CN105704905A - Printed circuit board, electronic equipment and method for manufacturing printed circuit board - Google Patents
Printed circuit board, electronic equipment and method for manufacturing printed circuit board Download PDFInfo
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- CN105704905A CN105704905A CN201410692522.2A CN201410692522A CN105704905A CN 105704905 A CN105704905 A CN 105704905A CN 201410692522 A CN201410692522 A CN 201410692522A CN 105704905 A CN105704905 A CN 105704905A
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Abstract
The invention discloses a printed circuit board, electronic equipment and a method for manufacturing the printed circuit board. The technical problem that fast dissipation of heat inside electronic equipment under the condition of not increasing the weight of the electronic equipment is hard to achieve is solved. The printed circuit board, which is used for arranging an electronic component, comprises a conductive layer electrically connected with the electronic component, and an insulating nano carbon layer attached to the conductive layer and used for transferring heat produced by the electronic component arranged on the insulating nano carbon layer.
Description
Technical field
The present invention relates to electronic technology field, particularly to a kind of method of printed circuit board, electronic equipment and making printed circuit board。
Background technology
Along with the development of microelectric technique, from strength to strength, power consumption also increases the function of electronic equipment therewith。On the other hand, along with developing rapidly of development of Mobile Internet technology, the size of electronic equipment is more and more less, under the background that equipment power dissipation increases, the heat dispersion of electronic equipment is proposed strict requirement。
In prior art, the mobile terminal for small volume generally adopts the mode of passive heat radiation to dispel the heat, it may be assumed that attaches the fin such as sheet metal on electronic devices and components and is conducted by the heat at thermal source place, reduces the temperature at thermal source place。But on thermal source electronic devices and components, attach metal fin by increasing the weight of electronic equipment, disagree with lightening, the portability trend of electronic equipment。
Summary of the invention
The application provides a kind of printed circuit board, electronic equipment and the method making printed circuit board, solves the technical problem being difficult to realize electronic equipment internal quick heat radiating when not increasing the weight of electronic equipment。
The application first aspect provides a kind of printed circuit board, is used for arranging electronic devices and components, and described printed circuit board includes: conductive layer, is electrically connected with described electronic devices and components；Insulating nano carbon-coating, is attached on described conductive layer, for conducting heat produced by the described electronic devices and components being arranged on described insulating nano carbon-coating。
Optionally, described insulating nano carbon-coating having hole, wherein, described conductive layer realizes electrical connection with described electronic devices and components especially by the lead-in wire through described hole。
Optionally, described conductive layer is etched with circuitous pattern。
Optionally, described printed circuit board also includes: insulated substrate, and wherein, described conductive layer is specifically attached on first of described insulated substrate；Second conductive layer, be attached to described insulated substrate with on described first contrary second；Second insulating nano carbon-coating, is attached on described second conductive layer, for conducting heat produced by the second electronic devices and components being arranged on described second insulating nano carbon-coating；Wherein, described second conductive layer and described second electronic devices and components electrical connection。
The embodiment of the present application second aspect provides a kind of electronic equipment, including: the printed circuit board that first aspect provides；Electronic devices and components, are arranged on described insulating nano carbon-coating。
The embodiment of the present application third aspect provides a kind of method making printed circuit board, including: etch circuitous pattern on the electrically conductive；Described conductive layer is prepared insulating nano carbon-coating。
Optionally, described on described conductive layer, prepare insulating nano carbon-coating after, described method also includes: described insulating nano carbon-coating is heated。
Optionally, described described insulating nano carbon-coating is heated, including: adopt infrared light supply to irradiate described insulating nano carbon-coating；Or described printed circuit board is placed in the baking oven of 200 DEG C and heats 20 minutes。
Optionally, described on described conductive layer, prepare insulating nano carbon-coating, including: adopt the mode of electrostatic atomization spraying to prepare described insulating nano carbon-coating on described conductive layer。
