CN105652569B

CN105652569B - A kind of laser projection device

Info

Publication number: CN105652569B
Application number: CN201610180046.5A
Authority: CN
Inventors: 张琰
Original assignee: Hisense Group Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2016-03-25
Filing date: 2016-03-25
Publication date: 2018-08-07
Anticipated expiration: 2036-03-25
Also published as: CN105652569A

Abstract

The present embodiments relate to projection arts, more particularly to a kind of laser projection device, on the one hand on the other hand the dust-proof degree for improving the component sensitive to dust to laser projection device inside improves the radiating efficiency to the heat source component inside laser projection device.In the embodiment of the present invention, includes sealing shell outside laser light source component, improve the dust-proof degree of laser light source component.Further, heat caused by laser light source component and opto-mechanical part is all imported into heat by heat conducting pipe and concentrates module, the purpose to laser light source component and opto-mechanical part heat dissipation is realized in such a way that radiating module concentrates the heat in module to carry out concentrating heat dissipation heat, the process is without directly radiating to laser light source component and opto-mechanical part, it is therefore prevented that the problem of dust is brought into laser light source component and opto-mechanical part again in radiation processes；In addition, due to being to concentrate the heat in module to carry out concentration heat dissipation heat, radiating efficiency is improved.

Description

Laser projection equipment

Technical Field

The embodiment of the invention relates to the technical field of projection, in particular to laser projection equipment.

Background

At present, projectors are widely used in various fields, and the projectors are devices that receive video signals from computers and project the video signals onto a projection screen or a wall surface. With the development of projectors, laser projection apparatuses using a laser as a light source have been widely used because of the advantages of high brightness, wide color gamut, and the like. The laser projection device generally includes a laser light source component and an optical mechanical component, the laser light source component generally includes a laser and some light-transmitting mirrors, and the laser and the light-transmitting mirrors in the light path are very precise components and are very sensitive to dust. Dust enters the laser display system and adheres to the transparent mirror and the wavelength conversion device, so that the transmittance of the transparent mirror lens is reduced, the conversion rate of the wavelength conversion device is reduced, and finally the problem of light attenuation of the laser display system is caused.

On the other hand, the laser projection apparatus includes a plurality of heat source parts, such as a laser light source part and an optical mechanical part, which generate heat. The laser light source component of the laser projection equipment has high working temperature, particularly in the laser light source with the fluorescent wheel, the fluorescent wheel absorbs laser emitted by a laser and converts the laser into fluorescent light, the temperature of the surface of the fluorescent wheel can reach about 200 ℃, and the temperature of other components of the laser light source component, such as a light-transmitting mirror and other devices, can also be rapidly increased. In the specific working process, the laser light source components have certain limiting requirements on the working temperature rise, and the temperature cannot be too high. If the temperature is too high, the working efficiency and the fluorescence conversion efficiency of the laser light source component can be affected, and even the laser light source component can be damaged, for example, the light-transmitting mirror can be deformed when the temperature is too high, and thus, the light path of the laser light source component can not work normally.

In the prior art, a fan is used for blowing heat source parts inside the laser projection equipment, so that the cooling efficiency is low, and external dust can be blown into parts sensitive to dust in the heat source parts by the fan.

In summary, there is a need for a laser projection apparatus, which is used to improve the dust-proof performance of the components sensitive to dust inside the laser projection apparatus, and improve the heat dissipation efficiency of the heat source components inside the laser projection apparatus.

Disclosure of Invention

The embodiment of the invention provides laser projection equipment, which is used for improving the dustproof degree of a part sensitive to dust in the laser projection equipment on one hand and improving the heat dissipation efficiency of a heat source part in the laser projection equipment on the other hand.

An embodiment of the present invention provides a laser projection apparatus, including:

a heat source member; the heat source part at least comprises a laser light source part and an optical-mechanical part; wherein, the laser light source part comprises a sealed shell; the laser light source component is a closed structure which is closed by using a first shell;

one end of the heat conduction pipe is connected with the heat source part, and the other end of the heat conduction pipe is connected with the heat concentration module; a heat concentrating module for conducting heat generated by each of the heat source components away to the heat concentrating module;

a heat concentrating module located outside the sealed housing; a heat pipe for receiving heat generated by each of the heat source parts to which the heat pipe is introduced;

and the heat dissipation module is used for dissipating heat of the heat concentration module.

In the embodiment of the invention, the laser light source part comprises the sealing shell outside, so that the dust-proof degree of the laser light source part is improved. Furthermore, the heat generated by the laser light source part and the optical machine part is completely led into the heat concentration module through the heat conduction pipe, and the purpose of heat dissipation of the laser light source part and the optical machine part is realized in a way that the heat on the heat concentration module is subjected to concentrated heat dissipation through the heat dissipation module; in addition, the heat on the heat concentration module is subjected to concentrated heat dissipation, so that the heat dissipation efficiency is improved; furthermore, in the embodiment of the invention, only one heat dissipation module for dissipating heat of the heat concentration module is arranged, and the heat dissipation modules are not required to be respectively arranged for the laser light source component and the optical machine component, so that the structure of the heat dissipation module in the laser projection equipment is simplified.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments will be briefly described below.

Fig. 1a is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 1b is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 1c is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 1d is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 2a is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 2b is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 2c is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 3a is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 3b is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 4a is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 4b is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

FIG. 4c is a schematic diagram illustrating a top view of the fluorescent wheel of the laser projection apparatus shown in FIG. 4b connected to the heat dissipation module via the heat pipe;

FIG. 4d is a schematic diagram illustrating a top view of the laser device in the laser projection apparatus shown in FIG. 4b connected to the heat dissipation module through the heat pipe;

FIG. 4e is a schematic diagram illustrating a top view of the first optical lens of the laser projection apparatus shown in FIG. 4b connected to the heat dissipation module through the heat pipe;

FIG. 4f is a schematic diagram of a top view of the DMD of the laser projection device shown in FIG. 4b connected to the heat sink module through a heat pipe;

fig. 5a is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

fig. 5b is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

FIG. 5c is a schematic diagram of a flow circuit of the cooling liquid in the heat pipe in the laser projection apparatus shown in FIG. 5 b;

FIG. 5d is a schematic diagram illustrating a flow loop of the cooling liquid in the heat pipe of the laser projection apparatus according to an embodiment of the present invention;

fig. 5e is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention.

Reference numbers on the drawings of the specification: 1-laser projection equipment complete machine shell; 2-sealing the housing; 3-laser light source component; 4-a fluorescent wheel; 5-a first heat pipe; 6-opto-mechanical components; 7-DMD; 8-a third heat pipe; 9-a heat concentration module; 10-a thermally conductive material; 11-a first fan; 12-power and/or drive boards; 13-a second fan; 14-a laser; 15-a second heat pipe; 16-a first optical lens; 17-a fluorescent wheel metal base; 18-a fluorescent wheel support; 19-laser metal base; 20-a fourth heat pipe; 21-a first optic metal base; 22-DMD metal base; 23-a heat dissipation module; 24-a heat pipe; 25-heat dissipation fins; 26-a heat sink; 27-a dispenser; 28-a pump; 29-a storage tank; 30-a heat source component; 31-a water cooling head; 32-a first water cooling head; 33-a second water cooling head; 34-a third water cooling head; 35-fourth water cooling head.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Example one

In an embodiment of the invention, the components of the laser projection device comprise at least two parts: a first part: a heat source member; a second part: a power board and/or a driver board. Wherein, the heat source part at least comprises a laser light source part and an optical machine part.

Optionally, the laser light source component is an enclosed structure enclosed with the first housing. Optionally, the opto-mechanical part is a closed structure closed with a second housing.

Optionally, the laser light source component comprises at least a laser, a fluorescent wheel. Optionally, the laser light source component further comprises a first optical lens. Optionally, the opto-mechanical part comprises at least a Digital micro-mirror Device (DMD). Optionally, the opto-mechanical part further comprises a second optical lens.

In a laser projection apparatus, there are mainly the following components that generally generate a large amount of heat:

first, a laser in a laser light source unit. The laser generates a large amount of heat while emitting excitation light. For high power laser projection devices, their high power must be accompanied by the generation of high heat. The laser corresponds to an operating temperature range, the highest temperature in the operating temperature range of the laser is low, and if the temperature of the laser exceeds the operating temperature range, for example, is higher than the highest temperature in the operating temperature range, the laser may fail. That is, the laser is a heat source in the laser projection device, and is relatively easy to generate heat, but cannot operate at a relatively high temperature.

Second, a first optical lens in the laser light source unit. The laser light source component comprises one or more optical lenses, that is to say the first optical lens comprises one or more optical lenses in the laser light source component. The first optical lens transmits laser light and absorbs a small part of the laser light, and the part of the laser light absorbed by the first optical lens is converted into heat, so that the temperature of the first optical lens is increased. The maximum temperature of the working temperature range of the first optical lens is also low, and if the temperature of the first optical lens exceeds the working temperature range of the first optical lens, for example, is higher than the maximum temperature in the working temperature range, the first optical lens may be deformed, and finally, the light attenuation problem is caused.

Third, a fluorescent wheel in the laser light source unit. The fluorescent material on the fluorescent wheel is irradiated by laser to emit tricolor light, and meanwhile, the fluorescent wheel can also generate a large amount of heat, so that the temperature on the fluorescent wheel is increased. The highest temperature of the operating temperature range of the luminescent wheel is also low, and if the temperature of the luminescent wheel exceeds the operating temperature range of the luminescent wheel, e.g., is higher than the highest temperature within the operating temperature range, the motor of the luminescent wheel may fail.

