The flexible diel of a kind of plate semicanal and process for stamping
Technical field
The application relates to a kind of panel beating semicanal forming technique in aircraft manufacturing field, and specifically a kind of plate semicanal flexibility diel and using method, be particularly suited for thin plate semicanal stamping.
Background technology
The current plate main manufacturing process of sheeting semicanal is bent pressure, fall pressure, drawing, and it shapes major defect for problems such as pressing partially, break, be wrinkling.Conventional stamping method shortcoming has several aspect, and one is because most semicanals are in irregular shape, shapes unbalance stress, it is easy to produce to press inclined phenomenon;Two is that forming process plate central region is in unsettled free deformation, it is impossible to suppress deformation inequality to produce Instability wrinkling problem;Three is to overcome woollen pressure that increased in size partially can only be taked to compensate the scarce material problem of shaping, causing putting limit, receive limit difficulty sharp increase;Four is that mould needs to process the complexity protrusion profile matched with part surfaces externally and internally and depression profile, and mould processing capacity is big, and quality of fit requires height.Above reason causes that new product development success rate is relatively low, causes various diel die trial repeatedly, repairs a die, and causes great amount of cost and time waste.
Summary of the invention
The purpose of the application is in that for the deficiencies in the prior art, it is provided that a kind of plate semicanal flexibility diel and using method;This diel adopts upper mould rigid convex profile to continuingly act on plate with counterdie inner high voltage flexible media, it is suppressed that plate central region is wrinkling, produces the alleviation of enough frictional force simultaneously and presses inclined problem, can reduce the required woollen of shaping and reduce semicanal shaping difficulty.
A kind of plate semicanal flexibility process for stamping, containing mould in rigidity and flexible counterdie, it is characterized in that: 1) described in rigidity on the convex face mated of arranged below and plate system half pipe internal surface of mould, the matrix of described flexible counterdie is that a square rigidity holds basket and rigid cover plate, a movable rigidity panel is respectively connected respectively through the bolt and nut with spring inside the left and right sides wallboard that rigidity holds frame, the top of two rigidity panels is connected by elastic eyelid covering, this rigidity panel and rigidity are held in the middle part of the another two sidewall of frame and elastic eyelid covering constitutes a flexible cavity closed, the middle part of described rigid cover plate is provided with the profile hole mated with mould convex facial contour in rigidity, rigid cover plate is pressed in rigidity by fastener cover and holds the top of frame;2) in decline, mould makes convex face be completely embedded in the flexible cavity of counterdie by the profile hole of rigid cover plate, regulates the bolt and nut connecting rigidity panel, by spring compression to appropriate location;3) injecting resisting medium to the flexible cavity of counterdie makes it be full of flexible cavity;4) going up mould on, adjusting screw rod nut pull-off spring is to appropriate location again, and spring promotes rigidity panel slid inward, makes to keep certain initial pressure in counterdie flexibility cavity;5) being placed between upper mould and counterdie by plate to be formed, in decline, mould makes convex face embed in flexible cavity, and it is stamping that the compression drag of spring promotes resisting medium generation pliable pressure continuous action plate to complete plate semicanal.
The invention has the beneficial effects as follows: 1) the stamping profile hole only needing processing mold convex face and counterdie of the application, Making mold workload greatly reduces, and is absent from upper mould convex face and manufactures quality of fit problem with counterdie matrix face.2) the application is by changing the cover plate profile hole shaping required upper mould and matching, and can meet variously-shaped semicanal stamping, not limited by half tube shape, applied widely.3) the application passes through high pressure resisting medium effect and panel surface, is more uniformly stressed compared with conventional rigid stamping die, and panel surface damage is little, and product quality is high.4) producing frictional force in the middle part of the application punching course plate and can alleviate the woollen inclined problem of pressure, advantageously reduce the required woollen of shaping, wrinkling district, middle part excess stock is excluded and adds to weakened section simultaneously, greatly alleviates weakened section and ftractures.
