CN105732923A - Preparation method of low acidic phenolic foam insulation material - Google Patents
Preparation method of low acidic phenolic foam insulation material Download PDFInfo
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- CN105732923A CN105732923A CN201410764604.3A CN201410764604A CN105732923A CN 105732923 A CN105732923 A CN 105732923A CN 201410764604 A CN201410764604 A CN 201410764604A CN 105732923 A CN105732923 A CN 105732923A
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Abstract
The invention relates to a preparation method of a low acidic phenolic foam insulation material. Phenolic resins are prepared from raw materials of phenol, paraformaldehyde, a catalyst, a modifier, an acid capture agent, and then the low acidic phenolic foam insulation material is prepared from raw materials of the prepared phenolic resins, a foaming agent, a curing agent, a filling material, and a foam stabilizer. Compared with the prior art, the preparation method of the low acidic phenolic foam insulation material reduces the curing agent dosage, reduces the acidity of the phenolic foam insulation material, thereby improving the bonding intensity between the insulation materials and walls.
Description
Technical field
The invention belongs to architecture exterior wall insulating materials field, the preparation method especially relating to a kind of low in acidity phenolic aldehyde foam thermal insulation material.
Background technology
The pH of Present Domestic phenolic resin foam insulation material is 2.0～3.0, because phenol formaldehyde foam is phenolic resin adds foaming agent and firming agent post-foaming curing molding, and firming agent used is strong acid curing dose, and acid major part all remains in foams.
The acidity of phenol formaldehyde foam is a great defect of phenolic aldehyde foam thermal insulation material: 1., in work progress, cystosepiment is to be fixed on foundation wall by crab-bolt, and in cystosepiment, metal anchorage is had corrosivity by the acid of residual.2., foundation wall and play the cement mortar etc. of cementation for sheet material and foundation wall, be all alkalescence, the acid remained in cystosepiment reacts the adhesion strength affecting between cystosepiment and body of wall.
In order to reduce phenolic aldehyde foam thermal insulation material acidity, most efficient method is exactly: 1., reduce the input amount of firming agent in foaming process, for guaranteeing the feasibility of foam process after the input amount reducing firming agent, only promote can the activity of foamed phenolic resin, thus reducing the input amount of firming agent in foaming process.2. acid agent for capturing, is added so that the residual acid in phenolic foam board slowly reacts away.
Chinese patent CN101962429A discloses foamed phenolic resin and preparation method thereof.The raw material of this modified foaming phenolic resin comprises the phenol of 100 molar fractions；The paraformaldehyde of 80-100 molar fraction；The modifying agent of 10-20 molar fraction；The catalyst of 0.5-8 molar fraction.During preparation, these raw materials are joined in reactor and stirs evenly；Stop heating after being then heated to 50-80 DEG C, be incubated 2-10 hour；The cooling of last stopped reaction obtains finished product, although adopting the intensity of phenol formaldehyde foam that this modified foaming phenolic resin prepares can meet the needs of wall heat insulation material, but the pH value in the uncontrollable resin of the method, the acidity of foam is still very strong, thus the adhesion strength that can affect between cystosepiment and body of wall.
Summary of the invention
Defect that the purpose of the present invention is contemplated to overcome above-mentioned prior art to exist and a kind of acidity reducing phenolic aldehyde foam thermal insulation material is provided and reduces the preparation method of low in acidity phenolic aldehyde foam thermal insulation material of hardener dose.
The purpose of the present invention can be achieved through the following technical solutions:
The preparation method of a kind of low in acidity phenolic aldehyde foam thermal insulation material, adopts following steps:
(1) phenolic resin synthesis
A, get the raw materials ready according to following components and weight portion content:
Phenol 1000, paraformaldehyde 660-680, catalyst 20～40, modifying agent one 40～60, modifying agent 2 50～100, acid agent for capturing 20～50,
B, putting in reactor by phenol, paraformaldehyde, catalyst, modifying agent two, temperature is raised to 60～90 DEG C, reacts 3h；
C, be cooled to 70 DEG C add modifying agent one and acid agent for capturing, continue reaction 0.5h, namely cooling discharge obtains phenolic resin；
(2) phenolic aldehyde foam thermal insulation material synthesis
A, get the raw materials ready according to following components and weight portion content:
The phenolic resin 100 for preparing, foaming agent 4～6, firming agent 5～12, filler 20～30, foam stabilizer 2；
B, in phenolic resin add foam stabilizer, filler, foaming agent, add firming agent, high-speed stirred 30～40s after stirring, pour in the mould of 70 DEG C of heated at constant temperature, after 8min, foam substantially completely solidifies, and takes out foam, namely obtains low in acidity phenolic aldehyde foam thermal insulation material.
