CN105719985B - A kind of detecting system of bga chip - Google Patents
A kind of detecting system of bga chip Download PDFInfo
- Publication number
- CN105719985B CN105719985B CN201610250896.8A CN201610250896A CN105719985B CN 105719985 B CN105719985 B CN 105719985B CN 201610250896 A CN201610250896 A CN 201610250896A CN 105719985 B CN105719985 B CN 105719985B
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- plate
- bga chip
- cylinder
- bottom plate
- positioning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a kind of detecting system of bga chip, including rack, bga chip detent mechanism, press plate mechanism and bga chip testing agency；The rack includes bottom plate, four support columns and cylinder mounting plate；The bottom plate is square plate；The support column is fixed on vertically on four angles of bottom plate；The cylinder mounting plate is fixed on the upper surface of four support columns；The press plate mechanism includes cylinder and pressing plate；The cylinder is set straight down；The cylinder is fixed on the lower face center of cylinder mounting plate；The bga chip testing agency is arranged on the framework soleplate；The advantages of invention, is：The placement and extraction of bga chip not only facilitate staff to operate, but also can ensure the safety of staff so all under shell outside, non-press plate mechanism.
Description
Technical field
The present invention relates to bga chip fields, are especially a kind of bga chip detecting system.
Background technology
Since the common QFP of chip (referred to as bga chip) thickness ratio of BGA package reduces more than 1/2, weight saving 3/
More than 4, while can improve electric heating property, parasitic parameter is small, and signal transmission delay is small, and it is extensive to adapt to frequency, and assembling can be with coplanar
The features such as soldering reliability is high, thus be widely used in the high density such as CPU, mainboard south, north bridge chips, high-performance, more pins collection
Into circuit and the portable mobile termianl higher to volume and quality requirement, such as tablet computer, PAD.
Existing bga chip welding is completed to cause product bad phenomena such as detecting it, avoid the occurrence of solder skip, rosin joint.Mesh
It is preceding that artificial hand press operation, since bga chip is plane-welding, artificial hand pressure detection are mainly passed through to bga chip welding detection
When, the bga chip discontinuity of plane is susceptible to, is made and part solder joint occur can not contact with probe, influences detection effect
Fruit and efficiency.
In order to solve the above technical problems, the application for a patent for invention application No. is CN201420837741.0 discloses one kind
Bga chip manual detection device, it is described raised with connecting including being equipped with rotation connection on the bracket and equipped with the compression bar of protrusion
The connecting rod cooperation of briquetting is connect, the probe module set on workbench is equipped with multiple extensible probes being connect with detection module signal,
Protrusion during detection on compression bar makes briquetting be in close contact the probe on the pad and probe module of bga chip.It, will during work
Bga chip to be detected is put into workbench fixing groove, by rotating compression bar, moves down briquetting by the protrusion on compression bar, by BGA
Chip compresses downwards, makes each of which solder joint that can be contacted with the probe on probe module and form signal with detection module and connect,
And then determine whether the welding of bga chip solder joint meets the requirements.Due to can by briquetting be rigid material, briquetting make solder joint with
When probe contacts, the uniform force on bga chip everywhere.
In the prior art, it is difficult to easily and quickly determine bga chip for operating personnel existing for above-mentioned technical proposal
The problem of position is in fixing groove is designed as probe module can move up and down and lifts bga chip and in fixed front of the slot installation
There is telescopic positioning device, this improvement is with the obvious advantage, not only easy to operate, moreover, bga chip accurate positioning.
But two above-mentioned schemes all have the following problems：After the completion of detection, the position of bga chip is extracted all in pressing plate
Under, thus there are the hidden danger of safe operation.
Invention content
The purpose of the present invention is in view of the shortcomings of the prior art, providing a kind of extraction bga chip all except the range of pressing plate
Detecting system.
In order to achieve the above objectives, the present invention provides a kind of detecting systems of bga chip, are positioned including rack, bga chip
Mechanism, press plate mechanism and bga chip testing agency；The rack includes bottom plate, four support columns and cylinder mounting plate；The bottom
Plate is square plate；The support column is fixed on vertically on four angles of bottom plate；The cylinder mounting plate is fixed on four support columns
Upper surface on；The press plate mechanism includes cylinder and pressing plate；The cylinder is set straight down；The cylinder is fixed on cylinder
The lower face center of installing plate；Pressing plate is fixed on the piston rod of the cylinder；The bga chip detent mechanism includes positioning
Plate, supporting rack and positioning cylinder；The bottom plate upper surface offers longitudinal positioning board slot；The positioning plate is plugged in the bottom
In the positioning board slot of plate；The base plate rear end face offers sliding slot；The positioning cylinder is vertically fixed in the bottom plate；It is described
The piston rod initial position of positioning cylinder is located at the front face of sliding slot；Support frame as described above is the angle that a pair of of level is oppositely arranged
Steel；Support frame as described above is fixed on the front end face of the bottom plate；The positioning plate is plugged on support frame as described above；The positioning plate
Latter half of lower face forms vertical push plate；The push plate is fixed on the piston rod of the positioning cylinder；The positioning plate
The cuboid of location hole is offered for one end；The bga chip testing agency includes resetting-mechanism and probe；The resetting-mechanism
Including square box and several compression springs；The bottom plate centre offers bga chip detection square hole；The bga chip detects square hole
Surrounding is opened up there are one square box slot；The probe is fixed on the bottom surface of the bga chip detection square hole；The square box is put
It puts in the square box slot of the bottom plate；Several compression springs are evenly arranged between the square box and square box groove bottom.
As a preferred embodiment of the above technical solution, the bga chip detection square hole of the location hole of the positioning plate and the bottom plate
Size is identical, and the location hole of the positioning plate is corresponding to bga chip size.
As a preferred embodiment of the above technical solution, guide rail is formed at left and right sides of the positioning plate, the guide rail is plugged in institute
It states in the corresponding guide groove of bottom plate.
As a preferred embodiment of the above technical solution, the pressing plate for cuboid and has cut off four angles, the cylinder mounting plate
A pair of guide rods is fixed between bottom plate, the guide rod passes through pressing plate.
As a preferred embodiment of the above technical solution, the extreme higher position of the square box under the action of the spring is square box upper surface
It is coplanar with the bottom surface of the positioning board slot of bottom plate.
The beneficial effects of the present invention are：The placement of bga chip and extraction all under shell outside, non-press plate mechanism,
Not only staff is facilitated to operate in this way, but also can ensure the safety of staff.
Description of the drawings
Fig. 1 is the positive structure diagram of the present invention；
Fig. 2 is the side structure schematic view of the present invention；
Fig. 3 is the A-A cross-sectional views of the initial position of Fig. 1 of the present invention；
Fig. 4 is the A-A cross-sectional views of the test position of Fig. 1 of the present invention；
Fig. 5 is the B-B cross-sectional views of Fig. 2 of the present invention；
Fig. 6 is the enlarged structure schematic diagram of C in Fig. 5 of the invention；
Fig. 7 is the cross-sectional view of the BGA device stent of the present invention；
Fig. 8 is the overlooking the structure diagram of the pressing plate 22 of the present invention；
In figure, 10, rack；11st, pedestal；110th, sliding slot；12nd, support column；13rd, cylinder mounting plate；20th, press plate mechanism；21、
Cylinder；22nd, pressing plate；23rd, guide rod；30th, bga chip testing agency；31st, supporting rack；32nd, positioning plate；321st, location hole；322nd, it leads
Rail；33rd, bga chip；34th, push plate；35th, positioning cylinder；40th, bga chip testing agency；41st, square box；42nd, spring；43rd, it visits
Needle.
Specific embodiment
As shown in Fig. 1~Fig. 6, a kind of detecting system of bga chip, including rack 10, bga chip detent mechanism 30, pressure
Trigger structure 20 and bga chip testing agency 40；It is characterized in that：It is gentle that the rack 10 includes 11, four support columns 12 of bottom plate
Cylinder installing plate 13；The bottom plate 11 is square plate；The support column 12 is fixed on vertically on four angles of bottom plate 11；The cylinder
Installing plate 13 is fixed on the upper surface of four support columns 12；The press plate mechanism 20 includes cylinder 21 and pressing plate 22；The gas
Cylinder 21 is set straight down；The cylinder 21 is fixed on the lower face center of cylinder mounting plate 13；The piston rod of the cylinder 21
On be fixed with pressing plate 22；The bga chip detent mechanism 30 includes positioning plate 32, supporting rack 31 and positioning cylinder 35；The bottom
11 upper surface of plate offers longitudinal positioning board slot；The positioning plate 32 is plugged in the positioning board slot of the bottom plate 11；It is described
11 rear end face of bottom plate offers sliding slot 110；The positioning cylinder 35 is vertically fixed in the bottom plate 11；The positioning cylinder 35
Piston rod initial position be located at the front face of sliding slot 110；Support frame as described above 31 is the angle steel that a pair of of level is oppositely arranged；Institute
Supporting rack 31 is stated to be fixed on the front end face of the bottom plate 11；The positioning plate 32 is plugged on support frame as described above 31；It is described fixed
Position 32 latter half of lower face of plate forms vertical push plate 34；The push plate 34 is fixed on the piston rod of the positioning cylinder 35
On；The positioning plate 32 offers the cuboid of location hole 321 for one end；The bga chip testing agency 40 includes reset machine
Structure and probe 43；The resetting-mechanism includes square box 41 and several compression springs 42；11 centre of bottom plate offers bga chip
Detect square hole；Bga chip detection square hole surrounding opens up that there are one square box slots；The probe 43 is fixed on the BGA cores
On the bottom surface of piece detection square hole；The square box 41 is placed in the square box slot of the bottom plate 11；The square box 41 and side
Several compression springs 42 are evenly arranged between shape frame groove bottom.
As shown in Figure 3, Figure 4, the bga chip detection square hole ruler of the location hole 321 of the positioning plate 32 and the bottom plate 11
Very little identical, the location hole of the positioning plate 32 is corresponding to 33 size of bga chip.
As shown in figure 8,32 left and right sides of positioning plate forms guide rail 322, the guide rail 322 is plugged in the bottom plate
In 11 corresponding guide grooves.
As shown in Figure 5, Figure 7, the pressing plate 22 for cuboid and has cut off four angles, the cylinder mounting plate 13 and bottom plate
A pair of guide rods 23 is fixed between 11, the guide rod 23 passes through pressing plate 22.
As shown in fig. 6, extreme higher position of the square box 41 under the effect of spring 42 is 41 upper surface of square box and bottom plate
The bottom surface of 11 positioning board slot is coplanar.
During concrete operations, the workflow of the detecting system of bga chip of the present invention is as follows：
The first step, staff are placed on bga chip 33 in the location hole 321 of positioning plate 32, and bga chip 33 is supported
Frame 31 supports；
Second step starts positioning cylinder 35, and positioning cylinder 35 drives positioning plate 32 to move by push plate 34, positioning cylinder 35
Maximum stroke is moved to, the location hole 321 of positioning plate 32 is placed exactly on the bga chip detection square hole of bottom plate 11, bga chip
33 are supported by square box 41；
Third walks, and starts cylinder 21, and cylinder 21 is moved downward with dynamic pressure plate 22, and pressing plate 22 presses against bga chip 33 and transports downwards
It is dynamic to be contacted with probe 43, and form signal with detection module and connect, and then determine that bga chip solder joint welding foot is no and meet the requirements；
4th step is again started up cylinder 21, and cylinder 21 is made to be moved upwards with dynamic pressure plate 22, due to the presence of spring 42, meeting
Bga chip 33 is pushed to return in the location hole 321 of positioning plate 32, then starts positioning cylinder 35, cylinder 35 is made to drive positioning plate
32 return to initial position, staff from the location hole 321 of positioning plate 32 take out bga chip 33 put in order (detection OK's, into
Row next process；NG is detected, carry out repair welding or scraps recovery processing).
More than content is only the better embodiment of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes, the content of the present specification should not be construed as to this hair in specific embodiments and applications
Bright limitation.
Claims (1)
1. a kind of detecting system of bga chip, including rack (10), bga chip (33) detent mechanism (30), press plate mechanism (20)
With bga chip testing agency (40)；It is characterized in that：The rack (10) is gentle including bottom plate (11), four support columns (12)
Cylinder installing plate (13)；The bottom plate (11) is square plate；The support column (12) is fixed on vertically on four angles of bottom plate (11)；
The cylinder mounting plate (13) is fixed on the upper surface of four support columns (12)；The press plate mechanism (20) includes cylinder (21)
With pressing plate (22)；The cylinder (21) is set straight down；The cylinder (21) is fixed on the lower face of cylinder mounting plate (13)
Center；Pressing plate (22) is fixed on the piston rod of the cylinder (21)；The bga chip detent mechanism (30) is including positioning plate
(32), supporting rack (31) and positioning cylinder (35)；Bottom plate (11) upper surface offers longitudinal positioning board slot；The positioning
Plate (32) is plugged in the positioning board slot of the bottom plate (11)；Bottom plate (11) rear end face offers sliding slot (110)；It is described fixed
Position cylinder (35) is vertically fixed in the bottom plate (11)；The piston rod initial position of the positioning cylinder (35) is located at sliding slot
(110) at front face；Support frame as described above (31) is the angle steel that a pair of of level is oppositely arranged；Support frame as described above (31) is fixed on institute
On the front end face for stating bottom plate (11)；The positioning plate (32) is plugged on support frame as described above (31)；The positioning plate (32) is later half
Subordinate end face forms vertical push plate (34)；The push plate (34) is fixed on the piston rod of the positioning cylinder (35)；Institute
State the cuboid that positioning plate (32) offers location hole (321) for one end；The bga chip testing agency (40) is including resetting machine
Structure and probe (43)；The resetting-mechanism includes square box (41) and several compression springs (42)；Bottom plate (11) centre opens up
There is bga chip to detect square hole；Bga chip detection square hole surrounding opens up that there are one square box slots；The probe (43) is fixed
On the bottom surface of bga chip detection square hole；The square box (41) is placed in the square box slot of the bottom plate (11)；Institute
It states and several compression springs (42) is evenly arranged between square box (41) and square box groove bottom；
The location hole (321) of the positioning plate (32) is identical with the bga chip of the bottom plate (11) detection square hole size, described fixed
The location hole of position plate (32) is corresponding to bga chip (33) size；
Guide rail (322) is formed at left and right sides of the positioning plate (32), it is corresponding that the guide rail (322) is plugged in the bottom plate (11)
Guide groove in；
The pressing plate (22) is cuboid and has cut off four angles, is fixed between the cylinder mounting plate (13) and bottom plate (11)
A pair of guide rods (23), the guide rod (23) is across pressing plate (22)；
The square box (41) is square box (41) upper surface in the lower extreme higher position of spring (42) effect and bottom plate (11) determine
The bottom surface of position board slot is coplanar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610250896.8A CN105719985B (en) | 2016-04-20 | 2016-04-20 | A kind of detecting system of bga chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610250896.8A CN105719985B (en) | 2016-04-20 | 2016-04-20 | A kind of detecting system of bga chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105719985A CN105719985A (en) | 2016-06-29 |
| CN105719985B true CN105719985B (en) | 2018-06-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610250896.8A Active CN105719985B (en) | 2016-04-20 | 2016-04-20 | A kind of detecting system of bga chip |
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| Country | Link |
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| CN (1) | CN105719985B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110907805A (en) * | 2019-12-11 | 2020-03-24 | 杭州易正科技有限公司 | Integrated circuit packaging testing device of portable categorised ejection of compact |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203519778U (en) * | 2013-09-10 | 2014-04-02 | 嘉兴景焱智能装备技术有限公司 | Chip finished product testing machine |
| CN204289401U (en) * | 2014-12-16 | 2015-04-22 | 深圳市慧为智能科技有限公司 | A kind of bga chip manual detection device |
| CN105334444A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Detection system of BGA chip |
-
2016
- 2016-04-20 CN CN201610250896.8A patent/CN105719985B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203519778U (en) * | 2013-09-10 | 2014-04-02 | 嘉兴景焱智能装备技术有限公司 | Chip finished product testing machine |
| CN204289401U (en) * | 2014-12-16 | 2015-04-22 | 深圳市慧为智能科技有限公司 | A kind of bga chip manual detection device |
| CN105334444A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Detection system of BGA chip |
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| Publication number | Publication date |
|---|---|
| CN105719985A (en) | 2016-06-29 |
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Effective date of registration: 20180523 Address after: 518000 2 building, B building, Xing Hui science and Technology Industrial Park, Hua Long West Road, Longhua New District, Shenzhen, Guangdong. Applicant after: Shenzhen Yatai Technology Co., Ltd. Address before: 313000 Wuxing District, Huzhou City, Zhejiang Applicant before: HUZHOU GUOXIN MATERIALS CO., LTD. |
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