CN105657970B - Rigid-flex combined board and its blind buried via hole method for plugging - Google Patents
Rigid-flex combined board and its blind buried via hole method for plugging Download PDFInfo
- Publication number
- CN105657970B CN105657970B CN201610084223.XA CN201610084223A CN105657970B CN 105657970 B CN105657970 B CN 105657970B CN 201610084223 A CN201610084223 A CN 201610084223A CN 105657970 B CN105657970 B CN 105657970B
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- Prior art keywords
- rigid
- daughter board
- flexible
- board
- via hole
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000003825 pressing Methods 0.000 claims description 20
- 239000013039 cover film Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 238000012545 processing Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of rigid-flex combined board and its blind buried via hole method for plugging, rigid-flex combined board includes rigid daughter board and rigid-flexible daughter board, the rigid daughter board is fixed on rigid-flexible daughter board, the rigid daughter board and/or rigid-flexible daughter board are equipped with blind buried via hole, at least one not flow model prepreg is equipped between the rigid daughter board and rigid-flexible daughter board, the blind buried via hole is filled by the gummosis of not flow model prepreg.The blind buried via hole method for plugging of rigid-flex combined board includes the following steps：Rigid-flexible daughter board and rigid daughter board are provided；Blind buried via hole is processed in the rigid daughter board and/or rigid-flexible daughter board；Metalized is carried out to blind buried via hole；Will at least one not flow model prepreg overlay between rigid daughter board and rigid-flexible daughter board；Rigid daughter board and rigid-flexible daughter board are pressed, the gummosis of not flow model prepreg is pressed into blind buried via hole.Above-mentioned rigid-flex combined board and its blind buried via hole method for plugging, not only easy to process, plate face planarization is good, and eliminates special equipment, reduces production cost.
Description
Technical field
The present invention relates to wiring board printing technology field, more particularly to a kind of rigid-flex combined board and its blind buried via hole consent side
Method.
Background technology
With electronic product towards miniaturization, portability direction develop, required printed wiring board also to it is light, thin,
Short, small direction is developed.Wherein, with high-density wiring, contact and the high density interconnection (HDI) that can realize three-dimensional assembling
Rigid-flex combined board is exactly the product for meeting this developing direction.
Due to wiring board multiple stratification, the requirement of densification, blind buried via hole increasingly frequently occurs in circuit board structure.It is rigid-flexible
Various in conjunction with plate material, medium is changeable, further causes the complication of its blind buried via hole processing technology.Wiring board process
In, it needs to provide a flat surface by consent, avoids being involved in corrosion impurity in blind buried via hole.For filler plumpness and reliably
Property the considerations of, the common method for plugging of manufacturer is vacuum resin consent method, is sucked dedicated resin in blind buried via hole using vacuum,
Process time is longer.This method requires mating corresponding special equipment, and needs remaining glue of polishing after processing, for enterprise undoubtedly
Increase production cost.
Invention content
Based on this, the invention reside in overcoming the deficiencies of existing technologies, a kind of rigid-flex combined board and its blind buried via hole consent are provided
Method, not only easy to process, plate face planarization is good, and eliminates special equipment, reduces production cost.
Its technical solution is as follows：
A kind of rigid-flex combined board, including rigid daughter board and rigid-flexible daughter board, the rigid daughter board are fixed on rigid-flexible daughter board, institute
It states rigid daughter board and/or rigid-flexible daughter board is equipped with blind buried via hole, at least one is equipped between the rigid daughter board and rigid-flexible daughter board not
Flow model prepreg, the blind buried via hole are filled by the gummosis of not flow model prepreg.
In one of the embodiments, the rigid-flexible daughter board include be sequentially laminated fixed first rigid plate, flexible board and
Second rigid plate.
The rigid-flexible daughter board is equipped with flexure region in one of the embodiments, and the flexure region is located at flexible board
Over and under, the upper surface and the lower surface of the flexible board is equipped with line pattern, is located on the line pattern described
Part in flexure region is flexible region line pattern, and the flexible region line pattern is equipped with cover film.
