CN105716513A - Novel film sensor and production technology thereof - Google Patents
Novel film sensor and production technology thereof Download PDFInfo
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- CN105716513A CN105716513A CN201610058216.2A CN201610058216A CN105716513A CN 105716513 A CN105716513 A CN 105716513A CN 201610058216 A CN201610058216 A CN 201610058216A CN 105716513 A CN105716513 A CN 105716513A
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- rete
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
Abstract
The invention provides a novel film sensor and a production technology thereof. The novel film sensor comprises upper and lower monomer contact film layers prepared from polyimides film substrates, and a middle filling film layer is arranged between the upper and lower monomer contact film layers; the lower surface of the upper monomer contact film layer is printed with an upper conductive silver slurry layer, an upper conductive plastic resin slurry layer is printed on the upper conductive silver slurry layer, and a non-use function layer on the upper conductive plastic resin slurry layer is printed with an upper insulated resin protective layer; and the upper surface of the lower monomer contact film layer is printed with a lower conductive silver slurry layer, the lower conductive silver slurry layer is printed with a lower conductive plastic resin slurry layer, and a non-use function layer on the lower conductive plastic resin slurry layer is printed with a lower insulated resin protective layer. The upper monomer contact film layer is pasted to lower monomer contact film layer via first and second hot-pressing pasted films, and then an output port of a terminal member is connected. The novel film sensor is simple in technology, suitable for large-scale production and lower in the production cost.
Description
Technical field
The present invention relates to technical field of electronic components, be specifically related to a kind of novel thin film sensor；The invention still further relates to the production technology of a kind of novel thin film sensor.
Background technology
Thin film sensor, as a kind of position sensor, is widely used in all kinds of place needing feedback position information, for instance automobile industry seat position senses, all kinds of monitors etc. of instrument industry.Thin film sensor is typical contact absolute type angular sensor, one is had (to comprise carbon resistance film at resistive film, conductive plastic film, metallic resistance film, conductivity ceramics film etc.) on sliding contact, by external action, contacting points position is made to change thus the ratio of the upper and lower resistance of resistive film, realize output end voltage to change with external position, thin film sensor is by the diverse location printed electrode on press membrane upper strata, the resistance ratios of conducting membrane lower floor printed resistor diaphragm realizes what output voltage changed, in the process, the resistance resistance at two ends will not change with external position, identical with general slide rheostat operation principle, and adopt metal terminal to connect signal lead.Market is all contact with the carbon film of brushing piece Yu resistive surface in existing thin film sensor, forming conduction output, the feature of this contact is that life of product use is low, it is easy to abrasion resistence surface, and existing thin film sensor production process is complicated, be not suitable for producing in enormous quantities.
Summary of the invention
The problem to be solved in the present invention is to provide that a kind of simple in construction, electric property be relatively stable, the novel thin film sensor of friction and longer service life；
To achieve these goals; the technical solution used in the present invention is: a kind of novel thin film sensor; include contact rete on the monomer being made up of Kapton substrate and contact rete with under monomer; described monomer contacts rete the centre contacting rete under described monomer is provided with central filler rete; described monomer contacts the lower surface of rete is printed with conductive silver slurry layer; described upper conductive silver slurry layer is printed with the conductive plastics paste resin bed of material, on described on the conductive plastics paste resin bed of material non-usage functional layer printed thereon have on insulating resin protective layer；
Contact under described monomer and the upper surface of rete be printed with lower conductive silver slurry layer, described lower conductive silver slurry layer is printed with the lower conductive plastics paste resin bed of material, on the described lower conductive plastics paste resin bed of material non-usage functional layer printed thereon have on insulating resin protective layer.
Preferentially, above-mentioned a kind of novel thin film sensor, wherein said central filler rete is made up of Kapton substrate, and centre is provided with through hole.
Preferentially, above-mentioned a kind of novel thin film sensor, the lower surface of wherein said central filler rete, upper surface are respectively arranged with the first hot pressing type pad pasting and the second hot pressing type pad pasting.
It is a further object to provide a kind of packaging technology relatively easy, the production technology of the above-mentioned thin film sensor that processing cost is low.
