CN105695150A - Glue removing agent for LED (light emitting diode) encapsulation residue glue - Google Patents

Glue removing agent for LED (light emitting diode) encapsulation residue glue Download PDF

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Publication number
CN105695150A
CN105695150A CN201610164931.4A CN201610164931A CN105695150A CN 105695150 A CN105695150 A CN 105695150A CN 201610164931 A CN201610164931 A CN 201610164931A CN 105695150 A CN105695150 A CN 105695150A
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CN
China
Prior art keywords
led
cull
encapsulates
glue
methylimidazole
Prior art date
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Pending
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CN201610164931.4A
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Chinese (zh)
Inventor
刘德强
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Element Semiconductor Co Ltd Is Contained By Shenzhen
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Element Semiconductor Co Ltd Is Contained By Shenzhen
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Priority to CN201610164931.4A priority Critical patent/CN105695150A/en
Publication of CN105695150A publication Critical patent/CN105695150A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/835—Mixtures of non-ionic with cationic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/38—Cationic compounds
    • C11D1/62—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/38—Cationic compounds
    • C11D1/645—Mixtures of compounds all of which are cationic
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/044—Hydroxides or bases
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2003—Alcohols; Phenols
    • C11D3/2006—Monohydric alcohols
    • C11D3/201—Monohydric alcohols linear
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2003—Alcohols; Phenols
    • C11D3/2006—Monohydric alcohols
    • C11D3/2017—Monohydric alcohols branched
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2003—Alcohols; Phenols
    • C11D3/2041—Dihydric alcohols
    • C11D3/2044—Dihydric alcohols linear
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2096—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/28—Heterocyclic compounds containing nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3707—Polyethers, e.g. polyalkyleneoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • C11D1/721—End blocked ethers

Abstract

The invention discloses a glue removing agent for LED (light emitting diode) encapsulation residue glue. The glue removing agent is basically prepared from the following ingredients in percentage by weight: 30 to 80 percent of solvents, 10 to 60 percent of diluting agents, 5 to 10 percent of penetrating agents, 0.1 to 5 percent of metal protecting agents, 0.1 to 5 percent of catalysts and 0.1 to 0.5 percent of surface active agents. The product can be used for removing silica gel and epoxide resin encapsulation glue remained by an LED encapsulation material on equipment; the effect is good; no corrosion is left on the equipment; toxicity on the human body is low; compared with conventional methylene dichloride, carbon tetrachloride, tetrachloroethylene, acetone, toluene, xylene and vinyl acetate, the effect is equivalent; the consumption is low; the environment-friendly effect is achieved; the use is convenient.

Description

A kind of LED encapsulates the adhesive remover of cull
Technical field
The present invention relates to LED and encapsulate production field, be specifically related to the adhesive remover of LED packaging plastic。
Technical background
In recent years, LED was more and more wider in the range of application of the industries such as city lighting engineering, electrical equipment industry and civil buildings。Semiconductor light-emitting-diode (LED) is a kind of solid-state semiconductor device converting electrical energy into visible ray, the spectrum of LED almost all concentrates on visible light frequency band, its luminous efficiency, up to 80%～90%, is a kind of new and effective light source, has the 3 big advantages such as energy-saving and environmental protection, life-span length。Under the background of global energy shortage, LED is more and more concerned。Light-emitting diode display part works under rugged environment because it is chronically exposed to harshness, it is desirable to must have good environmental suitability。The purpose of light-emitting diode display part embedding: be first seal and insulation, it is to avoid the pin of printed wiring board and light emitting diode is exposed in environment, thus from moisture, rainwater, dust, radiation (light, heat), migrating the environmental injuries such as ion;Next to that fixing LED, improve the product resistance to external shock, vibrations, it is prevented that cause the defect that display screen display quality declines because LED is crooked。The Embedding Material being currently used for LED display module is various in style, and conventional has epoxy resin, polyurethane and organosilicon。Epoxy resin faces moisture-proof, thermostability, internal stress problem etc.;It is that casting glue surface is excessively soft, easy to foaming that polyurethane also exists insoluble problem in the application;Solidify easy embrittlement when insufficient and hot setting;In the working environment that condition is harsh, polyurethane potting material is often difficult to meet that wet-heat resisting is ageing-resistant, high-low temperature resistant requirement。Organosilicon macromolecule material has the weatherability of uniqueness, an ageing-resistant performance because of special siliconoxygen bond backbone structure, excellent high and low temperature resistance, good hydrophobicity, mechanical performance, electric insulation etc., thus is widely used in electrical and electronic component。
Both at home and abroad the organic silicon potting adhesive for electronic devices and components mostly is single-component product, and its electric property, waterproof, weather-proof, ageing-resistant performance better, but the elastomer after sulfuration is poor with the cementability of metal。Light-emitting diode display part embedding also there is many research both at home and abroad。What can not be fully solved in light-emitting diode display part embedding to occur peels off with LED pin, support, the problem such as hot strength and bonding force, and the cohesive force of epoxy resin is better, and epoxy encapsulant is also widely used in LED industry。
LED encapsulation process, use silica gel or epoxide-resin glue, Glue dripping head, conveyance conduit, dress gluing equipment usually removing residual glue, it is necessary to clean, adopt dichloromethane, tetrachloromethane, acetone etc. to dissolve, not only soon but also the smell is awful in consumption。
Summary of the invention
For solving the problems referred to above, the present invention provides a kind of LED to encapsulate the adhesive remover of cull, and cost is low and simple to operate。
For achieving the above object, the present invention adopts the following technical scheme that
A kind of LED encapsulates the adhesive remover of cull, and its each component and percentage by weight be: the present invention basic composition is with weight ratio: solvent 30～80%, diluent 10～60%; penetrating agent 5～10%; metal coating agent 0.1～5%, catalyst 0.1～5%, surfactant 0.1～0.5%。
Wherein, solvent is one or more mixture of gamma-butyrolacton, N-Methyl pyrrolidone, N-ethyl-2-pyrrolidone, 2-Pyrrolidone, glycol monoethyl ether, ethylene glycol monobutyl ether。
Wherein, diluent is one or more mixture of glycerol, isopropanol, ethylene glycol, triethylene-glycol, diethylene glycol, water。
Wherein, penetrating agent is one or more mixture of JFC, JFC-1, JFC-2, JFC-E。
Wherein, metal coating agent is BTA, 2-methyl phenylpropyl alcohol triazole, imidazoles, 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-phenylimidazole, 2-undecyl imidazole, 1 benzyl 2 methyl imidazole, 2-heptadecyl imidazole, 4, 5-diphenyl-imidazole, 2-methylimidazole quinoline, 2-benzylimidazoline, 2-undecyl imidazole quinoline, 2-heptadecyl imidazole quinoline, 2 isopropyl imidazole, 2, 4-methylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl imidazol(e) quinoline, 2-phenyl-4-methylimidazole quinoline, one or more mixture of 1-cyano ethyl imidazoles。
Wherein, catalyst is one or more mixture of sodium hydroxide, potassium hydroxide, ammonia, Tetramethylammonium hydroxide, monoethanolamine。
Wherein, surfactant is: OP-10, OP-20, phenol polyethenoxy ether sodium sulfate, isooctanol sodium sulfate, dodecylbenzene sodium sulfonate, perfluoroalkyl potassium sulfate, tetrabutyl ammonium bromide, four base ammonium bromide, cetyl trimethylammonium bromide the mixture of one or more。
The present invention according to silica type or epoxy resin, can regulate solvent based on gamma-butyrolacton or pyrrolidinone compounds, during configuration, be sequentially added in container stir according to solvent, diluent, metal coating agent and surfactant。The adhesive remover of the present invention uses temperature 5～130 DEG C, soak time 5～150 minutes, can add ultrasonic unit, suitably can adjust according to practical situation。The adhesive remover of the present invention can efficiently be removed LED packaging plastic and remain in the uncured of equipment etc. and the glue solidified, and do not corrode genus matrix material, configure simple, easy to operate, cost is low, environmental protection etc.。
Detailed description of the invention
Below in conjunction with specifically used example, setting forth the present invention through a step, embodiment is merely to illustrate the present invention and is not intended to this anti-scope of invention。
Embodiment 1～10, concrete formula is in Table 1。
The each Example formulations table of table 1
According to table 1 formula, weigh respective substance, mix homogeneously, adhesive remover can be obtained。
Embodiment provided by the invention, according to table 1 Example formulations, configuration adhesive remover, electronics silica gel (RTV-T)-LED or the special casting glue of (RTV-5801)-LED, during embedding, first A, B bi-component in container mixing and stirring, embedding again, but when the container joining glue reuses, it is necessary to cull is cleaned up, otherwise, joining glue and easily produce filament, affect mobility, embedding is bad, container has uncured and cure component, using this adhesive remover, soaking at room temperature, after 30 minutes, is washed, dry up, namely arrive removing glue effect。
According to table 1 Example formulations, configuration adhesive remover is applied to LED Automatic encapsulation machine, and during use, gelatin substance remains in mold runner or steam vent etc., may blocking as reused, affect package quality, use this adhesive remover, soaking at room temperature is after 30 minutes, washing, dries up, and namely arrives removing glue effect。
The present invention is for removing the packaging plastic of plug-in unit LED residual, according to table 1 Example formulations, configures adhesive remover。Plug-in unit LED, after embedding, the root of LED, there are residual packaging plastic, impact plating, cull needs to remove, and uses this adhesive remover, and 60 DEG C, after soaking 30 minutes, washing dries up, and namely reaches removing glue effect。
Embodiments of the invention simply introduce its detailed description of the invention, do not lie in and limit its protection domain。The technical staff of the industry may be made that some is revised under the inspiration of the present embodiment, therefore all equivalences done according to patent of invention scope change or modify, and belong in patent of invention right claimed range。

Claims (7)

1. LED encapsulates an adhesive remover for cull, it is characterized by, its each component and percentage by weight are respectively as follows: solvent 30～80%, diluent 10～60%, penetrating agent 5～10%, metal coating agent 0.1～5%, catalyst 0.1～5%, surfactant 0.1～0.5%。
2. LED as claimed in claim 1 encapsulates the adhesive remover of cull, it is characterized by, described solvent is one or more mixture of gamma-butyrolacton, N-Methyl pyrrolidone, N-ethyl-2-pyrrolidone, 2-Pyrrolidone, glycol monoethyl ether, ethylene glycol monobutyl ether。
3. LED as claimed in claim 1 encapsulates the adhesive remover of cull, it is characterized by, described diluent is one or more mixture of glycerol, isopropanol, ethylene glycol, triethylene-glycol, diethylene glycol, water。
4. LED as claimed in claim 1 encapsulates the adhesive remover of cull, it is characterized by, described penetrating agent is one or more mixture of JFC, JFC, JFC-1, JFC-2, JFC-E。
5. LED as claimed in claim 1 encapsulates the adhesive remover of cull, it is characterized by, described metal coating agent is BTA, 2-methyl phenylpropyl alcohol triazole, imidazoles, 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-phenylimidazole, 2-undecyl imidazole, 1 benzyl 2 methyl imidazole, 2-heptadecyl imidazole, 4, 5-diphenyl-imidazole, 2-methylimidazole quinoline, 2-benzylimidazoline, 2-undecyl imidazole quinoline, 2-heptadecyl imidazole quinoline, 2 isopropyl imidazole, 2, 4-methylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl imidazol(e) quinoline, 2-phenyl-4-methylimidazole quinoline, one or more mixture of 1-cyano ethyl imidazoles。
6. LED as claimed in claim 1 encapsulates the adhesive remover of cull, it is characterized by, described catalyst is one or more mixture of sodium hydroxide, potassium hydroxide, ammonia, Tetramethylammonium hydroxide, ethanolamine。
7. LED as claimed in claim 1 encapsulates the adhesive remover of cull, it is characterized by, described surfactant is: OP-10, OP-20, phenol polyethenoxy ether sodium sulfate, isooctanol sodium sulfate, dodecylbenzene sodium sulfonate, perfluoroalkyl potassium sulfate, tetrabutyl ammonium bromide, four base ammonium bromide, cetyl trimethylammonium bromide the mixture of one or more。
CN201610164931.4A 2016-03-22 2016-03-22 Glue removing agent for LED (light emitting diode) encapsulation residue glue Pending CN105695150A (en)

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106475378A (en) * 2016-10-19 2017-03-08 肇庆高新区飞越信息科技有限公司 A kind of label peeling agent of recycled plastic carafe
CN106554862A (en) * 2016-10-26 2017-04-05 张萍 One kind damping under room temperature environment removes solution and minimizing technology with silicone rubber
CN106833941A (en) * 2017-01-09 2017-06-13 盛益腾电子科技无锡有限公司 A kind of middle temperature alkalescence bating liquor and preparation method thereof
CN106906082A (en) * 2017-03-08 2017-06-30 齐齐哈尔百思特科技有限责任公司 One kind is except gluing cleaning agent and preparation method thereof
CN107805550A (en) * 2017-07-06 2018-03-16 上海新阳半导体材料股份有限公司 A kind of glue-dispenser, its preparation method and application available for deburring
CN108048233A (en) * 2017-12-29 2018-05-18 广东铁科灌浆科技有限公司 Epoxy resin cleaning agent and preparation method thereof
CN109433799A (en) * 2018-11-14 2019-03-08 蓝思科技（长沙）有限公司 It is a kind of for separation of glasses-assembled metal part release agent and separating technology
CN109810792A (en) * 2017-11-20 2019-05-28 蓝思科技（长沙）有限公司 A kind of glass cleaner and preparation method thereof
CN110484391A (en) * 2018-05-15 2019-11-22 蓝思科技（长沙）有限公司 One kind wiping agent and wiping method
CN111117815A (en) * 2019-12-31 2020-05-08 南通曜世新材料科技有限公司 Resin dissolving solution for resin diamond wire and broken wire connection method thereof
CN111876268A (en) * 2020-06-24 2020-11-03 日益和化工（苏州）有限公司 Proportioning production process of chemical degumming liquid
CN112680287A (en) * 2020-12-22 2021-04-20 青岛科金电子材料有限公司 Glue-removing and softening integrated low-temperature deburring liquid for surface-mounted diodes
CN113444583A (en) * 2021-06-25 2021-09-28 山东新华莎罗雅生物技术有限公司 Medical degumming agent and preparation method thereof
CN113502479A (en) * 2021-07-15 2021-10-15 南京科润工业介质股份有限公司 Non-phosphorus water-based degumming and degreasing agent
CN114277262A (en) * 2021-12-21 2022-04-05 永臻科技股份有限公司 Aluminum alloy frame recovery processing equipment

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CN104450308A (en) * 2014-12-11 2015-03-25 江门市江海区奥琪化工科技有限公司 Fire retardant cleaner for LED and preparation method thereof
CN104862134A (en) * 2015-03-27 2015-08-26 武汉宜田科技发展有限公司 Silicon wafer degumming agent, manufacturing method and use method thereof
CN105219542A (en) * 2015-10-22 2016-01-06 西安文理学院 Non-setting adhesive cull scavenging agent of a kind of environment-protecting asepsis and preparation method thereof

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US20150057375A1 (en) * 2012-01-17 2015-02-26 Taminco Use of improved n-alkyl pyrrolidone solvent
CN103215148A (en) * 2013-03-28 2013-07-24 广东山之风环保科技有限公司 Balsaming lens overflowing glue cleaning fluid and preparation and use methods thereof
CN104450308A (en) * 2014-12-11 2015-03-25 江门市江海区奥琪化工科技有限公司 Fire retardant cleaner for LED and preparation method thereof
CN104862134A (en) * 2015-03-27 2015-08-26 武汉宜田科技发展有限公司 Silicon wafer degumming agent, manufacturing method and use method thereof
CN105219542A (en) * 2015-10-22 2016-01-06 西安文理学院 Non-setting adhesive cull scavenging agent of a kind of environment-protecting asepsis and preparation method thereof

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106475378A (en) * 2016-10-19 2017-03-08 肇庆高新区飞越信息科技有限公司 A kind of label peeling agent of recycled plastic carafe
CN106554862A (en) * 2016-10-26 2017-04-05 张萍 One kind damping under room temperature environment removes solution and minimizing technology with silicone rubber
CN106833941A (en) * 2017-01-09 2017-06-13 盛益腾电子科技无锡有限公司 A kind of middle temperature alkalescence bating liquor and preparation method thereof
CN106906082A (en) * 2017-03-08 2017-06-30 齐齐哈尔百思特科技有限责任公司 One kind is except gluing cleaning agent and preparation method thereof
CN107805550A (en) * 2017-07-06 2018-03-16 上海新阳半导体材料股份有限公司 A kind of glue-dispenser, its preparation method and application available for deburring
CN107805550B (en) * 2017-07-06 2020-12-15 上海新阳半导体材料股份有限公司 Degumming agent for deburring, preparation method and application thereof
CN109810792A (en) * 2017-11-20 2019-05-28 蓝思科技（长沙）有限公司 A kind of glass cleaner and preparation method thereof
CN108048233A (en) * 2017-12-29 2018-05-18 广东铁科灌浆科技有限公司 Epoxy resin cleaning agent and preparation method thereof
CN110484391A (en) * 2018-05-15 2019-11-22 蓝思科技（长沙）有限公司 One kind wiping agent and wiping method
CN109433799A (en) * 2018-11-14 2019-03-08 蓝思科技（长沙）有限公司 It is a kind of for separation of glasses-assembled metal part release agent and separating technology
CN109433799B (en) * 2018-11-14 2021-07-13 蓝思科技（长沙）有限公司 Separating agent for separating glass-metal assembly and separation process
CN111117815A (en) * 2019-12-31 2020-05-08 南通曜世新材料科技有限公司 Resin dissolving solution for resin diamond wire and broken wire connection method thereof
CN111876268A (en) * 2020-06-24 2020-11-03 日益和化工（苏州）有限公司 Proportioning production process of chemical degumming liquid
CN112680287A (en) * 2020-12-22 2021-04-20 青岛科金电子材料有限公司 Glue-removing and softening integrated low-temperature deburring liquid for surface-mounted diodes
CN113444583A (en) * 2021-06-25 2021-09-28 山东新华莎罗雅生物技术有限公司 Medical degumming agent and preparation method thereof
CN113502479A (en) * 2021-07-15 2021-10-15 南京科润工业介质股份有限公司 Non-phosphorus water-based degumming and degreasing agent
CN114277262A (en) * 2021-12-21 2022-04-05 永臻科技股份有限公司 Aluminum alloy frame recovery processing equipment

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