CN105679922B - 用于增大的光提取和非黄色的断开状态颜色的在封装剂中具有颗粒的led - Google Patents
用于增大的光提取和非黄色的断开状态颜色的在封装剂中具有颗粒的led Download PDFInfo
- Publication number
- CN105679922B CN105679922B CN201610249881.XA CN201610249881A CN105679922B CN 105679922 B CN105679922 B CN 105679922B CN 201610249881 A CN201610249881 A CN 201610249881A CN 105679922 B CN105679922 B CN 105679922B
- Authority
- CN
- China
- Prior art keywords
- light
- encapsulant
- particle
- led
- phosphor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000008393 encapsulating agent Substances 0.000 title claims abstract description 69
- 239000002245 particle Substances 0.000 title claims abstract description 46
- 238000000605 extraction Methods 0.000 title description 7
- 230000001965 increasing effect Effects 0.000 title description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000000007 visual effect Effects 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims description 18
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 3
- 239000002223 garnet Substances 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 229910003087 TiOx Inorganic materials 0.000 claims description 2
- 229910003134 ZrOx Inorganic materials 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims 2
- 239000007844 bleaching agent Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract description 59
- 229920001296 polysiloxane Polymers 0.000 abstract description 12
- 239000003795 chemical substances by application Substances 0.000 abstract description 9
- 238000005538 encapsulation Methods 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 12
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001540 jet deposition Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610249881.XA CN105679922B (zh) | 2008-10-01 | 2008-10-01 | 用于增大的光提取和非黄色的断开状态颜色的在封装剂中具有颗粒的led |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801313735A CN102171844A (zh) | 2008-10-01 | 2008-10-01 | 用于增大的光提取和非黄色的断开状态颜色的在封装剂中具有颗粒的led |
CN201610249881.XA CN105679922B (zh) | 2008-10-01 | 2008-10-01 | 用于增大的光提取和非黄色的断开状态颜色的在封装剂中具有颗粒的led |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008801313735A Division CN102171844A (zh) | 2008-10-01 | 2008-10-01 | 用于增大的光提取和非黄色的断开状态颜色的在封装剂中具有颗粒的led |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105679922A CN105679922A (zh) | 2016-06-15 |
CN105679922B true CN105679922B (zh) | 2018-07-17 |
Family
ID=56215865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610249881.XA Active CN105679922B (zh) | 2008-10-01 | 2008-10-01 | 用于增大的光提取和非黄色的断开状态颜色的在封装剂中具有颗粒的led |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105679922B (zh) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6650044B1 (en) * | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
TWI226357B (en) * | 2002-05-06 | 2005-01-11 | Osram Opto Semiconductors Gmbh | Wavelength-converting reaction-resin, its production method, light-radiating optical component and light-radiating semiconductor-body |
US7847302B2 (en) * | 2005-08-26 | 2010-12-07 | Koninklijke Philips Electronics, N.V. | Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature |
-
2008
- 2008-10-01 CN CN201610249881.XA patent/CN105679922B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN105679922A (zh) | 2016-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11631790B2 (en) | Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same | |
US7791093B2 (en) | LED with particles in encapsulant for increased light extraction and non-yellow off-state color | |
EP2342763B1 (en) | Led with particles in encapsulant for increased light extraction and non-yellow off-state color | |
CN103117348B (zh) | 发光器件以及具有发光器件的照明装置 | |
US7847302B2 (en) | Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature | |
US8324646B2 (en) | Chip coated light emitting diode package and manufacturing method thereof | |
TWI463708B (zh) | 側面出光型發光元件封裝結構及其製造方法 | |
JP4611937B2 (ja) | 表面実装型発光装置及びその製造方法 | |
US20110037083A1 (en) | Led package with contrasting face | |
KR100986571B1 (ko) | 발광소자 패키지 및 그 제조방법 | |
KR20170123831A (ko) | 형광체 조성물, 이를 포함하는 발광 소자 패키지 및 조명 장치 | |
KR20080055549A (ko) | Led 패키지 제조방법 | |
KR20140004351A (ko) | 발광 다이오드 패키지 | |
US10125947B2 (en) | Board and light source module including the same | |
KR102409966B1 (ko) | 광원 모듈의 제조방법 | |
CN105679922B (zh) | 用于增大的光提取和非黄色的断开状态颜色的在封装剂中具有颗粒的led | |
JP5628475B2 (ja) | 表面実装型発光装置の製造方法 | |
KR101655464B1 (ko) | 발광소자 패키지, 그 제조방법 및 조명시스템 | |
KR20140057932A (ko) | 형광체 및 이를 구비한 발광 소자 | |
JP2010225607A (ja) | 発光装置 | |
JP2004179430A (ja) | 半導体装置およびその製造方法 | |
KR20030083452A (ko) | 고휘도 발광 다이오드 및 그 제조 방법 | |
JP2008252148A (ja) | 発光装置用のパッケージ及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Eindhoven, Netherlands Co-patentee after: LUMILEDS LLC Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Eindhoven, Netherlands Co-patentee before: Philips Ramildes Lighting Equipment Co.,Ltd. Patentee before: KONINKLIJKE PHILIPS ELECTRONICS N.V. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200902 Address after: Holland Schiphol Patentee after: KONINKLIJKE PHILIPS NV Address before: Eindhoven, Netherlands Co-patentee before: LUMILEDS LLC Patentee before: KONINKLIJKE PHILIPS N.V. |
|
TR01 | Transfer of patent right |