To achieve these goals, the technical solution used in the present invention is: the production technology of a kind of novel thin film sensor, it is characterised in that this production method specifically sequentially includes the following steps:
Step 1: print conductive silver paste in the front of the first Kapton substrate by thick film reticulated printing method, forms the upper conductive silver slurry layer being attached on described first Kapton substrate, then is put in drying oven and dries；
Step 2: with thick film reticulated printing method conductive silver slurry layer printed thereon nano-level conducting plastic resin slurry on described, form the upper conductive plastics paste resin bed of material being attached on described upper conductive silver slurry layer, then be put in drying oven and dry；
Step 3: with thick film reticulated printing method non-usage functional layer printed thereon insulating resin protective paste on the conductive plastics paste resin bed of material on described; form the upper insulating resin protective layer being attached to above the described upper conductive plastics paste resin bed of material; it is put in drying oven again and dries, ultimately form to have and functional contact rete on the whole；
Step 4: by what print bit line is cut out on some the monomers with independent function contact rete by contacting rete described in monoblock on the whole with plane cutter, stand-by；
Step 5: print conductive silver paste in the front of the second Kapton substrate by thick film reticulated printing method, forms the lower conductive silver slurry layer being attached on described Kapton substrate, then is put in drying oven and dries；
Step 6: by thick film reticulated printing method at described lower conductive silver slurry layer printed thereon nano-level conducting plastic resin slurry, forms the lower conductive plastics paste resin bed of material being attached on described lower conductive silver slurry layer, then is put in drying oven and dries；
Step 7: with thick film reticulated printing method non-usage functional layer printed thereon insulating resin protective paste on the described lower conductive plastics paste resin bed of material; form the lower insulating resin protective layer being attached to above the described lower conductive plastics paste resin bed of material; it is put in drying oven again and dries, ultimately form and there is contact rete under functional entirety；
Step 8: by what print bit line is cut out under some the monomers with independent function contact rete by contacting rete under described entirety with plane cutter, stand-by；
Step 9: cutting out one piece of centre with plane cutter on the 3rd Kapton substrate is hollow central filler rete, stand-by；
Step 10: cut out centre for hollow the first hot pressing type pad pasting and the second hot pressing type pad pasting for adding contact rete and described central filler rete on monomer described in hot adhesion with plane cutter on one piece of hot pressing type pad pasting, stand-by；
Step 11: contacting rete under the described monomer that step 8 is obtained and keep flat, the described first hot pressing type pad pasting layer that step 10 is obtained lies in above the front contacting rete under described monomer, stand-by；
Step 12: the central filler rete that step 9 is obtained lies in above the described first hot pressing type pad pasting layer that above-mentioned steps 11 obtains, stand-by；
Step 13: the described second hot pressing type pad pasting that step 10 is obtained lies in above the described central filler rete that step 12 obtains, stand-by；
Step 14: contact rete on the monomer that step 4 is obtained, be attached on the described second hot pressing type pad pasting layer that step 13 obtains counter for its front；
Step 15: the 5 groups of retes posted through step 11-14, by the mode of the boiling hot pressure of high temperature, makes to contact rete on monomer and is fully contacted with contacting rete under monomer, form the film position sensor of fuction output；
Step 16: contact rete on the monomer in the film position sensor that step 15 is obtained and be stitched together with the output termination contacting rete under monomer, and be put in automatic punching machine and 3 feet are riveted from the contact pin for 2.54 described on output termination；
Step 17: step 16 to the contact pin of 3 2.54 be directly inserted in special terminal plastics, thus forming the terminal member output port that can connect output；
Step 18: contact rete on the monomer in described film position sensor so as to contact with contacting rete under monomer by pressing down, thus forming resistance or the voltage ratio signal of R (PIN1-PIN2)=R (PIN1-PIN3)-R (PIN2-PIN3).
Preferentially, the production technology of above-mentioned a kind of novel thin film sensor, in wherein said step 3, through drying oven dry after and be placed on temperature be in 150-300 DEG C of curing oven solidify baking 30-60 minute.
Preferentially, the production technology of above-mentioned a kind of novel thin film sensor, in its described step 7, through described drying oven dry after and be placed on temperature be in 150-300 DEG C of curing oven solidify baking 30-60 minute.
Preferentially, the production technology of above-mentioned a kind of novel thin film sensor, in its described step 15, the temperature range of the boiling hot pressure of high temperature is 150-300 DEG C.
The present invention has the advantage that and provides the benefit that: includes and contacts rete on the monomer being made up of Kapton substrate and contact rete with under monomer, on monomer, under contact membranes and described monomer, the centre of contact membranes is provided with central filler rete, monomer contacts the lower surface of rete is printed with conductive silver slurry layer, upper conductive silver slurry layer is printed with the conductive plastics paste resin bed of material, on the upper conductive plastics paste resin bed of material non-usage functional layer printed thereon have on insulating resin protective layer, contact under monomer and the upper surface of rete is printed with lower conductive silver slurry layer, lower conductive silver slurry layer is printed with the lower conductive plastics paste resin bed of material, on the lower conductive plastics paste resin bed of material non-usage functional layer printed thereon have on insulating resin protective layer, thinner than traditional potentiometric pick-up, simple in construction, volume is less；Because it is in the middle of non-direct contact during use, compare traditional contact potentiometric pick-up life-span longer, more robust, and technique is simple, is suitable for large-scale production, and production cost is lower.
Accompanying drawing explanation
Fig. 1 is the explosive view of thin film sensor in the present invention；
Fig. 2 is the production technological process of thin film sensor of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, specific embodiments of the invention are elaborated.
Such as Fig. 1, shown in Fig. 2, a kind of novel thin film sensor, include and the monomer being made up of Kapton substrate contacts rete 1 and under monomer, contacts rete 8, monomer contacts rete 1 and is provided with central filler rete 10 with the centre contacting rete 8 under monomer, central filler rete 10 is made up of Kapton substrate, and centre is provided with through hole, the lower surface of central filler rete 10, upper surface is respectively arranged with the first hot pressing type pad pasting 9 and the second hot pressing type pad pasting 11, monomer contacts the lower surface of rete 1 is printed with conductive silver slurry layer 2, upper conductive silver slurry layer 2 is printed with the conductive plastics paste resin bed of material 3, on the upper conductive plastics paste resin bed of material 3 non-usage functional layer printed thereon have on insulating resin protective layer 4；Under monomer contact rete 8 upper surface on be printed with lower conductive silver slurry layer 7, lower conductive silver slurry layer 7 is printed with the lower conductive plastics paste resin bed of material 6, on the lower conductive plastics paste resin bed of material 6 non-usage functional layer printed thereon have on insulating resin protective layer 5.
It is a further object to provide a kind of packaging technology relatively easy, the production technology of the above-mentioned thin film sensor that processing cost is low, this production method specifically sequentially includes the following steps:
S1: by thick film reticulated printing method at a block length 229mm, the front printing conductive silver paste of the blank first Kapton substrate that thickness is 0.125mm of wide 100mm, form the upper conductive silver slurry layer being attached on described first Kapton substrate, then be put in drying oven and dry；
S2: with thick film reticulated printing method conductive silver slurry layer printed thereon nano-level conducting plastic resin slurry on described, form the upper conductive plastics paste resin bed of material being attached on described upper conductive silver slurry layer, then be put in drying oven and dry；
S3: with thick film reticulated printing method non-usage functional layer printed thereon insulating resin protective paste on the conductive plastics paste resin bed of material on described; form the upper insulating resin protective layer being attached to above the described upper conductive plastics paste resin bed of material; it is put in drying oven again and dries; after drying and to be placed on temperature be solidify baking 30-60 minute in 150-300 DEG C of curing oven, ultimately form to have and functional contact rete on the whole；
S4: by what print bit line is cut out on some the monomers with independent function contact rete by contacting rete described in monoblock on the whole with plane cutter, stand-by；
S5: by thick film reticulated printing method at a block length 229mm, the front printing conductive silver paste of the blank second Kapton substrate that thickness is 0.125mm of wide 100mm, form the lower conductive silver slurry layer being attached on described Kapton substrate, then be put in drying oven and dry；
S6: by thick film reticulated printing method at described lower conductive silver slurry layer printed thereon nano-level conducting plastic resin slurry, forms the lower conductive plastics paste resin bed of material being attached on described lower conductive silver slurry layer, then is put in drying oven and dries；
S7: with thick film reticulated printing method non-usage functional layer printed thereon insulating resin protective paste on the described lower conductive plastics paste resin bed of material; form the lower insulating resin protective layer being attached to above the described lower conductive plastics paste resin bed of material; it is put in drying oven again and dries; after drying and to be placed on temperature be solidify baking 30-60 minute in 150-300 DEG C of curing oven, ultimately form and there is under functional entirety contact rete；
S8: by what print bit line is cut out under some the monomers with independent function contact rete by contacting rete under described entirety with plane cutter, stand-by；
S9: cutting out in the middle of some block length 135mm, wide 16.6mm with plane cutter on blank the 3rd Kapton substrate that thickness is 0.125mm of a block length 229mm, wide 100mm is hollow central filler rete, stand-by；
S10: at a block length 150mm, the blank hot pressing type pad pasting that thickness is 0.1mm of wide 100mm cuts out long 135mm with plane cutter, for hollow the first hot pressing type pad pasting and the second hot pressing type pad pasting for adding contact rete and central filler rete on hot adhesion monomer in the middle of wide 16.6mm, stand-by；
S11: contacting rete under the described monomer that step 8 is obtained and keep flat, the described first hot pressing type pad pasting layer that step 10 is obtained lies in above the front contacting rete under described monomer, stand-by；
S12: the central filler rete that step 9 is obtained lies in above the described first hot pressing type pad pasting layer that above-mentioned steps 11 obtains, stand-by；
S13: the described second hot pressing type pad pasting that step 10 is obtained lies in above the described central filler rete that step 12 obtains, stand-by；
S14: contact rete on the monomer that step 4 is obtained, be attached on the described second hot pressing type pad pasting layer that step 13 obtains counter for its front；
S15: the 5 groups of retes posted through step 11-14, by the mode of the boiling hot pressure of the high temperature of 150-300 DEG C, makes to contact rete on monomer and is fully contacted with contacting rete under monomer, form the film position sensor of fuction output；
S16: contact rete on the monomer in the film position sensor that step 15 is obtained and be stitched together with the output termination contacting rete under monomer, and be put in automatic punching machine and 3 feet are riveted from the contact pin for 2.54 described on output termination；
S17: step 16 to the contact pin of 3 2.54 be directly inserted in special terminal plastics, thus forming the terminal member output port that can connect output；
S18: contact rete on the monomer in described film position sensor so as to contact with contacting rete under monomer by pressing down, thus forming resistance or the voltage ratio signal of R (PIN1-PIN2)=R (PIN1-PIN3)-R (PIN2-PIN3).
It is above one embodiment of the present of invention has been described in detail, but described content is only presently preferred embodiments of the present invention, it is impossible to be considered the practical range for limiting the present invention.All equalizations made according to the present patent application scope change and improvement etc., all should still belong within the patent covering scope of the present invention.
Claims (7)
1. a novel thin film sensor; it is characterized in that: include contact rete on the monomer being made up of Kapton substrate and contact rete with under monomer; described monomer contacts rete the centre contacting rete under described monomer is provided with central filler rete; described monomer contacts the lower surface of rete is printed with conductive silver slurry layer; described upper conductive silver slurry layer is printed with the conductive plastics paste resin bed of material, on described on the conductive plastics paste resin bed of material non-usage functional layer printed thereon have on insulating resin protective layer；
Contact under described monomer and the upper surface of rete be printed with lower conductive silver slurry layer, described lower conductive silver slurry layer is printed with the lower conductive plastics paste resin bed of material, on the described lower conductive plastics paste resin bed of material non-usage functional layer printed thereon have on insulating resin protective layer.
2. a kind of novel thin film sensor according to claim 1, it is characterised in that: described central filler rete is made up of Kapton substrate, and centre is provided with through hole.
3. a kind of novel thin film sensor according to claim 2, it is characterised in that: the lower surface of described central filler rete, upper surface are respectively arranged with the first hot pressing type pad pasting and the second hot pressing type pad pasting.
4. the production technology of an a kind of novel thin film sensor as claimed in claim 1, it is characterised in that this production method specifically sequentially includes the following steps:
Step 1: print conductive silver paste in the front of the first Kapton substrate by thick film reticulated printing method, forms the upper conductive silver slurry layer being attached on described first Kapton substrate, then is put in drying oven and dries；
Step 2: with thick film reticulated printing method conductive silver slurry layer printed thereon nano-level conducting plastic resin slurry on described, form the upper conductive plastics paste resin bed of material being attached on described upper conductive silver slurry layer, then be put in drying oven and dry；
Step 3: with thick film reticulated printing method non-usage functional layer printed thereon insulating resin protective paste on the conductive plastics paste resin bed of material on described; form the upper insulating resin protective layer being attached to above the described upper conductive plastics paste resin bed of material; it is put in drying oven again and dries, ultimately form to have and functional contact rete on the whole；
Step 4: by what print bit line is cut out on some the monomers with independent function contact rete by contacting rete described in monoblock on the whole with plane cutter, stand-by；
Step 5: print conductive silver paste in the front of the second Kapton substrate by thick film reticulated printing method, forms the lower conductive silver slurry layer being attached on described Kapton substrate, then is put in drying oven and dries；
Step 6: by thick film reticulated printing method at described lower conductive silver slurry layer printed thereon nano-level conducting plastic resin slurry, forms the lower conductive plastics paste resin bed of material being attached on described lower conductive silver slurry layer, then is put in drying oven and dries；
Step 7: with thick film reticulated printing method non-usage functional layer printed thereon insulating resin protective paste on the described lower conductive plastics paste resin bed of material; form the lower insulating resin protective layer being attached to above the described lower conductive plastics paste resin bed of material; it is put in drying oven again and dries, ultimately form and there is contact rete under functional entirety；
Step 8: by what print bit line is cut out under some the monomers with independent function contact rete by contacting rete under described entirety with plane cutter, stand-by；
Step 9: cutting out one piece of centre with plane cutter on the 3rd Kapton substrate is hollow central filler rete, stand-by；
Step 10: cut out centre for hollow the first hot pressing type pad pasting and the second hot pressing type pad pasting for adding contact rete and described central filler rete on monomer described in hot adhesion with plane cutter on one piece of hot pressing type pad pasting, stand-by；
Step 11: contacting rete under the described monomer that step 8 is obtained and keep flat, the described first hot pressing type pad pasting layer that step 10 is obtained lies in above the front contacting rete under described monomer, stand-by；
Step 12: the central filler rete that step 9 is obtained lies in above the described first hot pressing type pad pasting layer that above-mentioned steps 11 obtains, stand-by；
Step 13: the described second hot pressing type pad pasting that step 10 is obtained lies in above the described central filler rete that step 12 obtains, stand-by；
Step 14: contact rete on the monomer that step 4 is obtained, be attached on the described second hot pressing type pad pasting layer that step 13 obtains counter for its front；
Step 15: the 5 groups of retes posted through step 11-14, by the mode of the boiling hot pressure of high temperature, makes to contact rete on monomer and is fully contacted with contacting rete under monomer, form the film position sensor of fuction output；
Step 16: contact rete on the monomer in the film position sensor that step 15 is obtained and be stitched together with the output termination contacting rete under monomer, and be put in automatic punching machine and 3 feet are riveted from the contact pin for 2.54 described on output termination；
Step 17: step 16 to the contact pin of 3 2.54 be directly inserted in special terminal plastics, thus forming the terminal member output port that can connect output；
Step 18: contact rete on the monomer in described film position sensor so as to contact with contacting rete under monomer by pressing down, thus forming resistance or the voltage ratio signal of R (PIN1-PIN2)=R (PIN1-PIN3)-R (PIN2-PIN3).
5. the production technology of an a kind of novel thin film sensor as claimed in claim 4, it is characterised in that: in described step 3, through drying oven dry after and be placed on temperature be in 150-300 DEG C of curing oven solidify baking 30-60 minute.
6. the production technology of a kind of novel thin film sensor according to claim 5, it is characterised in that: in described step 7, through described drying oven dry after and be placed on temperature be in 150-300 DEG C of curing oven solidify baking 30-60 minute.
7. the production technology of a kind of novel thin film sensor according to claim 6, it is characterised in that: in described step 15, the temperature range of the boiling hot pressure of high temperature is 150-300 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610058216.2A CN105716513B (en) | 2016-01-28 | 2016-01-28 | A kind of novel thin film sensor and production technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610058216.2A CN105716513B (en) | 2016-01-28 | 2016-01-28 | A kind of novel thin film sensor and production technology |
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| CN105716513A true CN105716513A (en) | 2016-06-29 |
| CN105716513B CN105716513B (en) | 2018-06-29 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109088071A (en) * | 2018-08-17 | 2018-12-25 | 深圳新源柔性科技有限公司 | A kind of composite layer and its application |
| CN114962995A (en) * | 2021-02-26 | 2022-08-30 | 新启时代(北京)材料科技有限公司 | Prefabricated sensor film layer, wound gas cylinder health monitoring system and preparation method |
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| CN105224118A (en) * | 2014-06-24 | 2016-01-06 | 深圳市比亚迪电子部品件有限公司 | The method for making of glass sensor, glass sensor and touch-screen in touch-screen |
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| US20080093694A1 (en) * | 2001-08-07 | 2008-04-24 | Hubert Benzel | Method for manufacturing a semcoductor component and a semiconductor component, in particular a diaphragm sensor |
| CN101315824A (en) * | 2008-06-30 | 2008-12-03 | 广东风华高新科技股份有限公司 | Production method of ceramic substrate resistor plate, and resistor plate acquired by this |
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| CN114962995A (en) * | 2021-02-26 | 2022-08-30 | 新启时代(北京)材料科技有限公司 | Prefabricated sensor film layer, wound gas cylinder health monitoring system and preparation method |
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| CN105716513B (en) | 2018-06-29 |
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