CN105710980A - Laser in-situ assisted device and method for mechanically scratching hard and brittle materials assisted by laser in situ - Google Patents
Laser in-situ assisted device and method for mechanically scratching hard and brittle materials assisted by laser in situ Download PDFInfo
- Publication number
- CN105710980A CN105710980A CN201610046614.2A CN201610046614A CN105710980A CN 105710980 A CN105710980 A CN 105710980A CN 201610046614 A CN201610046614 A CN 201610046614A CN 105710980 A CN105710980 A CN 105710980A
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- China
- Prior art keywords
- diamond particles
- transparent diamond
- laser
- tool rest
- situ
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a laser in-situ assisted device for mechanically scratching hard and brittle materials. The device comprises a transparent diamond particle with a cone tool bit and for scratching the hard and brittle materials, a shank and a tool apron provided with through holes along the axis, and embedded optical fiber laser introduced into the through holes; the top surface of the tool apron is fixedly connected to the bottom of the shank; an accommodating tank corresponding to the transparent diamond particle is formed in one side of the bottom of the tool apron; the top surface of the transparent diamond particle is fixedly connected to the top surface in the accommodating tank, and forms a horizontal positioning surface; and the optical fiber laser penetrates through the shank and the tool apron to irradiate on the horizontal positioning surface of the transparent diamond particle and form a focusing point at the bottom of the cone tool bit of the transparent diamond particle. The invention further provides a processing method of the device. The device and the method use the laser for performing the in-situ energy effect on an area with the scratched hard and brittle materials to achieve the purpose of softening the hard and brittle materials so as to improve the scratching quality of the hard and brittle materials.
Description
Technical field
The present invention relates to the mechanical scribing techniques field of hard brittle material, be specifically related to the device and method of laser in-situ Aided Machine delineation hard brittle material.
Background technology
Mechanical scribing method currently for hard brittle material usually causes due to the hard crisp characteristic of machined material that delineation crudy is bad, and the diamond cutter used by mechanical scratching can be caused damage by the hard crisp characteristic of machined material, and then stablizing of crudy is delineated in impact.In order to solve this problem, the method providing laser assisted mechanical scratching in prior art, namely apply heat and then the hard crisp characteristic of softener material at cutter front end or rear end, thus improving the quality of machining.But the contact surface that this kind of method is difficult to make Laser energy transmission to cutter Yu material, and laser energy can produce to interfere with peripheral cutting coolant, lubricating fluid and chip etc. sometimes, thus being difficult to play useful effect.
Summary of the invention
It is an object of the invention to provide the device and method of a kind of laser in-situ Aided Machine delineation hard brittle material, in order to overcome above-mentioned deficiency.
For solving above-mentioned technical problem, the present invention provides techniques below scheme: the device of laser in-situ Aided Machine delineation hard brittle material, including the transparent diamond particles with cone cutter head for hard brittle material being carried out delineation operation, handle of a knife and the tool rest of through hole is offered along axis, pass into the embedded optical-fiber laser in through hole, described tool rest end face is fixedly connected on bottom handle of a knife, described tool rest bottom side offers the holding tank corresponding with transparent diamond particles, described transparent diamond particles end face is fixedly connected on holding tank inner top surface and transparent diamond particles end face forms horizontal location face, described smooth pricker laser traverse handle of a knife, tool rest is radiated on the horizontal location face of transparent diamond particles and forms focus point in the bottom of transparent diamond particles cone cutter head.
On such scheme basis preferentially, described transparent diamond particles side is brazed on the sidewall of tool rest holding tank.
The method of laser in-situ Aided Machine delineation hard brittle material, including:
(1) on tool rest, the holding tank corresponding with transparent diamond particles is offered, transparent diamond particles with cone cutter head is fixed on the holding tank of tool rest, and the end face of transparent diamond particles forms the horizontal location face that transparent diamond particles contacts with holding tank；
(2) tool rest is fixed on bottom handle of a knife, and axially on handle of a knife and tool rest, offers through hole, then pass into embedded optical-fiber laser to through hole；
(3) optical-fiber laser is through handle of a knife, tool rest just horizontal location face to transparent diamond particles, and it is radiated at bottom the cone cutter head of transparent diamond particles by transparent diamond particles, form laser focusing point, realize laser by the optical effect of cone and carry out original position energy to being scored hard brittle material region, reach the purpose of softening hard brittle material.
