CN105722254A - Photo-curable resistance paste for flexible electrothermal film and preparation method of photo-curable resistance paste - Google Patents
Photo-curable resistance paste for flexible electrothermal film and preparation method of photo-curable resistance paste Download PDFInfo
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- CN105722254A CN105722254A CN201610099552.1A CN201610099552A CN105722254A CN 105722254 A CN105722254 A CN 105722254A CN 201610099552 A CN201610099552 A CN 201610099552A CN 105722254 A CN105722254 A CN 105722254A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 113
- 239000011230 binding agent Substances 0.000 claims abstract description 33
- 239000007790 solid phase Substances 0.000 claims abstract description 33
- 239000000178 monomer Substances 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000002270 dispersing agent Substances 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims description 68
- 239000002002 slurry Substances 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 42
- 239000012528 membrane Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 20
- 239000013530 defoamer Substances 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 16
- -1 light trigger Substances 0.000 claims description 12
- 239000006185 dispersion Substances 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 8
- 229920000178 Acrylic resin Polymers 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical group C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 229940008099 dimethicone Drugs 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 4
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 3
- 229940106691 bisphenol a Drugs 0.000 claims description 3
- 239000004258 Ethoxyquin Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- APZPSKFMSWZPKL-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(CO)CO APZPSKFMSWZPKL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052681 coesite Inorganic materials 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- 229910052906 cristobalite Inorganic materials 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- DECIPOUIJURFOJ-UHFFFAOYSA-N ethoxyquin Chemical compound N1C(C)(C)C=C(C)C2=CC(OCC)=CC=C21 DECIPOUIJURFOJ-UHFFFAOYSA-N 0.000 claims description 2
- 229940093500 ethoxyquin Drugs 0.000 claims description 2
- 235000019285 ethoxyquin Nutrition 0.000 claims description 2
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910052682 stishovite Inorganic materials 0.000 claims description 2
- 229910052905 tridymite Inorganic materials 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 claims 2
- ZLXYJUZXHDRQMJ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol prop-1-ene Chemical group C=CC.C=CC.C=CC.C(O)C(CC)(CO)CO ZLXYJUZXHDRQMJ-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 125000002252 acyl group Chemical group 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 239000002518 antifoaming agent Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000000470 constituent Substances 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 5
- 238000005485 electric heating Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical class [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- ZAUUZASCMSWKGX-UHFFFAOYSA-N manganese nickel Chemical compound [Mn].[Ni] ZAUUZASCMSWKGX-UHFFFAOYSA-N 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002528 anti-freeze Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007613 slurry method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000010512 thermal transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses photo-curable resistance paste for a flexible electrothermal film and a preparation method of the photo-curable resistance paste. The resistance paste comprises the following constituents by weight: 40-80% of solid phase and 20-60% of organic binding agent, wherein the solid phase comprises 80-100% of silver powder and 0-20% of oxide by weight, the silver powder comprises 30-90% of sheet-shaped silver powder and 10-70% of linear silver powder by weight, the organic binding agent comprises 65-90% of photo-curable resin, 5-30% of photo active monomer, 0.5-5% of photo initiator, 0.1-1% of defoaming agent and 0.5-2% of dispersing agent by weight. By the resistance paste, photo-curable formation can be adopted, the resistance adjustment range can be expanded, and the effect of building a conductive path in the sheet-shaped silver powder by the linear silver powder can be fully utilized. The preparation method comprises the three steps of solid phase preparation, organic binding agent preparation and resistance paste preparation, and can be used for effectively producing the photo-curable resistance paste for the flexible electrothermal film.
Description
Technical field
The present invention relates to technical field of electronic materials, particularly relate to a kind of flexible electrothermal membrane light-cured type resistance slurry and
Its preparation method.
Background technology
Flexible electrothermal membrane belongs to a kind of low-temperature heating new material in heated by electrothermal film technology, and its likeness in form paper tape and softness are light
Thin, there is higher hot strength, folding resistance good (10,000 times), and in planar heating, the thermal efficiency is high, applied voltage wide ranges
(2.4-380 volt), watt level can set on demand, any cutting forming, and the energy conversion being easily achieved under low-voltage.
