CN105718987A - Method and system for realizing one card with two numbers, and SIM card - Google Patents
Method and system for realizing one card with two numbers, and SIM card Download PDFInfo
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- CN105718987A CN105718987A CN201610027596.3A CN201610027596A CN105718987A CN 105718987 A CN105718987 A CN 105718987A CN 201610027596 A CN201610027596 A CN 201610027596A CN 105718987 A CN105718987 A CN 105718987A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- Microelectronics & Electronic Packaging (AREA)
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Telephone Function (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a method and a system for realizing one card with two numbers, and a SIM card. The method for realizing one card with two numbers comprises the following steps of: cutting a first SIM card so as to obtain an effective part of a golden finger part of a first SIM card, wherein the effective part includes key safety information of a first operator; removing a packaging material of the effective part so as to obtain a SIM card chip module; designing a chip which includes key safety information of a second operator that is different from the first operator; designing a circuit, the front surface of which is provided with many function contact surfaces and the back surface of which is provided with two welding pad positions, wherein one welding pad position is used o carry the SIM card chip module and the other welding pad position is used to carry the chip; electrically connecting the function contact surfaces, the SIM card chip module and the chip; and packaging the circuit board, the SIM card chip module and the chip to obtain a second SIM card which supports one-card-two-number.
Description
Technical field
The present invention relates to mobile communication technology field, particularly relate to the method that realizes of an a kind of card two and realize system and SIM.
Background technology
SIM common on the market at present is all one number of a card.If the user desired that use new number, he would have to unload original SIM.Accordingly, there exist user and use inconvenience and the problem that the operator of new SIM develops new user's inconvenience.
For this problem, occur in that thin film SIM.But, the thickness of thin film SIM is relatively more higher than the thickness of existing SIM.Therefore, the draw-in groove of now much trendy mobile phone is caused cannot to insert this thin film SIM.Additionally, the chip of thin film SIM is arranged on the surface of original SIM, in plug process, it is easy to damage the chip of thin film SIM, causes the irreversible damage of thin film SIM.Additionally, thin film SIM adopts double faced adhesive tape form and original SIM to carry out surface laminating.Owing to fitting area is too small, be in use easy to come off, cause that thin film SIM shifts, gently then loose contact cause mobile phone can not identification card, heavy then cause that the contact flat spring of mobile phone draw-in groove damages.
The problem that thickness in order to solve thin film SIM causes, occurs in that the SIM of the one-card multi-number of deciphering formula.The SIM of this one-card multi-number is in application process, it is necessary to adopt improper means to decrypt the original SIM secure cryptographic key information of Liang Ge operator to realize the function of a card two.But, the original SIM secure cryptographic key information of each operator not easily obtains.Even so, it is assumed that the secure cryptographic key information of the original SIM of each operator can be obtained, will there is serious potential safety hazard for a user in this.
In sum, it is achieved during No. two functions of card, the problem both having solved SIM thickness, also solve SIM safety issue, be technical problem currently urgently to be resolved hurrily.
Summary of the invention
In view of this, when being necessary in fact to provide one to realize No. two functions of card, the problem both having solved SIM thickness, also solve SIM safety issue a card two realize method, implement the system that realizes of the method that realizes of this card two and the SIM that the method that realizes of application one card two obtains.
A kind of one card No. two realize method, comprise the steps:
Cutting the first SIM to obtain the effective site of the golden finger part of the first SIM, effective site includes the key safety information of the first operator.
Remove the encapsulating material of effective site to obtain SIM chip module.
Designing a chip, chip includes the key safety information of the second operator, and the first operator and the second operator are identical or different.
Designing a circuit board, the front of circuit board is provided with multiple function contact surface, and the back side of circuit board is provided with two pad positions, and a pad position is used for carrying SIM chip module, and another is used for carrying chip.
Electricity connection function contact surface, SIM chip module and chip.
Dimensional packaged circuit board, SIM chip module and chip obtain supporting the second SIM of a card two.
Preferably, function contact surface includes a VCC function contact surface, a GND function contact surface, the first I O function contact surface, a CLK function contact surface and a RST function contact surface.Chip includes VCC pin, GND pin, I/O pin, CLK pin, RST pin and IO1Pin.SIM chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface.The step of electricity connection function contact surface, SIM chip module and chip includes:
VCC pin, the 2nd VCC function contact surface are electrically connected with a VCC function contact surface respectively.GND pin, the 2nd GND function contact surface are electrically connected with a GND function contact surface respectively.CLK pin, the 2nd CLK function contact surface are electrically connected with a CLK function contact surface respectively.RST pin, the 2nd RST function contact surface are electrically connected with a RST function contact surface respectively.
First I O function contact surface is electrically connected with I/O pin, IO1Pin and the second I O function contact surface are electrically connected.
A kind of one card No. two realize system, including:
Cutting module, for cutting the first SIM to obtain the effective site of the golden finger part of the first SIM, effective site includes the key safety information of the first operator.
Remove module, be used for the encapsulating material removing effective site to obtain SIM chip module.
First design module, is used for designing a chip, and chip includes the key safety information of the second operator, and the first operator and the second operator are identical or different.
Second design module, is used for designing a circuit board, and the front of circuit board is provided with multiple function contact surface, and the back side of circuit board is provided with two pad positions, and a pad position is used for carrying SIM chip module, and another is used for carrying chip.
Link block, for electricity connection function contact surface, SIM chip module and chip.
Package module, obtains supporting the second SIM of a card two for dimensional packaged circuit board, SIM chip module and chip.
Preferably, function contact surface includes a VCC function contact surface, a GND function contact surface, the first I O function contact surface, a CLK function contact surface and a RST function contact surface.Chip includes VCC pin, GND pin, I/O pin, CLK pin, RST pin and IO1Pin.SIM chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface.Link block includes:
Parallel units, is electrically connected with a VCC function contact surface respectively for VCC pin, the 2nd VCC function contact surface.GND pin, the 2nd GND function contact surface are electrically connected with a GND function contact surface respectively.CLK pin, the 2nd CLK function contact surface are electrically connected with a CLK function contact surface respectively.RST pin, the 2nd RST function contact surface are electrically connected with a RST function contact surface respectively.
Series unit, is electrically connected with I/O pin for the first I O function contact surface, IO1Pin and the second I O function contact surface are electrically connected.
A kind of SIM, including circuit board, SIM chip module and chip.SIM chip module includes the key safety information of the first operator, and chip includes the key safety information of the second operator, and the first operator and the second operator are identical or different.The front of circuit board is provided with multiple function contact surface, the back side of circuit board is provided with two pad positions, one pad position is used for carrying SIM chip module, and another pad position is used for carrying chip, and SIM chip module, chip are electrically connected with each function contact surface respectively.
Preferably, function contact surface includes a VCC function contact surface, a GND function contact surface, the first I O function contact surface, a CLK function contact surface and a RST function contact surface.Chip includes VCC pin, GND pin, I/O pin, CLK pin, RST pin and IO1Pin.SIM chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface.VCC pin, the 2nd VCC function contact surface are electrically connected with a VCC function contact surface respectively.GND pin, the 2nd GND function contact surface are electrically connected with a GND function contact surface respectively.CLK pin, the 2nd CLK function contact surface are electrically connected with a CLK function contact surface respectively.RST pin, the 2nd RST function contact surface are electrically connected with a RST function contact surface respectively.First I O function contact surface is electrically connected with I/O pin, IO1Pin and the second I O function contact surface are electrically connected.
Preferably, including standard SIM card, Micro-SIM card or Nano-SIM card.
Preferably, the size range of SIM chip module is 3.83*2.78mm～7.65*5.55mm, and thickness is 0.42mm.
Preferably, the thickness of chip is 0.2mm.
Preferably, circuit board is of a size of 10.8*8.0mm, and the thickness of circuit board is 0.1～0.16mm.
The invention have the benefit that SIM chip module and chip have respective key safety information, it is therefore not necessary to obtain key safety information can realize a card two so that improving safety.Additionally, front arranges multiple shared function contact surface, the back side arranges the pad position of accommodating SIM chip module and chip so that reducing the thickness of the SIM of a card two.
Accompanying drawing explanation
Fig. 1 is the frame structure schematic diagram of a kind of embodiment of SIM of the present invention.
Fig. 2 is the structural representation of a kind of embodiment of effective site of the first SIM.
Fig. 3 is the electrical connection schematic diagram of function contact surface, SIM chip module and a kind of embodiment of chip.
Fig. 4 is the schematic flow sheet that the present invention one blocks a kind of embodiment of the method that realizes of No. two.
Fig. 5 is the high-level schematic functional block diagram that the present invention one blocks a kind of embodiment of the system that realizes of No. two.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the present invention, be not used to limit the present invention.
Fig. 1～Fig. 3 illustrates a kind of embodiment of SIM of the present invention.In the present embodiment, referring to Fig. 1, this SIM includes circuit board 1, SIM chip module 3 and chip 2.
Wherein, the front of circuit board 1 is provided with multiple function contact surface, and the back side of circuit board 1 is provided with two pad positions, and a pad position is used for carrying SIM chip module 3, and another pad position is used for carrying chip 2.This function contact surface includes a VCC function contact surface, a GND function contact surface, the first I O function contact surface, a CLK function contact surface and a RST function contact surface.It should be noted that the function contact surface in the present embodiment also includes VPP function contact surface (unsettled).Additionally, this circuit board 1 is of a size of 10.8*8.0mm, the thickness of circuit board 1 is 0.1～0.16mm.Multiple function contact surfaces that circuit board 1 one side in the present embodiment is arranged are shared by SIM chip module 3, chip 2, another side arranges pad position so that SIM chip module 3 and chip 2 are firm with circuit board 1 is connected, and the diversity being caused the thickness of the SIM of the present embodiment and the thickness of existing SIM by this kind of structure is only small.Additionally, the present embodiment causes the situation not easily occurring that chip 2 or SIM chip module 3 come off by pad structure.
Wherein, SIM chip module 3 is to obtain through a first SIM cutting.Referring to Fig. 2, the first SIM in the present embodiment includes standard SIM card 4, Micro-SIM card 5 or Nano-SIM card 6.Therefore, the present embodiment is applicable to existing all of SIM.Specifically, the first step, cut the first SIM to obtain the effective site 7 of the golden finger part of the first SIM, effective site 7 includes the key safety information of the first operator.In order to ensure the precision of cutting further, the present embodiment adopts the mode of cut.Additionally, the size of the effective site 7 of different SIMs is different, the present embodiment can cut out various sizes of effective site 7 according to the character of SIM to be cut.The size range of this effective site 7 is 3.83*2.78mm～7.65*5.55mm.Second step, removes the encapsulating material of effective site 7 to obtain SIM chip module 3.The present embodiment reduces the thickness of effective site 7 by removing operation.Such as: this SIM chip module 3 thickness after removing operation becomes 0.42mm.SIM chip module 3 includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface.Referring to Fig. 3, the 2nd VCC function contact surface and a VCC function contact surface are electrically connected.2nd GND function contact surface and a GND function contact surface are electrically connected.2nd CLK function contact surface and a CLK function contact surface are electrically connected.2nd RST function contact surface and a RST function contact surface are electrically connected.Second I O function contact surface and chip 2 are electrically connected.
Wherein, chip 2 is a kind of special chip 2.This chip 2 can be designed as different sizes according to demand.Such as: 3*3mm.Additionally, the thickness of chip 2 is 0.2mm.This chip 2 includes the key safety information of the second operator, and the first operator and the second operator are identical or different.Additionally, this chip 2 includes VCC pin, GND pin, I/O pin, CLK pin, RST pin and IO1Pin.It is electrically connected referring to Fig. 3, VCC pin and a VCC function contact surface.GND pin and a GND function contact surface are electrically connected.CLK pin and a CLK function contact surface are electrically connected.RST pin and a RST function contact surface are electrically connected.First I O function contact surface is electrically connected with I/O pin, and IO1 pin and the second I O function contact surface are electrically connected.
In conjunction with Fig. 1 and Fig. 3, when using the SIM of the present embodiment, first, when the SIM of the present embodiment is inserted some mobile phone, during the number that user selects the operator performing SIM chip module 3 to provide by the menu item of mobile phone, the flow direction of data stream is: the first I O function contact surface of circuit board 1, the I/O pin of chip 2, chip 2 IO1Pin, SIM chip module 3 the bidirectional data transfers of the second I O function contact surface.Secondly, during the number that user selects the operator performing chip 2 to provide by the menu item of mobile phone, the flow direction of data stream is: the first I O function contact surface of circuit board 1, chip 2 the bidirectional data transfers of I/O pin.
Fig. 4 illustrates a kind of embodiment that the present invention one blocks the method that realizes of No. two.In the present embodiment, the method that realizes of this card two comprises the steps:
Step S1, cuts the first SIM to obtain the effective site of the golden finger part of the first SIM, and effective site includes the key safety information of the first operator.
It should be noted that the first SIM in the present embodiment includes standard SIM card, Micro-SIM card or Nano-SIM card.Therefore, the present embodiment is applicable to existing all of SIM.The purpose of the present embodiment is in that to be obtained the effective site of the first SIM by the mode cut.Specifically, the mode of cut is adopted, it is possible to ensure the precision of cutting further.The present embodiment can cut out various sizes of effective site according to the character of the first SIM.The size range of this effective site is 3.83*2.78mm～7.65*5.55mm.
Step S2, removes the encapsulating material of effective site to obtain SIM chip module.
The present embodiment reduces the thickness of effective site by removing operation.
Step S3, designs a chip, and chip includes the key safety information of the second operator, and the first operator and the second operator are identical or different.
The present embodiment both can support different two number of same operator, it is also possible to supports different two number of different operators.
Step S4, designs a circuit board, and the front of circuit board is provided with multiple function contact surface, and the back side of circuit board is provided with two pad positions, and a pad position is used for carrying SIM chip module, and another is used for carrying chip.The present embodiment uses STM surface patch technique, and SIM chip module, chip are affixed on the pad locations that the back side of circuit board is corresponding, merges through high temperature stannum, is formed and possesses complete physical circuit and connect New type of S IM card chip module.
Multiple function contact surfaces that circuit board one side in the present embodiment is arranged are shared by SIM chip module, chip, another side arranges pad position so that SIM chip module and chip are firm with circuit board is connected, and the situation that chip or SIM chip module come off not easily occurs.
Step S5, electricity connection function contact surface, SIM chip module and chip.
Specifically, this function contact surface includes a VCC function contact surface, a GND function contact surface, the first I O function contact surface, a CLK function contact surface and a RST function contact surface.Chip includes VCC pin, GND pin, I/O pin, CLK pin, RST pin and IO1Pin.SIM chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface.VCC pin, the 2nd VCC function contact surface are electrically connected with a VCC function contact surface respectively.GND pin, the 2nd GND function contact surface are electrically connected with a GND function contact surface respectively.CLK pin, the 2nd CLK function contact surface are electrically connected with a CLK function contact surface respectively.RST pin, the 2nd RST function contact surface are electrically connected with a RST function contact surface respectively.First I O function contact surface is electrically connected with I/O pin, IO1Pin and the second I O function contact surface are electrically connected.
Step S6, dimensional packaged circuit board, SIM chip module and chip obtain supporting the second SIM of a card two.
The present embodiment adopt high temperature stannum dimensional packaged circuit board, SIM chip module and chip thus the electric property of the second SIM obtained more preferably.Additionally, the present embodiment uses pvc packaging technology, the New type of S IM card chip module obtained by step S4 is encapsulated as the SIM of a standard, and thickness is 0.9mm to the maximum, finally by die-cut pvc, can make and obtain standard SIM card, Micro-SIM card or Nano-SIM card.
Fig. 5 illustrates a kind of embodiment that the present invention one blocks the system that realizes of No. two.In the present embodiment, the system that realizes of this card two includes cutting module 10, removes module the 11, first design module the 12, second design module 13, link block 14 and package module 15.
Wherein, cutting module 10, for cutting the first SIM to obtain the effective site of the golden finger part of the first SIM, effective site includes the key safety information of the first operator.It should be noted that for the precision ensureing cutting further, the present embodiment adopts the mode of cut.Remove module 11, be used for the encapsulating material removing effective site to obtain SIM chip module.It should be noted that SIM chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface.First design module 12, is used for designing a chip, and chip includes the key safety information of the second operator, and the first operator and the second operator are identical or different.It should be noted that this chip includes VCC pin, GND pin, I/O pin, CLK pin, RST pin and IO1Pin.Second design module 13, is used for designing a circuit board, and the front of circuit board is provided with multiple function contact surface, and the back side of circuit board is provided with two pad positions, and a pad position is used for carrying SIM chip module, and another is used for carrying chip.It should be noted that function contact surface includes a VCC function contact surface, a GND function contact surface, the first I O function contact surface, a CLK function contact surface and a RST function contact surface.Link block 14, for electricity connection function contact surface, SIM chip module and chip.It should be noted that this link block 14 includes parallel units and series unit.Wherein, parallel units, it is electrically connected with a VCC function contact surface respectively for VCC pin, the 2nd VCC function contact surface.GND pin, the 2nd GND function contact surface are electrically connected with a GND function contact surface respectively.CLK pin, the 2nd CLK function contact surface are electrically connected with a CLK function contact surface respectively.RST pin, the 2nd RST function contact surface are electrically connected with a RST function contact surface respectively.Series unit, is electrically connected with I/O pin for the first I O function contact surface, IO1Pin and the second I O function contact surface are electrically connected.Package module 15, obtains supporting the second SIM of a card two for dimensional packaged circuit board, SIM chip module and chip.The present embodiment adopts PVC packaging technology, dimensional packaged circuit board, SIM chip module and the SIM that chip is a standard, and thickness is 0.9mm to the maximum, finally by die-cut pvc, can make and obtain standard SIM card, Micro-SIM card or Nano-SIM card.
Above the detailed description of the invention of invention being described in detail, but it is only used as example, the present invention is not limiting as and specific embodiments described above.For a person skilled in the art, any equivalent modifications that this invention is carried out or replacement are also all among scope of the invention, therefore, the impartial conversion made under without departing from the spirit and principles in the present invention scope and amendment, improvement etc., all should contain within the scope of the invention.
Claims (10)
1. one kind one card No. two realize method, it is characterised in that comprise the steps:
Cutting the first SIM to obtain the effective site of the golden finger part of described first SIM, described effective site includes the key safety information of the first operator；
Remove the encapsulating material of described effective site to obtain SIM chip module；
Designing a chip, described chip includes the key safety information of the second operator, and described first operator and described second operator are identical or different；
Designing a circuit board, the front of described circuit board is provided with multiple function contact surface, and the back side of described circuit board is provided with two pad positions, and a pad position is used for carrying described SIM chip module, and another is used for carrying described chip；
It is electrically connected described function contact surface, described SIM chip module and described chip；
Encapsulate described circuit board, described SIM chip module and described chip and obtain supporting the second SIM of a card two.
2. according to claim 1 one card No. two realize method, it is characterized in that, described function contact surface includes a VCC function contact surface, a GND function contact surface, the first I O function contact surface, a CLK function contact surface and a RST function contact surface；Described chip includes VCC pin, GND pin, I/O pin, CLK pin, RST pin and IO1Pin；Described SIM chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface；The step being electrically connected described function contact surface, described SIM chip module and described chip includes:
Described VCC pin, described 2nd VCC function contact surface are electrically connected with a described VCC function contact surface respectively；Described GND pin, described 2nd GND function contact surface are electrically connected with a described GND function contact surface respectively；Described CLK pin, described 2nd CLK function contact surface are electrically connected with a described CLK function contact surface respectively；Described RST pin, described 2nd RST function contact surface are electrically connected with a described RST function contact surface respectively；
Described first I O function contact surface is electrically connected with described I/O pin, described IO1Pin is electrically connected with described second I O function contact surface.
3. one kind one card No. two realize system, it is characterised in that including:
Cutting module, for cutting the first SIM to obtain the effective site of the golden finger part of described first SIM, described effective site includes the key safety information of the first operator；
Remove module, be used for the encapsulating material removing described effective site to obtain SIM chip module；
First design module, is used for designing a chip, and described chip includes the key safety information of the second operator, and described first operator and described second operator are identical or different；
Second design module, is used for designing a circuit board, and the front of described circuit board is provided with multiple function contact surface, and the back side of described circuit board is provided with two pad positions, and a pad position is used for carrying described SIM chip module, and another is used for carrying described chip；
Link block, is used for being electrically connected described function contact surface, described SIM chip module and described chip；
Package module, obtains supporting the second SIM of a card two for encapsulating described circuit board, described SIM chip module and described chip.
4. according to claim 3 one card No. two realize system, it is characterized in that, described function contact surface includes a VCC function contact surface, a GND function contact surface, the first I O function contact surface, a CLK function contact surface and a RST function contact surface；Described chip includes VCC pin, GND pin, I/O pin, CLK pin, RST pin and IO1Pin；Described SIM chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface；Described link block includes:
Parallel units, is electrically connected with a described VCC function contact surface respectively for described VCC pin, described 2nd VCC function contact surface；Described GND pin, described 2nd GND function contact surface are electrically connected with a described GND function contact surface respectively；Described CLK pin, described 2nd CLK function contact surface are electrically connected with a described CLK function contact surface respectively；Described RST pin, described 2nd RST function contact surface are electrically connected with a described RST function contact surface respectively；
Series unit, is electrically connected with described I/O pin for described first I O function contact surface, described IO1Pin is electrically connected with described second I O function contact surface.
5. a SIM, it is characterized in that, including circuit board, SIM chip module and chip, described SIM chip module includes the key safety information of the first operator, described chip includes the key safety information of the second operator, and described first operator and described second operator are identical or different；The front of described circuit board is provided with multiple function contact surface, the back side of described circuit board is provided with two pad positions, one pad position is used for carrying described SIM chip module, another pad position is used for carrying described chip, and described SIM chip module, described chip are electrically connected with function contact surface each described respectively.
6. SIM according to claim 5, it is characterised in that described function contact surface includes a VCC function contact surface, a GND function contact surface, the first I O function contact surface, a CLK function contact surface and a RST function contact surface；Described chip includes VCC pin, GND pin, I/O pin, CLK pin, RST pin and IO1Pin；Described SIM chip module includes the 2nd VCC function contact surface, the 2nd GND function contact surface, the second I O function contact surface, the 2nd CLK function contact surface and the 2nd RST function contact surface；Described VCC pin, described 2nd VCC function contact surface are electrically connected with a described VCC function contact surface respectively；Described GND pin, described 2nd GND function contact surface are electrically connected with a described GND function contact surface respectively；Described CLK pin, described 2nd CLK function contact surface are electrically connected with a described CLK function contact surface respectively；Described RST pin, described 2nd RST function contact surface are electrically connected with a described RST function contact surface respectively；Described first I O function contact surface is electrically connected with described I/O pin, described IO1Pin is electrically connected with described second I O function contact surface.
7. SIM according to claim 5, it is characterised in that include standard SIM card, Micro-SIM card or Nano-SIM card.
8. according to claim 5 one card No. two realize method, it is characterised in that the size range of described SIM chip module is 3.83*2.78mm～7.65*5.55mm, and thickness is 0.42mm.
9. according to claim 5 one card No. two realize method, it is characterised in that the thickness of described chip is 0.2mm.
10. according to claim 5 one card No. two realize method, it is characterised in that described circuit board is of a size of 10.8*8.0mm, and the thickness of described circuit board is 0.1～0.16mm.
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| CN107592383A (en) * | 2017-08-30 | 2018-01-16 | 胡文东 | The data transmission method of control circuit, SIM card double card Kato and double card application |
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| CN105718987B (en) | 2019-01-25 |
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