CN105711032A - In mold decoration method and material for electronic equipment - Google Patents
In mold decoration method and material for electronic equipment Download PDFInfo
- Publication number
- CN105711032A CN105711032A CN201610082758.3A CN201610082758A CN105711032A CN 105711032 A CN105711032 A CN 105711032A CN 201610082758 A CN201610082758 A CN 201610082758A CN 105711032 A CN105711032 A CN 105711032A
- Authority
- CN
- China
- Prior art keywords
- pattern
- thin film
- word
- film
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/02—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore of moulding techniques only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
- B29C2045/14704—Coating articles provided with a decoration ink decorations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
- B29C2045/14713—Coating articles provided with a decoration decorations in contact with injected material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Printing Methods (AREA)
Abstract
The embodiment of the invention discloses an in mold decoration method and a material for electronic equipment. The in mold decoration method comprises the following steps of printing set patterns and/or characters on a film; placing the printed film in a metal mould, injecting a material for moulding into the metal film and curing the material for moulding with the printed film, and transferring the set patterns and/or characters onto the material for moulding; and peeling the film on the material for moulding, and exposing the set patterns and/or characters on the outer surface of the material for moulding.
Description
Technical field
The present invention relates to the printing technology based on in-mold decoration (IMD, InMoldDecoration), particularly relate to a kind of in-mold decorative method and electronic equipment material.
Background technology
At present, the printing of electronic equipment material, typically via one-body molded (NMT, NanoMoldingTechnology) technology realizes, but this method can cause that plastic cement exposed parts is not easily decorated, and it is typically only capable to keep plastic cement true qualities, also has only a few scheme can spray paint after adopting or printing technology is decorated, but it is limited that this method still results in printing zone, size and all conditional technical problem of printing zone curved surface seriality.
Summary of the invention
For solving the technical problem of existing existence, embodiments provide a kind of in-mold decorative method and electronic equipment material.
The technical scheme of the embodiment of the present invention is achieved in that
A kind of in-mold decorative method, described method includes:
Thin film prints pattern and/or the word of setting；
Thin film after printing is placed in mould, and molding material is injected in described mould with printing after film hardening, make the pattern of setting and/or words transfer printing to described molding material；
Thin film on described molding material is peeled off, makes the pattern of setting and/or word be revealed in the outer surface on described molding material.
In the embodiment of the present invention, described thin film includes Merlon (PC, Polycarbonate) thin film or polyethylene terephthalate (PET, Polyethyleneterephthalate) thin film or acrylonitrile-butadiene-styrene copolymer (ABS, AcrylonitrileButadieneStyrenecopolymers) thin film.
In the embodiment of the present invention, after the described pattern printing setting on thin film and/or word, described method also includes:
The film drying that will print, makes the pattern of printing and/or word be fixed on thin film.
In the embodiment of the present invention, after the pattern printed and/or word are fixed on thin film, described method also includes:
It is being printed with the film surface pasting protective film of pattern and/or word.
In the embodiment of the present invention, described molding material includes plastic cement.
In the embodiment of the present invention, described mould is metal pattern.
A kind of electronic equipment material, described material is provided with pattern and/or word, described pattern and/or word and is made by any one in-mold decorative method above-mentioned.
In the embodiment of the present invention, first on thin film, print pattern and/or the word of setting, and the thin film printed is placed in metal pattern, by injecting molding material in metal pattern, molding material is made to form electronic equipment parts to be processed, and make the parts after processing transfer pattern and/or the word of setting, thus on the parts to be processed of electronic equipment, print corresponding pattern and/or word.By the pattern and character etc. that the embodiment of the present invention is printed, damage resistant, corrosion resistance are strong, long service life, and pattern and character or its color etc. can arbitrarily be arranged, and it is more convenient to process.
Accompanying drawing explanation
Fig. 1 is the process flow chart of the in-mold decorative method of the embodiment of the present invention.
Detailed description of the invention
In order to more fully hereinafter understand feature and the technology contents of the present invention, below in conjunction with accompanying drawing, the realization of the present invention is described in detail, appended accompanying drawing purposes of discussion only for reference, is not used for limiting the present invention.
Fig. 1 is the process flow chart of the in-mold decorative method of the embodiment of the present invention, as it is shown in figure 1, the in-mold decorative method of the embodiment of the present invention, including following operation:
1, on thin film, print pattern and/or the word of setting；
2, the thin film after printing is placed in metal pattern, and molding material is injected in described metal pattern with printing after film hardening, make the pattern of setting and/or words transfer printing to described molding material；
3, the thin film on described molding material is peeled off, make the pattern of setting and/or word be revealed in the outer surface on described molding material.
In the embodiment of the present invention, when described molding material is injected after in metal pattern, the electronic equipment parts corresponding with metal mold cavity shapes can be generated, now, thin film is attached to the surface with film contacts, owing to being printed on thin film before the pattern set and/or word, this will cause that the pattern set and/or word are covered by thin film, therefore, need to peel off the thin film that be attached on electronic equipment parts, make the pattern of setting and/or word at the corresponding surface open of electronic equipment parts.
In the embodiment of the present invention, described thin film includes PC thin film or PET film or ABS thin film.
In the embodiment of the present invention, after the described pattern printing setting on thin film and/or word, also include following operation:
The film drying that will print, makes the pattern of printing and/or word be fixed on thin film.
In the embodiment of the present invention, after the pattern printed and/or word are fixed on thin film, also include following operation:
It is being printed with the film surface pasting protective film of pattern and/or word.
In the embodiment of the present invention, described molding material includes the materials such as plastic cement.