Described paraformaldehyde is the low molecular polymer of formaldehyde, and in the initial reaction stage of step (1), first paraformaldehyde is depolymerized to low molecule formaldehyde, then with phenol reactant novolak resin.
Described catalyst is base catalyst, including sodium hydroxide, barium hydroxide, ammonia or triethylamine.
Described modifying agent one is phosphoamide,
Described modifying agent two is resorcinol or metacresol,
Described sour agent for capturing is calcium stearate or zinc stearate.
Phenol, paraformaldehyde, catalyst, modifying agent two in a kettle., react 1h in 60 DEG C, are then warmed up to 90 DEG C of reaction 2h.
Described foaming agent is pentane,
Described firming agent is phenolsulfonic acid, p-methyl benzenesulfonic acid or benzenesulfonic acid,
Described foam stabilizer is Tween 80 or silicone oil,
Described filler is aluminium hydroxide or the magnesium hydroxide of granularity >=1200 order.
Compared with prior art, due to the fact that resorcinol, the addition of metacresol, substantially increase the activity of phenolic resin, thus accelerating the curing rate of phenolic resin, under same foaming process conditions, the consumption of firming agent is greatly lowered, when making to foam than phenolic resin when foaming, the consumption of firming agent declines 60%, after the Foaming of phenolic resin of synthesis, the pH of foam rises to more than 4.5 from 2.0～3.0, in addition, the filler added in the sour agent for capturing added in resin and foaming process occurs in slowly and reaction with the acid of residual in foams, thus the content of acid in reducing foams, it is prepared between insulation material and the body of wall obtained and there is good adhesion strength.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail.
Embodiment 1
The preparation method of a kind of low in acidity phenolic aldehyde foam thermal insulation material, adopts following steps:
(1) phenolic resin synthesis
A, get the raw materials ready according to following components and weight portion content:
Phenol 1000, paraformaldehyde: 660, catalyst sodium hydroxide 20, modifying agent phosphoamide 40, modifying agent resorcinol 50, acid agent for capturing calcium stearate 20,
B, phenol, paraformaldehyde, catalyst, modifying agent resorcinol are put in reactor, reacting 1h in 60 DEG C, be then warmed up to 90 DEG C of reaction 2h, paraformaldehyde is the low molecular polymer of formaldehyde, first be depolymerized to low molecule formaldehyde in initial reaction stage, then with phenol reactant novolak resin；
C, be cooled to 70 DEG C add modifying agent phosphoamides and acid agent for capturing, continue reaction 0.5h, namely cooling discharge obtains phenolic resin；
(2) phenolic aldehyde foam thermal insulation material synthesis
A, get the raw materials ready according to following components and weight portion content:
The phenolic resin 100 for preparing, pentane foaming agent 4, firming agent phenolsulfonic acid 5, granularity >=1200 order aluminium hydroxide as filler 20, Tween 80 as foam stabilizer 2；
B, in phenolic resin add foam stabilizer, filler, foaming agent, add firming agent, high-speed stirred 30s after stirring, pour in the mould of 70 DEG C of heated at constant temperature, after 8min, foam substantially completely solidifies, and takes out foam, namely obtains low in acidity phenolic aldehyde foam thermal insulation material.
