CN105679715B - The thermistor that lies low with foot stool - Google Patents
The thermistor that lies low with foot stool Download PDFInfo
- Publication number
- CN105679715B CN105679715B CN201410655467.XA CN201410655467A CN105679715B CN 105679715 B CN105679715 B CN 105679715B CN 201410655467 A CN201410655467 A CN 201410655467A CN 105679715 B CN105679715 B CN 105679715B
- Authority
- CN
- China
- Prior art keywords
- foot stool
- chip body
- thermistor
- electrode
- breach
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Thermistors And Varistors (AREA)
Abstract
The present invention is a thermistor that lies low with foot stool, with a chip body, it is arranged at two electrodes of the chip body two apparent surface, two L-type foot stools and two termination electrodes for being arranged at the chip body two opposite sides side, the two L-types foot stool is arranged at the two opposite sides side of the chip body, and the two L-types foot stool has a first piece portion vertical with the chip body surface and a second piece portion parallel with the chip body surface respectively, 2 first portions of the two L-types foot stool electrically connect with two termination electrode respectively, 2 second portions of the two L-types foot stool are then for being soldered to a circuit board.This has the thermistor that lies low of foot stool not merely with the padded chip body of two L foot stools to increase radiating efficiency, and can effectively utilize two L foot stools and fix the chip body, makes the chip body be not easy to be changed position by external force.It solid space is reduced and simple in construction by the present invention, can be welded using automatic piece mode, saving cost of manufacture.
Description
Technical field
The present invention is a kind of thermistor, espespecially a kind of thermistor that lies low with foot stool.
Background technology
Refer to shown in Fig. 6, existing thermistor 30 is designed using vertical type, and it has a body 31 and two pins
32.The body 31 is a circular lamellar body, and two pins 32 are stretched out and structure by the direction parallel with the surface of body 31
Into.When the thermistor 30 is soldered to a circuit board 40, two pins 32 are inserted in the welding hole 41 of the circuit board 40,
To be welded with the circuit board 40.But the existing thermistor 30 using vertical type design is when welding causes circuit board 40, because should
Two pins 32 are parallel with the body 31, and perpendicular to the circuit board 40, cause the height of the body 31 to occupy larger stand
Body space, thus it is existing adopt vertical type design thermistor 30 and can not be suitable for the product of light and thin type.
Refer to shown in Fig. 7, when being assembled in the circuit board 40 to improve the thermistor 30, take larger solid space
The problem of, it is to bend two pins 32 of the thermistor 30 separately to have a design, makes the surface of body 31 and the circuit board 40
Surface is parallel, makes the body 31 of the thermistor 30 more press close to the surface of circuit board 40, is welded with reducing the thermistor 30
The height of the body 31 after to the circuit board 40, make the thermistor 30 in taking less solid space on the circuit board 40,
To reduce the volume of the circuit board 40.
But the design for bending two pins 32 of the thermistor 30, merely with the flexibility of two pins 32, by this
Body 31 remains motionless after bending, and therefore, is easily caused the body 31 to move by other external force (such as rock or push).This
Outside, two pins 32 of the thermistor 30 are respectively positioned on the same side of the body 31 of the thermistor 30, in being assembled to the electricity
During the plate 40 of road, the body 31 of the thermistor 30 causes assembling built on the sand only by unilateral support.In addition, the thermistor
30 when the circuit board 40 is assembled to, because its structure can not be welded by the way of automatic piece, it is necessary to pass through artificial plug-in unit
Welded, but manufacturing cost can be allowed to improve by the way of artificial plug-in unit
When the effect of the thermistor 30 is to suppress the surge current of energization moment, because being powered the moment body 31
Temperature can bring up to hundreds of degrees Celsius of high temperature, and the thermistor 30 is different from the thermal coefficient of expansion of the circuit board 40, works as temperature
Degree can be because the difference of the coefficient of expansion produces stress when improving so that the thermistor 30 ruptures, and influences service life.And the heat
For quick resistance 30 when steady state operation, its operating temperature is about 90~160 DEG C, and the carbon of circuit board 40 can be made under long term high temperature state
Change, influence the reliability of remaining electronic component on the circuit board 40.Therefore, thus the thermistor 30 of prior art certainly will do into
The improvement of one step.