Fourth, DMD in opto-mechanical components. A DMD is formed from a plurality of tiny square mirror plates closely arranged in rows and columns and attached to electrical nodes on a silicon wafer. Each micro mirror corresponds to a pixel of the generated image. The digital signals of the DMD are sequentially rotated, the tiny mirror plates on the DMD are turned on or off according to the positions of pixels and the number of colors, and the light is reflected by the tiny mirror plates on the DMD and finally projected on a screen through a lens. During the operation of the DMD, the DMD absorbs part of the light while reflecting the light, and the part absorbed by the DMD is optically converted into heat to raise the temperature of the DMD. The maximum temperature of the operating temperature range of the DMD is also low, and if the temperature of the DMD exceeds, e.g., is higher than, the maximum temperature of the operating temperature range of the DMD, the DMD may fail.

Optionally, the laser projection apparatus further includes a lens. Specifically, one of the two planes of the lens needs to be directed toward the projection area in order for the lens to be able to project toward the projection area. The laser projection equipment has the working principle that the laser emits exciting light, the exciting light is converged by the first optical lens and irradiates the fluorescent wheel, and the fluorescent material of the fluorescent wheel emits red, green and blue lights under the irradiation of the laser. The red, green and blue lights are projected onto the DMD through the high-speed rotating color filter wheel and then projected onto the lens through the second optical lens, and the lens projects the lights onto the screen to complete image projection.

From the above discussion, it can be seen that the heat source components in the laser projection apparatus can generate a large amount of heat, but are also sensitive to temperature, i.e. cannot work under the condition of high temperature of the working environment. Therefore, the embodiment of the invention is used for improving the heat dissipation efficiency when the heat source component is subjected to heat dissipation so as to ensure that the working environment temperature of the heat source component is kept within a proper temperature range.

Fig. 1a schematically illustrates a structure of a laser projection apparatus according to an embodiment of the present invention. As shown in fig. 1a, the laser projection apparatus in the embodiment of the present invention includes:

a heat source member; the heat source part at least comprises a laser light source part and an optical-mechanical part;

Alternatively, as shown in fig. 1a, the laser projection apparatus includes a laser projection apparatus main body case 1, and the laser projection apparatus main body case 1 includes a heat source member 30, a heat pipe 24, a heat concentrating module 9, and a heat dissipating module 23. The heat source unit 30 includes at least a laser light source unit 3 and an optical-mechanical unit 6.

Optionally, a distance between the heat concentrating module and each of the heat source components is greater than a first distance threshold. The first distance threshold is for example 4 cm, etc. The first distance threshold is used for ensuring that a certain distance is kept between the heat concentration module and each component in the heat source component so as to prevent the heat received by the heat concentration module from influencing the heat source component.

Optionally, the distance between the heat dissipation module and the heat concentration module is smaller than a third distance threshold; the second distance threshold is greater than the third distance threshold. That is to say, the distance between the heat dissipation module and the heat concentration module is short, so that the heat dissipation module can dissipate heat on the heat concentration module more effectively. The distance between the heat dissipation module and the heat source component can be far or near, and the heat dissipation module does not directly dissipate heat of the heat source component, so that the heat dissipation module and the heat source component do not need to be near.

In the embodiment of the invention, the heat generated by the heat source component is completely led into the heat concentration module through the heat conduction pipe, and the heat on the heat concentration module is subjected to concentrated heat dissipation through the heat dissipation module, so that the heat dissipation efficiency is improved; and because the heat on the heat concentration module is subjected to concentrated heat dissipation, and the heat source component is not directly subjected to heat dissipation, the problem that dust is brought into the heat source component again in the heat dissipation process is solved, and the dust prevention degree of the heat source component is improved. On the other hand, since the heat concentrating module is only required to be intensively cooled by one heat dissipating module, the structure of the heat dissipating module does not need to be set to be plural to respectively dissipate heat of each part of the heat source part, thereby simplifying the structure of the heat dissipating module.

The heat conducting pipe in the embodiment of the invention can be in various forms, such as a heat pipe or a pipe with coolant flowing inside. The heat pipe is a member for bringing heat generated by the heat source member to the heat concentrating module. In the embodiment of the present invention, one or more heat pipes may be provided.

As shown in fig. 1a, the heat concentration module in the embodiment of the present invention may be a component which is insensitive to heat, i.e. can work at a higher temperature, and has better heat conductivity. When the heat conduction pipe is a plurality of, the heat concentration module is connected with all the heat conduction pipes. In this case, for example, the heat concentrating module is a heat conducting block made of a heat conducting material, and one end of each of the heat conducting pipes is connected to the heat conducting block, so that heat on the heat conducting pipes is transferred to the heat conducting block. For another example, the heat concentrating module is a heat dissipating fin made of a heat conductive material, and one end of each heat conducting pipe is connected to the heat dissipating fin, so that heat on the heat conducting pipes is transmitted to the heat dissipating fin.

Fig. 1b schematically shows a structural diagram of a laser projection apparatus provided in an embodiment of the present invention. As shown in fig. 1b, the laser projection apparatus includes a laser projection apparatus main body case 1, and the laser projection apparatus main body case 1 includes a heat source member 30, a heat pipe 24, a heat concentrating module 9, and a heat dissipating module 23. The heat source unit 30 includes at least a laser light source unit 3 and an optical-mechanical unit 6. Alternatively, the collected portion of all of the heat conductive pipes may also be referred to as a heat concentrating module, that is, the heat concentrating module is an area that includes a portion of each of the heat conductive pipes, where the heat concentrating module is also connected to each of the heat conductive pipes. For example, when the heat pipes are heat pipes, the gathering areas of the condensing ends of all the heat pipes are heat concentration modules, and at this time, the heat concentration modules are not a real object and are only called names of the gathering areas of the condensing ends of the heat pipes.

Optionally, the heat dissipation module includes a first fan, and the first fan is located at one side of the heat concentration module; the heat collecting module is used for dissipating heat in a mode of blowing air flowing through the first fan to the heat collecting module.

Fig. 1c schematically shows a structural diagram of a laser projection apparatus provided in an embodiment of the present invention. As shown in fig. 1c, the laser projection apparatus includes a laser projection apparatus main body case 1, and the laser projection apparatus main body case 1 includes a heat source member 30, a heat pipe 24, a heat concentrating module 9, and a heat dissipating module 23. The heat source unit 30 includes at least a laser light source unit 3 and an optical-mechanical unit 6. The heat concentration module 9 can be a heat dissipation fin 25; the heat dissipation module 23 includes a first fan 11 therein. Optionally, when the heat pipe is a heat pipe, the heat concentrating module includes heat dissipating fins. The heat dissipation fins are connected with the condensation end of the heat conduction pipe; for receiving heat generated by each of the heat source components into which the heat conductive pipes are introduced.

For example, the heat dissipation fins are solid sheet structures, one end of each of the heat pipes is connected to the heat dissipation fins through a heat conductive material, the heat dissipation fins receive heat generated by each of the heat source components transmitted from the heat pipes, and the first fan blows air flowing through the first fan to the heat dissipation fins.

Optionally, the laser projection apparatus in the embodiment of the present invention further includes a power board, a driving board, and other components. Such parts are generally less sensitive to dust, i.e. can work with a larger dust cover, and there are more heating elements in such parts, such as heating elements on the surfaces of various boards in power boards and driver boards. The surface of such components is also typically relatively uneven. Furthermore, the components can work under the condition of higher temperature of the working environment, namely the components have lower requirement on the temperature of the working environment and do not need high-efficiency heat dissipation.

Based on the above discussion, in the embodiment of the invention, the heat source components and the like are sensitive to temperature, components with high heat dissipation efficiency are required to be gathered together, the power board and the driving board are not sensitive to temperature, components with high heat dissipation efficiency are not required to be gathered together, and the two types of components are respectively cooled by the heat dissipation module.

Optionally, the heat dissipation module further comprises a second fan; the power panel and/or the driving board is positioned between the first fan and the second fan, so that air flowing through the first fan and the second fan passes through the power panel and/or the driving board to dissipate heat of the power panel and/or the driving board. In the embodiment of the invention, the power supply board and/or the driving board can be as follows: specifically, the power board, or specifically the driver board, or specifically the power board and the driver board.

Fig. 1d schematically shows a schematic structural diagram of a laser projection apparatus provided in an embodiment of the present invention. As shown in fig. 1d, the laser projection apparatus includes a laser projection apparatus housing 1, and the laser projection apparatus housing 1 includes a heat source member 30, a heat pipe 24, a heat concentrating module 9, and a heat dissipating module 23. The heat source unit 30 includes at least a laser light source unit 3 and an optical-mechanical unit 6. The heat concentration module 9 can be a heat dissipation fin 25; the heat dissipation module 23 includes a first fan 11 and a second fan 13. A power board and/or a driving board 12 is further included between the first fan 11 and the second fan 13. The heat dissipation module further comprises a second fan. Optionally, the power board and/or the driving board is located between the first fan and the second fan, so that air flowing through the first fan and the second fan passes through the power board and/or the driving board to dissipate heat of the power board and/or the driving board.