Optionally, described on described conductive layer, prepare insulating nano carbon-coating, including: on described conductive layer, mask plate is set, on described conductive layer, described insulating nano carbon-coating is prepared according to described mask plate, the figure of described mask plate is determined according to described circuitous pattern, and the figure of described insulating nano carbon-coating is corresponding with the figure of described mask plate。
The one or more technical schemes provided in the embodiment of the present application, at least have the following technical effect that or advantage:
In the embodiment of the present application, the conductive layer of circuit board adheres to one layer of insulating nano carbon-coating, owing to insulating nano carbon-coating has the capacity of heat transmission of excellence, it is possible to quickly conducted by the heat that the electronic devices and components being arranged on insulating nano carbon-coating produce。Wherein, the density of nano-sized carbon is much smaller than heat dissipation metal sheet material, less than 1/6th of the density of conventional heat sink material copper, and the nano-carbon layer coating that to be only thickness minimum, its thickness can less than 2～3mm, less than the thickness of metal fin。Therefore, dispel the heat by having the printed circuit board of insulating nano carbon-coating, can not only effectively reduce the temperature at thermal source place, and hinge structure uses metal fin heat radiation, it is possible to be substantially reduced the weight of electronic equipment。
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in the embodiment of the present application, below the accompanying drawing used required during embodiment is described is briefly introduced, apparently, accompanying drawing in the following describes is only some embodiments of the application, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings。
The structural representation of the Fig. 1 printed circuit board 100 for providing for the embodiment of the present application；
Fig. 2 is the decomposition texture schematic diagram of printed circuit board 100；
Fig. 3 is the further refined structure schematic diagram of printed circuit board 100；
The schematic flow sheet of the method making printed circuit board that Fig. 4 provides for the embodiment of the present application。
Detailed description of the invention
It is difficult to realize the technical problem that electronic equipment internal is dispelled the heat when not increasing the weight of electronic equipment for what prior art existed, the embodiment of the present application provides a kind of printed circuit board, electronic equipment and the method making printed circuit board, by adhering to one layer of insulating nano carbon-coating on the conductive layer of circuit board, owing to insulating nano carbon-coating has the capacity of heat transmission of excellence, it is possible to quickly the heat that the electronic devices and components being arranged on insulating nano carbon-coating produce is conducted。Wherein, the density of nano-sized carbon is much smaller than heat dissipation metal sheet material, less than 1/6th of the density of conventional heat sink material copper, and the nano-carbon layer coating that to be only thickness minimum, its thickness can less than 2～3mm, less than the thickness of metal fin。Therefore, compared with using metal fin heat radiation, use the heat dissipation for circuit board with nano-carbon layer can be substantially reduced the weight of electronic equipment。
Below by accompanying drawing and specific embodiment, technical scheme is described in detail, the specific features being to be understood that in the embodiment of the present application and embodiment is the detailed description to technical scheme, rather than the restriction to technical scheme, when not conflicting, the embodiment of the present application and the technical characteristic in embodiment can be mutually combined。
Referring to Fig. 1 and Fig. 2, printed circuit board 100 includes conductive layer 110 and and the insulating nano carbon-coating 120 that is attached on conductive layer 110。Wherein, conductive layer 110 can be the metal material with excellent conductive performance, for instance copper, stannum, terne metal, gun-metal, gold, silver, etc.。
Can arranging electronic devices and components 200 on printed circuit board 100, electronic devices and components are specifically located on insulating nano carbon-coating 120, and are electrically connected with conductive layer 110。In the embodiment of the present application, the mode realizing electrical connection between conductive layer 110 and electronic devices and components 200 includes:
Mode 1, continuing with referring to Fig. 2, insulating nano carbon-coating 120 has hole 121, and wherein, conductive layer 110 realizes electrical connection with electronic devices and components 200 especially by the lead-in wire through hole 121。That is, conductive layer 110 being provided with and the pin of electronic devices and components 200 realization electrical connection, draw lead-in wire from this pin, lead-in wire is connected through hole 121 with electronic devices and components 200。In practical situation, the shape in hole 121 can be circular or oval, it is also possible to for square or flute profile and irregularly shaped, in the embodiment of the present application, this is not limited。
Mode 2, insulating nano carbon-coating 120 includes two or more than two the insulating nano carbon block being separated, wire can be drawn on conductive layer 110, it is connected through the space the two pieces of insulating nano carbon block being separated with electronic devices and components, it is achieved the electrical connection of conductive layer 110 and electronic devices and components 200。
Mode 3, draws wire from the side of conductive layer 110, and insulating nano carbon-coating 120 walked around by wire, is connected with electronic devices and components, it is achieved the electrical connection of conductive layer 110 and electronic devices and components 200。
The embodiment of the present application can be realized the electrical connection of conductive layer 110 and electronic devices and components 200 by any one in above-mentioned three kinds of modes, it is also possible to use two or more mode therein to realize the electrical connection of conductive layer 110 and electronic devices and components 200 simultaneously。
In the embodiment of the present application, being arranged on by electronic devices and components on insulating nano carbon-coating 120, insulating nano carbon-coating 120 has the capacity of heat transmission of excellence, and its heat conductivity is up to 5300Wm-1K-1, it is possible to quickly being derived by the heat that electronic devices and components produce, wherein, W is watt, and m is rice, and K is Kelvin, and material thermal conductivity is more big, and capacity of heat transmission is more big, and radiating effect is more good。Reviewing in prior art, in heat radiating metal sheet material, the heat conductivity of the copper that heat conductivity is higher only has 400Wm-1K-1, the radiating effect of heat-dissipating metal sheet is far away not as good as the radiating effect of insulating nano carbon-coating。
Moreover, the density of nano-sized carbon is much smaller than heat dissipation metal sheet material, less than 1/6th of the density of conventional heat sink material copper, and the nano-carbon layer coating that to be only thickness minimum, its thickness can less than 2～3mm, less than the thickness of metal fin。Therefore, compared with using metal fin heat radiation, use the heat dissipation for circuit board with nano-carbon layer can be substantially reduced the weight of electronic equipment。
Further, since insulating nano carbon-coating 120 has stable physical property and chemical property, it can as the protective layer of conductive layer 110, it is to avoid conductive layer 110 is damaged, and improves reliability and the service life of printed circuit board 100。
Optionally, conductive layer 110 is etched with circuitous pattern, as the path of connection between electronic devices and components。It addition, the circuitous pattern on conductive layer 110 can also include big metal covering as ground connection or bus plane。The mode etching circuitous pattern on conductive layer 110 is referred to prior art, and the embodiment of the present application no longer describes in detail。
Further, with reference to Fig. 3, printed circuit board 100 also includes insulated substrate 130, and insulated substrate 130 provides physical bodies for printed circuit board 100, and namely conductive layer 110 is attached on insulated substrate 130。The material of insulated substrate can be the insulation adhesive film of the compactings such as glass fibre, not fabric material, resin, such as cotton paper, phenolic aldehyde cotton paper, epoxy resin, glass cloth, polyester etc., it addition, the material of insulated substrate can also be the material such as aluminium nitride, carborundum。
Optionally, printed circuit board 100 can be double-sided PCB, and namely the tow sides of printed circuit board 100 all can arrange electronic devices and components。
Concrete, continuing referring to Fig. 3, insulated substrate 130 includes the first contrary face 131 and the second face 132。Conductive layer 110 is attached on the first face 131, and on the second face 132, it is attached with the second conductive layer 140, and the second conductive layer 140 is attached with the second insulating nano carbon-coating 150, for conducting 300 the produced heats of the second electronic devices and components being arranged on the second insulating nano carbon-coating 150。Wherein, the second conductive layer 140 and the second electronic devices and components 300 are electrically connected。
Wherein, the implementation of the second conductive layer 140 is referred to conductive layer 110, the implementation of the second insulating nano carbon-coating 150 is referred to insulating nano carbon-coating 120, the electric connecting mode of the second conductive layer 140 and the second electronic devices and components 300 is referred to the electric connecting mode of conductive layer 110 and electronic devices and components 200, and the embodiment of the present application is not described in detail in this。
In the embodiment of the present application technique scheme, printed circuit board 100 two sides all can arrange electronic devices and components, and printed circuit board both sides are respectively provided with insulating nano carbon-coating, it is possible to quickly the heat that the electronic devices and components on circuit board produce is conducted, it is achieved dispel the heat fast and effectively。
Optionally, the printed circuit board 100 in the embodiment of the present application can include the conductive layer of more than 2 layers, and each conductive layer presss from both sides between two insulating substrates。Printed circuit board can also include the insulating nano carbon-coating of more than 2 layers, except positive and negative two surfaces at printed circuit board 100 have insulating nano carbon-coating, the internal layer of printed circuit board can also increase insulating nano carbon-coating, to increase the heat-sinking capability of printed circuit board。
Based on identical inventive concept, the embodiment of the present application provides a kind of electronic equipment, having the printed circuit board 100 in previous embodiment in this electronic equipment, the electronic devices and components that have in this electronic equipment are arranged on the insulating nano carbon-coating 120 on printed circuit board 100 surface。Owing to the insulating nano carbon-coating 120 on the surface of printed circuit board 100 has the capacity of heat transmission of excellence, can rapidly by printed circuit board 100 arrange electronic devices and components produced by heat conduct, avoid performance and the safety of the too high reduction electronic devices and components of temperature of near heating sources, extend the service life of electronic equipment。
Moreover, owing to the density of nano-sized carbon is much smaller than heat dissipation metal sheet material, less than 1/6th of the density of conventional heat sink material copper, and the nano-carbon layer coating that to be only thickness minimum, its thickness can less than 2～3mm, less than the thickness of metal fin。Therefore, compared with using metal fin heat radiation, use the heat dissipation for circuit board with nano-carbon layer can be substantially reduced the weight of electronic equipment。
On the other hand, the embodiment of the present application additionally provides a kind of method making printed circuit board, and with reference to Fig. 4, the flow process of the method comprises the steps:
Step 401: etch circuitous pattern on conductive layer 110。
Concrete, the method for etched circuit figure includes subtraction (Subtractive) and addition process (Additive)。Wherein, subtraction is to utilize chemicals or machinery by local removing unwanted on blank metal conducting layer, and remaining place is required circuit。And addition process (Additive) is covering photoresist on the insulated substrate plating thin copper foil layer in advance, develop again through ultraviolet photoetching, the thin copper layer part needed is exposed, then utilize plating, on exposed portion, metal level is thickened required specification, plate the anti-etching resist of last layer (metal foil stannum) again, finally remove photoresist, then the copper foil layer under photoresist is etched away, form required circuit。The specific implementation of step 401 is referred to technique of the prior art, and the embodiment of the present application no longer describes in detail。
Step 402: prepare insulating nano carbon-coating 120 on conductive layer 110。
Concrete, after etching circuitous pattern, prepare insulating nano carbon-coating 120 on the electrically conductive。In the embodiment of the present application, the mode preparing insulating nano carbon-coating 120 includes: electrostatic atomization spraying, plasma spray deposition, graphite acr method, laser evaporation graphite method, chemical vapour deposition technique, etc.。Specific implementation is referred to prior art, and the embodiment of the present application is not described in detail in this。
By preparing insulating nano carbon-coating on the electrically conductive, enabling setting electronic devices and components on circuit boards to contact with insulating nano carbon-coating 120, insulating nano carbon-coating 120 has the capacity of heat transmission of excellence, it is possible to quickly derived by the heat that electronic devices and components produce。Moreover, the density of nano-sized carbon is much smaller than heat dissipation metal sheet material, less than 1/6th of the density of conventional heat sink material copper, and the nano-carbon layer coating that to be only thickness minimum, its thickness can less than 2～3mm, less than the thickness of metal fin。Therefore, compared with using metal fin heat radiation, use the heat dissipation for circuit board with nano-carbon layer can be substantially reduced the weight of electronic equipment。
Optionally, before step 402 performs, it is possible to first the printed circuit board 100 etching conducting layer figure is carried out pressing, it is ensured that each layer of circuit board is closely attached onto, improve the structural stability of circuit board, and reduce circuit board integral thickness。
Optionally, when preparing insulating nano carbon-coating on the electrically conductive, mask plate is set first on the electrically conductive, mask plate can be patterned photoresist layer, it can also be patterned mask substrate, then prepare insulating nano carbon-coating on the electrically conductive according to mask plate, the figure of mask plate is determined according to circuitous pattern, and the figure of insulating nano carbon-coating is corresponding with the figure of mask plate。Such as, the place of welding pin is needed to avoid the need for deposition insulating nano carbon-coating on the electrically conductive, it is possible to be blocked this position with mask plate, make above pin, do not have insulating nano carbon, it is simple to later stage lead-in wire is connected with electronic devices and components。
Optionally, when preparing insulating nano carbon-coating on the electrically conductive, it is also possible to first prepare a flood insulating nano carbon-coating, then etch the figure of insulating nano carbon-coating with etching technics。
Optionally, continue referring to Fig. 4, after step 402, also include step 403: insulating nano carbon-coating is heated。
Concrete, the mode that insulating nano carbon-coating is heated includes:
Mode 1, adopts infrared light supply to irradiate insulating nano carbon-coating。
Mode 2, baking oven for heating post bake, it is possible to printed circuit board is placed in the baking oven of 200 DEG C and heats 20 minutes。
By the insulating nano carbon-coating of preparation is heated, the physical stability of insulating nano carbon-coating will be improved。
The one or more technical schemes provided in the embodiment of the present application, at least have the following technical effect that or advantage:
In the embodiment of the present application, the conductive layer of circuit board adheres to one layer of insulating nano carbon-coating, owing to insulating nano carbon-coating has the capacity of heat transmission of excellence, it is possible to quickly conducted by the heat that the electronic devices and components being arranged on insulating nano carbon-coating produce。Wherein, the density of nano-sized carbon is much smaller than heat dissipation metal sheet material, less than 1/6th of the density of conventional heat sink material copper, and the nano-carbon layer coating that to be only thickness minimum, its thickness can less than 2～3mm, less than the thickness of metal fin。Therefore, dispel the heat by having the printed circuit board of insulating nano carbon-coating, can not only effectively reduce the temperature at thermal source place, and hinge structure uses metal fin heat radiation, it is possible to be substantially reduced the weight of electronic equipment。
Those skilled in the art are it should be appreciated that embodiments herein can be provided as method, system or computer program。Therefore, the application can adopt the form of complete hardware embodiment, complete software implementation or the embodiment in conjunction with software and hardware aspect。And, the application can adopt the form at one or more upper computer programs implemented of computer-usable storage medium (including but not limited to disk memory, CD-ROM, optical memory etc.) wherein including computer usable program code。
The application describes with reference to flow chart and/or the block diagram according to the method for the embodiment of the present application, equipment (system) and computer program。It should be understood that can by the combination of the flow process in each flow process in computer program instructions flowchart and/or block diagram and/or square frame and flow chart and/or block diagram and/or square frame。These computer program instructions can be provided to produce a machine to the processor of general purpose computer, special-purpose computer, Embedded Processor or other programmable data processing device so that the instruction performed by the processor of computer or other programmable data processing device is produced for realizing the device of function specified in one flow process of flow chart or multiple flow process and/or one square frame of block diagram or multiple square frame。
These computer program instructions may be alternatively stored in and can guide in the computer-readable memory that computer or other programmable data processing device work in a specific way, the instruction making to be stored in this computer-readable memory produces to include the manufacture of command device, and this command device realizes the function specified in one flow process of flow chart or multiple flow process and/or one square frame of block diagram or multiple square frame。
Although having been described for the preferred embodiment of the application, but those skilled in the art are once know basic creative concept, then these embodiments can be made other change and amendment。So, claims are intended to be construed to include preferred embodiment and fall into all changes and the amendment of the application scope。
Obviously, the application can be carried out various change and modification without deviating from spirit and scope by those skilled in the art。So, if these amendments of the application and modification belong within the scope of the application claim and equivalent technologies thereof, then the application is also intended to comprise these change and modification。
Claims (10)
1. a printed circuit board, is used for arranging electronic devices and components, it is characterised in that described printed circuit board includes:
Conductive layer, is electrically connected with described electronic devices and components；
Insulating nano carbon-coating, is attached on described conductive layer, for conducting heat produced by the described electronic devices and components being arranged on described insulating nano carbon-coating。
2. printed circuit board as claimed in claim 1, it is characterised in that have hole on described insulating nano carbon-coating, wherein, described conductive layer realizes electrical connection with described electronic devices and components especially by the lead-in wire through described hole。
3. printed circuit board as claimed in claim 2, it is characterised in that be etched with circuitous pattern on described conductive layer。
4. printed circuit board as described in any claim in claim 1-3, it is characterised in that described printed circuit board also includes:
Insulated substrate, wherein, described conductive layer is specifically attached on first of described insulated substrate；
Second conductive layer, be attached to described insulated substrate with on described first contrary second；
Second insulating nano carbon-coating, is attached on described second conductive layer, for conducting heat produced by the second electronic devices and components being arranged on described second insulating nano carbon-coating；
Wherein, described second conductive layer and described second electronic devices and components electrical connection。
5. an electronic equipment, it is characterised in that including:
Printed circuit board as described in any claim in claim 1-4；
Electronic devices and components, are arranged on described insulating nano carbon-coating。
6. the method making printed circuit board, it is characterised in that including:
Etch circuitous pattern on the electrically conductive；
Described conductive layer is prepared insulating nano carbon-coating。
7. method as claimed in claim 6, it is characterised in that described on described conductive layer, prepare insulating nano carbon-coating after, described method also includes:
Described insulating nano carbon-coating is heated。
8. method as claimed in claim 7, it is characterised in that described described insulating nano carbon-coating is heated, including:
Infrared light supply is adopted to irradiate described insulating nano carbon-coating；Or
Described printed circuit board is placed in the baking oven of 200 DEG C and heats 20 minutes。
9. method as claimed in claim 6, it is characterised in that described prepare insulating nano carbon-coating on described conductive layer, including:
The mode adopting electrostatic atomization spraying prepares described insulating nano carbon-coating on described conductive layer。
10. the method as described in claim 6 or 9, it is characterised in that described prepare insulating nano carbon-coating on described conductive layer, including:
Arranging mask plate on described conductive layer, prepare described insulating nano carbon-coating according to described mask plate on described conductive layer, the figure of described mask plate is determined according to described circuitous pattern, and the figure of described insulating nano carbon-coating is corresponding with the figure of described mask plate。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410692522.2A CN105704905A (en) | 2014-11-26 | 2014-11-26 | Printed circuit board, electronic equipment and method for manufacturing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410692522.2A CN105704905A (en) | 2014-11-26 | 2014-11-26 | Printed circuit board, electronic equipment and method for manufacturing printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN105704905A true CN105704905A (en) | 2016-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410692522.2A Pending CN105704905A (en) | 2014-11-26 | 2014-11-26 | Printed circuit board, electronic equipment and method for manufacturing printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109550953A (en) * | 2018-12-06 | 2019-04-02 | 山东大学 | A kind of method that laser lithography-electrospray deposition prepares micro- texture |
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| CN102958273A (en) * | 2012-10-23 | 2013-03-06 | 陈伟杰 | PCB (Printed Circuit Board) |
| CN203181411U (en) * | 2013-03-14 | 2013-09-04 | 苏州热驰光电科技有限公司 | FR4 printed circuit board with enhanced highly-heat-conductive nano diamond-like-carbon (DLC) coating |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100051332A1 (en) * | 2008-09-03 | 2010-03-04 | Foxconn Advanced Technology Inc. | Circuit substrate for mounting electronic component and circuit substrate assembly having same |
| CN201479462U (en) * | 2009-05-11 | 2010-05-19 | 成都航天通信设备有限责任公司 | Cooling plate printing plate |
| CN102958273A (en) * | 2012-10-23 | 2013-03-06 | 陈伟杰 | PCB (Printed Circuit Board) |
| CN203181411U (en) * | 2013-03-14 | 2013-09-04 | 苏州热驰光电科技有限公司 | FR4 printed circuit board with enhanced highly-heat-conductive nano diamond-like-carbon (DLC) coating |
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| CN109550953A (en) * | 2018-12-06 | 2019-04-02 | 山东大学 | A kind of method that laser lithography-electrospray deposition prepares micro- texture |
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Application publication date: 20160622 |
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