CN105716342A - Air-cooling type cooling control method for semiconductor refrigerating equipment - Google Patents
Air-cooling type cooling control method for semiconductor refrigerating equipment Download PDFInfo
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- CN105716342A CN105716342A CN201410710922.1A CN201410710922A CN105716342A CN 105716342 A CN105716342 A CN 105716342A CN 201410710922 A CN201410710922 A CN 201410710922A CN 105716342 A CN105716342 A CN 105716342A
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Abstract
The invention discloses an air-cooling type cooling control method for semiconductor refrigerating equipment. Due to the design of an air-cooling type cooling device of the semiconductor refrigerating equipment, the cooling effect of a cooling module in a natural calm state is greatly improved. Accordingly, through the method, the restrictive condition of starting of a fan can be improved, the fan is controlled to start only when power supply voltage U is higher than a set value, and the rotating speed of the fan is adjusted according to the magnitude of the differential temperature delta T; the fan is controlled to stop operating when the power supply voltage U is smaller than a set value, the fan is not in an operating state all the time, and therefore noise generated by rotation of the fan is lowered while cooling is guaranteed, the service life of the fan is prolonged, and energy consumption is lowered.
Description
Technical field
The invention belongs to refrigeration plant technical field of heat dissipation, particularly a kind of air-cooled cooling control method of semiconductor refrigerating equipment.
Background technology
Semiconductor refrigerating equipment generally all includes semiconductor refrigerating module, cold end radiator and hot-side heat dissipation device.The cold end refrigeration of semiconductor refrigerating module, is freezed to equipment room room by cold end radiator, and hot junction heats, by hot-side heat dissipation device to hot-side heat dissipation,
Existing semiconductor refrigeration system adopts the mode of constant voltage to drive fan so that rotation speed of the fan is constant.But, constant rotating speed is bigger to the abrasion of fan so that the life-span of fan is short, and work noise is big.Have again, owing to the temperature of semiconductor refrigerating module is not constant, when the temperature of semiconductor refrigerating module reduces, only need the low-speed running of fan can meet heat exchange, simultaneously, when the temperature of semiconductor refrigerating module raises, need fan to run up and could meet heat exchange, but, the invariablenes turning speed of fan, not only result in the waste of the energy, also lead to refrigeration low simultaneously.
Additionally, the power supply of semiconductor refrigerating equipment is in order to meet the refrigeration capacity requirement of semiconductor refrigerating module, only it is provided only with a large power supply, while powering for semiconductor refrigerating module, provides running voltage for fan.But, it is only necessary to adopt a small-power power just to ensure that the normal operation of fan, and still adopt large power supply to be powered, then can cause that energy consumption increases, be unfavorable for saves energy.
Additionally, in existing semiconductor refrigerating equipment, when the heat radiation of the overtension at semiconductor refrigerating module two ends of semiconductor refrigerating equipment, the hot junction of semiconductor refrigerating module is bad, the hot-side temperature of semiconductor refrigerating module often rapid increase, ultimately results in semiconductor refrigerating module damage.
Summary of the invention
It is an object of the invention to provide a kind of air-cooled cooling control method of semiconductor refrigerating equipment, reduce fan noise, improve service life.
For solving above-mentioned technical problem, the present invention is achieved by the following technical solutions:
A kind of air-cooled cooling control method of semiconductor refrigerating equipment, described air-cooled heat abstractor includes fan and at least two radiating module, and radiating module includes the heat carrier and the heat pipe that link together, and heat pipe is also associated with groups of fins；Wherein the heat pipe of a radiating module is also connected with the groups of fins of all the other one or more radiating modules, and fan, between groups of fins, the fin of groups of fins offers through hole, and each through hole in same groups of fins forms air channel, and described control method is:
First data acquisition step: the temperature difference △ T of average indoor temperature Tr and the target temperature Ts preset between acquisition；
Refrigeration energizing step: determine the supply voltage U to described semiconductor refrigerating module for power supply according to temperature difference △ T；
Radiating control step:
If supply voltage U > setting value, control starting fan the rotating speed of the size adjustment fan according to temperature difference △ T；
If supply voltage U≤setting value, control fan out of service.