The not flow model prepreg is 1-5 in one of the embodiments,.
The present invention also provides a kind of blind buried via hole method for plugging of rigid-flex combined board, include the following steps：
Rigid-flexible daughter board and rigid daughter board are provided；
Blind buried via hole is processed in the rigid daughter board and/or rigid-flexible daughter board；
Metalized is carried out to blind buried via hole；
Will at least one not flow model prepreg overlay between rigid daughter board and rigid-flexible daughter board；
Rigid daughter board and rigid-flexible daughter board are pressed, the gummosis of not flow model prepreg is pressed into blind buried via hole.
Specifically, described provide rigid-flexible daughter board, include the following steps：
First rigid plate, flexible board and the second rigid plate are provided；
Line pattern is produced on the upper and lower surface of flexible board；
Cover film is pasted at the line pattern of flexible region；
Pressing is carried out after first rigid plate, flexible board and the second rigid plate are stacked successively forms rigid-flexible daughter board；
Flexure region corresponding with flexible region line pattern is processed on rigid-flexible daughter board.
Preferably, the not flow model prepreg is equipped with and the matched windowing of the flexure region.
Preferably, the maximum pressure of pressing rigid daughter board and rigid-flexible daughter board is 200-500PSI.
Preferably, the maximum heating temperature of pressing rigid daughter board and rigid-flexible daughter board is 150-250 DEG C.
Preferably, the heating rate of pressing rigid daughter board and rigid-flexible daughter board is 2-8 DEG C/min.
The advantages of below to preceding solution or principle illustrate：
Above-mentioned rigid-flex combined board, by the way that at least one not flow model semi-solid preparation is arranged between rigid daughter board and rigid-flexible daughter board
Piece realizes the filling to blind buried via hole on rigid-flex combined board, to simplify filling holes with resin flow, is not necessarily to dedicated hole plugging equipment
And resin, greatly reduce production cost.And the rigid-flex combined board plate face planarization that pressing obtains is high, and it is high-quality, it can complete
The making of fine-line.
The above-mentioned blind buried via hole method for plugging of rigid-flex combined board, by the way that at least one is arranged between rigid daughter board and rigid-flexible daughter board
Not flow model prepreg realizes the filling to blind buried via hole on rigid-flex combined board, to simplify filling holes with resin flow, is not necessarily to
Dedicated hole plugging equipment and resin, greatly reduce production cost.And the rigid-flex combined board plate face planarization that pressing obtains is high,
It is high-quality, the making of fine-line can be completed.
Description of the drawings
Fig. 1 is the structural schematic diagram of the rigid-flex combined board described in the embodiment of the present invention；
Fig. 2 is the flow diagram of the blind buried via hole method for plugging of rigid-flex combined board described in the embodiment of the present invention.
Reference sign：
1, rigid daughter board, 2, rigid-flexible daughter board, 3, not flow model prepreg, 4, blind hole, 5, buried via hole, the 20, first rigid plate,
21, flexible board, 21a, flexible region line pattern, 21b, flexure region, the 22, second rigid plate.