Based on These characteristics, flexible electrothermal membrane has a wide range of applications at domestic and industrial aspect；For domestic aspect, flexible electrical
Hotting mask is usually used in safety electric heating wearing article, electric heating articles for use, direct-heating bathing device, electric kettle etc.；For industrial aspect
For, flexible electrothermal membrane is usually used in information terminal large screen display, cockpit light guide plate, de-electrifying lamp for automatic copier, oil pipeline
Heat preservation, electric heating, the antifreeze frost etc. of equipment；According to the range of application of flexible electrothermal membrane, flexible electrothermal membrane has higher
Researching value.
Resistant heat generating layer is as one of flexible electrothermal membrane core component, and on the one hand electric energy is turned by it as energy conversion unit
Chemical conversion heat energy, is on the other hand transferred to base material as energy transport vehicle by heat energy, in order to realize the uniform biography of planar heat producing body
Heat；Therefore, resistant heat generating layer plays extremely important effect to the performance of flexible electrothermal membrane combination property.
Need to be explained further, noble metal and rare earth element have good electric heating and convert and capacity of heat transmission, generally with electricity
Sub-slurry form and be applied in Electric radiant Heating Film, such as Patent No.: 201010158934.X, entitled: based on stainless steel substrate
The Chinese invention patent of YBCO thick-film resistor paste and preparation method thereof and Patent No. 200610036715.8, title
For: rare earth thick film circuit rare earth base metal resistor slurry based on metal basal board and the Chinese invention patent of preparation technology thereof,
Resistance slurry disclosed in above-mentioned two Chinese invention patent is all that metal powder is prepared as electric slurry, then passes through screen printing
System and high temperature sintering form resistant heat generating layer, and sintering temperature is generally more than 500 DEG C, but the highest bearing temperature of flexible parent metal
About 400 DEG C, this to a certain degree on limit sintering process application on flexible parent metal；Therefore, seeking gentle curing process is
The Basic Ways that in flexible electrothermal membrane prepared by resistant heat generating layer.
It should further be noted that Application No.: 201510183663.6, entitled: the manufacture method of a kind of flexible electrothermal membrane
Chinese invention patent, it discloses resistant heat generating layer preparation relate to magnetron sputtering plating, pad pasting, expose, the process such as etching, have
Effect avoid high-sintering process, during additionally use ferrum nickel manganese evanohm replace noble metal, this reduces to a certain extent
Material cost, but also bring some new problems: 1, ferrum nickel manganese evanohm replacement noble metal reduces electrothermal layer stability and electricity
Thermal transition ability；2, to prepare link more for electrothermal layer, adds somewhat to the complexity of technique；3, etching can produce in a large number
Waste liquid, is unfavorable for environmental protection.Therefore seek that a kind of technique is simple, the development to flexible electrothermal membrane of the low-temperature setting technique of energy-conserving and environment-protective
Significant.
Summary of the invention
Present invention aims to the deficiencies in the prior art and a kind of flexible electrothermal membrane light-cured type resistance is provided
Slurry, this flexible electrothermal membrane light-cured type resistance slurry has the advantage that 1, can use ultraviolet curing process molding, molding
Energy saving technology, environmental protection, low cost, process is simple and is prone to large-scale production；2, mixing argentum powder is used to mix the solid of oxide again
Powder, as function phase, has effectively widened resistance adjustment scope, it is provided that more resistive arrangement selects；3, flake silver powder and wire
Being used in mixed way of argentum powder, can make full use of wire argentum powder and set up the effect of conductive path between flake silver powder, it is achieved less argentum powder
The possibility of more conductive path, same electric conductivity is provided to use less argentum powder, thus effectively reduce resistance slurry
Cost of material.
Another object of the present invention is to provide the preparation method of a kind of flexible electrothermal membrane light-cured type resistance slurry, should
Preparation method operatively production can prepare flexible electrothermal membrane light-cured type resistance slurry.
