CN105746003B - The manufacturing method of printed wiring board with embedding circuit and the printed wiring board obtained with the manufacturing method - Google Patents
The manufacturing method of printed wiring board with embedding circuit and the printed wiring board obtained with the manufacturing method Download PDFInfo
- Publication number
- CN105746003B CN105746003B CN201480062866.3A CN201480062866A CN105746003B CN 105746003 B CN105746003 B CN 105746003B CN 201480062866 A CN201480062866 A CN 201480062866A CN 105746003 B CN105746003 B CN 105746003B
- Authority
- CN
- China
- Prior art keywords
- copper foil
- ultrathin copper
- carrier
- wiring board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0376—Etching temporary metallic carrier substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The object of the present invention is to provide the manufacturing methods that a kind of line width high with dimensional accuracy and linearity is printed wiring board of 30 μm of fine circuitries below as embedded circuit.In order to realize the purpose, the present invention provides a kind of manufacturing method of printed wiring board, the support substrate being made of the ultrathin copper foil with carrier and the insulating layer constituent material for supporting substrate to constitute is used in the manufacturing method, wherein, carrier can be removed used in peeling layer, and the outer surface of ultrathin copper foil layer is 0.2 μm≤Wmax≤1.3 μm, the ultrathin copper foil with carrier of 0.08 μm≤Ia≤0.43 μm, after the surface laminated insulating layer constituent material of the carrier, with the support substrate being made of the ultrathin copper foil and insulating layer constituent material with carrier, it is formed via the pattern of resistance to platedresist, copper facing, resistance to platedresist removal, the lamination of printed wiring board component parts, support the separation of substrate, the etching of ultrathin copper foil layer exists to obtain the outer circuit embedding configuration of at least one side Printed wiring board in insulating layer constituent material.
Description
Technical field
The present invention relates to the manufacturing method of the printed wiring board with embedding circuit and the printings obtained with the manufacturing method
Wiring board.Especially, it is related to being suitable for the manufacture for the printed wiring board that 30 μm of line width circuits below are formed.
Background technique
In the past, the line density by improving printed wiring board has been attempted to realize thin layer, the light weight of printed wiring board
Change.Furthermore the termination width of the semiconductor product carried in printed wiring board in recent years etc. is also gradually narrowing, for this
The circuit width and route spacing for the printed wiring board that termination width matches propose requirement.
As the technology that can form this fine circuitry, it is currently suggested (special using the technical solution of centreless lamination method
Sharp document 1).In patent document 1, pass through centreless lamination legal system with the copper foil with carrier foils with heat resistant metal layer to provide
When making multilayer printed circuit board, for the purpose of the manufacturing method for not needing the multilayer printed circuit board for removing the heat resistant metal layer, adopt
With " there is at least copper foil of copper foil layer/peeling layer/4 layers of the heat resistant metal layer/carrier foils structure with carrier foils as used,
It obtains after the carrier foils surface of the copper foil with carrier foils has been bonded the support substrate of insulating layer constituent material, in the support
The copper foil layer surface of the copper foil with carrier foils of substrate forms lamination line layer as the support base of lamination line layer is had
The support substrate with lamination line layer is obtained multilayer laminate using peeling layer separation, in turn, to the multilayer layer by plate
Pressing plate implements the manufacturing method that the multilayer printed circuit board of multilayer printed circuit board is obtained after necessary processing " etc. technical solutions.
Existing technical literature
Patent document
Patent document 1:WO2012/133638 bulletin
Summary of the invention
Problems to be solved by the invention
In centreless lamination support substrate, the electricity on the copper foil layer of the support substrate surface as lamination outer circuit layer
Lu Zhong, when forming 30 μm of fine circuitries below of line width using graphic plating method, there is be such as formed by circuit
The problem of line width uniformity is damaged, the linearity of circuit declines.
In view of problem above, at present for requiring to form line width in the outer circuit that centreless lamination supports substrate to be
When 30 μm of fine circuitries below, it is also capable of forming the manufacturing method of the printed wiring board of dimensional accuracy and the high circuit of linearity
Propose requirement.
Solution to the problem
The manufacturing method and printed wiring board of printed wiring board of the invention are as described below.
A, the manufacturing method of printed wiring board
The manufacturing method of printed wiring board of the invention is using by ultrathin copper foil and support substrate structure with carrier
At the manufacturing method of the printed wiring board of support substrate that constitutes of insulating layer constituent material, and to include the following process as it
Feature, the outer circuit to obtain at least one side are embedded printed wiring board of the configuration in insulating layer constituent material.
The preparation of ultrathin copper foil with carrier: prepare that carrier, the appearance of ultrathin copper foil layer can be removed using peeling layer
Face is the ultrathin copper foil with carrier of 0.2 μm≤Wmax≤1.3 μm and 0.08 μm≤Ia≤0.43 μm.
It supports the preparatory process of substrate: having the ultrathin copper foil of carrier with this, support substrate in the surface laminated of the carrier
The insulating layer constituent material of composition, thus the insulating layer for preparing the ultrathin copper foil by this with carrier and substrate being supported to constitute
The support substrate that constituent material is constituted.
The pattern of resistance to platedresist formation process: in the ultrathin copper foil layer of the ultrathin copper foil with carrier of the support substrate
Surface forms the pattern of resistance to platedresist with opening portion.
It plates copper process: in the resistance to platedresist opening portion of the support substrate with the pattern of resistance to platedresist, being formed
Copper plate forms circuit pattern.
Resistance to platedresist removing step: get on from the support substrate with the pattern of resistance to platedresist and circuit pattern
Except resistance to platedresist.
The laminating process of printed wiring board component parts: it is formed in the circuit pattern of the support substrate with circuit pattern
Face, laminated printed circuit boards component parts.
It supports the separation process of substrate: utilizing the pole with carrier of the layered product with printed wiring board component parts
The peeling layer of thin copper foil removes carrier to be separated, is formed in the lamination side with printed wiring board component parts and only protects
The layered product with ultrathin copper foil layer of the ultrathin copper foil layer of the ultrathin copper foil with carrier is stayed.
The etching work procedure of ultrathin copper foil layer: will be located at the ultrathin copper foil layer of the lamination volume surrounding with ultrathin copper foil layer,
It is removed by carrying out short time etching, to obtain the outer circuit with embedding configuration in insulating layer constituent material
Printed wiring board.
B, printed wiring board
Printed wiring board of the invention is characterized in that the printed wiring board is the track described in any of the above one
What the manufacturing method of road plate obtained.
The effect of invention
The manufacturing method of printed wiring board according to the present invention supports the circuit forming layer of substrate to use in centreless lamination
Ultrathin copper foil with carrier, the ultrathin copper foil that should have carrier have resist adaptation and the copper-plated circuit linearity of pattern
Excellent ultrathin copper foil layer, thus even if 30 μm of fine circuitries below of line width situation, can also be in centreless lamination
Support the surface formation dimensional accuracy of substrate and the fine circuitry that linearity is excellent.In turn, due to foring in insulation layer structure
The circuit of the fine circuitry is embedded in material, it is available that there is and impedance good for the adaptation of insulation layer structure material
Control the centreless lamination circuit board of also excellent outer circuit.
Detailed description of the invention
Fig. 1 is the schematic diagram for illustrating the manufacturing process of printed wiring board of the invention.
Fig. 2 is the schematic diagram for illustrating the manufacturing process of printed wiring board of the invention.
Fig. 3 is the schematic diagram for illustrating the manufacturing process of printed wiring board of the invention.
Fig. 4 is the schematic diagram for illustrating the manufacturing process of printed wiring board of the invention.
The explanation of symbol
P printed wiring board, S1 support substrate, S2 support substrate, S3 with the pattern of resistance to platedresist to have resistance to plating
The support substrate of resist pattern and circuit pattern, S4 support substrate, S5 with circuit pattern are constituted with printed wiring board
It is the ultrathin copper foil with carrier of layered product with ultrathin copper foil layer of the layered product of component, S6,1,2 carriers, 3 peeling layers, 4 very thin
Insulating layer constituent material, 6 insulating layer constituent materials, the 10 resistance to platedresists, 20 copper facing of copper foil layer, 5 support substrate compositions
Layer (=line circuit), the outer surface of 25 ultrathin copper foils, 30 duplicate surfaces
Specific embodiment
Hereinafter, for embodiments of the present invention, as needed referring to attached drawing while be divided into the " manufacture of printed wiring board
Mode " and " embodiment of printed wiring board " are illustrated.
A, the manufacture of printed wiring board
The manufacturing method of printed wiring board of the invention is using by ultrathin copper foil and support substrate structure with carrier
At the manufacturing method of the printed wiring board of support substrate that constitutes of insulating layer constituent material, which is characterized in that comprising following
Process.Also, for the printed wiring board with regard to being obtained with the manufacturing method, the outer circuit of at least one side, which is embedded to configure, to exist
In insulating layer constituent material.Hereinafter, explaining one by one each process.
The preparation of ultrathin copper foil with carrier: firstly, prepare that carrier can be removed using peeling layer, ultrathin copper foil layer
Outer surface is the ultrathin copper foil with carrier of 0.2 μm≤Wmax≤1.3 μm and 0.08 μm≤Ia≤0.43 μm.Fig. 1's (A)
Diagrammatic cross-section shows the ultrathin copper foil 1 with carrier.Here, the outer surface 25 of so-called ultrathin copper foil layer, which refers to, is exposed to table
The face in face.For the Wmax, the linear viewpoint based on the circuit formed on the surface of the ultrathin copper foil layer with galvanoplastic,
Preferably 1.3 μm or less.Also, good viewpoint is become based on the adaptation of resistance to platedresist, Wmax be preferably 0.2 μm with
On.Furthermore so-called Wmax refers to the maximum difference of height of fluctuating, be with three-dimensional surface structure analysis microscope obtain with have
In the relevant information of bumps of the ultrathin copper foil layer surface of the ultrathin copper foil of carrier, with the wave relevant to fluctuating of filter extraction
The maximum value (the sum of maximum peak height and maximum valley depth of waveform) of the difference of height of graphic data.
Secondly, for the concave-convex Ia of the outer surface of the ultrathin copper foil layer, adaptation based on resistance to platedresist and anti-
Lose the linear viewpoint of agent circuit, preferably 0.08 μm≤Ia≤0.43 μm.Here, so-called Ia refers to average surface height.
For above-mentioned Wmax and Ia, use Zygo New View 5032 (Zygo corporation) as analyzer
Device, and use Metro Pro Ver.8.0.2 as analysis software, low-frequency filter is located at 11 μm, according to it is below a)~c)
Sequence be measured.
A) it using the outer surface of the ultrathin copper foil layer of the ultrathin copper foil with carrier as detection faces, is fastened on sample table.
B) in the range of the outer surface 1cm square of the ultrathin copper foil layer of the ultrathin copper foil with carrier, 6 108 μ are selected
It is detected in the visual field of m × 144 μm.
C) the Wmax value and Ia using the average value of the value obtained in 6 measuring points as the outer surface of ultrathin copper foil layer
Value.
Support substrate preparatory process: in the process, prepare Fig. 1 (A) diagrammatic cross-section shown in, by this have carrier
Ultrathin copper foil 1 and support substrate composition insulating layer constituent material 5 constitute support substrate S1.Here, used band
There is the ultrathin copper foil of carrier preferably using the layer structure with " 2/ peeling layer of carrier, 3/ ultrathin copper foil layer 4 " or " removing of carrier 2/
The material of layer 3/ heat resistant metal layer/ultrathin copper foil layer, 4 " layer structure.This is because, convenient for then removing when there is this layer structure
The reason of carrier.
Here, ultrathin copper foil layer 4 is preferably thinner than carrier 2.Specifically, for the thickness of ultrathin copper foil layer 4, based on subtracting
The generation of few pin hole and the viewpoint for reducing etch quantity fluctuation when etching removes, preferably 0.5 μm~5 μm of thickness of copper foil layer.
Also, the ultrathin copper foil layer 4 can use the liquid phase methods such as electrolysis method, non-electrical solution, the chemical gas-phase reaction methods such as CVD, sputtering or steaming
Any one method in physical methods such as plating is formed.
Also, carrier preferably uses resin film, electrolytic copper foil or rolled copper foil.Also, based on the rigidity ensured when operating
With the viewpoint of depth of parallelism when ensuring that punching press is laminated, the thickness of the carrier is preferably 12 μm~70 μm, more preferably 12 μm~35 μ
m。
Secondly, being illustrated to peeling layer.Peeling layer is divided into organic peeling layer and inorganic release layer.Using inorganic release layer
When, it is preferred to use containing selected from least one of the group being made of nitrogenous compound, sulfur-containing compound and carboxylic acid compound
Inorganic release layer.Organic compounds containing nitrogen mentioned herein includes the organic compounds containing nitrogen with substituent group.Specifically,
As organic compounds containing nitrogen, it is preferable to use the triazole compounds such as 1 with substituent group, 2,3- benzotriazole, carboxyl benzo three
Azoles, N ', bis- (benzotriazole ylmethyl) ureas of N ' -, 1H-1,2,4- triazole and 3- amino -1H-1,2,4- triazole etc..Also, as
Organic compounds containing sulfur is, it is preferable to use mercaptobenzothiazoler, trithiocyanuric acid and 2-mercaptobenzimidazole etc..Also, as carboxylic
Acid particularly preferably uses monocarboxylic acid, and it is preferable to use oleic acid, linoleic acid and linolenic acids etc. wherein.The high temperature of these organic principles
Excellent heat resistance can form the envelope of thickness 5nm~60nm on the surface of carrier.
Furthermore when using inorganic release layer, as inorganic constituents, preferably with selected from by Ni, Mo, Co, Cr, Fe, Ti, W, P,
Carbon and make that at least one of group that alloy or compound as main component form is above to be formed with them.These nothings
Machine class adhesive interface layer can use the known methods such as galvanoplastic, non-electrical solution, physical vapor deposition, be formed with arbitrary thickness.
Furthermore with regard to the heat resistant metal layer (figure that layer structure is " 2/ 3/ heat resistant metal layer of peeling layer of carrier/ultrathin copper foil layer 4 "
Show omission) for, " the phase counterdiffusion between carrier 2 and ultrathin copper foil layer 4 " that occurs can be to prevent when by inhibiting hot forming
Only carrier 2 and ultrathin copper foil layer 4 burn adhesion, so that the removing of subsequent carrier 2 be made to become easy.As the heating resisting metal
Layer, is preferably selected and is made in the group by molybdenum, tantalum, tungsten, cobalt, nickel and the various composition of alloy containing these metal components
With.It is, however, most preferred that forming heat resistant metal layer with nickel or nickel alloy.This is because, the film thickness shape of the epithelium of nickel or nickel alloy
, heat-resistant quality excellent at precision also stable reason.In addition it is also possible to using non-electrical solution, electrolysis method, sputtering vapor deposition, chemistry
The physical vapor depositions such as gas-phase reaction method methods forms heat resistant metal layer.
With the ultrathin copper foil described above with carrier, on the surface of the carrier, the insulation of substrate composition is supported in fitting
Layer constituent material." 5/ carrier of insulating layer constituent material, 2/ peeling layer, 3/ ultrathin copper foil of substrate composition is supported that is, preparing to have
Layer 4 " or " 5/ carrier of insulating layer constituent material, 2/ 3/ heat resistant metal layer of the peeling layer/ultrathin copper foil layer 4 for supporting substrate composition "
In any one layer of structure support substrate.Do not have for the insulating layer constituent material 5 of the support substrate composition used at this time
It is special to limit, prepreg, resin film or resin film with adhesive etc. can be used.Also, as applying method,
Hot forming method can also arbitrarily be selected, using fitting method of adhesive etc..
The pattern of resistance to platedresist formation process: in the process, in the very thin copper with carrier of above-mentioned support substrate
The ultrathin copper foil layer surface of foil forms the pattern of resistance to platedresist 10 with opening portion, to obtain the section such as Fig. 1 (B)
" the support substrate S2 with the pattern of resistance to platedresist " shown in schematic diagram.It is excellent as the resistance to platedresist used at this time
Choosing uses dry film or liquid resist.This is because, the exposure resolution ratio of the two is excellent, meets the objective to form fine circuitry
Reason.The surface for supporting the ultrathin copper foil layer of the ultrathin copper foil with carrier of substrate is covered with these.Then, it will specify
The pattern exposure of resistance to platedresist, after development, obtain " the support substrate S2 with the pattern of resistance to platedresist " of Fig. 1 (B).
In addition, being before covering the ultrathin copper foil layer surface for supporting the ultrathin copper foil with carrier of substrate with resistance to platedresist
The adaptation for improving resist, preferably removes the extra oxidation film of the ultrathin copper foil layer surface, and for the cleaning on surface,
It is preferred that carrying out carrying out washing treatment with dilution heat of sulfuric acid, dilute hydrochloric acid solution, Sulfuric-acid-hydrogen-peroxide aqueous solution etc..
Plate copper process: in the process, in the resistance to plating of above-mentioned " the support substrate S2 with the pattern of resistance to platedresist "
Implement copper facing 20 in resist opening portion.That is, forming the copper plate as circuit pattern there is no the position of resistance to platedresist,
Circuit pattern is formed there are the position of resistance to platedresist not forming copper plate.It is shown in Fig. 2 (C) obtained in the process
" the support substrate S3 with the pattern of resistance to platedresist and circuit pattern ".The ultrathin copper foil layer side of circuit pattern at this time
Surface is the duplicate of the surface shape of ultrathin copper foil layer.
Resistance to platedresist removing step: in the process, from " the support with the pattern of resistance to platedresist and circuit pattern
Resistance to platedresist 10 is removed on substrate S3 ", is obtained " the support substrate S4 with circuit pattern " shown in Fig. 2 (D).At this time
Usually using alkaline solution in the removal of resistance to platedresist 10.
The laminating process of printed wiring board component parts: in the process, with above-mentioned " the support substrate with circuit pattern
S4 " is bonded printed wiring board specified needed for obtaining purpose printed wiring board in circuit pattern forming face as shown in Fig. 3 (E)
Component parts obtains " the layered product S5 with printed wiring board component parts " shown in Fig. 3 (F).It " is obtained for mentioned herein
Obtain printed wiring board component parts specified needed for purpose printed wiring board ", as long as printed wiring board may finally be obtained,
There is no particular limitation, and it is preferable to employ the following method.
In the manufacturing method of printed wiring board of the invention, insulating layer constituent material 6 is preferably used as the track
Road plate component parts.That is, being bonded as shown in Fig. 3 (E) in the circuit pattern forming face of " the support substrate S4 with circuit pattern "
After insulating layer constituent material 6, " the layered product S5 with printed wiring board component parts " shown in available Fig. 3 (F).
Also, it is also preferred that lamination line layer is used as the printed wiring board component parts, to obtain multiple stratification
Printed wiring board.For the multiple stratification method of lamination line layer mentioned herein, there is no particular limitation.For example, can adopt
With via insulating layer constituent material 6, the printed wiring board of usual form is successively fitted in " the support substrate with circuit pattern
The circuit pattern forming face of S4 ", to form the side of " the layered product S5 with printed wiring board component parts " of multiple stratification
Method.Also, it is also preferred that using via insulating layer constituent material, in the circuit pattern shape of " the support substrate S4 with circuit pattern "
New copper foil layer is set at face, then implements perforation hole machined, plating processing, etching and processing etc., and then repeat similarly to operate
Come formed multiple stratification " the layered product S5 with printed wiring board component parts " centreless lamination method.
It supports the separation process of substrate: in the process, utilizing the above-mentioned " layered product with printed wiring board component parts
The insulating layer constituent material 5 and carrier 2 of substrate composition are supported in the peeling layer 3 of the ultrathin copper foil 1 with carrier of S5 ", removing
And separate removal.As a result, forming form shown in Fig. 4 (G).Here, it is formed in the layer with printed wiring board component parts
Laminate side only remains " the layered product S6 with ultrathin copper foil layer " of the ultrathin copper foil layer 4 of the ultrathin copper foil 1 with carrier.
The etching work procedure of ultrathin copper foil layer: in the process, the short time, which is etched to melt to remove to be located at, should have ultrathin copper foil
After the ultrathin copper foil layer 4 of the layered product S6 outer layer of layer, the printed wiring board with circuit pattern is obtained, which is to wrap
Bury the outer circuit configured in insulating layer constituent material 6.That is, obtaining the printed wiring board P as shown in Fig. 4 (H).At this point, just
For surface as the circuit pattern of outer circuit, as long as not implementing special etching process, roughening treatment etc., it can be formed
Invert the duplicate surface 30 of the surface shape of ultrathin copper foil layer 4, thus have 0.2 μm≤Wmax≤1.3 μm and 0.08 μm≤Ia≤
0.43 μm of surface characteristic.It is excellent with the wellability of scolding tin as the circuit surface with this surface characteristic, thus be also suitable for
It is used as component terminal.In addition, implementing chemical treatment, at etching on the surface of the circuit pattern as the outer circuit
Whens reason, roughening treatment etc., as long as the variation that its surface characteristic is not big, so that it may maintain same surface characteristic.Also, pass through
Ultrathin copper foil layer 4 is etched, can also be formed on the surface of insulating layer constituent material 6 and invert the surface shape of ultrathin copper foil layer 4
Duplicate surface.In other words, the surface of insulating layer constituent material 6 also has 0.2 μm≤Wmax≤1.3 μm and 0.08 μm≤Ia
≤ 0.43 μm of value.The surface of this insulating layer constituent material 6 and the solder resist or the resinous woods such as sealing resin formed on surface layer
The adaptation of material is good.
In addition, during the fitting of Fig. 3 (E), it, can also be via insulating layer in the outer layer of printed wiring board component parts
The circuit pattern side of " the support substrate S4 with circuit pattern " shown in Fig. 2 (D) is fitted in the insulating layer structure by constituent material 6
At material side, to remove carrier simultaneously using the peeling layer of the ultrathin copper foil with carrier in the same of the middle explanation of Fig. 4 (G)
After separation removal, the layered product with ultrathin copper foil layer that two sides exposure has ultrathin copper foil layer is formed, obtains the outer layer electricity on two sides
Printed wiring board of the road embedding configuration in insulating layer constituent material.
As the manufacturing method of above-mentioned printed wiring board of the invention, for the purpose for being easy to understand its process,
The one side of the insulating layer constituent material 5 for using the support substrate composition of Fig. 1 (A) is only illustrated as the embodiment of object.But
The two sides of the insulating layer constituent material 5 of the support substrate composition of Fig. 1 (A) can also be used as object, and implement same operation.
B, the embodiment of printed wiring board
Printed wiring board of the invention is characterized in that the printed wiring board is with any one above-mentioned printed wiring board
Manufacturing method obtain.In addition, printed wiring board of the invention can be single side printed wiring board, two-face printing wiring board,
Or three layers or more of multilayer printed circuit board.
Embodiment 1
The preparation of ultrathin copper foil with carrier: firstly, having prepared that the removing of carrier, very thin copper can be carried out in peeling layer
The outer surface of layers of foil is Wmax=0.7 μm, Ia=0.19 μm, the layer structure with " 2/ peeling layer of carrier, 3/ ultrathin copper foil layer 4 "
The ultrathin copper foil 1 ((A) referring to Fig.1) with carrier.In addition, being somebody's turn to do the ultrathin copper foil 1 with carrier by 18 μm of thickness of carrier
2, the peeling layer 3 that 3.0 μm of thickness of ultrathin copper foil layer 4, carboxyl benzotriazole are formed is constituted.
Support the preparatory process of substrate: in the process, with the above-mentioned ultrathin copper foil 1 with carrier, in the table of the carrier 2
Face paste closes the insulating layer constituent material 5 for supporting substrate composition, is had and " insulating layer of substrate composition is supported to constitute material
Expect to support substrate S1 shown in Fig. 1 (A) of the layer structure of 5/ carrier, 2/ peeling layer, 3/ ultrathin copper foil layer 4 ".The support substrate is constituted
In insulating layer constituent material 5, FR-4 prepreg is used.