Specific implementation mode
The embodiment of the present invention is described in detail below：
As shown in Figure 1, the rigid-flex combined board described in the present embodiment, including rigid daughter board 1 and rigid-flexible daughter board 2, the rigidity
Daughter board 1 is fixed on rigid-flexible daughter board 2, and the rigid daughter board 1 and/or rigid-flexible daughter board 2 are equipped with blind buried via hole, the rigid daughter board 1
Being equipped at least one between rigid-flexible daughter board 2, flow model prepreg 3, the blind buried via hole do not pass through not flow model prepreg 3
Gummosis filling.Above-mentioned rigid-flex combined board, by the way that at least one not flow model is arranged between rigid daughter board 1 and rigid-flexible daughter board 2
Prepreg 3 realizes the filling to blind buried via hole on rigid-flex combined board, to simplify filling holes with resin flow, without dedicated
Hole plugging equipment and resin, greatly reduce production cost.And the rigid-flex combined board plate face planarization that pressing obtains is high, quality
It is good, the making of fine-line can be completed.Can be only buried via hole it is emphasized that the blind buried via hole can be only blind hole 4
5, it can also be while there is blind hole 4 and buried via hole 5.That is, can there was only blind hole on the rigid daughter board 1, rigid-flexible daughter board 2
4, can there was only buried via hole 5, can also have blind hole 4 and buried via hole 5, blind buried via hole that can require to be arranged according to actual production simultaneously.
Wherein, the rigid-flexible daughter board 2 includes being sequentially laminated fixed first rigid plate 20, flexible board 21 and the second rigid plate
22.The rigid-flexible daughter board 2 is simple in structure, compact, it is ensured that higher plate quality.The rigid-flexible daughter board 2 is equipped with flexible region
Domain 21b, the flexure region 21b are located at flexible board 21 over and under, and the upper surface and the lower surface of the flexible board 21 is equal
It is flexible region line pattern 21a, institute to be located at the part in the flexure region 21b equipped with line pattern, on the line pattern
It states flexible region line pattern 21a and is equipped with cover film.The cover film can be to the flexible region line pattern 21a of the flexible board
It shields.
Preferably, the not flow model prepreg 3 is 1-5.According to the processing request of different size plate, it is being laminated
The not flow model prepreg 3 of 1 or more quantity can be set when processing, to ensure that good pressing quality and plate face are smooth
Property, it is advisable no more than 5.
With reference to shown in Fig. 2, the present embodiment also provides a kind of blind buried via hole method for plugging of rigid-flex combined board, includes the following steps：
S100：Rigid-flexible daughter board 2 and rigid daughter board 1 are provided；
In the present embodiment, the rigid daughter board 1 is lamina, certain rigid daughter board 1 or multi-layer board.
Specifically, described provide rigid-flexible daughter board 2, include the following steps：
First rigid plate 20, flexible board 21 and the second rigid plate 22 are provided；
Line pattern is produced on the upper and lower surface of flexible board 21, film transfer or laser explosure can be used in line pattern
Mode lithography obtain；
Cover film is pasted at the line pattern 21a of flexible region, the flexible region line pattern 21a of the flexographic plate can be risen
Protective effect；
Pressing is carried out after first rigid plate 20, flexible board 21 and the second rigid plate 22 are stacked successively forms rigid-flexible daughter board 2；
Flexure region 21b corresponding with flexible region line pattern 21a is processed on rigid-flexible daughter board 2, obtained rigid-flexible son
Plate 2 is simple in structure, compact, it is ensured that higher plate quality.
S200：Blind buried via hole is processed in the rigid daughter board 1 and/or rigid-flexible daughter board 2；
The mode of machine drilling or laser drill can be used when making the blind buried via hole, it is preferred to use laser drill swashs
The production efficiency higher in drill finish hole is suitable for rigid-flex combined board mass production.
S300：Metalized is carried out to blind buried via hole；
In the present embodiment, pass through heavy copper, electroplating work procedure copper facing in blind buried via hole.
S400：Will at least one not flow model prepreg 3 overlay between rigid daughter board 1 and rigid-flexible daughter board 2；
Preferably, the not flow model prepreg 3 is 1-5.According to the processing request of different size plate, it is being laminated
The not flow model prepreg 3 of 1 or more quantity can be set when processing, to ensure that good making sheet quality and plate face are smooth
Property, it is advisable no more than 5.
S500：Rigid daughter board 1 and rigid-flexible daughter board 2 are pressed, the gummosis of not flow model prepreg 3 is pressed into blind buried via hole.
