CN105652992A - Heat-dissipating grid, heat-dissipating device and laptop computer using same - Google Patents
Heat-dissipating grid, heat-dissipating device and laptop computer using same Download PDFInfo
- Publication number
- CN105652992A CN105652992A CN201610153978.0A CN201610153978A CN105652992A CN 105652992 A CN105652992 A CN 105652992A CN 201610153978 A CN201610153978 A CN 201610153978A CN 105652992 A CN105652992 A CN 105652992A
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- China
- Prior art keywords
- heat
- dissipating
- cover plate
- heat dissipation
- dissipation grid
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 claims description 41
- 230000005855 radiation Effects 0.000 claims description 18
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat-dissipating grid, a heat-dissipating device and a laptop computer using the same. The heat-dissipating grid comprises an upper cover plate and a lower cover plate which are oppositely arranged, and a heat-dissipating grid plate arranged between the upper cover plate and the lower cover plate in an inclined way. The heat-dissipating device comprises a heat-dissipating fan, further comprises the heat-dissipating grid and a heat-conducting tube for transmitting heat of a heating element to the heat-dissipating grid, and is used for dissipating heat of the laptop computer. The heat-dissipating grid provided by the invention is simple and firm in structure; compared with the conventional heat-dissipating grid, the heat-dissipating grid has relatively high compressive strength in forward and side directions, has a larger heat-dissipating area and provides a better heat-dissipating effect.
Description
Technical field
The present invention relates to electronics field, particularly relate to a kind of heat dissipation grid for very thin computer equipment and heat abstractor.
Background technology
Nowadays electronic product increasingly trends towards lightening design, this each assembly allowing for electronic product will develop to small-sized efficientization, but the device for carrying out dispelling the heat to the heat producing element of electronic product fails there is breakthrough progress always, particularly in notebook computer product, owing to its structure is more frivolous, result in the area of thermovent to receive and greatly cut down, especially in its height direction, in order to adapt to the thickness of frivolous notebook computer, the height causing heat dissipation grid is substantially reduced, thus having had a strong impact on its radiating effect.
In prior art, for solving the heat dissipation problem of notebook computer, often do and a little increase and improve by increasing the size on radiator fan, the quantity of thermovent and length direction, but, when whole notebook computer do frivolous after, its inner space will be compressed, if solving heat dissipation problem only by the mode increasing radiator fan quantity, this substantially runs counter to lightening developing direction; And, as shown in Figure 6, the structure setting of heat dissipation grid of the prior art remains in each heat radiation screen 2 and is parallel to each other and the technical merit perpendicular with its upper cover plate 1 and lower cover 3, reduction along with its height dimension (i.e. distance between upper and lower cover plate face), each area of dissipation dispelling the heat screen 2 will be obviously reduced, thus reducing its radiating effect, and due to the unstability of parallelogram, cause that heat dissipation grid is difficult to bear bigger external force.
Summary of the invention
Because the above-mentioned problems in the prior art, the present invention provides a kind of stabilized structure, the heat dissipation grid that thermal diffusivity is strong.
For solving the problems referred to above, present invention provide the technical scheme that
A kind of heat dissipation grid, is applied in the electronic equipment being realized heat radiation by air-flow, it is characterised in that including:
The upper and lower cover plate being oppositely arranged; And
It is obliquely installed the heat radiation screen between described upper and lower cover plate.
As preferably, described upper cover plate, described lower cover and described heat radiation screen are rectangular thin plate.
As preferably, dispel the heat described in adjacent two screen and be trapezoidal ventilating duct at the described upper and lower cover plate Formation cross-section dispelled the heat between screen described in two.
As preferably, dispel the heat described in adjacent two screen and be the ventilating duct of triangle at the described upper cover plate dispelling the heat between screen described in two or described lower cover Formation cross-section.
As preferably, the described opposing parallel setting of upper and lower cover plate.
A kind of heat abstractor, including radiator fan, also includes as above any one described heat dissipation grid, and the heat of heater element is transferred to the heat pipe of described heat dissipation grid.
A kind of notebook computer, including heat abstractor as above.
Compared with prior art, the beneficial effects of the present invention is:
Heat dissipation grid simple in construction provided by the invention consolidates, and relative to traditional heat-dissipating grid at forward, be laterally respectively provided with higher anti-pressure ability, and area of dissipation is bigger, it is provided that better radiating effect.