In the embodiment of the present invention, optionally, the first fan in the heat dissipation module dissipates heat of the heat concentration module, at this time, the first fan dissipates heat of the heat source component in the laser projection device, and then air flowing between the first fan and the second fan in the heat dissipation module dissipates heat of the power board and/or the driving board again. Therefore, in the embodiment of the invention, the heat dissipation module can dissipate heat of the heat source component, the power board and/or the driving board at the same time only through the first fan and the second fan, so that the structural form of the heat dissipation module in the laser projection equipment is greatly simplified, on one hand, the heat dissipation efficiency of the heat source component is improved, on the other hand, the heat dissipation of the power board and/or the driving board is increased, and the working environment of the power board and/or the driving board is optimized. And the wind flowing between the first fan and the second fan is fully and effectively utilized so as to optimize the working environment of the laser projection equipment to the maximum extent.

Optionally, the first fan is an air inlet fan, and the second fan is an air outlet fan; or, the first fan is an air outlet fan, and the second fan is an air inlet fan. The position of the air inlet fan corresponds to the air inlet of the laser projection equipment, and the position of the air outlet fan corresponds to the air outlet of the laser projection equipment. Specifically, air outside the laser projection device enters from the air inlet and flows out from the air outlet.

Optionally, the power board and/or the driver board are located: left or right side of the heat source component; or an upper or lower portion of the heat source member. That is, the power supply board and/or the driving board are collectively placed in the first position area, and the heat source part is collectively placed in the second position area; the first location area is located to the left, right, upper or lower of the second location area.

The laser projection equipment is a cuboid and comprises six surfaces, namely a front surface, a rear surface, a top surface, a bottom surface, a left surface and a right surface. In the above fig. 1a to 1d, assuming that the viewed surface is the front surface of the laser projection apparatus, based on the schematic structural diagrams of the laser projection apparatus shown in fig. 1a to 1d, fig. 2a exemplarily shows a schematic structural diagram of a laser projection apparatus provided in an embodiment of the present invention; fig. 2b schematically illustrates a schematic structural diagram of a laser projection apparatus provided in an embodiment of the present invention; fig. 2c schematically shows a structure of a laser projection apparatus provided in an embodiment of the present invention. Shown in fig. 2a, 2b and 2c is a cross-section of the laser projection device, which cross-section is parallel to the front in fig. 1a to 1d in fig. 2a, 2b and 2 c. The power supply board and/or the driving board are collectively placed in the first position area, and the heat source member is placed in the second position area. As shown in fig. 2a, 2b and 2c, the laser projection apparatus includes a laser projection apparatus main body case 1, and the laser projection apparatus main body case 1 includes a heat source member 30, a heat pipe 24, a heat concentrating module 9 and a heat dissipating module 23. The heat source unit 30 includes at least a laser light source unit 3 and an optical-mechanical unit 6. The heat concentration module 9 can be a heat dissipation fin 25; the heat dissipation module 23 includes a first fan 11 and a second fan 13. A power board and/or a driving board 12 is further included between the first fan 11 and the second fan 13.

As shown in fig. 1d, the first location area and the second location area are placed to the left and right. The first location area is located to the right of the second location area. The first fan is located between the first location area and the second location area, and the second fan is located to the right of the first location area. At the moment, a first air opening is formed in the bottom surface and the back of the whole machine shell of the laser projection equipment at the position corresponding to the first fan, and a second air opening is formed in the right side of the whole machine shell of the laser projection equipment at the position corresponding to the second fan. At this time, the heat dissipation fins are located between the second location area and the first location area.

Specifically, a first fan is projected on the bottom surface of the whole machine shell of the laser projection equipment, and a first air port is formed in the projection area of the first fan on the bottom surface of the whole machine shell of the laser projection equipment; the first fan is projected on the back of the whole machine shell of the laser projection equipment, and a first air opening is formed in a projection area of the first fan on the back of the whole machine shell of the laser projection equipment. And projecting the second fan on the right side of the whole machine shell of the laser projection equipment, and arranging a second air port in a projection area of a first ear fan on the right side of the whole machine shell of the laser projection equipment.

Optionally, the first fan is an air inlet fan, and at this time, the first air inlet is an air inlet; the second fan is an air outlet fan, and at the moment, the second air port is an air outlet. Under the action of the air inlet fan, external air of the laser projection equipment enters the laser projection equipment through the air inlet, and the air inlet fan blows the external air to the heat dissipation fins, so that the external air and the heat dissipation fins can exchange heat, and heat on the heat dissipation fins can be taken away. Since the heat sink fins receive the heat transmitted from the heat source member, the temperature of the outside air is lower than that of the heat sink fins. The air which exchanges the heat with the heat dissipation fins flows through the power panel and/or the driving panel between the air inlet fan and the air outlet fan under the action of the air inlet fan and the air outlet fan, and is discharged out of the laser projection equipment through the air outlet, so that the heat dissipation process inside the laser projection equipment is completed. That is, the external air first dissipates the heat of the heat source component received by the heat dissipation fins, and then dissipates the heat of the power board and/or the driving board.

In another optional embodiment, the first fan is an air outlet fan, and at this time, the first air outlet is an air outlet; the second fan is an air inlet fan, and at the moment, the second air inlet is an air inlet. Under the action of the air inlet fan, external air of the laser projection equipment enters the laser projection equipment through the air inlet, then the air firstly flows through the power panel and/or the driving panel between the air inlet fan and the air outlet fan under the action of the air inlet fan and the air outlet fan, so that the power panel and/or the driving panel are/is cooled firstly, then the air flows through the air outlet fan and is blown to the heat dissipation fins under the action of the air outlet fan, and therefore the air and the heat dissipation fins are subjected to heat exchange, and heat on the heat dissipation fins is taken away. And then the air is exhausted out of the laser projection equipment through the air outlet under the action of the air outlet fan, so that the heat dissipation process inside the laser projection equipment is completed.

Furthermore, after the external air enters the laser projection equipment in the embodiment of the invention, when the external air brings dust into the laser projection equipment, the dust brought by the external air can fall on the devices in the laser projection equipment through which the path of the external air passes, and as the path through which the external air passes comprises the heat dissipation fins, the first fan and the second fan, it can be seen that the path of the external air in the laser projection equipment does not comprise devices sensitive to dust, i.e. the devices in the path of the external air in the laser projection equipment can work under the condition of large dust covering amount, therefore, the air inlet in the embodiment of the invention does not need to be additionally provided with parts such as a filter screen and the like for filtering dust or particles in the external air, and the heat dissipation structure in the laser projection equipment is further simplified.

As can be seen from the above discussion, in the embodiment of the present invention, the heat of the heat source component may be dissipated first, and then the wind after dissipating the heat of the heat source component is utilized secondarily to dissipate the heat of the power board and/or the driving board; in this case, the heat source member can be efficiently radiated in a targeted manner, and the radiation efficiency is high.

As shown in fig. 2a, the first location area and the second location area are placed left and right. The first location area is located to the left of the second location area. The first fan is located between the first location area and the second location area, and the second fan is located to the left of the first location area. At the moment, a first air opening is formed in the bottom surface and the back of the whole machine shell of the laser projection equipment at the position corresponding to the first fan, and a second air opening is formed in the right side of the whole machine shell of the laser projection equipment at the position corresponding to the second fan. At this time, the heat dissipation fins are located between the second location area and the first location area.

Optionally, the first fan is an air inlet fan, and at this time, the first air inlet is an air inlet; the second fan is an air outlet fan, and at the moment, the second air port is an air outlet. In another optional embodiment, the first fan is an air outlet fan, and at this time, the first air outlet is an air outlet; the second fan is an air inlet fan, and at the moment, the second air inlet is an air inlet. The process of air flow is similar to that discussed in fig. 1d and will not be described again.

Optionally, in this manner, the lens in the laser projection apparatus is a lens except for the short-focus lens with a reflector, so as to avoid a thermal disturbance phenomenon caused by interference between reflected light emitted from the lens when the rear side of the laser projection apparatus is out of the wind.

In the embodiment of the invention, the power panel and/or the driving board are/is firstly radiated, and then the heat source part is radiated, although the temperature is increased after the external air firstly radiates the power panel and/or the driving board, the temperature is lower than that of the heat concentration module, so that the heat radiation efficiency of the heat source part by using wind after the power panel and/or the driving board are radiated is higher.

As shown in fig. 2b, the first location area and the second location area are placed one above the other. The first location area is located below the second location area. The first fan is located to the left of the first location area and the second location area, and the second fan is located to the right of the first location area and the second location area. At the moment, a first air opening is formed in the left surface of the whole machine shell of the laser projection equipment at the position corresponding to the first fan, and a second air opening is formed in the right surface of the whole machine shell of the laser projection equipment at the position corresponding to the second fan. The first air opening and the second air opening are positioned such that air flowing from the first air opening to the second air opening can flow through the heat dissipating fins and the first position area. At this time, the heat dissipation fins are located between the second location area and the first location area.

Optionally, the first fan is an air inlet fan, and at this time, the first air inlet is an air inlet; the second fan is an air outlet fan, and at the moment, the second air port is an air outlet. Under the action of the air inlet fan, external air of the laser projection equipment enters the laser projection equipment through the air inlet, and the air inlet fan blows the external air to the heat dissipation fins and the power panel and/or the driving board at the same time, so that the external air and the heat dissipation fins exchange heat, heat on the heat dissipation fins is taken away, and heat dissipation is carried out on the power panel and/or the driving board.

In another optional embodiment, the first fan is an air outlet fan, and at this time, the first air outlet is an air outlet; the second fan is an air inlet fan, and at the moment, the second air inlet is an air inlet. Under the action of the air inlet fan, external air of the laser projection equipment enters the laser projection equipment through the air inlet, and the air inlet fan blows the external air to the heat dissipation fins and the power panel and/or the driving board at the same time, so that the external air and the heat dissipation fins exchange heat, heat on the heat dissipation fins is taken away, and heat dissipation is carried out on the power panel and/or the driving board.

That is, at this time, the upper portion of the laser projection apparatus is a heat source part, and thus the upper portion is a closed structure, and the lower portion is a power supply board and/or a driving board, and thus the lower portion is an open structure or a semi-open structure. Optionally, at this time, since the upper part is heavier, a load-bearing structure may be added to the lower part of the laser projection apparatus, so as to support the heat source component of the upper part, so that the weight of the whole laser projection apparatus is balanced, and the laser projection apparatus is prevented from falling down during transportation and carrying.

Optionally, in order to reasonably utilize the space, the space inside the laser projection apparatus according to the embodiment of the present invention is not wasted, and therefore, the boundary between the optical engine and the other components such as the board card in the embodiment of the present invention is designed according to the shape structure of the optical engine and the board card, so that the space is reasonably utilized, and the volume of the whole apparatus is reduced.

As shown in fig. 2c, the first location area and the second location area are placed one above the other. The first location area is located above the second location area. The first fan is located to the left of the first location area and the second location area, and the second fan is located to the right of the first location area and the second location area. At the moment, a first air opening is formed in the left surface of the whole machine shell of the laser projection equipment at the position corresponding to the first fan, and a second air opening is formed in the right surface of the whole machine shell of the laser projection equipment at the position corresponding to the second fan. The first air opening and the second air opening are positioned such that air flowing from the first air opening to the second air opening can flow through the heat dissipating fins and the first position area. The heat sink fins are located between the second location area and the first location area. At this time, the heat dissipation fins are located between the second location area and the first location area.

Optionally, since the first position area is located above the second position area, when designing and using the short-focus lens, attention needs to be paid to light reflected by the optical machine lens, arrangement of components such as the board card and the like is reasonably designed, and the shape of the housing is reasonably designed so as to prevent interference with the light and influence on the picture.

In the embodiment of the invention, the heat generated by the heat source component is completely led into the heat concentration module through the heat conduction pipe, and the heat on the heat concentration module is subjected to concentrated heat dissipation through the heat dissipation module, so that the heat dissipation efficiency is improved.

Example two

Based on the same conception, the embodiment of the invention also provides laser projection equipment.

Fig. 3a schematically illustrates a laser projection apparatus to which an embodiment of the present invention is applicable, and as shown in fig. 3a, the laser projection apparatus provided by the embodiment of the present invention includes:

Alternatively, as shown in fig. 3a, the laser projection apparatus includes a laser projection apparatus main body case 1, and the laser projection apparatus main body case 1 includes a heat source member 30, a heat pipe 24, a heat concentrating module 9, and a heat dissipating module 23. The heat source unit 30 includes at least a laser light source unit 3 and an optical-mechanical unit 6. A sealed case 2 is provided outside the laser light source unit 3.

In the embodiment of the invention, the heat generated by the laser light source part in the sealed shell is led out to the outside of the sealed shell through the heat conduction pipe and is led into the heat concentration module, the heat on the heat concentration module is subjected to concentrated heat dissipation through the heat dissipation module, the heat dissipation efficiency is improved, and the problem that dust is brought into the heat source part again in the heat dissipation process is prevented and the dust-proof degree of the heat source part is improved because the heat on the heat concentration module is subjected to concentrated heat dissipation instead of directly performing heat dissipation on the heat source part. And furthermore, due to the existence of the sealed shell, the dust-proof degree of the laser light source component inside the laser projection equipment is further improved.

Optionally, the connection of the heat pipe and the sealed housing comprises a sealant or a sealing ring. In the embodiment of the invention, the sealing shell is a shell with higher sealing performance, and the dustproof effect can be optimized.

Optionally, the heat concentration module is located outside the sealed enclosure, and the heat concentration module is independent of the sealed enclosure. That is, the heat concentration module does not contact the hermetic container to prevent the heat concentration module from transferring heat to the heat source part inside the hermetic container again, further improving the heat dissipation efficiency of the heat source part.

Optionally, the laser light source component comprises at least a laser, a fluorescent wheel. Optionally, the laser light source component further comprises a first optical lens. Optionally, the opto-mechanical part comprises at least a Digital micro-mirror Device (DMD). The heat conduction pipe sequentially penetrates through the sealing shell and the first shell and is sequentially connected with the laser and the fluorescent wheel in the laser light source part in the first shell. Optionally, the laser light source component further comprises a first optical lens. The heat conducting pipe penetrates through the sealing shell and the first shell in sequence to be connected with the first optical lens.

Optionally, the opto-mechanical component is located within the sealed housing; the optical-mechanical part is a closed structure which is closed by using a second shell. Optionally, the heat pipe passes through the sealed enclosure and the second enclosure in sequence and is connected to the DMD inside the second enclosure. Optionally, the opto-mechanical part further comprises a second optical lens. The heat conducting pipe penetrates through the sealed shell and the second shell in sequence to be connected with the second optical lens. Fig. 3b is a schematic diagram of a laser projection device suitable for use in embodiments of the present invention, and as shown in fig. 3b, the opto-mechanical assembly is located within a sealed housing. Alternatively, as shown in fig. 3b, the laser projection apparatus includes a laser projection apparatus housing 1, and the laser projection apparatus housing 1 includes a heat source member 30, a heat pipe 24, a heat concentrating module 9, and a heat dissipating module 23. The heat source unit 30 includes at least a laser light source unit 3 and an optical-mechanical unit 6. The laser light source unit 3 and the optical device unit 6 are provided with a sealed case 2 on the outside.

Optionally, the heat dissipation module includes a first fan, and the first fan is located at one side of the heat concentration module; the heat collecting module is used for dissipating heat in a mode of blowing air flowing through the first fan to the heat collecting module. Optionally, the heat dissipation module further comprises a second fan; the power panel and/or the driving board is positioned between the first fan and the second fan, so that air flowing through the first fan and the second fan passes through the power panel and/or the driving board to dissipate heat of the power panel and/or the driving board.

Optionally, the first fan is an air inlet fan, and the second fan is an air outlet fan; or, the first fan is an air outlet fan, and the second fan is an air inlet fan. The position of the air inlet fan corresponds to an air inlet of the laser projection equipment, and the position of the air outlet fan corresponds to an air outlet of the laser projection equipment. Optionally, the power board and/or the driver board are located: left or right side of the heat source component; or an upper or lower portion of the heat source member.

The structure of the heat dissipation module in the second embodiment, and the positional relationship with other parts, such as the positional relationship between the heat dissipation module and the heat source component, and the positional relationship between the heat dissipation module and the power board and/or the driving board, are the same as those described in the first embodiment, and are not described herein again.

Therefore, the laser light source component comprises the sealing shell outside, and the dust prevention degree of the laser light source component is improved. Furthermore, the heat generated by the laser light source part and the optical machine part is completely led into the heat concentration module through the heat conduction pipe, and the purpose of heat dissipation of the laser light source part and the optical machine part is realized in a way that the heat on the heat concentration module is subjected to concentrated heat dissipation through the heat dissipation module; in addition, the heat on the heat concentration module is subjected to concentrated heat dissipation, so that the heat dissipation efficiency is improved; furthermore, in the embodiment of the invention, only one heat dissipation module for dissipating heat of the heat concentration module is arranged, and the heat dissipation modules are not required to be respectively arranged for the laser light source component and the optical machine component, so that the structure of the heat dissipation module in the laser projection equipment is simplified.

The heat conducting pipe in the embodiment of the invention can be in various forms, such as a heat pipe or a pipe with coolant flowing inside. Optionally, when the heat pipe is a heat pipe, the heat concentrating module includes heat dissipating fins; the heat dissipation fins are connected with the condensation end of the heat conduction pipe; for receiving heat generated by each of the heat source components into which the heat conductive pipes are introduced.

Optionally, when the heat conduction pipe is a pipe in which cooling liquid flows, the heat conduction pipe is communicated with the heat concentration module to form a loop; the circuit also comprises a pump, which is used for enabling the cooling liquid in the circuit to circularly flow along the circuit under the action of the pump; the heat concentration module comprises a radiator with a hollow inner part; a radiator for receiving the coolant flowing through each of the heat source parts in the heat conductive pipes and carrying heat generated by each of the heat source parts, flowing the coolant through an inner hollow portion of the radiator, and then re-discharging the coolant out of the hollow portion of the radiator and back into the heat conductive pipes.

Two states of the heat pipe and the pipe in which the coolant flows are described in detail in the third and fourth embodiments.

EXAMPLE III

Based on the same concept, the embodiment of the invention provides laser projection equipment. The laser projection apparatus provided in the third embodiment is suitable for the laser projection apparatus provided in the first embodiment, and is also suitable for the laser projection apparatus provided in the second embodiment. That is, optionally, the laser projection apparatus provided in the third embodiment may include a sealed housing outside the laser light source unit, or may not include the sealed housing.

Fig. 4a schematically illustrates a structure of a laser projection apparatus according to an embodiment of the present invention. As shown in fig. 4a, the laser projection apparatus includes:

one end of the heat conduction pipe is connected with the heat source part, and the other end of the heat conduction pipe is connected with the heat concentration module; a heat concentrating module for conducting heat generated by each of the heat source components away to the heat concentrating module; the heat conduction pipe is a heat pipe;

a heat concentrating module for receiving heat generated by each of the heat source components into which the heat pipe is introduced;

Alternatively, as shown in fig. 4a, the laser projection apparatus includes a laser projection apparatus main body case 1, and the laser projection apparatus main body case 1 includes a heat source member 30, a heat pipe 24, a heat concentration module, and a heat dissipation module 23. The heat source unit 30 includes at least a laser light source unit 3 and an optical-mechanical unit 6. The heat concentrating means is a heat radiating fin 25. The heat sink fins 25 are connected to the heat pipe 24 through the heat conductive material 10.

The heat pipe in the embodiment of the invention is applied to a heat pipe technology, a heat pipe (or called a heat pipe) is a special material with a rapid temperature equalization characteristic, a hollow metal pipe body has the characteristic of light weight, and the rapid temperature equalization characteristic has excellent heat superconductivity; heat pipes are used in a wide variety of applications, such as various heat exchangers, coolers, natural heat exchangers, etc.

From the thermodynamic point of view, the working principle of the heat pipe is specifically as follows: the heat absorption and the heat release of the object are relative, and the phenomenon that the heat is transferred from a high-temperature position to a low-temperature position necessarily occurs when a temperature difference exists. From the three modes of heat transfer (radiation, convection, conduction), the heat conduction is fastest. The heat pipe is used for evaporation refrigeration, so that the temperature difference between two ends of the heat pipe is large, and heat is conducted quickly. A typical heat pipe consists of a pipe shell, a wick, and end caps. The interior of the heat pipe is pumped into a negative pressure state and filled with proper liquid, and the liquid has a low boiling point and is easy to volatilize. The tube wall has a wick that is constructed of a capillary porous material. When one end of the heat pipe is heated, the liquid in the capillary tube is rapidly evaporated, the vapor flows to the other end under a slight pressure difference and releases heat to be condensed into liquid again, and the liquid flows back to the evaporation end along the porous material under the action of capillary force, so that the heat is not circulated and transferred from one end of the heat pipe to the other end. This cycle is rapid and heat can be conducted away from the heat source.

Optionally, when the heat pipe is a heat pipe, two ends of the heat pipe are respectively an evaporation end and a condensation end; the evaporation ends of the heat conduction pipes are respectively connected with a heat source component; the condensation end of the heat conduction pipe is respectively connected with the heat concentration module. Alternatively, the heat conductive pipe may be plural, and the evaporation end of each of the plural heat conductive pipes is connected to the heat source member; the condensation end of each heat conduction pipe in the plurality of heat conduction pipes is respectively connected with the heat concentration module.

Optionally, the evaporation end of the heat pipe is connected to the heat source component through a heat conducting medium and a heat conducting material, respectively, and the condensation end of the heat pipe is connected to the heat concentration module. So, heat accessible heat conduction medium and heat conduction material on the heat source part transmit to the evaporation end of heat pipe, further transmit this heat to the condensation end of heat pipe through the evaporation end, and the heat of later condensation end transmits to heat concentration module through the heat conduction material, and then can make heat dissipation module concentrate and carry out radiating mode to heat concentration module and realize dispelling the heat to the heat source part.

Optionally, the heat conducting medium is a copper block; the heat conducting pipe is made of copper; the working liquid in the heat conduction pipe is liquid which can generate phase change. Optionally, the heat conducting medium, the heat conducting material, the heat conducting pipe, etc. all have a heat conducting function, for example, the heat conducting medium is a metal block, such as a copper block. The heat pipe is generally made of copper. The working liquid in the heat conducting pipe is a liquid capable of undergoing a phase change, such as water, or other substances capable of undergoing a phase change. Phase change means in particular that a substance is capable of changing from a liquid state to a gaseous state or vice versa. For example, water may change from a liquid to a gas, and vice versa.

Optionally, the heat concentrating module comprises heat dissipating fins; the heat dissipation fins are connected with the condensation end of the heat conduction pipe; for receiving heat generated by each of the heat source components into which the heat conductive pipes are introduced. Optionally, the heat dissipation module includes a first fan, and the first fan is located at one side of the heat concentration module; the heat collecting module is used for dissipating heat in a mode of blowing air flowing through the first fan to the heat collecting module.

As shown in fig. 4a, the heat concentration module includes heat dissipation fins, for example, the heat dissipation fins may be solid heat conduction fins, the heat dissipation fins are connected to the condensation ends of all the heat conduction pipes through heat conduction materials, at this time, heat at the condensation ends of all the heat conduction pipes is transmitted to the heat dissipation fins through the heat conduction materials, and then the heat dissipation fins are dissipated by the first fan. Further, the heat dissipation fins are made of sheet-shaped heat conduction materials, namely, after heat on the condensation ends of all the heat conduction pipes is transmitted to the heat dissipation fins, the coverage area of the heat is enlarged, and at the moment, the first fan is used for dissipating the heat of the heat dissipation fins, so that the heat dissipation efficiency can be further improved.

Optionally, the heat dissipation module further comprises a second fan; the power panel and/or the driving board is positioned between the first fan and the second fan, so that air flowing through the first fan and the second fan passes through the power panel and/or the driving board to dissipate heat of the power panel and/or the driving board.

Optionally, the first fan is an air inlet fan, and the second fan is an air outlet fan; or the first fan is an air outlet fan, and the second fan is an air inlet fan; the position of the air inlet fan corresponds to an air inlet of the laser projection equipment, and the position of the air outlet fan corresponds to an air outlet of the laser projection equipment.

The structure of the heat dissipation module in the third embodiment, and the positional relationship with other parts, such as the positional relationship between the heat dissipation module and the heat source component, and the positional relationship between the heat dissipation module and the power board and/or the driving board, are the same as those described in the first embodiment and the second embodiment, and are not described herein again. The exterior of the heat source component of the third embodiment may include the sealed enclosure of the second embodiment, or may not include the sealed enclosure of the second embodiment, and is not limited in the third embodiment.

Optionally, the laser projection device further comprises a sealed housing located outside the laser light source component; the laser light source component is a closed structure which is closed by using a first shell. Optionally, the sealed housing further includes an optical-mechanical part inside, and the optical-mechanical part is an enclosed structure enclosed by the second housing.

Optionally, the laser light source component comprises at least a laser, a fluorescent wheel. Optionally, the laser light source component comprises a first optical lens. Optionally, the opto-mechanical part comprises at least a digital micromirror device DMD. Optionally, the opto-mechanical part further comprises a second optical lens. Thus, the dust-proof property of the heat source member can be improved.

When the heat pipe in the embodiment of the present invention is a heat pipe, there are various ways to achieve connection between the heat pipe and the heat source component in the embodiment of the present invention, and there are also various ways to achieve connection between the heat pipe and the heat concentrating module. The following specific connection modes of the heat conducting pipe and other components are provided in the embodiment of the invention.

FIG. 4b is a schematic structural diagram illustrating a laser projection apparatus according to an embodiment of the present invention; FIG. 4c is a schematic diagram illustrating a top view of the phosphor wheel in the laser projection device shown in FIG. 4b connected to a heat sink module by a heat pipe; FIG. 4d is a schematic diagram illustrating a top view of the laser in the laser projection device shown in FIG. 4b connected to a heat sink module by a heat pipe; FIG. 4e is a schematic diagram illustrating a top view of the first optical lens of the laser projection apparatus shown in FIG. 4b connected to the heat sink module through a heat pipe; fig. 4f schematically shows a schematic diagram of a top view of the DMD in the laser projection device shown in fig. 4b connected to the heat sink module by the heat pipe.

As shown in fig. 4b, the laser projection apparatus includes a laser projection apparatus casing 1, and the laser projection apparatus casing 1 includes a heat source part, a heat pipe, a heat concentrating module 9, and a heat dissipating module. The heat source part at least comprises a laser light source part 3 and an optical mechanical part 6. Optionally, a sealed housing 2 is included outside the laser light source component 3 and the opto-mechanical component 6. Optionally, the laser light source component 3 includes a fluorescent wheel 4, a first optical lens 16 and a laser 14. The opto-mechanical part 6 comprises DMD 7. The fluorescent wheel 4 is connected with the heat concentration module 9 through a first heat conduction pipe 5; the laser 14 is connected to the heat concentration module 9 by a second heat pipe 15. DMD7 is connected to heat concentrator module 9 by third thermally conductive tube 8. The heat dissipation module includes a first fan 11 and a second fan 13. A power board and/or a driving board 12 is further included between the first fan 11 and the second fan 13.

As shown in FIG. 4c, the fluorescence wheel 4 is connected to the first heat pipe 5 through the fluorescence wheel metal base 17 and the fluorescence wheel holder 18. As shown in fig. 4d, the laser 14 is connected to the second heat conducting pipe 15 through a laser metal matrix 19. As shown in fig. 4e, the first optical lens 16 is connected to the fourth heat pipe 20 through the first optical lens metal base 21. As shown in fig. 4f, DMD7 is connected to third heat pipe 8 through DMD metal matrix 22.

The heat conduction pipes are respectively a first heat conduction pipe, a second heat conduction pipe and a third heat conduction pipe. Optionally, the thermally conductive pipe further comprises a fourth thermally conductive pipe;

the evaporation end of the first heat conduction pipe is connected with the metal bracket of the fluorescent wheel through a heat conduction medium and a heat conduction material; or the evaporation end of the first heat conduction pipe is connected with the metal bracket of the fluorescent wheel; the evaporation end of the second heat conduction pipe is connected with the shell of the laser through a heat conduction medium and a heat conduction material; the first optical lens is connected with the first shell, and the first shell is connected with the evaporation end of the fourth heat conduction pipe through a heat conduction medium and a heat conduction material; the evaporation end of the third heat pipe is connected with the bracket of the DMD through a heat conducting medium and a heat conducting material; the second optical lens is connected with the second shell, and the second shell is connected with the evaporation end of the third heat conduction pipe through a heat conduction medium and a heat conduction material.

As shown in fig. 4b, 4c, 4d, 4e and 4f, the heat conducting medium is a metal block.

Specifically, the first heat conduction pipe is welded with a metal block, and the metal block is a metal base of the fluorescent wheel; the metal block is in direct contact with the metal bracket of the fluorescent wheel, the contact surface of the metal block and the metal bracket of the fluorescent wheel is as smooth as possible, and the metal block and the metal bracket of the fluorescent wheel can be filled with heat conduction materials. The other connection mode is that the fluorescent wheel metal bracket and the metal block are of an integral structure, namely the first heat conduction pipe is directly welded on the fluorescent wheel metal bracket. The metal block is made of a material with a high heat conductivity coefficient as much as possible. The first heat conduction pipe rapidly transfers and transmits heat generated by the fluorescent wheel to the heat concentration module outside the closed structure of the laser light source component.

The second heat conduction pipe is welded with a metal block, and the metal block is a laser metal base; the metal block is in direct contact with the laser, specifically, the metal block is in contact with a mounting shell of the laser, and the metal block and the laser are filled with a heat conduction material. The second heat conduction pipe transmits the heat generated by the laser to the heat concentration module outside the closed structure of the laser light source component.

The third heat conduction pipe is welded on a metal block, and the metal block is a DMD metal base; the metal block contacts with the DMD, and is specific, the metal block contacts with the fixed structure of the DMD, the contact surface is smooth as far as possible, and the metal block is made of a metal material with a high heat conductivity coefficient. The metal block and the DMD are filled with a heat conducting material, and the heat conducting material with low compressive stress is selected because the DMD is fragile. The third heat conduction pipe transmits the heat generated by the DMD to a heat concentration module outside the closed structure of the laser light source component.

The first optical lens is fixed on a metal shell of the laser light source component, for example, the first shell is a metal shell, the first optical lens is fixed on the metal shell of the laser light source component, and the metal shell is a metal base of the first optical lens; and the number of the optical lenses on the first optical lens is large, if each optical lens is separately cooled, the structural design is more complex, and the efficiency is not high. The outer surface of one side of the metal shell of the laser light source part is designed to be a plane and is in contact with the metal block welded with the fourth heat conduction pipe, the metal block and the metal shell of the laser light source part are filled with heat conduction materials, the heat absorbed by the first optical lens is conducted to the fourth heat conduction pipe through the metal shell of the laser light source part, and the heat is transferred to the heat concentration module through the fourth heat conduction pipe. Alternatively, the outer surface of the laser light source member on the metal case side and the fourth heat transfer pipe are directly welded together.

The second optical lens is fixed on the metal shell of the optical-mechanical part, for example, the second shell is a metal shell, the second optical lens is fixed on the metal shell of the optical-mechanical part, and the metal shell is a metal base of the second optical lens; and the number of the optical lenses on the second optical lens is large, if each optical lens is separately cooled, the structural design is more complex, and the efficiency is not high. The outer surface of one side of the metal shell of the optical-mechanical part is designed into a plane and is contacted with the metal block welded with the third heat-conducting pipe, the metal block and the metal shell of the optical-mechanical part are filled with heat-conducting materials, the heat absorbed by the second optical lens is conducted to the third heat-conducting pipe through the metal shell of the optical-mechanical part, and the heat is transferred to the heat concentration module through the third heat-conducting pipe. Or the outer surface of the optical machine part on one side of the metal shell is directly welded with the third heat conduction pipe.

The heat conducting medium, i.e. the metal block in the above description is located inside the closed structure, for example, the metal block connected to the laser is located inside the first housing of the laser light source component. The heat concentration module is located outside the closed structure of the heat source component, for example, the heat concentration module is located outside the first housing and also located outside the second housing. Through the heat pipe, for example first heat pipe, the second heat pipe, third heat pipe and fourth heat pipe derive the heat of heat source part to the outside of enclosed construction, thereby dispel the heat to it, the leakproofness of enclosed construction itself has been guaranteed on the one hand, on the other hand dispels the heat to the outside heat of enclosed construction and has improved the radiating efficiency, the third aspect, owing to need not directly to blow through the fan to heat source part, consequently also avoided blowing the dust to heat source part's problem, and need not to locate to set up the facility of filtering dust or granule to first fan and second fan, laser projection equipment's structural style has further been simplified.

Optionally, a sealing treatment, such as applying a sealant or the like, is performed at the junction of the heat pipe and the enclosure of the enclosed structure. Specifically, a sealant is coated at the contact positions of the first heat conduction pipe and the second heat conduction pipe with the first shell. And coating sealant at the contact position of the third heat-conducting pipe and the second shell.

Alternatively, if the sealing performance and the dust resistance of the heat source component are improved, a sealing housing may be added outside the laser light source component, such as shown in embodiment two. Optionally, a sealed housing may be added outside the laser light source component and the optical-mechanical component. Optionally, a sealant is applied to the contact position of the heat conducting pipe and the sealed shell.

In the embodiment of the invention, the heat generated by the heat source component is completely led into the heat concentration module through the heat conduction pipe, and the heat on the heat concentration module is subjected to concentrated heat dissipation through the heat dissipation module, so that the heat dissipation efficiency is improved. Further, each of the heat conduction pipes is a heat pipe; therefore, the heat generated by the heat source component can be efficiently guided into the heat concentration module through the heat conduction pipe based on the heat pipe principle, and the heat dissipation efficiency of the heat source component is further improved.

Example four

Based on the same concept, the embodiment of the invention provides laser projection equipment. The laser projection apparatus provided in the fourth embodiment is applied to the laser projection apparatuses provided in the first and second embodiments described above. That is, the laser projection apparatus provided in the fourth embodiment may include a sealed housing outside the laser light source unit, or may not include a sealed housing.

Fig. 5a schematically illustrates a structure of a laser projection apparatus according to an embodiment of the present invention. As shown in fig. 5a, the laser projection apparatus includes:

Alternatively, as shown in fig. 5a, the laser projection apparatus includes a laser projection apparatus main body case 1, and the laser projection apparatus main body case 1 includes a heat source member 30, a heat pipe 24, a heat concentrating module 9, and a heat dissipating module 23. The heat source unit 30 includes at least a laser light source unit 3 and an optical-mechanical unit 6. The heat conduction pipe is communicated with the heat concentration module to form a loop, and the cooling liquid circularly flows in the loop formed by the heat conduction pipe and the heat concentration module.

Optionally, the heat conducting pipe is communicated with the heat concentration module to form a loop; the circuit also comprises a pump, which is used for enabling the cooling liquid in the circuit to circularly flow along the circuit under the action of the pump; to guide heat generated from each of the heat source parts, respectively, into the heat concentration module. And a storage tank in communication with the circuit for storing the coolant in the circuit.

In one embodiment, the heat pipe connects the storage tank, the heat concentrating module and the pump in a loop. The heat pipe is connected with the heat source component through a heat conducting medium and a heat conducting material. Optionally, the heat conducting medium, the heat conducting pipe, etc. have a heat conducting function, for example, the heat conducting medium is a water cooling head or a water cooling block; the material of each of the plurality of heat conductive pipes is copper. Optionally, the coolant in each of the plurality of heat conductive pipes is water. Optionally, the storage tank is a water tank.

Optionally, the heat concentrating module comprises a heat sink with a hollow interior; a radiator for receiving the coolant flowing through each of the heat source parts in the heat conductive pipes and carrying heat generated by each of the heat source parts, flowing the coolant through an inner hollow portion of the radiator, and then re-discharging the coolant out of the hollow portion of the radiator and back into the heat conductive pipes.

Therefore, heat on the heat source component can be transmitted to the cooling liquid flowing inside the heat conduction pipe through the heat conduction medium and the heat conduction material, and the cooling liquid circularly flows in the loop, so that the cooling liquid carrying the heat of the heat source component can flow to the hollow part inside the radiator, and then the heat concentration module is subjected to concentrated heat dissipation by the heat dissipation module, so that the purpose of heat dissipation of the heat source component is achieved, and the heat dissipation efficiency is improved.

Optionally, the heat dissipation module includes a first fan located at one side of the heat concentration module; the heat collecting module is used for dissipating heat in a mode of blowing air flowing through the first fan to the heat collecting module.

As shown in fig. 5a, the heat sink may be some hollow fins, and the hollow portion inside the heat sink is communicated with each heat conducting pipe in the heat conducting pipes, and at this time, the coolant in all the heat conducting pipes flows into the heat sink, and as shown in fig. 5a, the coolant flows through the hollow portion inside each fin of the heat sink, and then flows out into the heat conducting pipes again through the heat sink. The radiator may also be referred to as a water drain. The radiator is cooled through the first fan, and because the radiator is the flaky heat conduction material, namely, after the cooling liquid carrying heat on the heat concentration module flows to the inside of the radiator, the heat coverage area is increased, and at the moment, the first fan is used for cooling the radiator, so that the heat dissipation efficiency can be increased.

Optionally, the heat dissipation module further includes a second fan, and the power board and/or the driving board are located between the first fan and the second fan, so that air flowing through the first fan and the second fan passes through the power board and/or the driving board to dissipate heat of the power board and/or the driving board.