Embodiment 2
The preparation method of a kind of low in acidity phenolic aldehyde foam thermal insulation material, adopts following steps:
(1) phenolic resin synthesis
A, get the raw materials ready according to following components and weight portion content:
Phenol 1000, paraformaldehyde 670, catalyst barium hydroxide 30, modifying agent phosphoamide 50, modifying agent metacresol 80, acid agent for capturing zinc stearate 30,
B, phenol, paraformaldehyde, catalyst, modifying agent metacresol are put in reactor, reacting 1h in 60 DEG C, be then warmed up to 90 DEG C of reaction 2h, paraformaldehyde is the low molecular polymer of formaldehyde, first be depolymerized to low molecule formaldehyde in initial reaction stage, then with phenol reactant novolak resin；
C, be cooled to 70 DEG C add modifying agent phosphoamides and acid agent for capturing, continue reaction 0.5h, namely cooling discharge obtains phenolic resin；
(2) phenolic aldehyde foam thermal insulation material synthesis
A, get the raw materials ready according to following components and weight portion content:
The phenolic resin 100 for preparing, pentane foaming agent 5, firming agent phenolsulfonic acid 6, granularity >=1200 order aluminium hydroxide as filler 25, Tween 80 as foam stabilizer 2；
B, in phenolic resin add foam stabilizer, filler, foaming agent, add firming agent, high-speed stirred 30s after stirring, pour in the mould of 70 DEG C of heated at constant temperature, after 8min, foam substantially completely solidifies, and takes out foam, namely obtains low in acidity phenolic aldehyde foam thermal insulation material.
Embodiment 3
The preparation method of a kind of low in acidity phenolic aldehyde foam thermal insulation material, adopts following steps:
(1) phenolic resin synthesis
A, get the raw materials ready according to following components and weight portion content:
Phenol 1000, paraformaldehyde 680, ammonia-catalyzed agent 40, modifying agent phosphoamide 60, modifying agent resorcinol 100, acid agent for capturing zinc stearate 50,
B, phenol, paraformaldehyde, catalyst, modifying agent resorcinol are put in reactor, reacting 1h in 60 DEG C, be then warmed up to 90 DEG C of reaction 2h, paraformaldehyde is the low molecular polymer of formaldehyde, first be depolymerized to low molecule formaldehyde in initial reaction stage, then with phenol reactant novolak resin；
C, be cooled to 70 DEG C add modifying agent phosphoamides and acid agent for capturing, continue reaction 0.5h, namely cooling discharge obtains phenolic resin；
(2) phenolic aldehyde foam thermal insulation material synthesis
A, get the raw materials ready according to following components and weight portion content:
The phenolic resin 100 for preparing, pentane foaming agent 6, firming agent p-methyl benzenesulfonic acid 12, granularity >=1200 order magnesium hydroxide as filler 30, silicone oil foam stabilizer 2；
B, in phenolic resin add foam stabilizer, filler, foaming agent, add firming agent, high-speed stirred 40s after stirring, pour in the mould of 70 DEG C of heated at constant temperature, after 8min, foam substantially completely solidifies, and takes out foam, namely obtains low in acidity phenolic aldehyde foam thermal insulation material.
Phenolic foam board pH method of testing:
Take phenolic foam board some, cross 60 mesh sieve after grinding, weigh the phenol formaldehyde foam powder 2g after sieving and put into (pH value of distilled water is 7.0) in 100 grams of distilled water, by powder filter after stirring 24 hours at 20 DEG C, with the pH value of pH meter filtrates tested.Embodiment 1 detects the pH=4.6 of phenol formaldehyde foam；Embodiment 2 detects the pH=4.5 of phenol formaldehyde foam；Embodiment 3 detects the pH=4.5 of phenol formaldehyde foam.
The application adds resorcinol and metacresol as modifying agent in building-up process, it is possible to increase substantially the activity of phenolic resin, accelerates the curing rate of resin, thus can reduce the addition of firming agent in foaming process.The filler added in the sour agent for capturing added in resin synthesis process and foaming process, the acid can decomposed and remain in foams reacts, thus reducing the acidity of phenolic aldehyde foam thermal insulation material.
The insulation material prepared in embodiment 1-3 being applied to the metope of exterior wall, the phenolic foam board prepared in embodiment is carried out the adhesion strength detection between foam board and metope in indoor ageing after 7 days, step is as follows:
By the regulation of chapter 6 in GB/T17671-1999, with Portland cement and medium sand by 1: 3 (weight ratio), the ratio of mud 0.5 makes cement bonded sand lumps, after maintenance 28 days, standby.
Phenol formaldehyde foam after ageing is cut into the sample of 40mm*40mm*20mm, standby.
The phenolic foam board cut one side (40mm*40mm) is spread interfacial agents and (is mainly composed of acrylate glue, about 1.0mm is thick), smear one layer of adhesive mortar (about 3～5mm is thick) after drying 0.5hr again, after being then adhered to cement bonded sand lumps, deposit 48hr.