The content of the invention
The main object of the present invention provides a kind of thermistor that lies low with foot stool, to overcome existing vertical type heat
Quick resistance occupancy solid space is too big, and the unsteady shortcoming of assembling.
The technical scheme is that providing a kind of thermistor that lies low with foot stool, include：
One chip body, there is parallel and relative a first surface and a second surface；
One first electrode, it is arranged at the first surface of the chip body；
One second electrode, it is arranged at the second surface of the chip body；
One first termination electrode and one second termination electrode, be respectively formed in the opposite sides side of the chip body, wherein this
One termination electrode electrically connects the first electrode, and second termination electrode electrically connects the second electrode；
One first foot stool, it is L-shaped lamellar body, and includes orthogonal one first portion and one second portion, this first
Piece portion is vertical with the first surface, and electrically connects first termination electrode, and second portion is parallel with the second surface, and with this
Two surfaces maintain a spacing；And
One second foot stool, it is L-type lamellar body, and includes orthogonal one first portion and one second portion, this second
First portion of foot stool is vertical with the second surface, and electrically connects second termination electrode, and second portion of second foot stool is with being somebody's turn to do
Second surface is parallel, and maintains the spacing with the second surface；
Wherein second portion of first foot stool is located at the phase homonymy of the chip body with second portion of second foot stool.
It is second smooth weldering in portion by first foot stool and second foot stool that this, which has the thermistor that lies low of foot stool,
Be connected on the weld pad of a circuit board, make the circuit board can by first foot stool and second foot stool respectively with this first, second
Electrode electrically connects, and connects the chip body.The first foot stool and second foot stool that so should be with the thermistor that lies low of foot stool
Second portion is parallel with first, second surface of the chip body, and the smooth weld pad for being welded in the circuit board in second portion
On, therefore chip body is parallel with the circuit board, consequently, it is possible to which the thermistor occupancy that lies low with foot stool can not only be saved
Steric bulk, and set up using the first foot stool and the crus secunda and be placed in two relative sides of the chip body, should with common support
Chip body, increase the fixing intensity of the thermistor that lies low with foot stool, make it be not readily susceptible to other external force and (such as rock
Or push) cause the chip body mobile and change position, can firmly it be assembled on the circuit board.In addition, there should be foot stool
The thermistor that lies low structure it is simple, the weldering of second portion of first foot stool and second foot stool and the circuit board can be passed through
Pad is welded using automatic piece mode, to save manufacturing cost.And the foot stool has height, with the padded chip body, makes this
There is the spacing between chip body and the circuit board, ventilates, improve radiating efficiency.
Brief description of the drawings
Fig. 1 is the side cutaway view of the first preferred embodiment of the invention.
Fig. 2 is the stereo appearance figure of the first preferred embodiment of the invention.
Fig. 3 is the stereo appearance figure of the second preferred embodiment of the invention.
Fig. 4 is stereo appearance figure of second preferred embodiment covered with insulating barrier of the invention.
Fig. 5 is side cutaway view of second preferred embodiment covered with insulating barrier of the invention.
Fig. 6 is the stereo appearance figure of existing vertical type thermistor.
Fig. 7 is the stereo appearance figure after the bending of existing vertical type thermistor.
Main element symbol description：
10 should the chip body of thermistor 11 that lies low with foot stool
The second surface of 111 first surface 112
The second electrode of 12 first electrode 13
14 first portions of foot stool 141 first
142 second breach of portion 143 first
The foot stool of 144 second breach 15 second
151 first portions of 152 second, portion
The breach of 153 first breach 154 second
The termination electrode of 16 first termination electrode 17 second
The circuit board of 18 insulating barrier 20
The thermistor of 21 weld pad 30
The pin of 31 body 32
The welding hole of 40 circuit board 41
Embodiment
Coordinate schema and present pre-ferred embodiments below, the present invention is expanded on further and is adopted to reach predetermined goal of the invention
The technological means taken.