The present invention compared with prior art has the beneficial effect that the present invention utilizes embedded optical-fiber laser through handle of a knife, tool rest just horizontal location face to transparent diamond particles, and it is radiated at bottom the cone cutter head of transparent diamond particles by transparent diamond particles, form laser focusing point, realize laser by the optical effect of cone and carry out original position energy to being scored hard brittle material region, reach the purpose of softening hard brittle material, and then improve the quality of hard brittle material delineation processing.
Accompanying drawing explanation
Fig. 1 is present configuration schematic diagram.
Number in the figure is: the transparent diamond particles of 1-, 2-cone cutter head, 3-handle of a knife, 4-tool rest, 5-holding tank, 6-horizontal location face, 7-optical-fiber laser, 8-focus point, 9-hard brittle material.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
In describing the invention, it will be appreciated that, term " longitudinal direction ", " transverse direction ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", the orientation of the instruction such as " outward " or position relationship be based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention, rather than instruction or hint indication device or element must have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
Known with reference to Fig. 1, the device of laser in-situ Aided Machine delineation hard brittle material, including the transparent diamond particles 1 with cone cutter head 2 for hard brittle material 9 being carried out delineation operation, handle of a knife 3 and the tool rest 4 of through hole is offered along axis, pass into the embedded optical-fiber laser 7 in through hole, described tool rest 4 end face is fixedly connected on bottom handle of a knife 3, described tool rest 4 bottom side offers the holding tank 5 corresponding with transparent diamond particles 1, described transparent diamond particles 1 end face is fixedly connected on holding tank 5 inner top surface and transparent diamond particles 1 end face forms the horizontal location face 6 that transparent diamond particles 1 contacts with tool rest 4, transparent diamond particles 1 side is brazed on the sidewall of tool rest 4 holding tank 5；Described smooth pricker laser 7 is radiated on the horizontal location face 6 of transparent diamond particles 1 through handle of a knife 3, tool rest 4 and at the bottom shape focus point 8 of transparent diamond particles 1 cone cutter head 2.
Its method is:
(1) on tool rest 4, the holding tank 5 corresponding with transparent diamond particles 1 is offered, being fixed in the holding tank 5 of tool rest 4 by the transparent diamond particles 1 with cone cutter head 2, the end face of transparent diamond particles 1 forms the horizontal location face 6 that transparent diamond particles 1 contacts with holding tank 5；
(2) tool rest 4 is fixed on bottom handle of a knife 3, and axially on handle of a knife 3 and tool rest 4, offers through hole, then pass into embedded optical-fiber laser 7 to through hole；Wherein, the parameter such as the clear aperature of optical-fiber laser 7, power and wavelength according to transparent diamond particles 1 and is scored the concrete technology condition of hard brittle material 9 and determines；
(3) optical-fiber laser 7 is through handle of a knife 3, tool rest 4 just horizontal location face 6 to transparent diamond particles 1, and it is radiated at bottom the cone cutter head 2 of transparent diamond particles 1 by transparent diamond particles 1, form laser focusing point 8, realize laser by the optical effect of cone and carry out original position energy to being scored hard brittle material region, reach the purpose of softening hard brittle material 9, and then improve the quality of hard brittle material delineation processing.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equivalent replacement and improvement etc. made within the spirit and principles in the present invention, should be included within protection scope of the present invention.
Claims (3)
1. the device of laser in-situ Aided Machine delineation hard brittle material, it is characterized in that, including the transparent diamond particles with cone cutter head for hard brittle material being carried out delineation operation, handle of a knife and the tool rest of through hole is offered along axis, pass into the embedded optical-fiber laser in through hole, described tool rest end face is fixedly connected on bottom handle of a knife, described tool rest bottom side offers the holding tank corresponding with transparent diamond particles, described transparent diamond particles end face is fixedly connected on holding tank inner top surface and transparent diamond particles end face forms horizontal location face, described smooth pricker laser traverse handle of a knife, tool rest is radiated on the horizontal location face of transparent diamond particles and forms focus point in the bottom of transparent diamond particles cone cutter head.