The structure of the heat dissipation module in the fourth embodiment, and the positional relationship with other parts, such as the positional relationship between the heat dissipation module and the heat source component, and the positional relationship between the heat dissipation module and the power board and/or the driving board, are the same as those described in the first embodiment and the second embodiment, and are not described herein again. The exterior of the heat source component of the fourth embodiment may include the sealed enclosure of the second embodiment, or may not include the sealed enclosure of the second embodiment, and is not limited in the fourth embodiment.

Optionally, the laser light source component comprises at least a laser and a fluorescent wheel, and optionally, the laser light source component further comprises a first optical lens. Optionally, the opto-mechanical part comprises at least DMD. Optionally, the opto-mechanical part further comprises a second optical lens.

When the heat pipe in the embodiment of the present invention is a liquid cooling pipe, there are various ways to achieve connection between the heat pipe and the heat source component in the embodiment of the present invention, and there are also various ways to achieve connection between the heat pipe and the heat sink. The following specific connection modes of the heat conducting pipe and other components are provided in the embodiment of the invention.

FIG. 5b is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention; FIG. 5c is a schematic diagram illustrating a flow circuit of the cooling liquid in the heat conductive pipe in the laser projection apparatus shown in FIG. 5 b; fig. 5d is a schematic diagram illustrating a flow loop of the cooling liquid in the heat conducting pipe in the laser projection apparatus according to the embodiment of the present invention.

As shown in fig. 5b, the laser projection apparatus includes a laser projection apparatus main body case 1, and the laser projection apparatus main body case 1 includes a heat source part, a heat pipe 24, a heat concentrating module, and a heat dissipating module 23. The heat source part at least comprises a laser light source part 3 and an optical mechanical part 6. The heat conduction pipe 24 is connected with each of the laser light source parts 3 through the first water cooling head 32, the second water cooling head 33 and the fourth water cooling head 35; the heat conduction pipe 24 is connected with the optical mechanical part 6 through a third water cooling head 34; the laser projection apparatus further includes a pump 28 and a storage tank 29. The heat concentrating module is a heat sink 26 within which the coolant in the heat conducting tubes can flow. The heat concentration module 9 can be a heat dissipation fin 25; the heat dissipation module 23 includes a first fan 11 and a second fan 13. A power board and/or a driving board 12 is further included between the first fan 11 and the second fan 13. The heat conduction pipe is communicated with the heat concentration module to form a loop, and the cooling liquid circularly flows in the loop formed by the heat conduction pipe and the heat concentration module.

As shown in fig. 5c, the laser projection apparatus includes a laser projection apparatus main body case 1, in the laser projection apparatus main body case 1: the coolant flows from the pump 28 along the heat pipe and then flows through the heat pipe connected to the water cooling head 31, and the water cooling head 31 is connected to the laser 14, the fluorescent wheel 4 and the DMD38 in the heat source unit 30, respectively. The heat of the laser 14, the fluorescent wheel 4 and the DMD38 is transmitted to the cooling liquid flowing through the inside of the heat conducting pipe connected with the water cooling head 31 through the water cooling head 31. The cooling liquid flows into the radiator 26 after carrying heat generated by the heat source component 30 through the storage tank 29, and the heat in the cooling liquid in the radiator 26 is carried away by the wind blown by the first fan 11 under the heat radiation action of the first fan 11, and is discharged through the corresponding air outlet of the second fan 13 by the action of the second fan 13. The wind brought into the laser projection device by the first fan 11 also passes through the power board and/or the driving board 12 and takes away the heat on the power board and/or the driving board 12, and then is exhausted from the air outlet corresponding to the second fan 13.

As shown in fig. 5d, the laser projection apparatus includes a laser projection apparatus casing 1, in the laser projection apparatus casing 1: the coolant flows from the pump 28 along the heat transfer tubes and then flows through the heat transfer tubes connected to the water cooling heads 31, the water cooling heads 31 being connected to respective ones of the heat source components 30. The heat of the heat source unit 30 is transferred to the coolant flowing through the inside of the heat transfer pipe to which the water cooling head 31 is connected through the water cooling head 31. The coolant flows into the radiator 26 after carrying heat generated by the heat source unit 30 through the storage tank 29, and the radiator 26 removes the heat from the coolant in the radiator 26 by the wind blown by the first fan 11 by the heat radiation action of the first fan 11.

As shown in fig. 5e, the laser projection apparatus includes a laser projection apparatus main body case 1, in the laser projection apparatus main body case 1: the coolant flows out of the pump 28 along heat pipes corresponding to two paths, which are a loop, as shown in fig. 5e, and the coolant in one path flows through the heat pipes connecting the first water cooling head 32, the second water cooling head 33 and the fourth water cooling head 35, and the first water cooling head 32, the second water cooling head 33 and the fourth water cooling head 35 are respectively connected with each of the laser source units 3. The heat of each of the laser light source units 3 is transferred to the coolant flowing through the inside of the heat pipes connected to the first, second and fourth water-cooled heads 32, 33 and 35 through the first, second and fourth water-cooled heads 32, 33 and 35. The coolant flows into the distributor 27 through a passage, carrying heat generated by each of the laser light source units 3. The other channel connected from the pump 28 is connected with the third water cooling head 34, the cooling liquid in the other channel flows through the heat conducting pipe connected with the third water cooling head 34, and the third water cooling head 34 is connected with the optical mechanical component 6. The heat of each part in the optical-mechanical part 6 is transferred to the cooling liquid flowing through the inside of the heat pipe connected with the third water cooling head 34 through the third water cooling head 34. The cooling liquid carries the heat generated by the individual components in the opto-mechanical part 6 via a further channel into the distributor 27. The distributor 27 feeds the received coolant to the internal hollow of the radiator 26, and the radiator 26 blows away the heat carried by the coolant flowing through the radiator 26 under the action of the first fan 11 of the radiator module 23. Alternatively, the air may be discharged to the outside of the laser projection apparatus through an air outlet corresponding to the second fan 13 of the heat dissipation module 23. After the heat of the coolant flowing through the radiator 26 is blown off, the coolant, which has lost heat, flows to another distributor 27 to which the radiator 26 is connected, and the distributor 27 distributes the received coolant to a plurality of passages of the heat conductive pipes, and circulates through a pump 28 through the plurality of passages. Optionally, the laser projection apparatus further comprises a power board and/or a driving board 12 located between the first fan 11 and the second fan 13, and the wind flowing through the first fan 11 and the second fan 13 carries away the heat generated by the power board and/or the driving board 12.

In the radiator 26, the heat in the coolant in the radiator 26 is taken away by the wind blown by the first fan 11 under the heat radiation action of the first fan 11, and is discharged through the corresponding air outlet of the second fan 13 by the action of the second fan 13 in the radiator 26. The wind brought into the laser projection device by the first fan 11 also passes through the power board and/or the driving board 12 and takes away the heat on the power board and/or the driving board 12, and then is exhausted from the air outlet corresponding to the second fan 13.

Optionally, the heat conducting pipe is connected with the metal bracket of the fluorescent wheel through a heat conducting medium and a heat conducting material; or the heat conducting pipe is connected with the metal bracket of the fluorescent wheel; the heat conducting pipe is connected with the shell of the laser through a heat conducting medium and a heat conducting material. Optionally, the heat pipe is connected with the bracket of the DMD through a heat conducting medium and a heat conducting material. Optionally, the first optical lens is connected with the first housing, and the first housing is connected with the heat conducting pipe through the heat conducting medium and the heat conducting material. Optionally, the second optical lens is connected to the second housing, and the second housing is connected to the heat pipe through a heat conducting medium and a heat conducting material.

Optionally, the heat concentration module further comprises two distributors connected to the heat sink; the two distributors are respectively positioned at two sides of the radiator; the two distributors communicate with the inside hollow portion of the heat sink so that the coolant in the heat conductive pipe flows to the inside hollow portion of the heat sink through one of the two distributors, flows out to the other of the two distributors from the inside hollow portion of the heat sink, and flows out into the heat conductive pipe via the other of the two distributors.

As shown in fig. 5b, 5c and 5d, the heat conducting medium is a water cooling head or a water cooling block. In the attached drawings of the specification, fig. 5b, fig. 5c and fig. 5d are described by taking a heat conducting medium as a water cooling head as an example. The heat concentration module can also be called as a cold row, and distributors can also be arranged at two sides of the heat concentration module. Fig. 5e schematically shows a structural diagram of a laser projection apparatus provided by an embodiment of the present invention.

As shown in fig. 5e, a large-capacity distributor is disposed at both ends of the cold row, and in this case, the tank may not be included in the flow circuit of the coolant formed by the heat transfer pipes. Each distributor includes a water inlet end and a water outlet end. When the radiator comprises distributors, the two distributors are generally symmetrically distributed on both sides of the radiator and the coolant circuit. Optionally, the material of the heat sink is aluminum. The distributor outputs the coolant from the water inlet end to the respective fine passages in the heat conductive pipe and balances the flow rate and amount of the coolant for each passage. Fig. 5e schematically shows a structure of the heat pipe in the laser projection apparatus, and as shown in fig. 5e, the heat pipe is a loop, but includes a plurality of channels.

Alternatively, in an embodiment of the present invention, the heat pipe is a loop, and the loop includes a water tank, a heat sink for absorbing heat of the heat source component, and a pump, and in an embodiment of the present invention, the loop may also include a pressurizing device and a fluid infusion device, and the pressurizing device and the fluid infusion device may be located at any position of the heat pipe, and the pressurizing device and the fluid infusion device may also be integrated with any of the water pump, the heat sink for absorbing heat of the heat source component, the pump, and the water tank as one component.

The water cooling head or the water cooling block is a metal block with a channel inside, and the channel is used for enabling the cooling liquid to flow, for example, when the cooling liquid is water, the channel is a water channel. The water cooling head or the water cooling block can be a material with a heat conduction function, such as a metal block with a heat conduction function, and can be a copper block or an aluminum block.

The working principle of the loop in the form of the heat conduction pipe is as follows: the heat conducting pipe is connected with a pump, a water tank, a radiator and a water cooling head or a water cooling block connected with each heat source component. The cooling liquid is arranged in the heat conduction pipe, and the cooling liquid circularly flows in the heat conduction pipe and is not leaked. The pump, the water tank, the heat concentration device and the radiator are all positioned outside the closed structure of the heat source component, and the water cooling head or the water cooling block connected with each heat source component is positioned inside the closed structure of the heat source component.

Under the action of a pump, cooling liquid flows from the pump to a water cooling head or a water cooling block connected to a heat source component, at the moment, the cooling liquid is low in temperature, when the cooling liquid passes through the water cooling head or the water cooling block connected to the heat source component, the heat on the heat source component is absorbed through the water cooling head or the water cooling block, so that the heat on the heat source component is reduced, the temperature of the cooling liquid is increased, the cooling liquid with the increased temperature flows out of a closed structure of the heat source component and flows into an inner hollow part of the radiator through a water tank, at the moment, the first fan blows air to the radiator so as to reduce the temperature of the cooling liquid in the inner hollow part of the radiator, the cooling liquid with the reduced temperature flows out of the inner hollow part of the radiator again through the pump, and then flows through the water cooling heads or the water cooling blocks connected to the plurality.

In the process, the heat of a plurality of heat source components in the closed structure is carried to the radiator outside the closed structure for heat dissipation through the circulating flow of the cooling liquid, and the heat dissipation efficiency is improved.

As shown in fig. 5b, 5c and 5d, the heat conducting medium is a water cooling head or a water cooling block, i.e. a metal block with a channel inside for allowing the cooling liquid to flow.

The metal block of the first water cooling head is in direct contact with the metal support of the fluorescence wheel, the contact surface of the metal block and the metal support of the fluorescence wheel is smooth as much as possible, and the metal block and the metal support of the fluorescence wheel can be filled with heat conduction materials. The other connection mode is that the metal bracket of the fluorescent wheel and the metal block are of an integral structure, namely the metal block of the first water cooling head is directly welded on the metal bracket of the fluorescent wheel. The metal block is made of a material with a high heat conductivity coefficient as much as possible. The metal block of the first water cooling head quickly transfers the heat generated by the fluorescent wheel to the heat concentration module outside the closed structure of the laser light source component.

The metal block of the second water cooling head is in direct contact with the laser, specifically, the metal block is in contact with a mounting shell of the laser, and the metal block and the laser are filled with a heat conduction material. The metal block of the second water cooling head transmits the heat generated by the laser to a heat concentration module outside the closed structure of the laser light source component.

The metal block of third water-cooling head contacts with DMD, and is specific, and the metal block contacts with DMD's fixed knot structure, and the contact surface is smooth as far as possible, and the metal block chooses the higher metal material of coefficient of heat conductivity for use. The metal block and the DMD are filled with a heat conducting material, and the heat conducting material with low compressive stress is selected because the DMD is fragile. And the metal block of the third water cooling head transmits the heat generated by the DMD to a heat concentration module outside the closed structure of the laser light source component.

The first optical lens is fixed on the metal shell of the laser light source component, for example, the first shell is a metal shell, the first optical lens is fixed on the metal shell of the laser light source component, and the number of the optical lenses on the first optical lens is large, if each optical lens is separately cooled, the structural design is complex, and the efficiency is not high. The outer surface of one side of the metal shell of the laser light source component is designed into a plane and is in contact with the metal block of the first water cooling head or the second water cooling head, the metal block and the metal shell of the laser light source component are filled with heat conducting materials, heat absorbed by the first optical lens is conducted to the first water cooling head or the second water cooling head through the metal shell of the laser light source component, and the heat is transferred to the heat concentration module through the first water cooling head or the second water cooling head.

The second optical lens is fixed on the metal shell of the optical mechanical component, for example, the second shell is a metal shell, the second optical lens is fixed on the metal shell of the optical mechanical component, and the number of the optical lenses on the second optical lens is large, if each optical lens is separately cooled, the structural design is complex, and the efficiency is not high. The outer surface of one side of the metal shell of the optical-mechanical part is designed into a plane and is in contact with the metal block welded with the third water cooling head, the metal block and the metal shell of the optical-mechanical part are filled with heat conduction materials, the heat absorbed by the second optical lens is conducted to the third water cooling head through the metal shell of the optical-mechanical part, and the heat is transferred to the heat concentration module through the third water cooling head.

Alternatively, the heat concentration module may be a region on the heat pipe, which may include one or more fine channels, as shown in the heat concentration module of fig. 5 e. That is, the heat concentration module is a radiator, and the radiator can be one water row or can be divided into several water rows.

The heat conducting medium, i.e. the water cooling head, in the above is located inside the closed framework, for example, the metal block of the water cooling head connected with the laser is located inside the first housing of the laser light source component. The heat concentration module is located outside the closed structure of the heat source component, for example, the heat concentration module is located outside the first housing and also located outside the second housing. Derive the heat of heat source part to the outside of enclosed construction through the heat pipe, thereby dispel the heat to it, the leakproofness of enclosed construction itself has been guaranteed on the one hand, on the other hand dispels the heat to the outside of enclosed construction and has improved the radiating efficiency, the third aspect, owing to need not directly to blow to the heat source part through the fan, consequently also avoided blowing the dust to the problem of heat source part, and need not to set up the facility of filtering dust or granule to first fan and second fan department, laser projection equipment's structural style has further been simplified.

Optionally, a sealing treatment, such as applying a sealant or the like, is performed at the junction of the heat pipe and the enclosure of the enclosed structure. Specifically, a sealant is applied to a contact position of the heat pipe and the first shell. And coating a sealant at the contact position of the heat conduction pipe and the second shell.

In the embodiment of the invention, the heat generated by the heat source component is completely led into the heat concentration module through the heat conduction pipe, and the heat on the heat concentration module is subjected to concentrated heat dissipation through the heat dissipation module, so that the heat dissipation efficiency is improved. Furthermore, because the liquid cooling mode is used in the embodiment of the invention, the cooling liquid in the heat conduction pipe can be recycled, so that the resource is saved, and the consumption is reduced.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A laser projection device, comprising:

the whole machine shell of the laser projection equipment;

a heat source member; the heat source part at least comprises a laser light source part and an optical-mechanical part; wherein the laser light source part comprises a sealed shell outside; the laser light source component is of a closed structure which is closed by using a first shell; the optical-mechanical part is positioned in the sealed shell; the optical-mechanical part is of a closed structure which is sealed by using a second shell; the sealed shell is not internally provided with a heat dissipation module;

one end of the heat conduction pipe is connected with the heat source component, and the other end of the heat conduction pipe is connected with the heat concentration module; a heat concentrating module for concentrating heat generated by each of the heat source components;

the heat concentration module is positioned outside the sealed shell; for receiving heat generated by each of the heat source components into which the heat conductive pipes are introduced;

2. The laser projection device of claim 1, wherein the laser light source component includes at least a laser, a fluorescent wheel; the optical-mechanical part at least comprises a Digital Micromirror Device (DMD).

3. The laser projection device of claim 1, wherein when the heat pipe is a heat pipe, the heat concentrating module comprises heat dissipating fins;

the heat dissipation fins are connected with the condensation end of the heat conduction pipe; for receiving heat generated by each of the heat source components into which the heat conductive pipes are introduced.

4. The laser projection device of claim 1, wherein the heat pipe is in communication with the heat concentration module as a loop;

the circuit also comprises a pump, and the pump is used for enabling the cooling liquid in the circuit to circularly flow along the circuit under the action of the pump;

the heat concentration module comprises a radiator with a hollow inner part;

the heat sink is configured to receive the coolant flowing through each of the heat source components in the heat conductive pipe and carrying heat generated by each of the heat source components, flow the coolant through the hollow portion inside the heat sink, and then re-discharge the coolant out of the hollow portion of the heat sink and back into the heat conductive pipe.

5. The laser projection device of claim 3 or 4, wherein the heat dissipation module comprises a first fan:

on one side of the heat concentrating module; the heat collecting module is used for dissipating heat by blowing air flowing through the first fan to the heat collecting module.

6. The laser projection device of claim 5, wherein the heat dissipation module further comprises a second fan;

the power panel and/or the driving panel are positioned between the first fan and the second fan, so that air flowing through the first fan and the second fan passes through the power panel and/or the driving panel to dissipate heat of the power panel and/or the driving panel.

7. The laser projection device of claim 6, wherein the first fan is an air inlet fan and the second fan is an air outlet fan; or,

the first fan is an air outlet fan, and the second fan is an air inlet fan.

8. The laser projection device of claim 7, wherein the power board and/or the driver board are located at:

a left or right side of the heat source component; or,

an upper portion or a lower portion of the heat source part.

9. The laser projection device of claim 1, wherein the junction of the heat pipe and the sealed enclosure comprises a sealant or a sealing ring.