Bond on the steel fixture stretched immediately after the another side of the phenolic foam block bondd is smeared last layer glue (epoxy glue or acrylic acid glue), deposit 24hr, to be measured.
After depositing 24hr, the hot strength of test sample.Bonding pull strength analyzer used, model: IMLB-A, Ying Beier (Tianjin) measurement and control instrument equipment Co., Ltd.
By said method, it is 0.12MPa, 0.12MPa, 0.13MPa that detection obtains preparing in embodiment 1-3 the adhesion strength of product.
Claims (6)
1. the preparation method of a low in acidity phenolic aldehyde foam thermal insulation material, it is characterised in that the method adopts following steps:
(1) phenolic resin synthesis
A, get the raw materials ready according to following components and weight portion content:
Phenol 1000, paraformaldehyde 660-680, catalyst 20～40, modifying agent one 40～60, modifying agent 2 50～100, acid agent for capturing 20～50,
B, putting in reactor by phenol, paraformaldehyde, catalyst, modifying agent two, temperature is raised to 60～90 DEG C, reacts 3h；
C, be cooled to 70 DEG C add modifying agent one and acid agent for capturing, continue reaction 0.5h, namely cooling discharge obtains phenolic resin；
(2) phenolic aldehyde foam thermal insulation material synthesis
A, get the raw materials ready according to following components and weight portion content:
The phenolic resin 100 for preparing, foaming agent 4～6, firming agent 5～12, filler 20～30, foam stabilizer 2；
B, in phenolic resin add foam stabilizer, filler, foaming agent, add firming agent, high-speed stirred 30～40s after stirring, pour in the mould of 70 DEG C of heated at constant temperature, after 8min, foam substantially completely solidifies, and takes out foam, namely obtains low in acidity phenolic aldehyde foam thermal insulation material.
2. the preparation method of a kind of low in acidity phenolic aldehyde foam thermal insulation material according to claim 1, it is characterized in that, described paraformaldehyde is the low molecular polymer of formaldehyde, initial reaction stage in step (1), first paraformaldehyde is depolymerized to low molecule formaldehyde, then with phenol reactant novolak resin.
3. the preparation method of a kind of low in acidity phenolic aldehyde foam thermal insulation material according to claim 1, it is characterised in that
Described catalyst is base catalyst, including sodium hydroxide, barium hydroxide, ammonia or triethylamine.
Described modifying agent one is phosphoamide,
Described modifying agent two is resorcinol or metacresol,
Described sour agent for capturing is calcium stearate or zinc stearate.
4. the preparation method of a kind of low in acidity phenolic aldehyde foam thermal insulation material according to claim 1, it is characterised in that phenol, paraformaldehyde, catalyst, modifying agent two in a kettle., react 1h in 60 DEG C, is then warmed up to 90 DEG C of reaction 2h.
5. the preparation method of a kind of low in acidity phenolic aldehyde foam thermal insulation material according to claim 1, it is characterised in that
Described foaming agent is pentane,
Described firming agent is phenolsulfonic acid, p-methyl benzenesulfonic acid or benzenesulfonic acid,
Described foam stabilizer is Tween 80 or silicone oil,
Described filler is aluminium hydroxide or magnesium hydroxide.
6. the preparation method of a kind of low in acidity phenolic aldehyde foam thermal insulation material according to claim 5, it is characterised in that granularity >=1200 order of described filler.