Refer to shown in Fig. 1 and Fig. 2, the present invention is a thermistor 10 that lies low with foot stool.This has the flat of foot stool
Thermistor 10 of lying includes a chip body 11, a first electrode 12, a second electrode 13, one first foot stool 14, one second
Foot stool 15, one first termination electrode 16 and one second termination electrode 17.
The chip body 11 is a lamellar body, and with being parallel to each other and a relative first surface 111 and a second surface
112.The first electrode 12 is arranged at the first surface 111 of the chip body 11, and the second electrode 13 is then arranged at the chip
The second surface 112 of body 11.First termination electrode 16 is respectively formed in the two of the chip body 11 with second termination electrode 17
Individual relative side, and first termination electrode 16 electrically connects the first electrode 12, and second termination electrode 17 electrically connects second electricity
Pole.
First foot stool 14 is L-type lamellar body, includes orthogonal one first portion, 141 and 1 second portions 142.Should
First portion 141 is vertical with the first surface 111, and is electrically connected with first termination electrode 16.Second portion 142 with this second
Surface 112 is parallel, and maintains a spacing H with the second surface 112.
Second foot stool 15 is L-type lamellar body, includes orthogonal one first portion, 151 and 1 second portions 152.Should
First portion 151 is vertical with the second surface 112, and is electrically connected with second termination electrode 17.Second portion 152 with this second
Surface 112 is parallel, and maintains spacing H with the second surface 112.Second portion 142 of first foot stool 14 and the crus secunda
Second portion 152 of frame 15 is respectively positioned on the phase homonymy of the chip body 11.
When there is the thermistor 10 that lies low of foot stool to be soldered on a circuit board 20 for this, pass through the of first foot stool 14
Two portions 142 and second portion 152 of second foot stool 15 are welded with the weld pad 21 on the circuit board 20, to be electrically connected to the electricity
Road plate 20.Second portion 142,152 of first foot stool 14 and second foot stool 15 and first, second table of the chip body 11
Face 111,112 is parallel, and on the smooth weld pad 21 for being welded in the circuit board 20 in two second portions 142,152, therefore chip sheet
Body 11 is parallel with the circuit board 20, consequently, it is possible to which the thermistor 10 that lies low that this has foot stool just can be saved in the circuit board 20
The steric bulk of upper occupancy.And should the structure with the thermistor 10 that lies low of foot stool it is simple, can by first foot stool 14 and
Second portion 142,152 of second foot stool 15 is welded with the weld pad 21 of the circuit board 20 using automatic piece mode, to save
Manufacturing cost.
Because first foot stool 14 and second foot stool 15 are arranged at two sides of the chip body 11, by the chip body
11 two sides support the chip body 11 jointly, can avoid, because external force causes the position of the chip body 11 to change, making it not
Easily caused the chip body 11 to move by other external force (such as rock or push) and change position, can firmly be assembled in this
On circuit board 20.
In addition, second portion 142,152 of first, second foot stool 14,15 is respectively positioned on the phase homonymy of the chip body 11,
And second portion 152 and first, second surface 111 of second portion 142 of first foot stool 14 and second foot stool 15,
112 is parallel, and has spacing H with the second surface 112, when there is the thermistor 10 that lies low of foot stool to be soldered to the circuit for this
During plate 20, it can make and spacing H is kept between the second surface 112 of the chip body 11 and the circuit board 20, to absorb because swollen
The difference of swollen coefficient and in the caused stress that expands with heat and contract with cold, while can maintain the circulation of air, there is provided good radiating efficiency, with
Be effectively reduced the temperature of weld pad 21 on the circuit board 20, avoid because the weld pad 21 be chronically at temperature it is too high in the state of, and
Cause the scolding tin of pad to melt to come off, or the situation of the circuit board 20 carbonization occurs.Therefore, the present invention can pass through change
Spacing H size adjusts the effect of radiating.
On the other hand, the material of first foot stool 14 and second foot stool 15 can also influence radiating efficiency and the weld pad 21
Temperature, and when the thermal conductivity of selected material is poorer, the temperature of the weld pad 21 is lower, i.e., the heat of the chip body 11 is not more
Easily conduction causes the weld pad 21.For example, can be selected the material such as metal such as copper, aluminium, iron, and wherein with the heat transfer efficiency of iron compared with
Difference, therefore during material of the selection iron as first foot stool 14 and second foot stool 15, the temperature of weld pad is relatively low.
Refer to shown in Fig. 3, have a common boundary in second portion 142 of first portion 141 and this of first foot stool 14, in this first
Piece portion 141 is formed with one first breach 143, and in second portion 142 formed with one second breach 144, and first breach
143 are connected with second breach 144.And have a common boundary in second portion 152 in first portion 151 of second foot stool 15 and this, in this
First portion 151 is formed with one first breach 153, and in second portion 152 formed with one second breach 154, and this first
Breach 153 is connected with second breach 154.By in first foot stool 14 be connected the first breach 143 and the second breach 144,
And the direction of the first breach 153 being connected in second foot stool 15 and second breach 154, further increase air circulation,
Radiating efficiency is improved, and reduces two second portions 142,152 and the contact area of the weld pad 21 of circuit board 20, thus reduces the core
Piece body 11 is conducted to the heat of the weld pad 21, further to reduce the temperature of the weld pad 21.
Refer to shown in Fig. 4 and Fig. 5, be somebody's turn to do the thermistor 10 that lies low with foot stool further with an insulating barrier 18, should
Insulating barrier 18 coats the chip body 11, the first electrode 12 and the second electrode 13, but expose first foot stool 14 and this
Bipod 15 is for welding circuits plate.In this preferred embodiment, the insulating barrier 18 be metal oxide, nonmetal oxide,
Glass or high polymer material.
Described above is only presently preferred embodiments of the present invention, not does any formal limitation to the present invention, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any to be familiar with this professional technology people
Member, in the range of technical solution of the present invention is not departed from, when the technology contents using the disclosure above make a little change or repair
The equivalent embodiment for equivalent variations is adornd, as long as being the content without departing from technical solution of the present invention, the technology according to the present invention is real
Any simple modification, equivalent change and modification that confrontation above example is made, still fall within the scope of technical solution of the present invention
It is interior.
Claims (4)
1. a kind of thermistor that lies low with foot stool, it is characterised in that include：
One chip body, there is parallel and relative a first surface and a second surface；
One first electrode, it is arranged at the first surface of the chip body；
One second electrode, it is arranged at the second surface of the chip body；
One first termination electrode and one second termination electrode, it is respectively formed in the opposite sides side of the chip body, the wherein first end
Electrode electrically connects the first electrode, and second termination electrode electrically connects the second electrode；
One first foot stool, it is L-shaped lamellar body, and includes orthogonal one first portion and one second portion, first portion
Vertical with the first surface, and electrically connect first termination electrode, second portion is parallel with the second surface, and with second table
Face maintains a spacing；And
One second foot stool, it is L-type lamellar body, and includes orthogonal one first portion and one second portion, second foot stool
First portion it is vertical with the second surface, and electrically connect second termination electrode, second portion of second foot stool with this second
Surface is parallel, and maintains the spacing with the second surface；
Wherein second portion of first foot stool is located at the phase homonymy of the chip body with second portion of second foot stool.
2. there is the thermistor that lies low of foot stool as claimed in claim 1, it is characterised in that
Have a common boundary in first portion of first foot stool and second portion of first foot stool, in first portion formed with one first
Breach, and in second portion formed with one second breach, and first breach is connected with second breach；
Have a common boundary in first portion of second foot stool and second portion of second foot stool, in first portion formed with one first
Breach, and in second portion formed with one second breach, and first breach is connected with second breach.
3. there is the thermistor that lies low of foot stool as claimed in claim 1 or 2, it is characterised in that further include：
One insulating barrier, coat the chip body, the first electrode and the second electrode.