Optionally, semiconductor refrigerating equipment includes the power output module to semiconductor refrigerating module for power supply, it is (Umin that described power output module includes the little output voltage range of rated power, Ubest) the first power output module and the second power output module that the big output voltage range of rated power is (Ubest, Umax)；
Described first power output module is that described fan is powered；
Wherein, described setting value to be Ubest, Ubest the be peak efficiency voltage the highest so that the refrigerating efficiency of described semiconductor refrigerating module；
The maximum cooling capacity voltage of Umax >=determine according to refrigeration plant maximum cooling capacity demand；
The minimum refrigerating capacity voltage of Umin≤determine according to the minimum refrigeration demand of refrigeration plant.
Further, described first data acquisition step also includes the hot-side temperature that gathers described semiconductor refrigerating module；And
Described method also includes between described first data acquisition step and described refrigeration energizing step:
First hot junction forbids that temperature judges step: judge whether described hot-side temperature reaches or forbid temperature beyond what preset；
If described hot-side temperature reaches or forbids temperature described in exceeding, then perform following first and stop power supply step: the supply voltage to described semiconductor refrigerating module is set to zero, stops described semiconductor refrigerating module for power supply.
Further, in described first hot junction, described method forbids that temperature also includes after judging step:
If described hot-side temperature forbids temperature less than described; then continue executing with following hot junction protection temperature upper limit and judge step: judge whether described hot-side temperature reaches or beyond the hot junction protection temperature upper limit preset, wherein said hot junction protection temperature upper limit forbids temperature less than described；
If described hot-side temperature reaches or beyond described hot junction protection temperature upper limit, then performs following first and is down to maintenance voltage steps: reduce the maintenance voltage that described supply voltage is extremely preset；
If described hot-side temperature protects temperature upper limit less than described hot junction, then perform described refrigeration energizing step.
Described method also includes after described first is down to maintenance voltage steps:
Second data acquisition step: obtain the temperature difference of described mean temperature and described target temperature, and gather described hot-side temperature；
Second hot junction forbids that temperature judges step: judge whether described hot-side temperature reaches or forbid temperature described in exceeding；
If described hot-side temperature reaches or forbids temperature described in exceeding, then perform following second and stop power supply step: the supply voltage to described semiconductor refrigerating module is set to zero, stops described semiconductor refrigerating module for power supply；
If described hot-side temperature forbids temperature less than described; then perform following hot junction protection lowest temperature and judge step: judging that whether described hot-side temperature is at or below default hot junction protection lowest temperature, wherein said hot junction protection lowest temperature protects the upper limit less than described hot-side temperature；
If described hot-side temperature protects lowest temperature at or below described hot junction, then perform described refrigeration energizing step；
If described hot-side temperature protects lowest temperature more than described hot junction, then perform following second and be down to maintenance voltage steps: reduce or keep described supply voltage extremely described maintenance voltage.
Optionally, after step is stopped power supply in execution described second, described method loops back described second data acquisition step and continues executing with.
Optionally, perform described second be down to maintenance voltage steps after, described method loops back described second data acquisition step and continues executing with.
Optionally, described maintenance voltage is the minimum refrigerating capacity voltage determined according to the minimum refrigeration demand of refrigeration plant.
Optionally, after performing described radiating control step, described method loops back described first data acquisition step and continues executing with.
Optionally, described first data acquisition step and described second data acquisition step include respectively:
Obtain the described target temperature preset, and gather the described mean temperature of room between refrigeration plant；
Calculate the temperature difference between described mean temperature and described pre-set target temperature Ts.
Compared with prior art, advantages of the present invention and having the benefit effect that
Due to the fact that the design of the air-cooled heat abstractor of semiconductor refrigerating equipment, substantially increase radiating module radiating effect under natural windless condition, thus, the method of the present invention can improve the restrictive condition of starting fan, only in supply voltage U > setting value, control starting fan, and the rotating speed of the size adjustment fan according to temperature difference △ T, when supply voltage U < setting value, control fan out of service, fan is not be in operating condition in real time, thus, while ensureing heat radiation, reduce fan and rotate the noise produced, improve the service life of fan, reduce energy consumption.
The method of the present invention adopts the power output module of different rated power to be semiconductor refrigerating module for power supply, and the first power output module adopting rated power little is that fan is powered, and can reduce energy consumption further.
The method of the present invention is owing to can reach or beyond hot junction protection temperature upper limit at hot-side temperature; reduce or keep to the supply voltage of described semiconductor refrigerating module for power supply be default maintenance voltage; therefore, it is possible to take into account the protection to quasiconductor refrigeration module and refrigeration; namely can continue when quasiconductor refrigeration module is protected semiconductor refrigerating equipment is powered, it is to avoid the refrigeration of semiconductor refrigerating equipment is brought excessive negative effect.
In the method for the invention, when hot-side temperature reaches or beyond forbidding temperature, then stop quasiconductor refrigeration module is powered, therefore avoid hot-side temperature too high time burn out semiconductor refrigerating module.
In the method for the invention, supply voltage is made to be equal to maximum cooling capacity voltage when the temperature difference is be more than or equal to default temperature difference threshold, therefore, it is possible to reduce rapidly temperature when the temperature difference is bigger with higher refrigerating efficiency so that the temperature difference tends to rapidly a smaller value；Making when the temperature difference is reduced to temperature difference threshold supply voltage start to decline from maximum cooling capacity voltage, therefore, it is possible to avoid cooling too fast, in order to avoid being reduced to the temperature far below preset value, causing bad refrigeration.
After reading in conjunction with the accompanying the detailed description of embodiment of the present invention, the other features and advantages of the invention will become clearer from.
Accompanying drawing explanation
Fig. 1 is the structural representation of semiconductor refrigerating equipment according to an embodiment of the invention.
Fig. 2 is the structural representation one of hot-side heat dissipation device in semiconductor refrigerating equipment according to an embodiment of the invention.
Fig. 3 is the structural representation two of hot-side heat dissipation device in semiconductor refrigerating equipment according to an embodiment of the invention.
Fig. 4 is Fig. 3 apoplexy flow principles figure in groups of fins.
Fig. 5 is the flow chart of the air-cooled heat dissipating method of semiconductor refrigerating equipment according to an embodiment of the invention.
Fig. 6 is the example graph that its supply voltage is controlled by supply voltage control method when semiconductor refrigerating module hot-side temperature is higher according to an embodiment of the invention.
Fig. 7 is that supply voltage control method quickly obtains maximum cooling capacity and the example graph mean temperature of room between semiconductor refrigerating equipment accurately controlled to the target temperature set with higher refrigerating efficiency according to an embodiment of the invention.
Fig. 8 is the supply voltage example graph with refrigerating efficiency and refrigerating capacity relation of semiconductor refrigerating module according to an embodiment of the invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Owing to the equipment of existing employing semiconductor refrigerating generally adopts fan that the hot junction of quasiconductor refrigeration module is carried out wind-cooling heat dissipating, need to consume substantial amounts of electric energy and fan operating noise always is comparatively serious, such as Fig. 1-4, hot-side heat dissipation device 400 in the present embodiment includes the second heat carrier 41, many second heat pipes 42 and groups of fins 43, described second heat pipe 42 is connected on described second heat carrier 41, and described groups of fins 43 is connected on described second heat pipe 42.Concrete, second heat carrier 41 is attached to the hot junction of semiconductor refrigerating module 200, and groups of fins 43 is attached on shell 101, the heat that the hot junction of semiconductor refrigerating module produces passes to the second heat pipe 42 by the second heat carrier 41, second heat pipe 42 can quickly transfer heat in groups of fins 43, and groups of fins 43 can make the radiator of larger area as required, groups of fins 43 can utilize the heat that the second heat pipe 42 is transmitted by the area of dissipation that self is bigger to carry out quick heat radiating, directly is dispelled the heat in the hot junction of quasiconductor refrigeration module from without by fan.Wherein, in order to utilize each groups of fins 43 to dispel the heat fully, being also associated with the 3rd heat pipe 44 on second heat carrier 41, described 3rd heat pipe 44 in arbitrary described hot-side heat dissipation device 400 is also connected with the described groups of fins 43 in hot-side heat dissipation device 400 all the other described.In actual use, when the heat that the work of each semiconductor refrigerating module produces is identical, each semiconductor refrigerating module is dispelled the heat by respective groups of fins 43, and when the heat dissipation capacity of some semiconductor refrigerating module is bigger, the second heat carrier 41 being connected to this semiconductor refrigerating module heat is transferred heat in groups of fins corresponding to other semiconductor refrigerating modules 43 by the 3rd heat pipe 44, such that it is able to utilize whole groups of fins 43 to dispel the heat more efficiently；In the design process, each second heat carrier 41 can pass through the 3rd heat pipe 44 and carry out thermally coupled with remaining groups of fins 43, for the heat-sinking capability of whole groups of fins 43, thus realizing natural cooling.And in order to strengthen the draught capacity of groups of fins 43, groups of fins 43 includes multi-disc radiating fin 431, described radiating fin 431 is provided with air vent 432, the multiple described air vent 432 being positioned on same axis forms air channel, outside groups of fins 43 is aerated other than with the interval between radiating fin 431, also utilize air vent 432 to form air channel to be aerated, such that it is able to effectively strengthen the draught capacity of groups of fins 43.And run when each semiconductor refrigerating module is under relatively high power, in order to meet the requirement of high-power heat-dissipation, the side in air channel is provided with fan 45, fan 45 can accelerate the flowing of air channel apoplexy, and relatively gently easily flow upward due to hot-air, in air vent 432, the wind of percolation will make hot-air vortex flow between two radiating fins 431, farthest utilize the area of radiating fin 431 to dispel the heat.As shown in Figure 3 and Figure 4, in order to utilize radiating fin 431 to dispel the heat more fully, except being positioned at the radiating fin 431 in outside, all the other radiating fins 431 offer breach 433, it is positioned at the breach 433 on sustained height position and forms auxiliary air channel, groups of fins 43 is additionally provided with cover body 46, described fan 45 is also located at the inner side in auxiliary air channel and is fixed on cover body 46, cover body 46 hides in groups of fins 43, the bottom of cover body 46 forms air inlet, and the upper end of cover body 46 forms air outlet, fan 45 starts in backward auxiliary air channel dries, accelerate the air flowing between radiating fin 431, and hot-air rises from air outlet output, the cold air making the external world enters between radiating fin 431 from the air inlet of bottom, make the cold wind can from bottom to up in motor process, whole surface through radiating fin 431, to make full use of the heat-sinking capability of radiating fin 431；And the position being used for installing fan 45 on cover body 46 is further opened with vent 461, extraneous wind is further incorporated in radiating fin 431 by fan 45 by vent 461.Wherein, the both sides of each second heat carrier 41 are respectively arranged with groups of fins 43, and fan 45 is simultaneously between two groups of fins 43.
Fig. 5 is the flow chart of the cooling control method of the air-cooled heat abstractor of semiconductor refrigerating equipment according to an embodiment of the invention.In the embodiment shown in fig. 1, this cooling control method comprises the steps that
First data acquisition step 101, gathers the hot-side temperature Thot of semiconductor refrigerating module；Obtain the temperature difference △ T of the mean temperature Tr of room and the target temperature Ts preset between refrigeration plant.Its detailed process may include that and obtains the target temperature Ts preset, and gathers the mean temperature Tr of room between refrigeration plant；Calculate the temperature difference △ T between mean temperature Tr and preset value Ts.
First hot junction forbids that temperature judges step 102, it is judged that whether hot-side temperature Thot reaches or forbid temperature beyond what preset；If hot-side temperature Thot reaches or beyond forbidding temperature, then perform first and stop power supply step 103: zero will be set to the supply voltage U of semiconductor refrigerating module, stop quasiconductor refrigeration module is powered；
Hot junction protection temperature upper limit judges step 104, performs less than when forbidding temperature at hot-side temperature Thot, it is judged that whether hot-side temperature Thot reaches or beyond the hot junction protection temperature upper limit preset, wherein protection temperature upper limit in hot junction is less than forbidding temperature；If hot-side temperature Thot protects temperature upper limit less than hot junction, then perform refrigeration energizing step 105: provide described supply voltage U to described semiconductor refrigerating module.
In this embodiment, in refrigeration energizing step 105, rule can be regulated according to default PID, by formula U=UPID (△ the T)+Ubest supply voltage U determined to the semiconductor refrigerating module for power supply of refrigeration plant, wherein U is the supply voltage to described semiconductor refrigerating module for power supply, Ubest is the peak efficiency voltage the highest so that the refrigerating efficiency of described semiconductor refrigerating module, △ T is the temperature difference of the mean temperature of room and default target temperature between refrigeration plant, the described temperature difference is carried out the numerical value that computing draws for regulating rule according to described PID by UPID (△ T).
The present embodiment is to the power output module of semiconductor refrigerating module for power supply, first power output module little including rated power and big the second power output module of rated power, the voltage range of the first power output module output is (Umin, Ubest), the voltage range of the second power output module output is (Ubest, Umax)；
Wherein, the first power output module is that described fan is powered；
Ubest is the peak efficiency voltage the highest so that the refrigerating efficiency of described semiconductor refrigerating module；
The maximum cooling capacity voltage of Umax >=determine according to refrigeration plant maximum cooling capacity demand；
The minimum refrigerating capacity voltage of Umin≤determine according to the minimum refrigeration demand of refrigeration plant.
After performing refrigeration energizing step 105, the present embodiment is also performed to radiating control step 112:
If supply voltage U > Ubest, enter and control starting fan step 113, and the rotating speed of the size adjustment fan according to temperature difference △ T；If supply voltage U≤Ubest, enter and control fan step 114 out of service.
The control mode of the present embodiment fan can be pulsewidth modulation (PWM), adjusts the voltage of fan by adjusting dutycycle, thus changing its rotating speed.
It should be noted that in some other embodiment of supply voltage control method of the present invention, the first hot junction forbid temperature judge step 102 protect temperature upper limit to judge step 104 to hot junction it is not necessary to.In such embodiments, the first data acquisition step 101 can only gather temperature difference △ T, without gathering hot-side temperature Thot；After the first data acquisition step 101 is finished, directly perform refrigeration energizing step 105.
In one embodiment of the invention, if hot-side temperature Thot reaches or beyond hot junction protection temperature upper limit, then performs first and is down to maintenance voltage steps 106: reduce or keep supply voltage U to the maintenance voltage Ukeep preset.Described maintenance voltage Ukeep can maintain, under, the extreme case such as air circulation is poor, humidity is excessive, the temperature difference is bigger too high in ambient temperature, the voltage that between refrigeration plant, the mean temperature Tr of room slowly rises or declines, and its a purpose is in that to ensure that the temperature in hot junction is not more than default hot junction protection lowest temperature as far as possible.
In another embodiment of the present invention, after first is down to maintenance voltage steps 106, performs second data acquisition step the 107, second hot junction successively and forbid that temperature judges step 108.Second data acquisition step 107 is: gather hot-side temperature Thot, and in some embodiments of the invention, the second data acquisition step 107 may also include acquisition temperature difference △ T.Second hot junction forbids that temperature judges that step 108 is: judge whether hot-side temperature Thot reaches or beyond forbidding temperature.
After above-mentioned second hot junction forbids that temperature judges that step 108 is finished, if hot-side temperature Thot reaches or beyond forbidding temperature, then perform second to stop power supply step 109: zero will be set to the supply voltage U of semiconductor refrigerating module, stop quasiconductor refrigeration module is powered；If hot-side temperature Thot is less than forbidding temperature, then performs hot junction protection lowest temperature and judge step 110: judging that whether hot-side temperature Thot is at or below default hot junction protection lowest temperature, wherein protection lowest temperature in hot junction protects the upper limit less than hot-side temperature.After step 109 is stopped power supply in execution second, the supply voltage control method of the present invention can loop back the second data acquisition step 107 and continue executing with.
After above-mentioned hot junction protection lowest temperature judges that step 110 is finished, if hot-side temperature Thot protects lowest temperature at or below hot junction, then perform refrigeration energizing step 105, radiating control step 112；If hot-side temperature Thot protects lowest temperature more than hot junction, then perform second and be down to maintenance voltage steps 111: reduce or keep supply voltage U to maintaining voltage Ukeep.So higher at hot-side temperature; but when not yet sufficiently achieving the condition stopping that quasiconductor refrigeration module is powered; the refrigerating capacity of refrigeration plant is met with relatively low supply voltage U; also the hot-side temperature making semiconductor refrigerating module declines, thus protecting semiconductor refrigerating module when not stopping freezing.After maintenance voltage steps 111 is down in execution second, the supply voltage control method of the present invention is recycled into the second data acquisition step 107 and continues executing with.
Fig. 6 is the example graph that its supply voltage is controlled by supply voltage control method when semiconductor refrigerating module hot-side temperature is higher according to an embodiment of the invention.In the embodiment shown in fig. 7; too high in such as ambient temperature, when air circulation is poor, humidity is excessive, temperature difference △ T needs big refrigerating capacity be more than or equal to the refrigeration plant such as default temperature difference threshold △ Tthd; with maximum cooling capacity voltage Umax-cold for supply voltage; the cold end making semiconductor refrigerating module comparatively fast freezes, and hot-side temperature Thot is gradually increased to the hot-side temperature protection upper limit by a low value.In the process, constantly carry out hot junction protection temperature upper limit and judge step 104.When protecting temperature upper limit to judge the judgement of step 104 as reaching or protecting temperature upper limit beyond hot junction in hot junction, as shown in Figure 6, perform first and be down to maintenance voltage steps 106 so that supply voltage U is reduced to maintenance voltage Ukeep.Owing to supply voltage U have dropped, hot-side temperature Thot also declines, and in the process, performs second data acquisition step the 107, second hot junction successively and forbids that temperature judges step 108.As shown in Figure 6, hot-side temperature Thot is not above forbidding temperature, and therefore the second hot junction forbids that temperature judges that the judgement of step 108 is always no, according to preceding method, performs hot junction protection lowest temperature and judges step 110.When hot-side temperature Thot reaches hot junction protection lowest temperature, then perform refrigeration energizing step 105.As seen from Figure 7, if now temperature difference △ T is more than temperature difference threshold △ Tthd, then regulating the regular supply voltage U obtained according to PID can be maximum cooling capacity voltage Umax-cold.Repeat said process, until the mean temperature △ T of room is less than starting after temperature difference threshold △ Tthd to regulate rule reduction voltage by PID between refrigeration plant.
Fig. 7 is that supply voltage control method quickly obtains maximum cooling capacity and the example graph mean temperature of room between semiconductor refrigerating equipment accurately controlled to the target temperature set with higher refrigerating efficiency according to an embodiment of the invention.May be arranged such that when temperature difference △ T is be more than or equal to default temperature difference threshold △ Tthd as it is shown in fig. 7, PID regulates rule so that supply voltage U is equal to maximum cooling capacity voltage Umax-cold, and so between energy pair, room lowers the temperature rapidly；When temperature difference △ T is reduced to temperature difference threshold △ Tthd, supply voltage U is made to start to decline from maximum cooling capacity voltage Umax-cold, so no longer with bigger supply voltage, quasiconductor refrigeration module is powered, it is possible to avoid the temperature in refrigeration plant to be reduced to and cause bad refrigeration far below the temperature of pre-set value.In refrigeration energizing step 105, it is possible to by this rule, quasiconductor refrigeration module is powered.
In one embodiment of the invention, as shown in Figure 7, PID regulates rule and can be set that after temperature difference △ T is reduced to null value first so that supply voltage U experience fluctuation change so that temperature difference △ T equal to or tend to the supply voltage U of null value to semiconductor refrigerating module for power supply.In refrigeration energizing step 105, by this rule, quasiconductor refrigeration module can be powered.So enable to supply voltage U finally stable near peak efficiency voltage Ubest.In conjunction with Fig. 7 and Fig. 6 it can be seen that in the figure 7, when temperature difference △ T is reduced in default temperature difference threshold △ Tthd, supply voltage can be certain value lower than maximum cooling capacity voltage Umax-cold；Then, after temperature difference △ T is reduced to null value first so that supply voltage experience fluctuation change so that temperature difference △ T equal to or tend to the supply voltage of null value to described semiconductor refrigerating module for power supply.
Fig. 8 is the supply voltage example graph with refrigerating efficiency and refrigerating capacity relation of semiconductor refrigerating module according to an embodiment of the invention.As shown in Figure 8, the relation according to supply voltage U Yu refrigerating efficiency, supply voltage U can be divided into 4 regions: the first non-economy district 401, efficient district 402, the 403, second non-economy district 404 of high refrigerating capacity district.The refrigerating capacity in the first non-economy district 401 is very little, substantially can not meet the minimum refrigeration demand of refrigeration plant；Although the refrigerating capacity of quasiconductor itself is likely to meet the minimum refrigeration demand of refrigeration plant in the second non-economy district 404, but owing to the supply voltage U needed for this region is high, power consumption is higher much than efficient district 402 and high refrigerating capacity district 403；Therefore in an embodiment of the present invention, the supply voltage U not using the first non-economy district 401 and the second non-economy district 404 is semiconductor refrigerating module for power supply, but makes the supply voltage U of semiconductor refrigerating module be positioned at efficient district 402 and high refrigerating capacity district 403.That is, in an embodiment of the present invention, by according to the requirement to quasiconductor refrigerating device refrigeration efficiency, maximum (i.e. maximum supply voltage Umax) and the minima (i.e. minimum supply voltage Umin) of semiconductor refrigerating module for power supply voltage used is determined, make the running voltage of semiconductor refrigerating module be positioned at efficient district 402 and high refrigerating capacity district 403 that the two value limits according to experiment.
As shown in Figure 8, maximum supply voltage Umax can be chosen for maximum cooling capacity voltage Umax-cold by experiment, that is: the PID in the present invention can be regulated rule to be arranged to make it make the maximum of supply voltage U be confirmed as maximum cooling capacity voltage Umax-cold in previously described formula, it is to say, UPID (△ T) is assigned when △ T is more than temperature difference threshold △ Tthd and is defined to maximum cooling capacity voltage Umax-cold and subtracts peak efficiency voltage Ubest.
Also as shown in Figure 8, minimum supply voltage Umin can be chosen for the supply voltage U, i.e. minimum refrigerating capacity voltage Umin-cold demarcated with efficient district 402 in the first economic zone 401 by experiment.Similarly, the PID in the embodiment of the present invention can be regulated rule to be arranged to make it make the minima of supply voltage U be confirmed as minimum refrigerating capacity voltage Umin-cold in previously described formula.It is to say, UPID (△ T) can be assigned when △ T is less than certain threshold value and be defined to minimum refrigerating capacity voltage Umin-cold to subtract the peak efficiency voltage Ubest(voltage value now calculated be a negative value).In some alternate embodiment of the present invention, minimum supply voltage Umin also can slightly below meeting the minimum refrigerating capacity voltage Umin-cold of refrigeration plant.
Additionally, as those skilled in the art according to Fig. 8 it can be appreciated that, peak efficiency voltage Ubest can through experiment obtain, its value is obviously between maximum cooling capacity voltage Umax-cold and minimum refrigerating capacity voltage Umin-cold.
It is to be appreciated that maintain voltage Ukeep generally can between minimum supply voltage Umin and peak efficiency voltage Ubest value.The selection principle maintaining voltage Ukeep is to consider when refrigeration plant is under the extreme cases such as ambient temperature is too high, air circulation is poor, humidity is excessive, the temperature difference is bigger, makes the temperature in refrigeration plant can also be preferably minimized design temperature quickly.The value maintaining voltage Ukeep being selected is under these extreme cases, is drawn by simulation experiment, and the difference of this value and Umax-cold is not as big.
Last it is noted that above example is only in order to illustrate technical scheme, it is not intended to limit；Although the present invention being described in detail with reference to previous embodiment, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or wherein portion of techniques feature is carried out equivalent replacement；And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. the air-cooled cooling control method of semiconductor refrigerating equipment, it is characterised in that described air-cooled heat abstractor includes fan and at least two radiating module, radiating module includes the heat carrier and the heat pipe that link together, and heat pipe is also associated with groups of fins；Wherein the heat pipe of a radiating module is also connected with the groups of fins of all the other one or more radiating modules, and fan, between groups of fins, the fin of groups of fins offers through hole, and each through hole in same groups of fins forms air channel, and described control method is:
First data acquisition step: the temperature difference △ T of average indoor temperature Tr and the target temperature Ts preset between acquisition；
Refrigeration energizing step: determine the supply voltage U to described semiconductor refrigerating module for power supply according to temperature difference △ T；
Radiating control step:
If supply voltage U > setting value, control starting fan the rotating speed of the size adjustment fan according to temperature difference △ T；
If supply voltage U≤setting value, control fan out of service.
2. method according to claim 1, it is characterized in that, described semiconductor refrigerating equipment includes the power output module to semiconductor refrigerating module for power supply, it is (Umin that described power output module includes the little output voltage range of rated power, Ubest) the first power output module and the second power output module that the big output voltage range of rated power is (Ubest, Umax)；
Described first power output module is that described fan is powered；
Wherein, described setting value to be Ubest, Ubest the be peak efficiency voltage the highest so that the refrigerating efficiency of described semiconductor refrigerating module；
The maximum cooling capacity voltage of Umax >=determine according to refrigeration plant maximum cooling capacity demand；
The minimum refrigerating capacity voltage of Umin≤determine according to the minimum refrigeration demand of refrigeration plant.
3. method according to claim 1 and 2, it is characterised in that
Described first data acquisition step also includes the hot-side temperature gathering described semiconductor refrigerating module；And
Described method also includes between described first data acquisition step and described refrigeration energizing step:
First hot junction forbids that temperature judges step: judge whether described hot-side temperature reaches or forbid temperature beyond what preset；
If described hot-side temperature reaches or forbids temperature described in exceeding, then perform following first and stop power supply step: the supply voltage to described semiconductor refrigerating module is set to zero, stops described semiconductor refrigerating module for power supply.
4. method according to claim 3, it is characterised in that
In described first hot junction, described method forbids that temperature also includes after judging step:
If described hot-side temperature forbids temperature less than described; then continue executing with following hot junction protection temperature upper limit and judge step: judge whether described hot-side temperature reaches or beyond the hot junction protection temperature upper limit preset, wherein said hot junction protection temperature upper limit forbids temperature less than described；
If described hot-side temperature reaches or beyond described hot junction protection temperature upper limit, then performs following first and is down to maintenance voltage steps: reduce the maintenance voltage that described supply voltage is extremely preset；
If described hot-side temperature protects temperature upper limit less than described hot junction, then perform described refrigeration energizing step.
5. method according to claim 4, it is characterised in that
Described method also includes after described first is down to maintenance voltage steps:
Second data acquisition step: obtain the temperature difference of described mean temperature and described target temperature, and gather described hot-side temperature；
Second hot junction forbids that temperature judges step: judge whether described hot-side temperature reaches or forbid temperature described in exceeding；
If described hot-side temperature reaches or forbids temperature described in exceeding, then perform following second and stop power supply step: the supply voltage to described semiconductor refrigerating module is set to zero, stops described semiconductor refrigerating module for power supply；
If described hot-side temperature forbids temperature less than described; then perform following hot junction protection lowest temperature and judge step: judging that whether described hot-side temperature is at or below default hot junction protection lowest temperature, wherein said hot junction protection lowest temperature protects the upper limit less than described hot-side temperature；
If described hot-side temperature protects lowest temperature at or below described hot junction, then perform described refrigeration energizing step；
If described hot-side temperature protects lowest temperature more than described hot junction, then perform following second and be down to maintenance voltage steps: reduce or keep described supply voltage extremely described maintenance voltage.
6. method according to claim 5, it is characterised in that
After step is stopped power supply in execution described second, described method loops back described second data acquisition step and continues executing with.
7. method according to claim 5, it is characterised in that
Perform described second be down to maintenance voltage steps after, described method loops back described second data acquisition step and continues executing with.
8. method according to claim 4, it is characterised in that
Described maintenance voltage is the minimum refrigerating capacity voltage determined according to the minimum refrigeration demand of refrigeration plant.
9. the method according to any one of claim 1-8, it is characterised in that
After performing described radiating control step, described method loops back described first data acquisition step and continues executing with.
10. method according to claim 1 or 5, it is characterised in that described first data acquisition step and described second data acquisition step include respectively:
Obtain the described target temperature preset, and gather the described mean temperature of room between refrigeration plant；
Calculate the temperature difference between described mean temperature and described pre-set target temperature Ts.
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| CN114111197A (en) * | 2020-08-28 | 2022-03-01 | 青岛海尔特种电冰柜有限公司 | Control method of refrigeration appliance and refrigeration appliance |
| CN114251867A (en) * | 2020-09-25 | 2022-03-29 | 青岛海尔特种电冰柜有限公司 | Control method of semiconductor refrigeration device |
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