Accompanying drawing explanation
Fig. 1 is the perspective view of the first embodiment of the heat dissipation grid of the present invention;
Fig. 2 is the cross section structure schematic diagram of the first embodiment of the heat dissipation grid of the present invention;
Fig. 3 is the perspective view of the second embodiment of the heat dissipation grid of the present invention;
Fig. 4 is the cross section structure schematic diagram of the second embodiment of the heat dissipation grid of the present invention;
Fig. 5 is the perspective view of the 3rd embodiment of the heat dissipation grid of the present invention;
Fig. 6 is the perspective view of the heat dissipation grid of prior art.
Accompanying drawing labelling:
1-upper cover plate; 2-dispels the heat screen; 3-ventilating duct; 4-lower cover.
Detailed description of the invention
For making those skilled in the art be better understood from technical scheme, below in conjunction with the drawings and specific embodiments, the present invention is elaborated.
If Fig. 1 is to shown in 5, a kind of heat dissipation grid provided by the invention, it is applied in the electronic equipment being realized heat radiation by air-flow, comprising: the upper and lower cover plate being oppositely arranged; And it is obliquely installed the heat radiation screen 2 between upper and lower cover plate. In embodiment provided by the invention, upper cover plate 1, lower cover 4 and heat radiation screen 2 are rectangular thin plate and the opposing parallel setting of upper and lower cover plate; Relative to be arrangeding in parallel of heat radiation screen of the prior art, the heat radiation screen 2 in the present invention is obliquely installed so that add the area of dissipation of each heat radiation screen 2 in the limited height (i.e. distance between upper and lower cover plate) of heat dissipation grid.
Further, as shown in Figure 1 and Figure 2, adjacent two heat radiation screens 2 and the upper and lower cover plate Formation cross-sections between two heat radiation screens 2 are trapezoidal ventilating duct 3; Concrete, in the first embodiment of heat dissipation grid provided by the invention, the cross sectional shape of ventilating duct 3 is isosceles trapezoid, and certainly in other embodiments, by changing the angles of inclination of adjacent two heat radiation screens 2, to carry out Formation cross-section be the trapezoidal ventilating ducts of other classifications; Further, if the position relationship of each heat radiation screen 2 in first embodiment in the present invention is moved closer to intersecting, just define Fig. 3, Fig. 4, as shown in second embodiment of heat dissipation grid of the present invention, in the present embodiment, the cross sectional shape of the ventilating duct 3 formed is isosceles triangle, in like manner, if changing the angle of inclination of adjacent two heat radiation screens 2 can Formation cross-section be also the ventilating duct 3 of triangle of other classifications. Owing to triangle and trapezoidal stability are higher than parallelogram, by above two embodiments, the structural stability of whole heat dissipation grid obtains and greatly promotes, being not susceptible to deformation under external force, this heat dissipation grid allowing for the present invention more can be suitably used in the design of ultrathin notebook PC.
But in actual product, the cross sectional shape of the ventilating duct 3 of single heat dissipation grid is not limited only to one, such as, as shown in Figure 5, in the 3rd embodiment of heat dissipation grid provided by the invention, combine the architectural feature in first embodiment and the second embodiment, thus defining the ventilating duct 3 of two kinds of different cross section shapes.Heat dissipation grid of the prior art is generally adopted multiple module units to be undertaken splicing (this technique is common technology means of the prior art, does not repeat) at this by the mode of snap fit. The heat dissipation grid of certain present invention may be used without the mode of traditional snap fit (concrete structure is not shown) and splices, additionally, may be used without welding or other techniques produce, ultimately form the heat dissipation grid of the construction features meeting the present invention on the whole. Again and, those skilled in that art it is well known that, heat abstractor in notebook computer generally comprises: radiator fan, it is positioned at the heat dissipation grid of air outlet, and the heat of heater element is transferred to the heat pipe of heat dissipation grid, it will therefore be apparent that heat abstractor provided by the present invention, only by the heat dissipation grid of the heat dissipation grid alternative costs invention of heat abstractor in prior art, production cost need to be greatly saved.
Additionally, on, the structure that lower cover is also not limited to be parallel to each other is arranged, if notebook computer is due to the factor of its appearance design, or the reasons such as the layout due to its internal structure, such as, consider that the cabling layout of radiating tube is more conducive to the heat of heater element is transferred to heat dissipation grid, cause that its thermovent is positioned at the side of its system end, and the thickness of system end is also inconsistent, such as, tended to thinning by the rear end face of system end to its front end face, now, on, the position relationship of lower cover just can be changed accordingly according to this architectural feature of notebook computer, and then obtain the most efficient space rate, produce better radiating effect.
Above example is only the exemplary embodiment of the present invention, is not used in the restriction present invention, and protection scope of the present invention is defined by the claims. The present invention in the essence of the present invention and protection domain, can be made various amendment or equivalent replacement by those skilled in the art, and this amendment or equivalent replacement also should be regarded as being within the scope of the present invention.