Below by way of concrete example, the essence of the technical scheme of the embodiment of the present invention is expanded on further.
The in-mold decorative method of the embodiment of the present invention includes following technique:
1) material is cut out: thin film (Film) is cut into and designs size such as square block, for printing, molding procedure.
2) planographic: icon as requested, word manufacture film net, prints icon, word etc. on the film F ilm cut.
The embodiment of the present invention is actually uses printing technology, high-pressure molding and matching die technology, 3D die-cut and the combination of 3D die cutting die technology and emission technology.The printing technology of the embodiment of the present invention is as the front end of technique, particularly important, it is the emphasis influence factor of product yield, compared with conventional printing techniques, the printing technology of the embodiment of the present invention is more harsh, and the major part phenomenon such as red ink, fracture, printing opacity, Pericarpium Citri Reticulatae is all likely to be caused by printing.Therefore, the embodiment of the present invention needs to do a few thing before thin film is printed and prepares: in general due to thin-film sheet self reason or store method reason, thin-film sheet contains moisture, so to do dried, and owing to make thin-film sheet washing shrinkage keep consistent before printing afterwards, make thin-film sheet keep the Flue curing parameter set once to toast when printing before printing.
3) ink setting is fixed: be placed on by the thin film (Film) printed in high temperature ovens dry, the ink on fixing thin film.
4) pasting protective film: avoid doing the pattern and character etc. on the film F ilm surface that flower has printed in follow-up when rushing location hole operation, it is possible to stick monolayer or double shielding film at the film surface printed.
5) hole, punching location: in this operation, it is necessary to the hole, thin film punching location after printing, thin film is positioned when cutting operation.
6) peripheral shape is sheared: utilize bicker to coordinate 3D die cutting die that the waste material of thin film is cut off.
7) material injection: remove the protecting film on thin film, thin film is placed in metal pattern, and molding material is injected in described metal pattern with molding after film hardening, make the pattern of setting and/or words transfer printing to described molding material.
8) thin film on described molding material is peeled off, make the pattern of setting and/or word be revealed in the outer surface on described molding material.Complete the pattern and character printing to electronic equipment parts.
The embodiment of the present invention has also stated that a kind of electronic equipment material, and described material is provided with pattern and/or word, and described pattern and/or word are to be made by the in-mold decorative method of any one embodiment aforementioned.
The above, be only presently preferred embodiments of the present invention, is not intended to limit protection scope of the present invention.
Claims (7)
1. an in-mold decorative method, described method includes:
Thin film prints pattern and/or the word of setting；
Thin film after printing is placed in mould, and molding material is injected in described mould with printing after film hardening, make the pattern of setting and/or words transfer printing to described molding material；
Thin film on described molding material is peeled off, makes the pattern of setting and/or word be revealed in the outer surface on described molding material.
2. method according to claim 1, it is characterised in that described thin film includes polycarbonate thin film or polyethylene terephthalate PET film or acrylonitrile-butadiene-styrene copolymer ABS thin film.
3. method according to claim 1, it is characterised in that after the described pattern printing setting on thin film and/or word, described method also includes:
The film drying that will print, makes the pattern of printing and/or word be fixed on thin film.
4. method according to claim 3, it is characterised in that after the pattern printed and/or word are fixed on thin film, described method also includes:
It is being printed with the film surface pasting protective film of pattern and/or word.
5. the method according to any one of Claims 1-4, it is characterised in that described molding material includes plastic cement.
6. method according to claim 5, it is characterised in that described mould is metal pattern.
7. an electronic equipment material, described material is provided with pattern and/or word, and described pattern and/or word are to be made by the in-mold decorative method described in any one of claim 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610082758.3A CN105711032A (en) | 2016-02-05 | 2016-02-05 | In mold decoration method and material for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610082758.3A CN105711032A (en) | 2016-02-05 | 2016-02-05 | In mold decoration method and material for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105711032A true CN105711032A (en) | 2016-06-29 |
Family
ID=56155641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610082758.3A Pending CN105711032A (en) | 2016-02-05 | 2016-02-05 | In mold decoration method and material for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105711032A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107097477A (en) * | 2017-04-27 | 2017-08-29 | 安徽华米信息科技有限公司 | Flexible glue product and its processing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101712193A (en) * | 2008-10-07 | 2010-05-26 | 太乙精密股份有限公司 | In-mold decorative method |
| CN101716811A (en) * | 2009-11-12 | 2010-06-02 | 镒生电线塑料(昆山)有限公司 | Method and special mechanism for transferring and printing in mold |
| WO2014068925A1 (en) * | 2012-10-29 | 2014-05-08 | 凸版印刷株式会社 | Transfer film, process for producing molded product, and molded product |
-
2016
- 2016-02-05 CN CN201610082758.3A patent/CN105711032A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101712193A (en) * | 2008-10-07 | 2010-05-26 | 太乙精密股份有限公司 | In-mold decorative method |
| CN101716811A (en) * | 2009-11-12 | 2010-06-02 | 镒生电线塑料(昆山)有限公司 | Method and special mechanism for transferring and printing in mold |
| WO2014068925A1 (en) * | 2012-10-29 | 2014-05-08 | 凸版印刷株式会社 | Transfer film, process for producing molded product, and molded product |
Non-Patent Citations (1)
| Title |
|---|
| 范有先: "《塑料先进成型技术》", 31 May 2014, 机械工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107097477A (en) * | 2017-04-27 | 2017-08-29 | 安徽华米信息科技有限公司 | Flexible glue product and its processing method |
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| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160629 |
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| RJ01 | Rejection of invention patent application after publication |