Preferably, the not flow model prepreg 3 be equipped with the matched windowings of flexure region 21b, avoid pressing
The gummosis of flow model prepreg 3 does not enter flexure region 21b when conjunction.In bonding processes, pressing rigid daughter board 1 and rigid-flexible son
The maximum pressure of plate 2 is 200-500PSI, and the maximum heating temperature for pressing rigid daughter board 1 and rigid-flexible daughter board 2 is 150-250 DEG C,
The heating rate for pressing rigid daughter board 1 and rigid-flexible daughter board 2 is 2-8 DEG C/min.With above-mentioned pressing parameter by rigid daughter board 1 with it is rigid-flexible
Daughter board 2 presses, and the making sheet problem such as hickie can effectively be avoided to generate, and has preferably pressing effect.
The above-mentioned blind buried via hole method for plugging of rigid-flex combined board, by the way that at least one is arranged between rigid daughter board 1 and rigid-flexible daughter board 2
Not flow model prepreg 3 is opened, the filling to blind buried via hole on rigid-flex combined board is realized, to simplify filling holes with resin flow,
Without dedicated hole plugging equipment and resin, production cost is greatly reduced.And the rigid-flex combined board plate face that pressing obtains is smooth
Property it is high, it is high-quality, the making of fine-line can be completed.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of rigid-flex combined board, which is characterized in that including rigid daughter board and rigid-flexible daughter board, the rigid daughter board is fixed on rigid-flexible
On daughter board, the rigid daughter board and/or rigid-flexible daughter board are equipped with blind buried via hole, are equipped with extremely between the rigid daughter board and rigid-flexible daughter board
Few one flow model prepreg, the blind buried via hole are not filled by the gummosis of not flow model prepreg.
2. rigid-flex combined board according to claim 1, which is characterized in that the rigid-flexible daughter board is fixed including being sequentially laminated
First rigid plate, flexible board and the second rigid plate.
3. rigid-flex combined board according to claim 2, which is characterized in that the rigid-flexible daughter board is equipped with flexure region, institute
It states flexure region and is located at flexible board over and under, the upper surface and the lower surface of the flexible board is equipped with line pattern, institute
It is flexible region line pattern to state the part being located on line pattern in the flexure region, and the flexible region line pattern is equipped with
Cover film.
4. according to claim 1-3 any one of them rigid-flex combined boards, which is characterized in that the not flow model prepreg is
1-5.
5. a kind of blind buried via hole method for plugging of rigid-flex combined board, which is characterized in that include the following steps：
Rigid-flexible daughter board and rigid daughter board are provided；
Blind buried via hole is processed in the rigid daughter board and/or rigid-flexible daughter board；
Metalized is carried out to blind buried via hole；
Will at least one not flow model prepreg overlay between rigid daughter board and rigid-flexible daughter board；
Rigid daughter board and rigid-flexible daughter board are pressed, the gummosis of not flow model prepreg is pressed into blind buried via hole.
6. the blind buried via hole method for plugging of rigid-flex combined board according to claim 5, which is characterized in that described to provide rigid-flexible son
Plate specifically includes following steps：
First rigid plate, flexible board and the second rigid plate are provided；
Line pattern is produced on the upper and lower surface of flexible board；
Cover film is pasted at the line pattern of flexible region；
Pressing is carried out after first rigid plate, flexible board and the second rigid plate are stacked successively forms rigid-flexible daughter board；
Flexure region corresponding with flexible region line pattern is processed on rigid-flexible daughter board.
7. the blind buried via hole method for plugging of rigid-flex combined board according to claim 6, which is characterized in that the not flow model half is solid
Change on piece to be equipped with and the matched windowing of the flexure region.
8. according to the blind buried via hole method for plugging of claim 5-7 any one of them rigid-flex combined boards, which is characterized in that pressing rigidity
The maximum pressure of daughter board and rigid-flexible daughter board is 200-500PSI.