The pattern of resistance to platedresist formation process: in the process, in the very thin with carrier of above-mentioned support substrate S1
After resistance to platedresist (dry film) is arranged in the ultrathin copper foil layer surface of copper foil, pass through 20 μm of line width have of exposure development formation
The pattern of resistance to platedresist 10 of opening portion has been obtained as shown in the diagrammatic cross-section of Fig. 1 (B) " with resistance to platedresist
The support substrate S2 " of pattern.
Plate copper process: in the process, in the resistance to plating of above-mentioned " the support substrate S2 with the pattern of resistance to platedresist "
Resist opening portion forms the copper plate 20 as circuit pattern, has obtained as shown in Fig. 2 (C) " with resistance to platedresist
The support substrate S3 " of pattern and circuit pattern.
Resistance to platedresist removing step: in the process, with alkaline solution from " with the pattern of resistance to platedresist and circuit
Resistance to platedresist 10 is removed on the support substrate S3 " of pattern, has obtained " the support with circuit pattern as shown in Fig. 2 (D)
Substrate S4 ".
The laminating process of printed wiring board component parts: in the process, with above-mentioned " the support substrate with circuit pattern
S4 ", as shown in Fig. 3 (E), insulating layer constituent material 6 needed for obtaining purpose printed wiring board is fitted in circuit pattern and is formed
Face has been obtained as shown in Fig. 3 (F) " the layered product S5 with printed wiring board component parts ".
It supports the separation process of substrate: in the process, utilizing the above-mentioned " layered product with printed wiring board component parts
The insulating layer constituent material 5 and carrier 2 of substrate composition are supported in the peeling layer 3 of the ultrathin copper foil 1 with carrier of S5 ", removing
To have done separation removal.As a result, foring shown in Fig. 4 (G) on the lamination side with printed wiring board component parts
Remain " the layered product S6 with ultrathin copper foil layer " of the ultrathin copper foil layer 4 of the ultrathin copper foil 1 with carrier.
The etching work procedure of ultrathin copper foil layer: in the process, removal is melted by etching and has ultrathin copper foil layer positioned at this
The ultrathin copper foil layer 4 of layered product S6 outer layer has obtained the printed wiring board P as shown in Fig. 4 (H) with circuit pattern, the electricity
Road pattern is the outer circuit for embedding configuration in insulating layer constituent material.At this point, circuit pattern as outer circuit
Surface is the duplicate surface 30 of the previously used ultrathin copper foil with carrier, the surface with Wmax=0.7 μm, Ia=0.19 μm
Characteristic.
Embodiment 2
In embodiment 2, in addition to having and carrying used in alternate embodiment 1 in the preparation of the ultrathin copper foil with carrier
The ultrathin copper foil of body, used ultrathin copper foil layer outer surface be Wmax=1.3 μm, Ia=0.29 μm have " carrier 2/ shell
Other than the ultrathin copper foil 1 with carrier of the layer structure of 3/ ultrathin copper foil layer 4 " of absciss layer, other processes are same as Example 1.Cause
And the outer circuit of finally obtained printed wiring board P, the i.e. surface of circuit pattern be use at this time it is very thin with carrier
The duplicate surface 30 of copper foil, the surface characteristic with Wmax=1.3 μm, Ia=0.29 μm.
Embodiment 3
In embodiment 3, in addition to having and carrying used in alternate embodiment 1 in the preparation of the ultrathin copper foil with carrier
The ultrathin copper foil of body, used ultrathin copper foil layer outer surface be Wmax=1.2 μm, Ia=0.43 μm have " carrier 2/ shell
Other than the ultrathin copper foil 1 with carrier of the layer structure of 3/ ultrathin copper foil layer 4 " of absciss layer, other processes are same as Example 1.Cause
And the outer circuit of finally obtained printed wiring board P, the i.e. surface of circuit pattern be use at this time it is very thin with carrier
The duplicate surface 30 of copper foil, the surface characteristic with Wmax=1.2 μm, Ia=0.43 μm.
Embodiment 4
In embodiment 4, in addition to having and carrying used in alternate embodiment 1 in the preparation of the ultrathin copper foil with carrier
The ultrathin copper foil of body, used ultrathin copper foil layer outer surface be Wmax=0.2 μm, Ia=0.08 μm have " carrier 2/ shell
Other than the ultrathin copper foil 1 with carrier of the layer structure of 3/ ultrathin copper foil layer 4 " of absciss layer, other processes are same as Example 1.Cause
And the outer circuit of finally obtained printed wiring board P, the i.e. surface of circuit pattern be use at this time it is very thin with carrier
The duplicate surface 30 of copper foil, the surface characteristic with Wmax=0.2 μm, Ia=0.08 μm.
Comparative example
Comparative example 1
In comparative example 1, in addition to having and carrying used in alternate embodiment 1 in the preparation of the ultrathin copper foil with carrier
The ultrathin copper foil of body, used ultrathin copper foil layer outer surface be Wmax=1.4 μm, Ia=0.50 μm have " carrier 2/ shell
Other than the ultrathin copper foil 1 with carrier of the layer structure of 3/ ultrathin copper foil layer 4 " of absciss layer, other processes are same as Example 1.Cause
And the outer circuit of finally obtained printed wiring board P, the i.e. surface of circuit pattern be use at this time it is very thin with carrier
The duplicate surface 30 of copper foil, the surface characteristic with Wmax=1.4 μm, Ia=0.50 μm.
Comparative example 2
In comparative example 2, in addition to having and carrying used in alternate embodiment 1 in the preparation of the ultrathin copper foil with carrier
The ultrathin copper foil of body, used ultrathin copper foil layer outer surface be Wmax=0.1 μm, Ia=0.07 μm have " carrier 2/ shell
Other than the ultrathin copper foil 1 with carrier of the layer structure of 3/ ultrathin copper foil layer 4 " of absciss layer, other processes are same as Example 1.Cause
And the outer circuit of finally obtained printed wiring board P, the i.e. surface of circuit pattern be use at this time it is very thin with carrier
The duplicate surface 30 of copper foil, the surface characteristic with Wmax=0.1 μm, Ia=0.07 μm.
Test method
Here, before comparative example and comparative example, first illustrate the fitness test of resistance to platedresist and circuit straight line
Property test method.