For reaching above-mentioned purpose, the present invention is achieved through the following technical solutions.
A kind of flexible electrothermal membrane light-cured type resistance slurry, includes the material of following weight portion, particularly as follows:
Solid phase 40%-80%
Organic binder bond 20%-60%；
Wherein, solid phase includes the material of following weight portion, particularly as follows:
Argentum powder 80%-100%
Oxide 0%-20%；
Argentum powder is mixed by flake silver powder, wire argentum powder, and flake silver powder, the weight portion of two kinds of materials of wire argentum powder are followed successively by:
30%-90%、10%-70%；
Organic binder bond includes the material of following weight portion, particularly as follows:
Light-cured resin 65%-90%
Photoactive monomer 5%-30%
Light trigger 0.5%-5%
Defoamer 0.1%-1%
Dispersant 0.5%-2%.
Wherein, the median particle diameter of described argentum powder is 1 μm-2 μm.
Wherein, described oxide is SnO2、SiO2、TiO2、Al2O3In one or more mixture formed.
Wherein, the median particle diameter of described oxide is 1 μm-2 μm.
Wherein, described light-cured resin is o-cresol formaldehyde epoxy acrylic resin, bisphenol-A epoxy acrylic resin, polyamides
One or more mixture formed in imine modified epoxy acrylic resin.
Wherein, described photoactive monomer is double pentaerythritol methacrylate, ethoxyquin trimethylolpropane tris acrylic acid
One or more mixture formed in ester, trimethylolpropane trimethacrylate.
Wherein, described light trigger is 2-isopropyl thioxanthone, 2-methyl isophthalic acid-(4-methyl mercapto phenyl)-2-morpholine-1-
One or more mixture formed in acetone, 2,4,6-trimethylbenzoy-dipheny phosphine oxides.
Wherein, described defoamer is dimethicone.
Wherein, described dispersant is BYK-AT204.
The preparation method of a kind of flexible electrothermal membrane light-cured type resistance slurry, includes following processing step, particularly as follows:
Prepared by a, solid phase: flake silver powder uniformly mixes to prepare combined silver powder, the sheet in combined silver powder with wire argentum powder
Shape argentum powder, the weight portion of wire argentum powder are followed successively by 30%-90%, 10%-70%, after prepared by argentum powder material to be mixed, toward combined silver
Adding oxide in powder, combined silver powder, the weight portion of two kinds of materials of oxide are followed successively by 80%-100%, 0%-20%, mixing
The mixture that argentum powder material and oxide are formed is ground, to obtain solid phase；
Prepared by b, organic binder bond: light-cured resin, photoactive monomer, light trigger, defoamer, dispersant are placed in container
Mixing and stirring, to obtain organic binder bond, wherein, light-cured resin, photoactive monomer, light trigger, defoamer, dispersion
The weight portion of five kinds of materials of agent is followed successively by 65%-90%, 5%-30%, 0.5%-5%, 0.1%-1%, 0.5%-2%；
Prepared by c, resistance slurry: carry out three-roll rolling, solid phase, organic binder bond two after solid phase, organic binder bond mixing dispersion
The weight portion planting material is followed successively by 40%-80%, 20%-60%, obtains resistance slurry after rolling.
The invention have the benefit that a kind of flexible electrothermal membrane light-cured type resistance slurry of the present invention, its bag
Include the material of following weight portion: solid phase 40%-80%, organic binder bond 20%-60%；Wherein, solid phase includes following weight portion
Material: argentum powder 80%-100%, oxide 0%-20%；Argentum powder is mixed by flake silver powder, wire argentum powder, flake silver powder, wire
The weight portion of two kinds of materials of argentum powder is followed successively by: 30%-90%, 10%-70%；Organic binder bond includes the material of following weight portion:
Light-cured resin 65%-90%, photoactive monomer 5%-30%, light trigger 0.5%-5%, defoamer 0.1%-1%, dispersant 0.5%-
2%.By above-mentioned material proportion, the flexible electrothermal membrane light-cured type resistance slurry of the present invention has the advantage that 1, can adopt
Using ultraviolet curing process molding, moulding process energy-saving and environmental protection, low cost, process is simple and is prone to large-scale production；2, mixing is used
Argentum powder is mixed the solid powder again of oxide and, as function phase, has effectively been widened resistance adjustment scope, it is provided that more resistive arrangement
Select；3, being used in mixed way of flake silver powder and wire argentum powder, can making full use of wire argentum powder, to set up conduction between flake silver powder logical
The effect on road, it is achieved less argentum powder provides the possibility of more conductive paths, same electric conductivity to use less argentum powder, thus
Effectively reduce the cost of material of resistance slurry.