2. the device of laser in-situ Aided Machine according to claim 1 delineation hard brittle material, it is characterised in that: described transparent diamond particles side is brazed on the sidewall of tool rest holding tank.
3. the method for laser in-situ Aided Machine delineation hard brittle material, it is characterised in that including:
(1) on tool rest, the holding tank corresponding with transparent diamond particles is offered, transparent diamond particles with cone cutter head is fixed on the holding tank of tool rest, and the end face of transparent diamond particles forms the horizontal location face that transparent diamond particles contacts with holding tank；
(2) tool rest is fixed on bottom handle of a knife, and axially on handle of a knife and tool rest, offers through hole, then pass into embedded optical-fiber laser to through hole；
(3) optical-fiber laser is through handle of a knife, tool rest just horizontal location face to transparent diamond particles, and it is radiated at bottom the cone cutter head of transparent diamond particles by transparent diamond particles, form laser focusing point, realize laser by the optical effect of cone and carry out original position energy to being scored hard brittle material region, reach the purpose of softening hard brittle material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610046614.2A CN105710980B (en) | 2016-01-17 | 2016-01-17 | Laser in-situ Aided Machine delineates the device and method of hard brittle material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610046614.2A CN105710980B (en) | 2016-01-17 | 2016-01-17 | Laser in-situ Aided Machine delineates the device and method of hard brittle material |
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| Publication Number | Publication Date |
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| CN105710980A true CN105710980A (en) | 2016-06-29 |
| CN105710980B CN105710980B (en) | 2017-08-22 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110340669A (en) * | 2019-07-22 | 2019-10-18 | 长春理工大学 | A method of the fast tool servo based on laser in-situ auxiliary processes hard brittle material free form surface |
| CN111299868A (en) * | 2020-03-03 | 2020-06-19 | 长春理工大学 | Optical system for mechanically scribing echelle grating by aid of laser in-situ |
| CN113478069A (en) * | 2021-07-23 | 2021-10-08 | 哈尔滨理工大学 | Laser heating auxiliary scribing device |
| CN113843630A (en) * | 2021-10-15 | 2021-12-28 | 华中科技大学 | Laser high-frequency accurate control system and method for selective field-assisted machining |
| CN114918530A (en) * | 2022-06-30 | 2022-08-19 | 华中科技大学 | Laser in-situ auxiliary indentation/scratch device and method |
| WO2023061161A1 (en) * | 2021-10-15 | 2023-04-20 | 华中科技大学 | Selective energy field auxiliary processing system |
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| CN102741179A (en) * | 2009-11-30 | 2012-10-17 | 康宁股份有限公司 | Methods for laser scribing and separating glass substrates |
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2016
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110340669A (en) * | 2019-07-22 | 2019-10-18 | 长春理工大学 | A method of the fast tool servo based on laser in-situ auxiliary processes hard brittle material free form surface |
| CN111299868A (en) * | 2020-03-03 | 2020-06-19 | 长春理工大学 | Optical system for mechanically scribing echelle grating by aid of laser in-situ |
| CN113478069A (en) * | 2021-07-23 | 2021-10-08 | 哈尔滨理工大学 | Laser heating auxiliary scribing device |
| CN113843630A (en) * | 2021-10-15 | 2021-12-28 | 华中科技大学 | Laser high-frequency accurate control system and method for selective field-assisted machining |
| CN113843630B (en) * | 2021-10-15 | 2022-07-19 | 华中科技大学 | Laser high-frequency precise control system and method for selective field-assisted machining |
| WO2023061161A1 (en) * | 2021-10-15 | 2023-04-20 | 华中科技大学 | Selective energy field auxiliary processing system |
| CN114918530A (en) * | 2022-06-30 | 2022-08-19 | 华中科技大学 | Laser in-situ auxiliary indentation/scratch device and method |
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| CN105710980B (en) | 2017-08-22 |
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