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| CN201410764604.3A CN105732923B (en) | 2014-12-11 | 2014-12-11 | A kind of preparation method of low in acidity phenolic aldehyde foam thermal insulation material |
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| CN201410764604.3A CN105732923B (en) | 2014-12-11 | 2014-12-11 | A kind of preparation method of low in acidity phenolic aldehyde foam thermal insulation material |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106632929A (en) * | 2016-09-21 | 2017-05-10 | 沈阳化工大学 | Preparation method of valoneaic acid dilactone copolymerization phenol-formaldehyde foaming resin |
| CN106977762A (en) * | 2017-03-31 | 2017-07-25 | 济南大学 | A kind of method of production of low-density and high-strength phenol formaldehyde foam |
| CN107719977A (en) * | 2017-09-28 | 2018-02-23 | 句容市武杭传动机械制造有限公司 | A kind of moisture proof foam packaging box and preparation method thereof |
| CN107777038A (en) * | 2017-09-28 | 2018-03-09 | 句容市武杭传动机械制造有限公司 | One kind anti-fracture foam packaging box and its manufacture method |
| CN110551471A (en) * | 2019-08-12 | 2019-12-10 | 杭州厚瑞科技有限公司 | Industrial glue curing method |
| CN111825817A (en) * | 2020-07-22 | 2020-10-27 | 苏州兴业材料科技南通有限公司 | Preparation method of high-activity foaming phenolic resin and neutral phenolic foam |
| CN112940207A (en) * | 2021-04-17 | 2021-06-11 | 肖海风 | Phenolic plastic foam and production process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101962429A (en) * | 2009-07-24 | 2011-02-02 | 苏州美克思科技发展有限公司 | Modified foaming phenolic resin and manufacturing method thereof |
| CN102504153A (en) * | 2011-11-09 | 2012-06-20 | 长春工业大学 | Method for preparing foaming phenolic formaldehyde resin |
| CN102633968A (en) * | 2012-05-04 | 2012-08-15 | 天津市宁聚科技发展有限公司 | Resorcinol modified phenolic foam preparation technology |
| CN103146015A (en) * | 2013-03-15 | 2013-06-12 | 中国科学院化学研究所 | Low-acidity phenolic foam and preparation method thereof |
| CN103194003A (en) * | 2013-04-02 | 2013-07-10 | 中国科学院化学研究所 | Low-acidity phenolic foam and preparation method thereof |
-
2014
- 2014-12-11 CN CN201410764604.3A patent/CN105732923B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101962429A (en) * | 2009-07-24 | 2011-02-02 | 苏州美克思科技发展有限公司 | Modified foaming phenolic resin and manufacturing method thereof |
| CN102504153A (en) * | 2011-11-09 | 2012-06-20 | 长春工业大学 | Method for preparing foaming phenolic formaldehyde resin |
| CN102633968A (en) * | 2012-05-04 | 2012-08-15 | 天津市宁聚科技发展有限公司 | Resorcinol modified phenolic foam preparation technology |
| CN103146015A (en) * | 2013-03-15 | 2013-06-12 | 中国科学院化学研究所 | Low-acidity phenolic foam and preparation method thereof |
| CN103194003A (en) * | 2013-04-02 | 2013-07-10 | 中国科学院化学研究所 | Low-acidity phenolic foam and preparation method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106632929A (en) * | 2016-09-21 | 2017-05-10 | 沈阳化工大学 | Preparation method of valoneaic acid dilactone copolymerization phenol-formaldehyde foaming resin |
| CN106977762A (en) * | 2017-03-31 | 2017-07-25 | 济南大学 | A kind of method of production of low-density and high-strength phenol formaldehyde foam |
| CN107719977A (en) * | 2017-09-28 | 2018-02-23 | 句容市武杭传动机械制造有限公司 | A kind of moisture proof foam packaging box and preparation method thereof |
| CN107777038A (en) * | 2017-09-28 | 2018-03-09 | 句容市武杭传动机械制造有限公司 | One kind anti-fracture foam packaging box and its manufacture method |
| CN110551471A (en) * | 2019-08-12 | 2019-12-10 | 杭州厚瑞科技有限公司 | Industrial glue curing method |
| CN111825817A (en) * | 2020-07-22 | 2020-10-27 | 苏州兴业材料科技南通有限公司 | Preparation method of high-activity foaming phenolic resin and neutral phenolic foam |
| CN111825817B (en) * | 2020-07-22 | 2023-11-03 | 苏州兴业材料科技南通有限公司 | Preparation method of high-activity foaming phenolic resin and neutral phenolic foam |
| CN112940207A (en) * | 2021-04-17 | 2021-06-11 | 肖海风 | Phenolic plastic foam and production process thereof |
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| CN105732923B (en) | 2018-05-25 |
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Effective date of registration: 20200323 Address after: 215000 No.50, Weihe Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee after: Suzhou Meikesi New Energy Technology Co., Ltd Address before: 215121, No. 50, Ho sum Road, Suzhou Industrial Park, Jiangsu, Suzhou, China Patentee before: SUZHOU MAX TECHNOLOGY DEVELOPMENT Co.,Ltd. |
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