Claims (7)
1. a heat dissipation grid, is applied in the electronic equipment being realized heat radiation by air-flow, it is characterised in that including:
The upper and lower cover plate being oppositely arranged; And
It is obliquely installed the heat radiation screen between described upper and lower cover plate.
2. heat dissipation grid according to claim 1, it is characterised in that described upper cover plate, described lower cover and described heat radiation screen are rectangular thin plate.
3. heat dissipation grid according to claim 2, it is characterised in that dispel the heat described in adjacent two screen and be trapezoidal ventilating duct at the described upper and lower cover plate Formation cross-section dispelled the heat between screen described in two.
4. heat dissipation grid according to claim 2, it is characterised in that dispel the heat described in adjacent two screen and be the ventilating duct of triangle at the described upper cover plate dispelling the heat between screen described in two or described lower cover Formation cross-section.
5. heat dissipation grid according to claim 1, it is characterised in that the described opposing parallel setting of upper and lower cover plate.
6. a heat abstractor, including radiator fan, it is characterised in that also include the heat dissipation grid as described in any one in claim 1 to 5, and the heat of heater element is transferred to the heat pipe of described heat dissipation grid.
7. a notebook computer, it is characterised in that include heat abstractor as claimed in claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610153978.0A CN105652992A (en) | 2016-03-16 | 2016-03-16 | Heat-dissipating grid, heat-dissipating device and laptop computer using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610153978.0A CN105652992A (en) | 2016-03-16 | 2016-03-16 | Heat-dissipating grid, heat-dissipating device and laptop computer using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105652992A true CN105652992A (en) | 2016-06-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610153978.0A Pending CN105652992A (en) | 2016-03-16 | 2016-03-16 | Heat-dissipating grid, heat-dissipating device and laptop computer using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105652992A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110389633A (en) * | 2018-04-18 | 2019-10-29 | 上海海秦花文化传播有限公司 | For the non-volume process flow of multiple dynamic data |
| CN112286323A (en) * | 2020-11-10 | 2021-01-29 | 上海英众信息科技有限公司 | Notebook computer water-cooling heat dissipation device and use method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003258472A (en) * | 2002-03-01 | 2003-09-12 | Sony Corp | Heat sink device and information processing unit |
| JP2004040125A (en) * | 2003-08-07 | 2004-02-05 | Fujitsu Ltd | Heat dissipation mechanism and electronic equipment having the same |
| TWM298733U (en) * | 2006-03-10 | 2006-10-01 | Cooler Master Co Ltd | Water cooled heat dissipation device and the water cool joint thereof |
| CN204314816U (en) * | 2015-01-12 | 2015-05-06 | 合肥联宝信息技术有限公司 | Wind direction regulating device, computer radiating apparatus and notebook computer thereof |
| CN205050062U (en) * | 2015-09-21 | 2016-02-24 | 天津普诚华科技有限公司 | Dustproof cpu fan |
| CN205427753U (en) * | 2016-03-16 | 2016-08-03 | 合肥联宝信息技术有限公司 | Heat radiation grille , heat abstractor and notebook computer thereof |
-
2016
- 2016-03-16 CN CN201610153978.0A patent/CN105652992A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003258472A (en) * | 2002-03-01 | 2003-09-12 | Sony Corp | Heat sink device and information processing unit |
| JP2004040125A (en) * | 2003-08-07 | 2004-02-05 | Fujitsu Ltd | Heat dissipation mechanism and electronic equipment having the same |
| TWM298733U (en) * | 2006-03-10 | 2006-10-01 | Cooler Master Co Ltd | Water cooled heat dissipation device and the water cool joint thereof |
| CN204314816U (en) * | 2015-01-12 | 2015-05-06 | 合肥联宝信息技术有限公司 | Wind direction regulating device, computer radiating apparatus and notebook computer thereof |
| CN205050062U (en) * | 2015-09-21 | 2016-02-24 | 天津普诚华科技有限公司 | Dustproof cpu fan |
| CN205427753U (en) * | 2016-03-16 | 2016-08-03 | 合肥联宝信息技术有限公司 | Heat radiation grille , heat abstractor and notebook computer thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110389633A (en) * | 2018-04-18 | 2019-10-29 | 上海海秦花文化传播有限公司 | For the non-volume process flow of multiple dynamic data |
| CN112286323A (en) * | 2020-11-10 | 2021-01-29 | 上海英众信息科技有限公司 | Notebook computer water-cooling heat dissipation device and use method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160608 |