4. there is the thermistor that lies low of foot stool as claimed in claim 3, it is characterised in that the insulating barrier is metal oxidation
Thing, nonmetal oxide, glass or high polymer material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410655467.XA CN105679715B (en) | 2014-11-17 | 2014-11-17 | The thermistor that lies low with foot stool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410655467.XA CN105679715B (en) | 2014-11-17 | 2014-11-17 | The thermistor that lies low with foot stool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105679715A CN105679715A (en) | 2016-06-15 |
| CN105679715B true CN105679715B (en) | 2018-03-30 |
Family
ID=56944513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410655467.XA Active CN105679715B (en) | 2014-11-17 | 2014-11-17 | The thermistor that lies low with foot stool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105679715B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111092062B (en) * | 2018-10-24 | 2021-06-08 | 欣兴电子股份有限公司 | Chip package structure and method for manufacturing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5107324A (en) * | 1989-04-27 | 1992-04-21 | Fuji Electric Co., Ltd. | Two-terminal semiconductor device of surface installation type |
| CN1526165A (en) * | 2001-05-15 | 2004-09-01 | Gem | Improved surface mount package |
| JP2005123342A (en) * | 2003-10-15 | 2005-05-12 | Alps Electric Co Ltd | Electronic circuit unit and its manufacturing method |
| CN204167284U (en) * | 2014-11-17 | 2015-02-18 | 兴勤电子工业股份有限公司 | There is the thermistor that lies low of foot rest |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9576884B2 (en) * | 2013-03-09 | 2017-02-21 | Adventive Ipbank | Low profile leaded semiconductor package |
-
2014
- 2014-11-17 CN CN201410655467.XA patent/CN105679715B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5107324A (en) * | 1989-04-27 | 1992-04-21 | Fuji Electric Co., Ltd. | Two-terminal semiconductor device of surface installation type |
| CN1526165A (en) * | 2001-05-15 | 2004-09-01 | Gem | Improved surface mount package |
| JP2005123342A (en) * | 2003-10-15 | 2005-05-12 | Alps Electric Co Ltd | Electronic circuit unit and its manufacturing method |
| CN204167284U (en) * | 2014-11-17 | 2015-02-18 | 兴勤电子工业股份有限公司 | There is the thermistor that lies low of foot rest |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105679715A (en) | 2016-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2012175488A3 (en) | Heat exchanger | |
| CN103687303A (en) | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same | |
| CN105679715B (en) | The thermistor that lies low with foot stool | |
| CN106298758A (en) | A kind of SMD power device Integrated Solution being applied to electric automobile electric control product | |
| CN202172370U (en) | Solar energy conjunction box | |
| CN204167284U (en) | There is the thermistor that lies low of foot rest | |
| JP3198101U (en) | PTC ceramic heater | |
| CN103619148A (en) | Electric vehicle controller heat dissipation device fixed by elastic sheet | |
| CN201266876Y (en) | DC/DC voltage converter with radiating effect | |
| CN201986264U (en) | Compound substrate for low-thermal resistance radio frequency amplifier | |
| CN103137274A (en) | High-power chip resistor | |
| CN103052181B (en) | Tao Jin mixed type PTC fast electric heater | |
| CN201515058U (en) | Shrapnel contact slot | |
| CN202134353U (en) | Embedded type pin | |
| CN205987528U (en) | Printed circuit board assembly easily dispels heat | |
| CN103249246A (en) | Circuit board and display device | |
| CN201174855Y (en) | Radiator assembly | |
| CN208434206U (en) | Multilayer power device stack structure | |
| CN107671478B (en) | Die structure convenient for assembling electrode | |
| CN101420841B (en) | Heat radiating mechanism | |
| CN102036470A (en) | Low-thermal-resistance and high-radiation metal-base circuit board | |
| CN205694031U (en) | Small-power photovoltaic DC-to-AC converter | |
| CN203839349U (en) | Reworking auxiliary tool | |
| TW201618127A (en) | Lie-flat thermistor with footstand | |
| TWM497335U (en) | Horizontal thermistor with stand |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |