DEG C, being subsequently adding 17.3g mass fraction is 40% NaOH solution, obtain mixed solution, react 10min;
Two, adding the formaldehyde that mass fraction is 37% 39% in step one mixed liquor, its quality added is whole reaction During formaldehyde total inventory 80%, be warmed up to 72 DEG C, add gamma-aminopropyl-triethoxy-silane 8.12g and (account for overall The 5% of system), then heat up, treat that temperature reaches 82 DEG C, react 1h;
Three, after reaction terminates, cooling, wait to cool to 72 DEG C, add the formaldehyde that mass fraction is 37% 39%, add The quality entered is the 20% of total inventory of formaldehyde in whole course of reaction, then heats up, and treats that temperature reaches 82 DEG C, reaction 200min;Total inventory of described formaldehyde is 310.4g;
Four, after reaction terminates, it is cooled to less than 40 DEG C and the material in container is poured out, obtain phenolic resin.
The resin drying prepared removes volatile matter, then according to the mensuration of GBT 1034-2008 plastic ink absorption processes To water absorption rate.
Embodiment 4
The preparation method of a kind of low water absorbable phenolic resin insulating cement, sequentially includes the following steps:
One, taking 172.4g phenol and add in container, melt at a temperature of 40 DEG C, being subsequently adding 17.3g mass fraction is 40% NaOH solution, obtain mixed solution, react 10min;
Two, adding the formaldehyde that mass fraction is 37% 39% in step one mixed liquor, its quality added is whole reaction During formaldehyde total inventory 80%, be warmed up to 72 DEG C, add gamma-aminopropyl-triethoxy-silane 13.8g and (account for overall The 8% of system), then heat up, treat that temperature reaches 82 DEG C, react 1h;
Three, after reaction terminates, cooling, wait to cool to 72 DEG C, add the formaldehyde that mass fraction is 37% 39%, add The quality entered is the 20% of total inventory of formaldehyde in whole course of reaction, then heats up, and treats that temperature reaches 82 DEG C, reaction 200min;Total inventory of described formaldehyde is 310.4g
Four, after reaction terminates, it is cooled to less than 40 DEG C and the material in container is poured out, obtain phenolic resin.
The resin drying prepared removes volatile matter, then according to the mensuration of GBT 1034-2008 plastic ink absorption processes To water absorption rate.
Process according to the mensuration of GBT 1034-2008 plastic ink absorption and specifically carry out by the following method: will be the most of the same race on request The liquid phenolic resin of class is placed in molding jig, makes the disk of diameter about 100mm, thickness about 1mm), warp (50 DEG C-some hours, 80 DEG C of-30min, 100 DEG C of-30min, 130 DEG C of-30min, until phenol to cross ladder-elevating temperature drying mode Urea formaldehyde cure hard, completely disengages from from processing release paper.
1. above-mentioned pure resin glue sample is put into and the baking oven of 50 DEG C is dried at least more than 24h, then cool down in drier To room temperature, weigh the quality of each sample, be accurate to 0.0001g (quality m1). repeat this step and no longer change to quality.
2. being put into by sample in the container filling distilled water, water temperature controls 23 DEG C or room temperature, after soaking 24h, takes out sample, Wipe rapidly all of water of specimen surface with cleaning dry cloth or filter paper, again weigh each sample quality, be accurate to 0.0001g (quality m2).After sample is taken out from water, should complete to weigh in 1min.
c = m 2 - m 1 m 1 × 100
The water suction mass fraction of c: sample
M1: the quality of dried sample, unit of gram (g) before soaking
M2: the quality of sample, unit of gram (g) after immersion
Table 1 is the resistance value before and after the water imbibition of all types of resin and water absorption test
Conclusion: the water imbibition being modified the thermosetting resin after process reduces.On the whole, Silane coupling agent KH550 is utilized Modification, 3-8% consumption all plays a role, and the content of 5% is more quite a lot of compared with other resin.

Claims (9)

1. a low water absorbable phenolic resin insulating cement, it is characterised in that: described phenolic resin insulating cement is by weight by 155 Part~the phenol of 190 parts, 14 parts~the NaOH solution of 20 parts, 270 parts~the formalin of 345 parts and 4.7 parts~15 parts Gamma-aminopropyl-triethoxy-silane forms;Described NaOH solution is the NaOH aqueous solution of mass fraction 40%~50%, described Formalin is the formalin of mass fraction 37%~39%.
The preparation method of a kind of low water absorbable phenolic resin insulating cement the most as claimed in claim 1, it is characterised in that: the party Method sequentially includes the following steps:
One, 155 parts~the phenol of 190 parts, 14 parts~the NaOH solution of 20 parts, 270 parts~345 parts are weighed by weight Formalin and 4.7 parts~the gamma-aminopropyl-triethoxy-silane of 15 parts;The formalin weighed is divided into two parts of A and B, Wherein the quality of A is the 70%~85% of formalin gross mass, and the quality of B is the 15%~30% of formalin gross mass; Described NaOH solution is the NaOH aqueous solution of mass fraction 40%~50%, and described formalin is mass fraction 37%~39% Formalin;
Two, take in the phenol addition container that step one weighs, melt at a temperature of 40 DEG C~50 DEG C, be subsequently adding step one title The NaOH solution taken, obtains mixed solution, reacts 8min~12min;
Three, in step 2 mixed liquor, add A, be warmed up to 70 DEG C~75 DEG C, be subsequently adding γ-aminopropyl that step one weighs Triethoxysilane, then heat up, treat that temperature reaches 80 DEG C~85 DEG C, react 1h ± 5min;
Four, after reaction terminates, cooling, wait to cool to 70 DEG C~75 DEG C, add B, then heat up, treat that temperature reaches 80 DEG C~85 DEG C, react 200min ± 10min;
Five, after reaction terminates, it is cooled to less than 40 DEG C and the material in container is poured out, obtain phenolic resin.
The preparation method of a kind of low water absorbable phenolic resin insulating cement the most according to claim 2, it is characterised in that: step Rapid one weighs phenol 172 parts by weight.
The preparation method of a kind of low water absorbable phenolic resin insulating cement the most according to claim 2, it is characterised in that: Step one weighs NaOH solution 17 parts by weight.
The preparation method of a kind of low water absorbable phenolic resin insulating cement the most according to claim 2, it is characterised in that step One weighs formalin 310 parts by weight.
The preparation method of a kind of low water absorbable phenolic resin insulating cement the most according to claim 2, it is characterised in that: step Rapid one weighs gamma-aminopropyl-triethoxy-silane 7.2 parts by weight.
The preparation method of a kind of low water absorbable phenolic resin insulating cement the most according to claim 2, it is characterised in that: step NaOH solution described in rapid one is the NaOH aqueous solution of mass fraction 40%.
The preparation method of a kind of low water absorbable phenolic resin insulating cement the most according to claim 2, it is characterised in that: step Quality is formalin gross mass the 80% of a rapid A.
The preparation method of a kind of low water absorbable phenolic resin insulating cement the most according to claim 2, it is characterised in that: step Quality is formalin gross mass the 20% of a rapid B.
CN201610150193.8A 2016-03-15 2016-03-15 A kind of low water absorbable phenolic resin insulating cement Active CN105754062B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610150193.8A CN105754062B (en) 2016-03-15 2016-03-15 A kind of low water absorbable phenolic resin insulating cement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610150193.8A CN105754062B (en) 2016-03-15 2016-03-15 A kind of low water absorbable phenolic resin insulating cement

Publications (2)

Publication Number Publication Date
CN105754062A true CN105754062A (en) 2016-07-13
CN105754062B CN105754062B (en) 2018-01-23

Family

ID=56333356

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610150193.8A Active CN105754062B (en) 2016-03-15 2016-03-15 A kind of low water absorbable phenolic resin insulating cement

Country Status (1)

Country Link
CN (1) CN105754062B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115418881A (en) * 2022-09-16 2022-12-02 江苏亚振电力有限公司 Preparation process of high-performance shielding insulating paper for high-voltage transformer

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102190996A (en) * 2010-03-08 2011-09-21 新沂市张氏磨具发展有限公司 Quick-curing adhesive and preparation method thereof
CN102241804A (en) * 2011-05-12 2011-11-16 四川上之登新材料有限公司 Preparation method of coupling phenolic resin used for drilling fluid
CN102408681A (en) * 2011-09-10 2012-04-11 广东东阳光铝业股份有限公司 Composite material for packaging and preparation method thereof
CN102675572A (en) * 2012-05-08 2012-09-19 浙江大学 Application of organic silicon modifier in modified thermosetting phenolic resin
CN104403261A (en) * 2014-09-04 2015-03-11 中国建筑材料科学研究总院 Inorganic material-modified phenolic foam insulation material with low water absorption and preparation method thereof
CN105131877A (en) * 2015-08-24 2015-12-09 江西省科学院应用化学研究所 Silane modified phenolic resin adhesive

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102190996A (en) * 2010-03-08 2011-09-21 新沂市张氏磨具发展有限公司 Quick-curing adhesive and preparation method thereof
CN102241804A (en) * 2011-05-12 2011-11-16 四川上之登新材料有限公司 Preparation method of coupling phenolic resin used for drilling fluid
CN102408681A (en) * 2011-09-10 2012-04-11 广东东阳光铝业股份有限公司 Composite material for packaging and preparation method thereof
CN102675572A (en) * 2012-05-08 2012-09-19 浙江大学 Application of organic silicon modifier in modified thermosetting phenolic resin
CN104403261A (en) * 2014-09-04 2015-03-11 中国建筑材料科学研究总院 Inorganic material-modified phenolic foam insulation material with low water absorption and preparation method thereof
CN105131877A (en) * 2015-08-24 2015-12-09 江西省科学院应用化学研究所 Silane modified phenolic resin adhesive

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115418881A (en) * 2022-09-16 2022-12-02 江苏亚振电力有限公司 Preparation process of high-performance shielding insulating paper for high-voltage transformer

Also Published As

Publication number Publication date
CN105754062B (en) 2018-01-23

Similar Documents

Publication Publication Date Title
CN105542394B (en) A kind of halogen-free resin composition and its application
CN102492140B (en) Bi-phthalonitrile prepolymer, bi-phthalonitrile prepolymer/epoxy resin copolymer, bi-phthalonitrile prepolymer/epoxy resin cured material , as well as preparation method and application thereof
CN106117964B (en) A kind of modified boron containing phenolic resin and the preparation method and application thereof
CN106280247B (en) Resin composition for electromagnetic wave absorbing material
CN110408071A (en) A kind of constant pressure and dry phenolic aldehyde aeroge and preparation method thereof
CN104479620B (en) A kind of refractory honeycomb node adhesive and preparation method thereof
CN107236249A (en) A kind of benzoxazine colophony based composites and preparation method thereof
CN110845829A (en) Low-temperature curing epoxy resin composition and preparation method of prepreg and composite material thereof
CN105754062A (en) Low-hydroscopicity phenolic resin insulating gel and preparation method thereof
CN104974469A (en) Resin combination, and prepreg and laminated board prepared from same
CN105273359B (en) High silica containing Mo-phenolic resin of carbon residue and preparation method thereof
CN106397699A (en) Hydroxyl-terminated polysiloxane silicone rubber copolymer phenolic foaming resin and preparation method thereof
CN104086729B (en) A kind of dimethylbenzene phenol-formaldehyde resin modified and the method preparing water discharging board thereof
CN103588942B (en) High Performance Phenolic Resins composition and method of making the same
CN101695880A (en) Production method of polyoxazolidone laminated board
CN106336662A (en) Thermosetting resin composition and prepreg and laminated board manufactured from same
CN103665775A (en) Epoxy molding compound filled with high amount of silica powder and preparation method thereof
CN105623186B (en) A method of it is moisture resistance hot to improve CEM-1 copper-clad laminate
CN104194264A (en) High-thermal-resisting POSS-based epoxy resin nano composite material for PCBs and preparation method of high-thermal-resisting POSS-based epoxy resin nano composite material
Huang et al. Nano‐SiO2/PMMA‐PU composite particles with core‐shell structure via emulsion polymerization and their application in epoxy resin
CN104804185A (en) Cyanate ester prepolymer used for preparing glue film and preparation method of cyanate ester prepolymer
CN102276957A (en) Phenolic resin for refractory bricks and preparation method thereof
CN103725003B (en) A kind of modified bismaleimide resin composition and method of making the same with high wet-hot aging performance
CN103980850B (en) The preparation method of phthalonitrile modified phenolic resin adhesive
CN103194040A (en) Phenolic resin composition

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant