CN105718843A - Fingerprint recognition device and manufacturing method thereof - Google Patents
Fingerprint recognition device and manufacturing method thereof Download PDFInfo
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- CN105718843A CN105718843A CN201410725076.0A CN201410725076A CN105718843A CN 105718843 A CN105718843 A CN 105718843A CN 201410725076 A CN201410725076 A CN 201410725076A CN 105718843 A CN105718843 A CN 105718843A
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Abstract
The invention provides a fingerprint recognition device and a manufacturing method thereof. The fingerprint recognition device comprises a substrate, a sensor chip, a sealing adhesive layer and a protective film. The sensor chip is disposed on the substrate and is provided with an upper surface. The sealing adhesive layer is disposed on the substrate, surrounds the sensor chip and exposes the upper surface of the sensor chip. The upper surface of the sealing adhesive layer flushes the upper surface of the sensor chip. The protective film covers the sensor chip and the sealing adhesive layer, and the protective film and the sealing adhesive layer are made of different materials. As the fingerprint recognition device and the manufacturing method thereof can accurately control the structural thickness on the sensor chip, the overall thickness of the fingerprint recognition device provided by the invention can be accurately estimated to improve the application rate of the fingerprint recognition device.
Description
Technical field
The present invention is about a kind of fingeprint distinguisher, especially with regard to a kind of fingeprint distinguisher with adhesive layer and manufacture method thereof.
Background technology
The manufacture method of general fingeprint distinguisher is to be arranged on substrate by identification chip；Then on identification chip and substrate, cover insulative potting material；Recycling grinds processing procedure, is polished by the insulative potting material of last for identification chip point；And color pattern layer and optics hardcoat are sequentially attached on insulative potting material.By above-mentioned manufacture method, general fingeprint distinguisher can be obtained, and this fingeprint distinguisher from bottom to top sequentially has substrate, identification chip, insulative potting material, color pattern layer and optics hardcoat.
But, when utilizing the grinding processing procedure in general manufacture method to polish insulative potting material, it is impossible to be precisely controlled removal quantity and the residual thickness of insulative potting material so that the fingeprint distinguisher encapsulated has obvious thickness deviation.In addition, the blocked up or excessively thin fingeprint distinguisher of integral thickness will be unable to be arranged in associated electronic components so that general fingeprint distinguisher can utility ratio not good.
Therefore, need a kind of new fingeprint distinguisher and manufacture method thereof at present badly, to solve disappearance produced by the structure of conventional fingerprint device for identifying and manufacture method.
Summary of the invention
Insulative potting material thickness cannot be precisely controlled for solving conventional fingerprint device for identifying, make the fingeprint distinguisher that encapsulation completes have the problem of obvious thickness deviation, a kind of fingeprint distinguisher that embodiments of the invention provide may be used to solve fingeprint distinguisher for a long time causes because integral thickness tolerance is excessive can the not good problem of utility ratio.
It is an aspect of the invention to provide a kind of fingeprint distinguisher.This fingeprint distinguisher comprises substrate, induction chip, adhesive layer and protecting film.
Induction chip is arranged on substrate, and has upper surface.Adhesive layer is arranged on substrate, around induction chip and the upper surface exposing induction chip, and the wherein upper surface flush of the upper surface of adhesive layer and induction chip.Protecting film covers on induction chip and adhesive layer, wherein protecting film and adhesive layer unlike material.
According to embodiments of the invention, aforesaid substrate comprises circuit substrate or insulated substrate.
According to embodiments of the invention, above-mentioned induction chip is electrically coupled to circuit substrate.
According to embodiments of the invention, between above-mentioned induction chip and substrate, also comprise the first adhesive layer.
According to embodiments of the invention, above-mentioned induction chip comprises identification of fingerprint chip.
According to embodiments of the invention, the material of above-mentioned adhesive layer comprises insulating composite material.
According to embodiments of the invention, above-mentioned insulating composite material comprises epoxy resin.
According to embodiments of the invention, said protection film comprises color paint layer and optics wearing course.According to embodiments of the invention, above-mentioned color paint layer covers on induction chip and adhesive layer, and optics wearing course covers on color paint layer.
According to embodiments of the invention, above-mentioned optics wearing course comprises optics cured coating layer or optical glass layer.
According to embodiments of the invention, said protection film also comprises the second adhesive layer, and it is folded between color paint layer and induction chip and adhesive layer.
According to embodiments of the invention, the thickness of said protection film is 20～50 microns.
It is another aspect of the invention to provide the manufacture method of a kind of fingeprint distinguisher.This manufacture method comprises: form induction chip on substrate；Forming adhesive layer on substrate, adhesive layer is around induction chip and the upper surface exposing induction chip, and wherein the upper surface of adhesive layer forms flat surfaces with the upper surface of induction chip；And form protecting film on induction chip and adhesive layer.
According to embodiments of the invention, above-mentioned manufacture method also comprises formation the first adhesive layer between induction chip and substrate.
According to embodiments of the invention, the step of above-mentioned formation protecting film comprises: form color paint layer on induction chip and adhesive layer；And formed on optics wearing course covering color paint layer.
According to embodiments of the invention, above-mentioned formation optics wearing course comprises formation optics cured coating layer or forms optical glass layer.
According to embodiments of the invention, said protection film also comprises the second adhesive layer, and it is arranged between color paint layer and induction chip and adhesive layer.
Accompanying drawing explanation
Fig. 1 is the profile of a kind of fingeprint distinguisher 100 according to embodiments of the invention depicted；
Fig. 2 is the profile of a kind of fingeprint distinguisher 200 according to embodiments of the invention depicted；
Fig. 3 is the profile of a kind of fingeprint distinguisher 300 according to embodiments of the invention depicted；
Fig. 4 is the profile of a kind of fingeprint distinguisher 400 according to embodiments of the invention depicted；
Fig. 5 A～5C is the stage profile of the manufacture method of a kind of fingeprint distinguisher 500 according to embodiments of the invention depicted；
Fig. 6 is the stage profile of the manufacture method of a kind of fingeprint distinguisher 600 according to embodiments of the invention depicted；
Fig. 7 A～7B is the stage profile of the manufacture method of a kind of fingeprint distinguisher 700 according to embodiments of the invention depicted；
Fig. 8 is the stage profile of the manufacture method of a kind of fingeprint distinguisher 800 according to embodiments of the invention depicted；And
Fig. 9 is the flow chart of the manufacture method of a kind of fingeprint distinguisher according to embodiments of the invention depicted.
Detailed description of the invention
Then with embodiment and coordinate accompanying drawing to describe the present invention in detail, at accompanying drawing or describe, similar or identical part is to use identical symbol or numbering.In the accompanying drawings, the shape of embodiment or thickness are likely to expand, and simplifying or convenient to indicate, and in accompanying drawing, the part of element will describe with word.Apprehensible, the element not illustrating or not describing can for being familiar with the various patterns known to this those skilled in the art.
Term as used herein is only for describing the purpose of specific embodiment and being not intended to limit the present invention.As used herein, singulative " " (a, an) and " being somebody's turn to do " (the) are intended to also include plural form, unless explicitly indicated that otherwise herein.It is further understood that, when using in this manual, term " comprises " (comprises and/or comprising) and specifies the feature described in existing, integer, step, running, element and/or component, but is not precluded from existence or adds one or more further feature, integer, step, running, element, component and/or its group.The cross section schematically illustrated herein by reference to the idealized embodiments (and intermediate structure) for the present invention illustrates to describe embodiments of the invention.So, we by expection deviate such explanation shape due to the change of (such as) manufacturing technology and/or tolerance.Therefore, embodiments of the invention should be considered limited to specific region shape illustrated herein, and the alteration of form manufactured due to (such as) will be included, and illustrated region is essentially schematically in such figure, and its shape is not intended to the true form in region of devices illustrated and is not intended to limit scope of the invention.
Insulative potting material thickness cannot be precisely controlled for solving conventional fingerprint device for identifying, make the problem that the fingeprint distinguisher that encapsulation completes has obvious thickness deviation, embodiments of the invention are provided the adhesive layer in a kind of fingeprint distinguisher only around induction chip and the upper surface exposing induction chip, in addition the upper surface flush of the upper surface of adhesive layer and induction chip, may be used to solve fingeprint distinguisher for a long time causes because integral thickness tolerance is excessive can the not good problem of utility ratio.
Fig. 1 is the profile of a kind of fingeprint distinguisher 100 according to embodiments of the invention depicted.In FIG, fingeprint distinguisher 100 comprises substrate 110, induction chip 120, adhesive layer 130 and protecting film 140.
Induction chip 120 is arranged on substrate 110, and has upper surface 121.According to embodiments of the invention, substrate 110 comprises circuit substrate or insulated substrate.According to embodiments of the invention, induction chip 120 is electrically coupled to circuit substrate.According to embodiments of the invention, induction chip 120 comprises identification of fingerprint chip.
Adhesive layer 130 is arranged on substrate 110, around induction chip 120 and the upper surface 121 exposing induction chip 120.In an embodiment of the present invention, the upper surface 131 of adhesive layer 130 flushes with the upper surface 121 of induction chip 120.According to embodiments of the invention, the material of adhesive layer 130 comprises insulating composite material.According to embodiments of the invention, insulating composite material comprises epoxy resin.
Protecting film 140 covers on induction chip 120 and adhesive layer 130, wherein protecting film 140 and adhesive layer 130 unlike material.According to embodiments of the invention, protecting film 140 comprises optics hardened layer.According to embodiments of the invention, the thickness (T) of protecting film 140 is 20～50 microns.
Fig. 2 is the profile of a kind of fingeprint distinguisher 200 according to embodiments of the invention depicted.In fig. 2, fingeprint distinguisher 200 comprises substrate 210, induction chip 220, adhesive layer 230, protecting film 240 and adhesive layer 250.
Induction chip 220 is arranged on substrate 210, and has upper surface 221.According to embodiments of the invention, substrate 210 comprises circuit substrate or insulated substrate.According to embodiments of the invention, induction chip 220 is electrically coupled to circuit substrate.According to embodiments of the invention, induction chip 220 comprises identification of fingerprint chip.
Being different from the fingeprint distinguisher 100 of Fig. 1, in fig. 2, fingeprint distinguisher 200 also comprises adhesive layer 250, and it is folded between substrate 210 and induction chip 220.
Adhesive layer 230 is arranged on substrate 210, around induction chip 220 and the upper surface 221 exposing induction chip 220.In an embodiment of the present invention, the upper surface 231 of adhesive layer 230 flushes with the upper surface 221 of induction chip 220.According to embodiments of the invention, the material of adhesive layer 230 comprises insulating composite material.According to embodiments of the invention, insulating composite material comprises epoxy resin.
Protecting film 240 covers on induction chip 220 and adhesive layer 230, wherein protecting film 240 and adhesive layer 230 unlike material.According to embodiments of the invention, protecting film 240 comprises optics hardened layer.
Fig. 3 is the profile of a kind of fingeprint distinguisher 300 according to embodiments of the invention depicted.In figure 3, fingeprint distinguisher 300 comprises substrate 310, induction chip 320, adhesive layer 330 and protecting film 340.
Induction chip 320 is arranged on substrate 310, and has upper surface 321.According to embodiments of the invention, substrate 310 comprises circuit substrate or insulated substrate.According to embodiments of the invention, induction chip 320 is electrically coupled to circuit substrate.According to embodiments of the invention, induction chip 320 comprises identification of fingerprint chip.
Adhesive layer 330 is arranged on substrate 310, around induction chip 320 and the upper surface 321 exposing induction chip 320.In an embodiment of the present invention, the upper surface 331 of adhesive layer 330 flushes with the upper surface 321 of induction chip 320.According to embodiments of the invention, the material of adhesive layer 330 comprises insulating composite material.According to embodiments of the invention, insulating composite material comprises epoxy resin.
Protecting film 340 covers on induction chip 320 and adhesive layer 330, wherein protecting film 340 and adhesive layer 330 unlike material.According to embodiments of the invention, protecting film 340 comprises color paint layer 341 and optics wearing course 342.
In figure 3, color paint layer 341 covers on induction chip 320 and adhesive layer 330, and optics wearing course 342 covers on color paint layer 341.According to embodiments of the invention, color paint layer 341 comprises color tree lipid layer.According to embodiments of the invention, color paint layer 341 has a color pattern, and this color pattern comprises black, white, other colors or its combination.According to embodiments of the invention, the thickness (t1) of color paint layer 341 is 5～30 microns.According to embodiments of the invention, optics wearing course 342 comprises optics cured coating layer or optical glass layer.According to embodiments of the invention, the hardness of optics wearing course 342 is 5H～9H.According to embodiments of the invention, the thickness (t2) of optics wearing course 342 is 15～40 microns.
Fig. 4 is the profile of a kind of fingeprint distinguisher 400 according to embodiments of the invention depicted.In the diagram, fingeprint distinguisher 400 comprises substrate 410, induction chip 420, adhesive layer 430, protecting film 440 and the first adhesive layer 450.
Induction chip 420 is arranged on substrate 410, and has upper surface 421.According to embodiments of the invention, substrate 410 comprises circuit substrate or insulated substrate.According to embodiments of the invention, induction chip 420 is electrically coupled to circuit substrate.According to embodiments of the invention, induction chip 420 comprises identification of fingerprint chip.
Being different from the fingeprint distinguisher 300 of Fig. 3, in the diagram, fingeprint distinguisher 400 also comprises the first adhesive layer 450, and it is folded between substrate 410 and induction chip 420.
Adhesive layer 430 is arranged on substrate 410, around induction chip 420 and the upper surface 421 exposing induction chip 420.In an embodiment of the present invention, the upper surface 431 of adhesive layer 430 flushes with the upper surface 421 of induction chip 420.According to embodiments of the invention, the material of adhesive layer 430 comprises insulating composite material.According to embodiments of the invention, insulating composite material comprises epoxy resin.
Protecting film 440 covers on induction chip 420 and adhesive layer 430, wherein protecting film 440 and adhesive layer 430 unlike material.According to embodiments of the invention, protecting film 440 comprises color paint layer 441 and optics wearing course 442.
In the diagram, color paint layer 441 covers on induction chip 420 and adhesive layer 430, and optics wearing course 442 covers on color paint layer 441.According to embodiments of the invention, color paint layer 441 comprises color tree lipid layer.According to embodiments of the invention, color paint layer 441 has a color pattern, and this color pattern comprises black, white, other colors or its combination.According to embodiments of the invention, the thickness (t1) of color paint layer 441 is 5～30 microns.According to embodiments of the invention, optics wearing course 442 comprises optics cured coating layer or optical glass layer.According to embodiments of the invention, the hardness of optics wearing course 442 is 5H～9H.According to embodiments of the invention, the thickness (t2) of optics wearing course 442 is 15～40 microns.
Being different from the fingeprint distinguisher 300 of Fig. 3, in the fingeprint distinguisher 400 of Fig. 4, protecting film 440 also comprises the second adhesive layer 443, and it is folded between color paint layer 441 and induction chip 420 and adhesive layer 430.According to embodiments of the invention, the thickness (t3) of the second adhesive layer 443 is 2～10 microns.
Fig. 5 A～5C is the stage profile of the manufacture method of a kind of fingeprint distinguisher 500 according to embodiments of the invention depicted.
In fig. 5, induction chip 520 is formed on substrate 510.In an embodiment of the present invention, substrate 510 comprises circuit substrate or insulated substrate.According to embodiments of the invention, induction chip 520 is electrically coupled to circuit substrate.According to embodiments of the invention, induction chip 520 comprises identification of fingerprint chip.In an embodiment of the present invention, the first adhesive layer 610 is formed between induction chip 520 and substrate 510, as shown in Figure 6.
In figure 5b, adhesive layer 530 is formed on substrate 510.Adhesive layer 530 is around induction chip 520 and the upper surface 521 exposing induction chip 520, and wherein the upper surface 531 of adhesive layer 530 forms flat surfaces with the upper surface 521 of induction chip 520.In an embodiment of the present invention, the upper surface 531 of adhesive layer 530 flushes with the upper surface 521 of induction chip 520.According to embodiments of the invention, the material of adhesive layer 530 comprises insulating composite material.According to embodiments of the invention, insulating composite material comprises epoxy resin.
In figure 5 c, protecting film 540 is formed on induction chip 520 and adhesive layer 530.According to embodiments of the invention, protecting film 540 and adhesive layer 530 unlike material.According to embodiments of the invention, protecting film 540 comprises optics hardened layer.According to embodiments of the invention, the thickness (T) of protecting film 540 is 20～50 microns.
Fig. 7 A～7B is the stage profile of the manufacture method of a kind of fingeprint distinguisher 700 according to embodiments of the invention depicted.Fig. 7 A and Fig. 7 B is hookup 5B.In Fig. 7 A and Fig. 7 B, the step forming protecting film 710 comprises: forms color paint layer 712 and forms optics wearing course 714.
Refer to Fig. 7 A, color paint layer 712 is formed on induction chip 520 and adhesive layer 530.According to embodiments of the invention, color paint layer 712 comprises color tree lipid layer.According to embodiments of the invention, color paint layer 712 has a color pattern, and this color pattern comprises black, white, other colors or its combination.According to embodiments of the invention, the thickness (t1) of color paint layer 712 is 5～30 microns.
Next referring to Fig. 7 B, optics wearing course 714 covers on color paint layer 714.According to embodiments of the invention, optics wearing course 714 comprises optics cured coating layer or optical glass layer.According to embodiments of the invention, the hardness of optics wearing course 714 is 5H～9H.According to embodiments of the invention, the thickness (t2) of optics wearing course 714 is 15～40 microns.
Fig. 8 is the stage profile of the manufacture method of a kind of fingeprint distinguisher 800 according to embodiments of the invention depicted.Fig. 8 is hookup 5B.In fig. 8, the step forming protecting film 810 comprises: forms adhesive layer 816, form color paint layer 812 and form optics wearing course 814.
Adhesive layer 816 is formed on induction chip 520 and adhesive layer 530.According to embodiments of the invention, the thickness (t3) of adhesive layer 816 is 2～10 microns.
Color paint layer 812 is formed on adhesive layer 816.According to embodiments of the invention, color paint layer 812 comprises color tree lipid layer.According to embodiments of the invention, color paint layer 812 has a color pattern, and this color pattern comprises black, white, other colors or its combination.According to embodiments of the invention, the thickness (t1) of color paint layer 812 is 5～30 microns.
Optics wearing course 814 covers on color paint layer 814.According to embodiments of the invention, optics wearing course 814 comprises optics cured coating layer or optical glass layer.According to embodiments of the invention, the hardness of optics wearing course 814 is 5H～9H.According to embodiments of the invention, the thickness (t2) of optics wearing course 814 is 15～40 microns.
Fig. 9 is the flow chart of the manufacture method of a kind of fingeprint distinguisher according to embodiments of the invention depicted.Step 901 in Fig. 9～903 are the manufacture method stage profiles of the fingeprint distinguisher 500 that Fig. 5 A～5C depicted is described.
In step 901, induction chip 520 is formed on substrate 510.In an embodiment of the present invention, substrate 510 comprises circuit substrate or insulated substrate.According to embodiments of the invention, induction chip 520 is electrically coupled to circuit substrate.According to embodiments of the invention, induction chip 520 comprises identification of fingerprint chip
In step 902, adhesive layer 530 is formed on substrate 510.Adhesive layer 530 is around induction chip 520 and the upper surface 521 exposing induction chip 520, and wherein the upper surface 531 of adhesive layer 530 forms flat surfaces with the upper surface 521 of induction chip 520.In an embodiment of the present invention, the upper surface 531 of adhesive layer 530 flushes with the upper surface 521 of induction chip 520.According to embodiments of the invention, the material of adhesive layer 530 comprises insulating composite material.According to embodiments of the invention, insulating composite material comprises epoxy resin.
In step 903, protecting film 540 is formed on induction chip 520 and adhesive layer 530.According to embodiments of the invention, protecting film 540 and adhesive layer 530 unlike material.According to embodiments of the invention, protecting film 540 comprises optics hardened layer.According to embodiments of the invention, the thickness (T) of protecting film 540 is 20～50 microns.
The thickness of insulative potting material cannot be precisely controlled for solving conventional fingerprint device for identifying, make the problem that the fingeprint distinguisher that encapsulation completes has obvious thickness deviation, embodiments of the invention are provided the adhesive layer in a kind of fingeprint distinguisher only around induction chip and the upper surface exposing induction chip, and the upper surface flush of the upper surface of adhesive layer and induction chip.By the upper surface flush of the upper surface of adhesive layer Yu induction chip, and the tolerance of the thickness of the protective layer of follow-up laminating is less, therefore can effectively control the upper structural thickness of induction chip between 20～50 microns.Additionally, due to fingeprint distinguisher provided by the present invention and manufacture method thereof can be precisely controlled the upper structural thickness of induction chip, therefore the integral thickness of fingeprint distinguisher provided by the present invention can accurately be estimated, can utility ratio with what promote fingeprint distinguisher.
On the other hand, eliminate the grinding processing procedure in classical production process due to the manufacture method of fingeprint distinguisher provided by the present invention, be therefore effectively reduced the loss of adhesive layer material and overall manufacturing time.
Although embodiments of the invention are disclosed above; so it is not limited to the present invention, any is familiar with this those skilled in the art, without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention ought be as the criterion with the scope that appending claims defines.
Claims (16)
1. a fingeprint distinguisher, it is characterised in that comprise:
One substrate；
One induction chip, is arranged on this substrate, and has a upper surface；
One adhesive layer, is arranged on this substrate, around this induction chip and this upper surface exposing this induction chip, and wherein this upper surface flush of a upper surface of this adhesive layer and this induction chip；And
One protecting film, covers on this induction chip and this adhesive layer, wherein this protecting film and this adhesive layer unlike material.
2. fingeprint distinguisher according to claim 1, it is characterised in that this substrate comprises a circuit substrate or an insulated substrate.
3. fingeprint distinguisher according to claim 2, it is characterised in that this induction chip is electrically coupled to this circuit substrate.
4. fingeprint distinguisher according to claim 1, it is characterised in that also comprise one first adhesive layer between this induction chip and this substrate.
5. fingeprint distinguisher according to claim 1, it is characterised in that this induction chip comprises an identification of fingerprint chip.
6. fingeprint distinguisher according to claim 1, it is characterised in that the material of this adhesive layer comprises an insulating composite material.
7. fingeprint distinguisher according to claim 5, it is characterised in that this insulating composite material comprises epoxy resin.
8. fingeprint distinguisher according to claim 1, it is characterised in that this protecting film comprises:
One color paint layer, covers on this induction chip and this adhesive layer；And
One optics wearing course, covers on this color paint layer.
9. fingeprint distinguisher according to claim 7, it is characterised in that this optics wearing course comprises optics cured coating layer or an optical glass layer.
10. fingeprint distinguisher according to claim 7, it is characterised in that this protecting film also comprises one second adhesive layer, it is folded between this color paint layer and this induction chip and this adhesive layer.
11. fingeprint distinguisher according to claim 1 a, it is characterised in that thickness of this protecting film is 20～50 microns.
12. the manufacture method of a fingeprint distinguisher, it is characterised in that comprise:
Form an induction chip on a substrate；
Forming an adhesive layer on this substrate, this adhesive layer is around this induction chip and this upper surface exposing this induction chip, and wherein a upper surface of this adhesive layer and this upper surface of this induction chip form a flat surfaces；And
Form a protecting film on this induction chip and this adhesive layer.
13. the manufacture method of fingeprint distinguisher according to claim 12, it is characterised in that also comprise formation one first adhesive layer between this induction chip and this substrate.
14. the manufacture method of fingeprint distinguisher according to claim 12, it is characterised in that form this protecting film and comprise:
Form a color paint layer on this induction chip and this adhesive layer；And
Form an optics wearing course, cover on this color paint layer.
15. the manufacture method of fingeprint distinguisher according to claim 14, it is characterised in that form this optics wearing course and comprise formation one optics cured coating layer or form an optical glass layer.
16. the manufacture method of fingeprint distinguisher according to claim 14, it is characterised in that form this protecting film and also comprise formation one second adhesive layer between this color paint layer and this induction chip and this adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410725076.0A CN105718843A (en) | 2014-12-03 | 2014-12-03 | Fingerprint recognition device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410725076.0A CN105718843A (en) | 2014-12-03 | 2014-12-03 | Fingerprint recognition device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105718843A true CN105718843A (en) | 2016-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410725076.0A Withdrawn CN105718843A (en) | 2014-12-03 | 2014-12-03 | Fingerprint recognition device and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN105718843A (en) |
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| CN107766778A (en) * | 2016-08-19 | 2018-03-06 | 致伸科技股份有限公司 | Induction installation |
| CN107918754A (en) * | 2016-10-11 | 2018-04-17 | 致伸科技股份有限公司 | The method for assembling identification of fingerprint module |
| CN107977595A (en) * | 2016-10-25 | 2018-05-01 | 致伸科技股份有限公司 | Identification of fingerprint module |
| CN108062498A (en) * | 2016-11-08 | 2018-05-22 | 致伸科技股份有限公司 | Identification of fingerprint module and its manufacturing method |
| CN109753844A (en) * | 2017-11-02 | 2019-05-14 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
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| TW200908247A (en) * | 2007-08-10 | 2009-02-16 | Internat Semiconductor Technology Co Ltd | Sliding type thin fingerprint sensor package, package method and substrate thereof |
| CN102034778A (en) * | 2009-10-07 | 2011-04-27 | 精材科技股份有限公司 | Chip package and fabrication method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107766778A (en) * | 2016-08-19 | 2018-03-06 | 致伸科技股份有限公司 | Induction installation |
| CN107918754A (en) * | 2016-10-11 | 2018-04-17 | 致伸科技股份有限公司 | The method for assembling identification of fingerprint module |
| CN107977595A (en) * | 2016-10-25 | 2018-05-01 | 致伸科技股份有限公司 | Identification of fingerprint module |
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| CN109753844A (en) * | 2017-11-02 | 2019-05-14 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
| CN109753844B (en) * | 2017-11-02 | 2024-03-08 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
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