Below in conjunction with embodiment accompanying drawing, the application is described in further detail:
Accompanying drawing explanation
Fig. 1 is the assembling signal of plate semicanal flexibility punching press counterdie
Fig. 2 is that rigidity holds basket and the assembling signal of rigidity panel
Fig. 3 is the signal of plate semicanal flexibility process for stamping principle
Number description: 1 rigidity hold basket, 2 rigid cover plates, 3 springs, 4 bolt and nuts, 5, rigidity panel, 6 elastic eyelid coverings, 7 flexible cavitys, 8 profile holes, mould, 10 convex faces, 11 resisting mediums, 12 compression drag, 13 pliable pressures, 14 material feeding through holes, 15 discharge through holes, 16 plates on 9.
Detailed description of the invention
Referring to accompanying drawing, plate semicanal flexibility diel disclosed in embodiment, containing mould in rigidity and flexible counterdie, the convex face 10 that in described rigidity, arranged below and plate system half pipe internal surface of mould 9 mates, the matrix of described flexible counterdie is that a square rigidity holds basket 1 and rigid cover plate 2, respectively connect a movable rigidity panel 5 respectively through the bolt and nut 4 with spring 3 inside the left and right sides wallboard that rigidity holds frame 1, the top of two rigidity panels 5 is connected by elastic eyelid covering 6, this rigidity panel 5 and rigidity are held in the middle part of the another two sidewall of frame 1 and elastic eyelid covering 6 constitutes a flexible cavity 7 closed, the middle part of described rigid cover plate 2 is provided with and the profile hole 8 of mould convex face 10 outline in rigidity, rigid cover plate 2 is pressed in rigidity by fastener cover and holds the top of frame 1.Hold in rigidity and in the middle part of both sides, the front and back sidewall of basket 1, be respectively equipped with a material feeding through hole 14 connecting flexible cavity 7 and a discharge through hole 15 near bottom with top.
Using the above-mentioned diel flexible forming method to plate semicanal, its operating procedure is as follows:
1) in decline, mould makes convex face 10 be completely embedded in the flexible cavity 7 of counterdie by the profile hole 8 of rigid cover plate 2, and spring 3 is pressed to appropriate location by adjusting screw rod nut 4.2) open material feeding through hole 14 and discharge through hole 15 simultaneously, inject resisting medium 11 to the flexible cavity 7 of counterdie and make it be full of flexible cavity 7.3) simultaneously closing off material feeding through hole 14 and discharge through hole 15, above go up mould, adjusting screw rod nut 4 pull-off spring 3 is to appropriate location, and spring 3 promotes rigidity panel 5 slid inward, makes to keep certain initial pressure in counterdie flexibility cavity 7.4) being placed between upper mould and counterdie by plate 16 to be formed, in decline, mould makes convex face 9 embed in flexible cavity 7, the compression drag 12 of spring 3 promote resisting medium 11 to produce pliable pressure 13 continuous action plate to complete plate semicanal stamping.
Require supplementation with three aspects of explanation; one is that illustrations and description illustrate with plate threeway semicanal; by changing rigid cover plate 2, this application matches that to be suitably adapted for plate system half bend pipe, half flat tube etc. flexible stamping in upper mould convex face 10, therefore other part takes the stamping technology of the reverse pliable pressure of similar applying should belong to this specification protection domain.Two is that the material feeding through hole 14 that holds before and after basket 1 on the sidewall of both sides of rigidity and discharge through hole 15 are respectively close to bottom and top, it is therefore an objective to discharges the gas in flexible cavity 7 to inject resisting medium 11, makes resisting medium 11 inject flexibility cavity 7 smoothly.Three is that the height of rigidity panel 5 is slightly less than rigidity and holds basket 1 depth capacity, it is therefore an objective to guarantees that rigidity panel 5 holds in basket 1 in rigidity and slides smoothly, it is to avoid rigidity panel 5 and rigid cover plate 2 lower surface friction.