Another of the present invention has the beneficial effect that a kind of flexible electrothermal membrane light-cured type resistance slurry of the present invention
Preparation method, it comprises the following steps that: prepared by a, solid phase: uniformly mix to prepare mixing with wire argentum powder by flake silver powder
Argentum powder material, the flake silver powder in combined silver powder, the weight portion of wire argentum powder are followed successively by 30%-90%, 10%-70%, silver to be mixed
After prepared by powder, in combined silver powder add oxide, combined silver powder, two kinds of materials of oxide weight portion successively
For 80%-100%, 0%-20%, the mixture that combined silver powder and oxide are formed is ground, to obtain solid phase；B, organic
Prepared by binding agent: by light-cured resin, photoactive monomer, light trigger, defoamer, that dispersant is placed in mix and blend in container is equal
Even, to obtain organic binder bond, wherein, light-cured resin, photoactive monomer, light trigger, defoamer, five kinds of materials of dispersant
Weight portion be followed successively by 65%-90%, 5%-30%, 0.5%-5%, 0.1%-1%, 0.5%-2%；Prepared by c, resistance slurry: by solid phase, have
Machine binding agent mixing dispersion after carry out three-roll rolling, solid phase, the weight portion of two kinds of materials of organic binder bond be followed successively by 40%-80%,
20%-60%, obtains resistance slurry after rolling.This preparation method production can prepare flexible electrothermal membrane light-cured type electricity effectively
Resistance paste.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention will be described.
Embodiment one, a kind of flexible electrothermal membrane light-cured type resistance slurry, include the material of following weight, specifically
For:
Solid phase 75g
Organic binder bond 25g；
Wherein, solid phase is mixed by argentum powder, oxide, wherein, containing flake silver powder 70g in 100g solid phase, and wire argentum powder
25g, stannum oxide 5g；
Organic binder bond is formed by light-cured resin, photoactive monomer, light trigger, defoamer, dispersant, wherein,
Containing (light-cured resin) bisphenol-A epoxy acrylic resin 70g, (photoactive monomer) Bis(pentaerythritol) in 100g organic binder bond
Six acrylate 25.5g, (light trigger) 2-isopropyl thioxanthone 3g, (defoamer) dimethicone 0.5g, (dispersant)
BYK-AT204 1g。
For the flexible electrothermal membrane light-cured type resistance slurry of the present embodiment one, the present embodiment one can use following soft
The preparation method of property Electric radiant Heating Film light-cured type resistance slurry is prepared, concrete:
A kind of preparation method of flexible electrothermal membrane light-cured type resistance slurry, it includes following processing step, particularly as follows:
Prepared by a, solid phase: flake silver powder uniformly mixes to prepare combined silver powder, the sheet in combined silver powder with wire argentum powder
Shape argentum powder, the weight of wire argentum powder are followed successively by 70g, 25g, after prepared by argentum powder material to be mixed, add in combined silver powder
Oxide, combined silver powder, the weight of two kinds of materials of oxide are followed successively by what 95g, 5g, combined silver powder and oxide were formed
Mixture is ground, to obtain solid phase；
Prepared by b, organic binder bond: light-cured resin, photoactive monomer, light trigger, defoamer, dispersant are placed in container
Mixing and stirring, to obtain organic binder bond, wherein, light-cured resin, photoactive monomer, light trigger, defoamer, dispersion
The weight of five kinds of materials of agent is followed successively by 70g, 25.5g, 3g, 0.5g, 1g；
Prepared by c, resistance slurry: carry out three-roll rolling after 75g solid phase, the mixing dispersion of 25g organic binder bond, obtain electricity after rolling
Resistance paste, the viscosity 120Pas-180 Pas of resistance slurry, fineness < 8 μm.
The flexible electrothermal membrane light-cured type resistance slurry prepared by above-mentioned formula and processing step is had the following advantages,
Particularly as follows: 1, can use ultraviolet curing process molding, moulding process energy-saving and environmental protection, low cost, process is simple and is prone to scale
Produce；2, the solid powder again using mixing argentum powder to mix oxide, as function phase, has effectively widened resistance adjustment scope, it is provided that
More resistive arrangement selects；3, being used in mixed way of flake silver powder and wire argentum powder, can make full use of wire argentum powder at lamellar silver
The effect of conductive path is set up, it is achieved less argentum powder provides the possibility of more conductive paths, same electric conductivity to use between powder
Less argentum powder, thus effectively reduce the cost of material of resistance slurry.
Embodiment two, a kind of flexible electrothermal membrane light-cured type resistance slurry, include the material of following weight, particularly as follows:
Solid phase 65g
Organic binder bond 35g；
Wherein, solid phase is mixed by argentum powder, oxide, wherein, containing aluminium oxide 5g in 100g solid phase, and flake silver powder 80g, line
Shape argentum powder 15g；
Organic binder bond is formed by light-cured resin, photoactive monomer, light trigger, defoamer, dispersant, wherein,
Containing (light-cured resin) polyimide modified epoxy acrylic resin 80g, (photoactive monomer) ethoxy in 100g organic binder bond
Change trimethylolpropane trimethacrylate 15.5g, (light trigger) 2-isopropyl thioxanthone 3g, (defoamer) dimethicone
0.5g, (dispersant) BYK-AT204 1g.
For the flexible electrothermal membrane light-cured type resistance slurry of the present embodiment two, the present embodiment two can use following soft
The preparation method of property Electric radiant Heating Film light-cured type resistance slurry is prepared, concrete:
A kind of preparation method of flexible electrothermal membrane light-cured type resistance slurry, it includes following processing step, particularly as follows:
Prepared by a, solid phase: flake silver powder uniformly mixes to prepare combined silver powder, the sheet in combined silver powder with wire argentum powder
Shape argentum powder, the weight of wire argentum powder are followed successively by 80g, 15g, after prepared by argentum powder material to be mixed, add in combined silver powder
Oxide, combined silver powder, the weight of two kinds of materials of oxide are followed successively by what 95g, 5g, combined silver powder and oxide were formed
Mixture is ground, to obtain solid phase；
Prepared by b, organic binder bond: light-cured resin, photoactive monomer, light trigger, defoamer, dispersant are placed in container
Mixing and stirring, to obtain organic binder bond, wherein, light-cured resin, photoactive monomer, light trigger, defoamer, dispersion
The weight of five kinds of materials of agent is followed successively by 80g, 15.5g, 3g, 0.5g, 1g；
Prepared by c, resistance slurry: carry out three-roll rolling after 65g solid phase, the mixing dispersion of 35g organic binder bond, obtain electricity after rolling
Resistance paste, the viscosity 120Pas-180 Pas of resistance slurry, fineness < 8 μm.
The flexible electrothermal membrane light-cured type resistance slurry prepared by above-mentioned formula and processing step is had the following advantages,
Particularly as follows: 1, can use ultraviolet curing process molding, moulding process energy-saving and environmental protection, low cost, process is simple and is prone to scale
Produce；2, the solid powder again using mixing argentum powder to mix oxide, as function phase, has effectively widened resistance adjustment scope, it is provided that
More resistive arrangement selects；3, being used in mixed way of flake silver powder and wire argentum powder, can make full use of wire argentum powder at lamellar silver
The effect of conductive path is set up, it is achieved less argentum powder provides the possibility of more conductive paths, same electric conductivity to use between powder
Less argentum powder, thus effectively reduce the cost of material of resistance slurry.
Above content is only presently preferred embodiments of the present invention, for those of ordinary skill in the art, according to the present invention's
Thought, the most all will change, and this specification content should not be construed as the present invention
Restriction.
Claims (8)
1. a flexible electrothermal membrane light-cured type resistance slurry, it is characterised in that include the material of following weight portion, specifically
For:
Solid phase 40%-80%
Organic binder bond 20%-60%；
Wherein, solid phase includes the material of following weight portion, particularly as follows:
Argentum powder 80%-100%
Oxide 0%-20%；
Argentum powder is mixed by flake silver powder, wire argentum powder, and median particle diameter is 1 μm-2 μm, flake silver powder, two kinds of things of wire argentum powder
The weight portion of material is followed successively by: 30%-90%, 10%-70%；
Organic binder bond includes the material of following weight portion, particularly as follows:
Light-cured resin 65%-90%
Photoactive monomer 5%-30%
Light trigger 0.5%-5%
Defoamer 0.1%-1%
Dispersant 0.5%-2%.
A kind of flexible electrothermal membrane light-cured type resistance slurry the most according to claim 1, it is characterised in that: described oxidation
Thing is SnO2、SiO2、TiO2、Al2O3In one or more mixture formed, oxide median particle diameter is 1 μm-2 μm.
A kind of flexible electrothermal membrane light-cured type resistance slurry the most according to claim 1, it is characterised in that: described light is solid
Changing resin is o-cresol formaldehyde epoxy acrylic resin, bisphenol-A epoxy acrylic resin, polyimide modified epoxy acrylic resin
In one or more mixture formed.
A kind of flexible electrothermal membrane light-cured type resistance slurry the most according to claim 1, it is characterised in that: described light is lived
Property monomer is double pentaerythritol methacrylate, ethoxyquin trimethylolpropane trimethacrylate, trimethylolpropane tris propylene
One or more mixture formed in acid esters.
A kind of flexible electrothermal membrane light-cured type resistance slurry the most according to claim 1, it is characterised in that: described light draws
Sending out agent is 2-isopropyl thioxanthone, 2-methyl isophthalic acid-(4-methyl mercapto phenyl)-2-morpholine-1-acetone, 2,4,6-trimethylbenzene first
One or more mixture formed in acyl group-diphenyl phosphine oxide.
A kind of flexible electrothermal membrane light-cured type resistance slurry the most according to claim 1, it is characterised in that: described froth breaking
Agent is dimethicone.
A kind of flexible electrothermal membrane light-cured type resistance slurry the most according to claim 1, it is characterised in that: described dispersion
Agent is BYK-AT204.
8. the flexible electrothermal membrane preparation method of light-cured type resistance slurry, it is characterised in that include following technique step
Suddenly, particularly as follows:
Prepared by a, solid phase: flake silver powder uniformly mixes to prepare combined silver powder, the sheet in combined silver powder with wire argentum powder
Shape argentum powder, the weight portion of wire argentum powder are followed successively by 30%-90%, 10%-70%, after prepared by argentum powder material to be mixed, toward combined silver
Adding oxide in powder, combined silver powder, the weight portion of two kinds of materials of oxide are followed successively by 80%-100%, 0%-20%, mixing
The mixture that argentum powder material and oxide are formed is ground, to obtain solid phase；
Prepared by b, organic binder bond: light-cured resin, photoactive monomer, light trigger, defoamer, dispersant are placed in container
Mixing and stirring, to obtain organic binder bond, wherein, light-cured resin, photoactive monomer, light trigger, defoamer, dispersion
The weight portion of five kinds of materials of agent is followed successively by 65%-90%, 5%-30%, 0.5%-5%, 0.1%-1%, 0.5%-2%；
Prepared by c, resistance slurry: carry out three-roll rolling, solid phase, organic binder bond two after solid phase, organic binder bond mixing dispersion
The weight portion planting material is followed successively by 40%-80%, 20%-60%, obtains resistance slurry after rolling.
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Application publication date: 20160629 |