The method for the fitness test of resistance to platedresist: the evaluation sample of resistance to platedresist uses sample as described below
Product.In the above-mentioned pattern of resistance to platedresist formation process, in the very thin copper for the ultrathin copper foil with carrier for supporting substrate S1
After resistance to platedresist (dry film) is arranged in layers of foil surface, blanket exposure has been carried out.Then, the resistance to plating on substrate S1 will be supported
Resist is pasted on the phenolic resin plate of thickness 0.8mm with adhesive, has obtained exposing after carrier of separating from peeling layer
Ultrathin copper foil layer has ultrathin copper foil layer/adhesive phase/phenolic resin plate layer structure layered product.In turn, in the lamination
Electro-coppering after having obtained 18 μm of thickness of copper electroplating layer with sulfuric acid copper facing mode on the ultrathin copper foil of body, to 1cm wide is cut into
The peel strength (90 ° of angle, speed 50mm/ minutes) of layer is determined, and then is carried out to the adaptation of resistance to platedresist
Evaluation.The judgment criteria of the adhesive strength is as described below.
(judgment criteria of resistance to platedresist adaptation)
Zero: 0.01kgf/cm or more
×: it is lower than 0.01kgf/cm
The linear evaluation method of circuit: for the embedded circuit with 20 μm of line width as above-mentioned outer layer electricity
The line width of the printed wiring board P of road pattern finds out the standard deviation of its line width using 4 μm of scales as 15 points of measuring space
Poor σwAfterwards as the linear index of circuit.Also, the judgment criteria of the standard deviation value is as described below.
(the linear judgment criteria of circuit)
Zero: σw≤2.2μm
×: σw2.2 μm of >
Overall merit: above-mentioned resistance to platedresist adaptation and circuit linearity evaluation in, according to following standard into
Overall merit is gone.
(judgment criteria of overall merit)
Zero: items evaluation is good
×: any one is evaluated as unqualified
The comparison of embodiment and comparative example
For the ease of the comparison of embodiment and comparative example, is concluded in table 1 below and show evaluation result.
Table 1
The manufacturing method of printed wiring board of the invention is characterized by, and as the ultrathin copper foil for having carrier, is used
The outer surface of ultrathin copper foil layer is the copper foil of 0.2 μm≤Wmax≤1.3 μm, 0.08 μm≤Ia≤0.43 μm.It here, can by table 1
To know, the ultrathin copper foil used in each embodiment with carrier meets the requirement of the ultrathin copper foil with carrier of the invention,
The fitness test of resistance to platedresist and circuit linearity have obtained good result in testing.
In contrast, for having the ultrathin copper foil of carrier used in comparative example 1, comparative example 2, the value of Wmax and Ia
Departing from optimum range of the invention.As a result, all not obtained in resist adaptation and the test of circuit linearity
Result.
Industrial applicibility
It is available using embedding circuit as the centreless lamination of outer layer using the manufacturing method of printed wiring board of the invention
Wiring board, as the embedding circuit, even line width is that 30 μm of fine circuitries below also have excellent linearity.Base
In the advantage, can be used in a variety of applications where after forming the excellent slim centreless laminated substrate of impedance control.For example, can use
As the carryings such as smart phone, tablet computer, PC, server, router, work station application processor or
The semiconductor package or module substrate of memory, 1~10MHz bandwidth high-frequency digital signal circuit.At these on the way
The electronic components such as resistor, the inductor that can be formed the excellent installation form of impedance matching, thus additional configuration can be reduced
Configuration number.It, can be with other than above-mentioned Digital Signal Processing purposes also, under the premise of playing the excellent characteristic
In antenna element substrate or CSP for being sent used in analog wireless communication in multiband etc., receiving circuit etc..
Claims (7)
- It is used 1. a kind of manufacturing method of printed wiring board, in the manufacturing method by the ultrathin copper foil with carrier and supports base The support substrate that the insulating layer constituent material of plate composition is constituted, and the outer circuit embedding configuration of at least one side is in insulating layer structure At in material, and with comprising process below for its feature,The preparation of ultrathin copper foil with carrier: prepare that the removing of carrier, the appearance of ultrathin copper foil layer can be carried out in peeling layer Face is the ultrathin copper foil with carrier of 0.2 μm≤Wmax≤1.3 μm and 0.08 μm≤Ia≤0.43 μm,Here, the Wmax refers to the maximum difference of height of fluctuating, be with three-dimensional surface structure analysis microscope obtain with institute It states in the relevant information of bumps of the ultrathin copper foil layer surface of the ultrathin copper foil with carrier, is filtered with the low frequency for being located at 11 μm Wave device extract Wave data relevant to fluctuating the maximum value of difference of height, the i.e. maximum peak height of waveform and maximum valley depth it With, the Ia be in information relevant to the bumps of the ultrathin copper foil layer surface of the ultrathin copper foil with carrier, The average surface height extracted with the low-frequency filter for being located at 11 μm,It supports the preparatory process of substrate: having the ultrathin copper foil of carrier with this, support substrate to constitute in the surface laminated of the carrier Insulating layer constituent material, so that the insulating layer for preparing the ultrathin copper foil by this with carrier and substrate being supported to constitute is constituted The support substrate that material is constituted,The pattern of resistance to platedresist formation process: in the ultrathin copper foil layer table of the ultrathin copper foil with carrier of the support substrate Face forms the pattern of resistance to platedresist with opening portion,It plates copper process: forming copper facing in the resistance to platedresist opening portion of the support substrate with the pattern of resistance to platedresist Layer, so that circuit pattern is formed,The removing step of resistance to platedresist: it is removed from the support substrate with the pattern of resistance to platedresist and circuit pattern Resistance to platedresist,The laminating process of printed wiring board component parts: this with circuit pattern support substrate circuit pattern forming face, Laminated printed circuit boards component parts,It supports the separation process of substrate: utilizing the very thin copper with carrier of the layered product with printed wiring board component parts The peeling layer of foil is removed and carrier of separating, is formed in the lamination side with printed wiring board component parts and remains with carrier Ultrathin copper foil ultrathin copper foil layer the layered product with ultrathin copper foil layer,The etching work procedure of ultrathin copper foil layer: the lamination volume surrounding with ultrathin copper foil layer is located at by short time etching removal Ultrathin copper foil layer obtains the printed wiring board of the outer circuit with embedding configuration in insulating layer constituent material.