9. according to the blind buried via hole method for plugging of claim 5-7 any one of them rigid-flex combined boards, which is characterized in that pressing rigidity
The maximum heating temperature of daughter board and rigid-flexible daughter board is 150-250 DEG C.
10. according to the blind buried via hole method for plugging of claim 5-7 any one of them rigid-flex combined boards, which is characterized in that pressing is rigid
The heating rate of temper plate and rigid-flexible daughter board is 2-8 DEG C/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610084223.XA CN105657970B (en) | 2016-02-06 | 2016-02-06 | Rigid-flex combined board and its blind buried via hole method for plugging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610084223.XA CN105657970B (en) | 2016-02-06 | 2016-02-06 | Rigid-flex combined board and its blind buried via hole method for plugging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105657970A CN105657970A (en) | 2016-06-08 |
| CN105657970B true CN105657970B (en) | 2018-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610084223.XA Active CN105657970B (en) | 2016-02-06 | 2016-02-06 | Rigid-flex combined board and its blind buried via hole method for plugging |
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| CN (1) | CN105657970B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108419381B (en) * | 2018-01-23 | 2020-04-14 | 广州兴森快捷电路科技有限公司 | Rigid-flex board and manufacturing method thereof |
| CN110099524A (en) * | 2019-04-30 | 2019-08-06 | 东莞联桥电子有限公司 | A kind of pressing production method of multilayer circuit board |
| CN113873745A (en) * | 2021-09-18 | 2021-12-31 | 华为技术有限公司 | Printed Circuit Board (PCB) and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104394658A (en) * | 2014-11-18 | 2015-03-04 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined circuit board and manufacturing method thereof |
| CN104470263A (en) * | 2014-11-28 | 2015-03-25 | 东莞康源电子有限公司 | Rigid-flex multi-order buried blind via circuit board manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4597686B2 (en) * | 2004-02-24 | 2010-12-15 | 日本メクトロン株式会社 | Method for manufacturing multilayer flexible circuit board |
-
2016
- 2016-02-06 CN CN201610084223.XA patent/CN105657970B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104394658A (en) * | 2014-11-18 | 2015-03-04 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined circuit board and manufacturing method thereof |
| CN104470263A (en) * | 2014-11-28 | 2015-03-25 | 东莞康源电子有限公司 | Rigid-flex multi-order buried blind via circuit board manufacturing method |
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|---|---|
| CN105657970A (en) | 2016-06-08 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20160608 Assignee: Guangzhou Kaide Finance Leasing Co.,Ltd. Assignor: SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd.|GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|YIXING SILICON VALLEY ELECTRONICS TECH Co.,Ltd.|GUANGZHOU XINGSEN ELECTRONIC Co.,Ltd. Contract record no.: 2019990000235 Denomination of invention: Rigid-flexible combined plate and method for plugging blind buried hole thereof Granted publication date: 20181023 License type: Exclusive License Record date: 20190716 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Rigid-flexible combined plate and method for plugging blind buried hole thereof Effective date of registration: 20190807 Granted publication date: 20181023 Pledgee: Guangzhou Kaide Finance Leasing Co.,Ltd. Pledgor: GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd.|GUANGZHOU XINGSEN ELECTRONIC Co.,Ltd. Registration number: Y2019990000032 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Guangzhou Kaide Finance Leasing Co.,Ltd. Assignor: GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd.|YIXING SILICON VALLEY ELECTRONICS TECH Co.,Ltd.|GUANGZHOU XINGSEN ELECTRONIC Co.,Ltd. Contract record no.: 2019990000235 Date of cancellation: 20220922 |
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| EC01 | Cancellation of recordation of patent licensing contract | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220922 Granted publication date: 20181023 Pledgee: Guangzhou Kaide Finance Leasing Co.,Ltd. Pledgor: GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd.|GUANGZHOU XINGSEN ELECTRONIC Co.,Ltd. Registration number: Y2019990000032 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |