CN105750421A - Back plate down-bending mold - Google Patents
Back plate down-bending mold Download PDFInfo
- Publication number
- CN105750421A CN105750421A CN201610288399.7A CN201610288399A CN105750421A CN 105750421 A CN105750421 A CN 105750421A CN 201610288399 A CN201610288399 A CN 201610288399A CN 105750421 A CN105750421 A CN 105750421A
- Authority
- CN
- China
- Prior art keywords
- bending mould
- bending
- mould under
- lower bolster
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
- B21D37/12—Particular guiding equipment, e.g. pliers; Special arrangements for interconnection or cooperation of dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
- B21D43/003—Positioning devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The invention discloses a back plate down-bending mold, and relates to the technical field of back plate molds. The back plate down-bending mold comprises an upper mold assembly and a lower mold assembly, wherein the upper mold assembly comprises an upper mold holder, a movable upper lining plate and an upper mold plate; the lower mold assembly comprises a lower mold plate and a lower mold holder; an insert core is arranged on the upper mold plate; when the upper mold assembly and the lower mold assembly are closed, a height difference for realizing the down-bending molding of products is formed between the upper lining plate and the insert core; an elastic positioning device is arranged between the upper mold assembly and the lower mold assembly. The back plate down-bending mold effectively solves problems that the conventional back plate down-bending mold is low in processing precision and poor in production stability; the back plate down-bending mold is convenient to operate, high in processing precision, easy to maintain and low in processing cost.
Description
Technical field
The present invention relates to backboard technical field of mold, particularly relate to Bending Mould under a kind of backboard.
Background technology
Electrochemistry is in the course of processing of backboard workpiece, it is sometimes desirable to carry out lower bending process, it is especially desirable to carries out bending under right angle and processes.Process the pressing equipment of the backboard workpiece of bending under this right angle at present generally all by a kind of upper and lower mould slide block device, it to be processed, by being separately positioned on the slide block with the vertical plane that matches on upper die and lower die and jacking block, reach punch forming the purpose of the demoulding smoothly, but the shortcoming of this version is: slide block and jacking block lay respectively on upper and lower mould, so in the moment of the two contact, impulsive force is bigger, machining accuracy may be had influence on, its production stability is poor, the number of times of mould of needing to place under repair is more, when produced in large volumes, often incur loss through delay production process because of repairing a die.
Summary of the invention
The purpose of the present invention is to propose to Bending Mould under a kind of backboard, solve the machining accuracy that under existing backboard, Bending Mould causes low, the problem of production stability difference.
For reaching this purpose, the present invention by the following technical solutions:
Bending Mould under a kind of backboard, including upper die component and lower mold assemblies, described upper die component includes upper bolster, mobilizable upper liner plate and cope match-plate pattern, described lower mold assemblies includes lower bolster and die shoe, described cope match-plate pattern is provided with into son, when upper die component and lower mold assemblies Guan Bi, described upper liner plate and enter to be formed between son for realizing the difference in height of bending and molding under product, between described upper die component and lower mold assemblies, elastic positioning device is set.
As the preferred version of Bending Mould under a kind of backboard, described in enter son the side relative with lower bolster be provided with groove.
As the preferred version of Bending Mould under a kind of backboard, described groove is vertical plane near the sidewall of upper liner plate.
As the preferred version of Bending Mould under a kind of backboard, described in enter sub and upper liner plate relative bottom, side be provided with circular arc chamfering.
As the preferred version of Bending Mould under a kind of backboard, described elastic positioning device includes alignment pin and corresponding hole, location, hole, location is arranged on the bottom of cope match-plate pattern, alignment pin traverse lower bolster, the bottom of alignment pin is provided with the first support spring, the first bottom surface conflict die shoe supporting spring, the bottom of alignment pin up extrudes lower bolster.
As the preferred version of Bending Mould under a kind of backboard, described location is provided with buffer spring bottom hole.
As the preferred version of Bending Mould under a kind of backboard, described lower bolster being provided with location punching, the bottom of location punching is provided with the second support spring.
As the preferred version of Bending Mould under a kind of backboard, between described cope match-plate pattern and upper bolster and between lower bolster and die shoe, it is provided with stage clip.
As the preferred version of Bending Mould under a kind of backboard, between described upper die component and lower mold assemblies, it is provided with guiding mechanism.
As the preferred version of Bending Mould under a kind of backboard, described guiding mechanism includes the guide pillar being arranged on cope match-plate pattern and the gathering sill being arranged on lower bolster, and described guide pillar is provided with damping spring, and described gathering sill and guide pillar match.
The invention have the benefit that
The present invention proposes Bending Mould under a kind of backboard, under this backboard, the upper membrane module of Bending Mould is provided with mobilizable upper liner plate and is arranged on and enters son on cope match-plate pattern, when upper die component and lower mold assemblies close, by upper liner plate and enter formation difference in height between son, it is achieved the lower bending and molding of product.It is low that the present invention effectively solves the machining accuracy that under existing backboard, Bending Mould causes, the problem of production stability difference, and easy to operate, machining accuracy is high, it is simple to maintenance, processing cost is low.
Accompanying drawing explanation
Fig. 1 is structural representation during Bending Mould die opening state under the backboard that embodiment of the present invention provides；
Fig. 2 is the partial enlarged drawing at A place in Fig. 1；
Fig. 3 is structural representation during Bending Mould closure state under the backboard that embodiment of the present invention provides；
Fig. 4 is the partial enlarged drawing at B place in Fig. 3.
In figure:
1, mounting plate；2, upper bolster；3, upper padding plate；4, cope match-plate pattern；5, lower bolster；6, lower bolster；7, die shoe；8, bottom plate；9, son is entered；10, groove；11, upper liner plate；12, location punching；13, alignment pin；14, first spring is supported；15, stage clip；16, second spring is supported；17, backboard；91, circular arc chamfering.
Detailed description of the invention
For the technical scheme making to present invention solves the technical problem that, adopting and the technique effect reached clearly, below in conjunction with accompanying drawing, the technical scheme of embodiment of the present invention is described in further detail, obviously, described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those skilled in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
In describing the invention; it will be appreciated that; term " orientation or the position relationship of the instruction such as " center ", " longitudinal direction ", " transverse direction ", "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward " be based on orientation shown in the drawings or position relationship; be for only for ease of the description present invention and simplifying and describe; rather than instruction or imply indication device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that limiting the scope of the invention.
Present embodiment proposes Bending Mould under a kind of novel backboard, as shown in Figures 1 to 4, under this backboard, Bending Mould includes upper die component and lower mold assemblies, wherein, upper die component includes the mounting plate 1, upper bolster 2, upper padding plate 3, mobilizable upper liner plate 11 and the cope match-plate pattern 4 that removably connect successively from top to bottom.Lower mold assemblies includes the lower bolster 5, lower bolster 6, die shoe 7, lower carriage and the bottom plate 8 that removably connect successively from top to bottom.Wherein, the setting of mounting plate 1 and bottom plate 8 can easy disassembly, more mold exchange.The setting of upper padding plate 3 and lower bolster 6 is prevented from that impulsive force is excessive and then damage upper bolster 2 and die shoe 7, plays certain cushioning effect.
In the present embodiment, cope match-plate pattern 4 being provided with into son 9, this enters son 9 and is close to liner plate 11 and arranges, and the bottom surface of bottom surface and cope match-plate pattern 4 flushes.When upper die component and lower mold assemblies Guan Bi, enter and form the height difference H (referring to Fig. 4) for realizing bending and molding under product between son 9 and upper liner plate 11, so, sheet metal component backboard 17 completes lower bending and molding in bonding processes, has been effectively ensured stability and the reliability of time bending, decrease the bending resistance in Forging Process, reducing the disqualification rate that backboard 17 product produces because of the abrasion in Forging Process, easy to operate, machining accuracy is high, being easy to maintenance, processing cost is low.
As shown in Figure 2 and Figure 4, the side entering son 9 relative with lower bolster 5 is provided with groove 10, and the setting of groove 10 can facilitate the end of backboard to be pre-formed bending structure when punching press.Further, groove 10 is vertical plane near the sidewall of upper liner plate 11 so that the end of backboard is pre-formed at a right angle upper bending structure back shaped with level when punching press, lays the foundation in order to bending and molding under right angle afterwards.
As shown in Figure 2 and Figure 4, the bottom, side entering son 9 relative with upper liner plate 11 is provided with circular arc chamfering 91, not only facilitates the process operation of bending under backboard, and is prevented effectively from the sharp comer scratching backboard 17 into son 9, and machining accuracy is high, and product quality is high.
Further, lower bolster 4 being provided with location punching 12, the bottom of location punching 12 is provided with the second support spring 16, it is possible to be accurately positioned processed product.
In the present embodiment, elastic positioning device it is provided with between upper die component and lower mold assemblies.Elastic positioning device includes alignment pin 13 and corresponding hole, location (not shown), hole, location is arranged on the bottom of cope match-plate pattern 4, alignment pin 13 traverse lower bolster 5, the bottom of alignment pin 13 is provided with the first support spring 14, the first bottom surface conflict die shoe 7 supporting spring 14, the bottom of alignment pin 13 up extrudes lower bolster 5.Location is provided with buffer spring bottom hole.Under buffer spring nature extended configuration, its bottom is that alignment pin 13 stretches out 2nd/to three/2nd of face length to the length between outer end of hole face, location, enables alignment pin 13 to shrink generation elastic force when inserting hole, location.Being provided with stage clip 15 between cope match-plate pattern 4 and upper bolster 2, be provided with stage clip 15 between lower bolster 5 and die shoe 7, the stage clip 15 at two places can increase the cushioning effect in work process, improves punching press stability.
In use, upper die component moves downward, alignment pin 13 inserts hole, location, upper die component continues to move downward, the upper surface of alignment pin 13 and buffer spring bottom contact, buffer spring and first supports spring the 14, second support spring 16 and all shrinks generation elastic force, and the common motion for cope match-plate pattern 4 brings buffering.First support spring 14 and the second support spring 16 shrink and the power of alignment pin 13 bottom squeeze lower bolster 5 are gradually reduced, namely the support force of lower bolster 5 is gradually reduced by the first support spring 14 and the second support spring 16, the stage clip 15 and first of lower bolster 5 supports spring the 14, second support spring 16 common support lower bolster 5, when lower bolster 5 support force is gradually reduced by the first support spring 14 and the second support spring 16, stage clip 15 pressure of lower bolster 5 becomes larger and shrinks generation elastic force, brings buffering when contacting lower bolster 5 for cope match-plate pattern 4.It is more fast that upper die component moves downward speed, and the stage clip 15 of lower bolster 5 gives the cushioning effect that cope match-plate pattern 4 brings more notable.Before cope match-plate pattern 4 contacts lower bolster 5, coordinate the double cushioning effect of generation for buffer spring, the first support spring 14.When cope match-plate pattern 4 contacts lower bolster 5, buffer spring, first support that spring 14, second supports spring 16, the cooperation of stage clip 15 produces cushioning effect jointly.Lower bolster 5 support force is had a progressive formation by the first support spring 14 and the second support spring 16, improves punching press stability and yield rate, reduces die wear, increase the service life.
Guiding mechanism it is provided with between upper die component and lower mold assemblies.Guiding mechanism includes the guide pillar being arranged on cope match-plate pattern 4 and the gathering sill being arranged on lower bolster 5, and guide pillar is provided with damping spring, and gathering sill and guide pillar match.By the setting of guiding mechanism, it is possible in the course of processing, mould is accurately positioned, improve machining accuracy.
The know-why of the present invention is described above in association with detailed description of the invention.These descriptions are intended merely to explanation principles of the invention, and can not be construed to limiting the scope of the invention by any way.Based on explanation herein, those skilled in the art need not pay creative work can associate other detailed description of the invention of the present invention, and these modes fall within protection scope of the present invention.
Claims (10)
1. Bending Mould under a backboard, including upper die component and lower mold assemblies, described upper die component includes upper bolster (2), mobilizable upper liner plate (11) and cope match-plate pattern (4), described lower mold assemblies includes lower bolster (5) and die shoe (7), it is characterized in that, described cope match-plate pattern (4) is provided with into son (9), when upper die component and lower mold assemblies Guan Bi, described upper liner plate (11) and entering is formed for realizing the difference in height of bending and molding under product between son (9), between described upper die component and lower mold assemblies, elastic positioning device is set.
2. Bending Mould under backboard according to claim 1, it is characterised in that described in enter son (9) side relative with lower bolster (5) and be provided with groove (10).
3. Bending Mould under backboard according to claim 2, it is characterised in that described groove (10) is vertical plane near the sidewall of upper liner plate (11).
4. Bending Mould under backboard according to claim 1, it is characterised in that described in enter son (9) the side bottom relative with upper liner plate (11) and be provided with circular arc chamfering (91).
5. Bending Mould under backboard according to claim 1, it is characterized in that, described elastic positioning device includes alignment pin (13) and corresponding hole, location, hole, location is arranged on the bottom of cope match-plate pattern (4), alignment pin (13) traverse lower bolster (5), the bottom of alignment pin (13) is provided with the first support spring (14), first bottom surface conflict die shoe (7) supporting spring (14), the bottom of alignment pin (13) up extrudes lower bolster (5).
6. Bending Mould under backboard according to claim 5, it is characterised in that described location is provided with buffer spring bottom hole.
7. Bending Mould under backboard according to claim 5, it is characterised in that being provided with location punching (12) on described lower bolster (5), the bottom of location punching (12) is provided with the second support spring (16).
8. Bending Mould under backboard according to claim 1, it is characterized in that, between described cope match-plate pattern (4) and upper bolster (2) and between lower bolster (5) and die shoe (7), be provided with stage clip (15).
9. Bending Mould under backboard according to claim 1, it is characterised in that be provided with guiding mechanism between described upper die component and lower mold assemblies.
10. Bending Mould under backboard according to claim 9, it is characterized in that, described guiding mechanism includes the guide pillar being arranged on cope match-plate pattern (4) and the gathering sill being arranged on lower bolster (5), being provided with damping spring on described guide pillar, described gathering sill and guide pillar match.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610288399.7A CN105750421A (en) | 2016-05-04 | 2016-05-04 | Back plate down-bending mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610288399.7A CN105750421A (en) | 2016-05-04 | 2016-05-04 | Back plate down-bending mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105750421A true CN105750421A (en) | 2016-07-13 |
Family
ID=56323346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610288399.7A Pending CN105750421A (en) | 2016-05-04 | 2016-05-04 | Back plate down-bending mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105750421A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108500145A (en) * | 2018-06-07 | 2018-09-07 | 杭州杰恺自动化设备有限公司 | A kind of automatic bending and molding pressing device of refrigerator doors coverboard |
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|---|---|---|---|---|
| JPH11151698A (en) * | 1997-11-18 | 1999-06-08 | Hitachi Aic Inc | Die for punching printed wiring board, and manufacture of the die |
| CN202894047U (en) * | 2012-11-16 | 2013-04-24 | 无锡爱博金属制品有限公司 | Bent forming and molding die of lower frame of automobile anti-locked braking system (ABS) |
| CN104259322A (en) * | 2014-10-09 | 2015-01-07 | 昆山煌佳精密模具有限公司 | Inclined surface diagonal bending stamping die |
| CN104550378A (en) * | 2014-12-24 | 2015-04-29 | 青岛华东工程机械有限公司 | Bending mould and bending method for refrigerator invisible door |
| CN204747232U (en) * | 2015-04-30 | 2015-11-11 | 昆山电子羽电业制品有限公司 | Mould of bending with automatic oiling structure |
| CN205020659U (en) * | 2015-08-31 | 2016-02-10 | 天津津荣天宇精密机械股份有限公司 | Be applied to bending of stamping die and press muscle structure |
| CN205096354U (en) * | 2015-09-29 | 2016-03-23 | 苏州博赢精密模具有限公司 | Bending die |
| CN205183520U (en) * | 2015-11-18 | 2016-04-27 | 江苏尚诚精密模具科技有限公司 | Washing machine box's mould of bending |
| CN205629124U (en) * | 2016-05-04 | 2016-10-12 | 昆山电子羽电业制品有限公司 | Mould of bending under backplate |
-
2016
- 2016-05-04 CN CN201610288399.7A patent/CN105750421A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11151698A (en) * | 1997-11-18 | 1999-06-08 | Hitachi Aic Inc | Die for punching printed wiring board, and manufacture of the die |
| CN202894047U (en) * | 2012-11-16 | 2013-04-24 | 无锡爱博金属制品有限公司 | Bent forming and molding die of lower frame of automobile anti-locked braking system (ABS) |
| CN104259322A (en) * | 2014-10-09 | 2015-01-07 | 昆山煌佳精密模具有限公司 | Inclined surface diagonal bending stamping die |
| CN104550378A (en) * | 2014-12-24 | 2015-04-29 | 青岛华东工程机械有限公司 | Bending mould and bending method for refrigerator invisible door |
| CN204747232U (en) * | 2015-04-30 | 2015-11-11 | 昆山电子羽电业制品有限公司 | Mould of bending with automatic oiling structure |
| CN205020659U (en) * | 2015-08-31 | 2016-02-10 | 天津津荣天宇精密机械股份有限公司 | Be applied to bending of stamping die and press muscle structure |
| CN205096354U (en) * | 2015-09-29 | 2016-03-23 | 苏州博赢精密模具有限公司 | Bending die |
| CN205183520U (en) * | 2015-11-18 | 2016-04-27 | 江苏尚诚精密模具科技有限公司 | Washing machine box's mould of bending |
| CN205629124U (en) * | 2016-05-04 | 2016-10-12 | 昆山电子羽电业制品有限公司 | Mould of bending under backplate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108500145A (en) * | 2018-06-07 | 2018-09-07 | 杭州杰恺自动化设备有限公司 | A kind of automatic bending and molding pressing device of refrigerator doors coverboard |
| CN108500145B (en) * | 2018-06-07 | 2023-10-10 | 杭州杰恺自动化设备有限公司 | Automatic forming compression fittings that bends of refrigerator door shell board |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160713 |