- 2. the manufacturing method of printed wiring board as described in claim 1, wherein manufacture have surface be 0.2 μm≤Wmax≤ The circuit pattern of 1.3 μm and 0.08 μm≤Ia≤0.43 μm as the outer circuit printed wiring board.
- 3. the manufacturing method of printed wiring board as described in claim 1, wherein use insulating layer constituent material as the printing Wiring board component parts.
- 4. the manufacturing method of printed wiring board as described in claim 1, wherein use lamination line layer as the printed wire Plate component parts.
- 5. the manufacturing method of the printed wiring board as described in any one of Claims 1 to 4, wherein with ultrathin copper foil The material of layer/peeling layer/carrier layer structure is as the ultrathin copper foil for having carrier.
- 6. the manufacturing method of the printed wiring board as described in any one of Claims 1 to 4, wherein with ultrathin copper foil Layer/peeling layer/heat resistant metal layer/carrier layer structure material is as the ultrathin copper foil for having carrier.
- 7. a kind of printed wiring board, which is characterized in that described in any one of the printed wiring board Claims 1 to 4 What the manufacturing method of printed wiring board obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710821288.2A CN107708314B (en) | 2013-11-22 | 2014-11-21 | Coreless stacking support substrate and printed wiring board manufactured by using same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-241584 | 2013-11-22 | ||
| JP2013241584 | 2013-11-22 | ||
| PCT/JP2014/080917 WO2015076372A1 (en) | 2013-11-22 | 2014-11-21 | Manufacturing method for printed wiring board provided with buried circuit, and printed wiring board obtained by the manufacturing method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710821288.2A Division CN107708314B (en) | 2013-11-22 | 2014-11-21 | Coreless stacking support substrate and printed wiring board manufactured by using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105746003A CN105746003A (en) | 2016-07-06 |
| CN105746003B true CN105746003B (en) | 2018-12-21 |
Family
ID=53179631
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480062866.3A Active CN105746003B (en) | 2013-11-22 | 2014-11-21 | The manufacturing method of printed wiring board with embedding circuit and the printed wiring board obtained with the manufacturing method |
| CN201710821288.2A Active CN107708314B (en) | 2013-11-22 | 2014-11-21 | Coreless stacking support substrate and printed wiring board manufactured by using same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710821288.2A Active CN107708314B (en) | 2013-11-22 | 2014-11-21 | Coreless stacking support substrate and printed wiring board manufactured by using same |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6753669B2 (en) |
| KR (2) | KR20170104648A (en) |
| CN (2) | CN105746003B (en) |
| TW (2) | TWI633817B (en) |
| WO (1) | WO2015076372A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170104648A (en) * | 2013-11-22 | 2017-09-15 | 미쓰이금속광업주식회사 | Coreless buildup support substrate and printed wiring board manufactured using said coreless buildup support substrate |
| KR20160095487A (en) * | 2015-02-03 | 2016-08-11 | 삼성전기주식회사 | Printed circuit board and manufacturing method of the same |
| JP6546526B2 (en) * | 2015-12-25 | 2019-07-17 | 三井金属鉱業株式会社 | Patent application title: Copper foil with carrier, laminate for coreless support, coreless support with wiring layer, and method for producing printed wiring board |
| WO2017149810A1 (en) * | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | Copper foil with carrier, production method for same, production method for coreless support with wiring layer, and production method for printed circuit board |
| WO2018066113A1 (en) * | 2016-10-06 | 2018-04-12 | 三井金属鉱業株式会社 | Production method for multilayer wiring board |
| WO2020145003A1 (en) * | 2019-01-11 | 2020-07-16 | 三井金属鉱業株式会社 | Laminate body |
| CN110996540B (en) * | 2019-12-31 | 2022-02-08 | 生益电子股份有限公司 | Manufacturing method of PCB |
| KR20230111212A (en) * | 2020-11-24 | 2023-07-25 | 코닝 인코포레이티드 | Micro light emitting diodes and micro-electronics transfer substrates |
| CN113380529A (en) * | 2021-05-13 | 2021-09-10 | 江苏普诺威电子股份有限公司 | Processing technology of single-layer wireless charging coil carrier plate |
| KR102429384B1 (en) * | 2021-07-02 | 2022-08-04 | 와이엠티 주식회사 | Carrier foil with metal foil, laminate for printed wiring board using the same and manufacturing method of the laminate |
| CN113473721A (en) * | 2021-07-08 | 2021-10-01 | 江西柔顺科技有限公司 | Flexible printed circuit board and preparation method thereof |
| WO2023016061A1 (en) * | 2021-08-09 | 2023-02-16 | 广州方邦电子股份有限公司 | Metal foil, circuit board, and method for manufacturing circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101395304A (en) * | 2006-03-10 | 2009-03-25 | 三井金属矿业株式会社 | Surface-treated electro-deposited copper foil and method for manufacturing the same |
| CN103430642A (en) * | 2011-03-30 | 2013-12-04 | 三井金属矿业株式会社 | Multilayer printed wiring board manufacturing method, and multilayer printed wiring board obtained by said manufacturing method |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11186716A (en) * | 1997-10-14 | 1999-07-09 | Fujitsu Ltd | Method of forming metal layer |
| US7026059B2 (en) * | 2000-09-22 | 2006-04-11 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine printed wiring boad |
| US6893742B2 (en) * | 2001-02-15 | 2005-05-17 | Olin Corporation | Copper foil with low profile bond enhancement |
| US6930256B1 (en) * | 2002-05-01 | 2005-08-16 | Amkor Technology, Inc. | Integrated circuit substrate having laser-embedded conductive patterns and method therefor |
| JP4517564B2 (en) * | 2002-05-23 | 2010-08-04 | 住友金属鉱山株式会社 | 2-layer copper polyimide substrate |
| US20050158574A1 (en) * | 2003-11-11 | 2005-07-21 | Furukawa Circuit Foil Co., Ltd. | Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier |
| JP2008182273A (en) * | 2003-11-14 | 2008-08-07 | Hitachi Chem Co Ltd | Method of forming insulating resin layer on metal |
| JP4756637B2 (en) * | 2005-11-10 | 2011-08-24 | 三井金属鉱業株式会社 | Sulfuric acid copper electrolyte and electrolytic copper foil obtained using the sulfuric acid copper electrolyte |
| JP4927503B2 (en) * | 2005-12-15 | 2012-05-09 | 古河電気工業株式会社 | Ultra-thin copper foil with carrier and printed wiring board |
| JP2010157605A (en) * | 2008-12-26 | 2010-07-15 | Panasonic Electric Works Co Ltd | Circuit board and method of manufacturing circuit board |
| KR101298999B1 (en) * | 2009-09-01 | 2013-08-23 | 일진머티리얼즈 주식회사 | Embedded Copper foil for fine pattern |
| JP5473838B2 (en) * | 2010-03-30 | 2014-04-16 | 日本電解株式会社 | Composite metal layer with support metal foil, wiring board using the same and manufacturing method thereof, and manufacturing method of semiconductor package using the wiring board |
| JP5672524B2 (en) * | 2010-07-02 | 2015-02-18 | 日立化成株式会社 | Manufacturing method of package substrate for mounting semiconductor device |
| CN101892499B (en) * | 2010-07-24 | 2011-11-09 | 江西理工大学 | Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof |
| JP5896200B2 (en) * | 2010-09-29 | 2016-03-30 | 日立化成株式会社 | Manufacturing method of package substrate for mounting semiconductor device |
| KR20170104648A (en) * | 2013-11-22 | 2017-09-15 | 미쓰이금속광업주식회사 | Coreless buildup support substrate and printed wiring board manufactured using said coreless buildup support substrate |
-
2014
- 2014-11-21 KR KR1020177024807A patent/KR20170104648A/en not_active Application Discontinuation
- 2014-11-21 KR KR1020167013101A patent/KR20160089364A/en not_active Application Discontinuation
- 2014-11-21 WO PCT/JP2014/080917 patent/WO2015076372A1/en active Application Filing
- 2014-11-21 CN CN201480062866.3A patent/CN105746003B/en active Active
- 2014-11-21 TW TW106114233A patent/TWI633817B/en active
- 2014-11-21 CN CN201710821288.2A patent/CN107708314B/en active Active
- 2014-11-21 TW TW103140381A patent/TWI589201B/en active
- 2014-11-21 JP JP2015515311A patent/JP6753669B2/en active Active
-
2017
- 2017-08-17 JP JP2017157371A patent/JP6753825B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101395304A (en) * | 2006-03-10 | 2009-03-25 | 三井金属矿业株式会社 | Surface-treated electro-deposited copper foil and method for manufacturing the same |
| CN103430642A (en) * | 2011-03-30 | 2013-12-04 | 三井金属矿业株式会社 | Multilayer printed wiring board manufacturing method, and multilayer printed wiring board obtained by said manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170104648A (en) | 2017-09-15 |
| JP6753669B2 (en) | 2020-09-09 |
| CN107708314B (en) | 2021-01-01 |
| CN105746003A (en) | 2016-07-06 |
| TW201731355A (en) | 2017-09-01 |
| KR20160089364A (en) | 2016-07-27 |
| TWI589201B (en) | 2017-06-21 |
| TWI633817B (en) | 2018-08-21 |
| WO2015076372A1 (en) | 2015-05-28 |
| JPWO2015076372A1 (en) | 2017-03-16 |
| JP2017224848A (en) | 2017-12-21 |
| JP6753825B2 (en) | 2020-09-09 |
| TW201536134A (en) | 2015-09-16 |
| CN107708314A (en) | 2018-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105746003B (en) | The manufacturing method of printed wiring board with embedding circuit and the printed wiring board obtained with the manufacturing method | |
| CN102098883A (en) | Carrier for manufacturing substrate and method of manufacturing substrate using the same | |
| US20090236130A1 (en) | Multilayered printed circuit board and method of manufacturing the same | |
| KR20020042658A (en) | Carrier-foiled composite copper foil, method for manufacturing printed circuit board with resistance circuit, and printed circuit board having resistance circuit | |
| KR102118245B1 (en) | Composite metal foil, copper-clad laminate using the composite metal foil, and manufacturing method of the copper-clad laminate | |
| CN101578014A (en) | Method of manufacturing PCB and PCB manufactured by the same | |
| JP2008218966A (en) | Method for manufacturing printed circuit board with built-in capacitor, and printed circuit board with built-in capacitor | |
| CN104883820B (en) | A kind of outer-layer circuit production method of the structure asymmetry backboard of warpage | |
| CN1979673B (en) | Wired circuit board and producing method thereof | |
| US11877397B2 (en) | Printed circuit board | |
| JP6353193B2 (en) | Copper foil with carrier, method for producing a copper-clad laminate using the copper foil with carrier, method for producing a printed wiring board using the copper foil with carrier, and method for producing a printed wiring board | |
| JP2011171621A (en) | Copper foil with resistor layer and copper clad laminate including the same, and method of manufacturing the copper clad laminate | |
| JP3112128B2 (en) | Method for producing metal-coated glass epoxy substrate | |
| KR101832806B1 (en) | Copper foil having carrier, production method for copper foil having carrier, and copper clad laminate sheet and printed wiring board obtained using copper foil having carrier | |
| CN104105337A (en) | Circuit board with high-density circuits and method for manufacturing the circuit board | |
| JP2004009357A (en) | Metal vapor-deposited/metal plated laminated film and electronic part using the same | |
| KR101026061B1 (en) | Conductor having resistance layer, fabrication method thereof and printed circuit board including the same | |
| CN110089205A (en) | Printed circuit board and manufacturing methods | |
| US7451540B2 (en) | Method for fabricating a printed circuit board | |
| JP2011082848A (en) | Metal layered resin film for plane antenna | |
| KR101026000B1 (en) | Resistance layer coated conductor, fabrication method thereof and printed circuit board including the same | |
| JP2002290034A (en) | Laminated board and its manufacturing method | |
| TWI805902B (en) | Surface treated copper foil, copper clad laminate and printed circuit board | |
| KR101453490B1 (en) | Printed circuit board and method of manufacturing the same | |
| CN118019210A (en) | Metal foil, wiring board, copper-clad laminate, negative electrode material for battery, and battery |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |