CN105648484A - Preparation method of double-gradient copper alloy material - Google Patents
Preparation method of double-gradient copper alloy material Download PDFInfo
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- CN105648484A CN105648484A CN201610021601.XA CN201610021601A CN105648484A CN 105648484 A CN105648484 A CN 105648484A CN 201610021601 A CN201610021601 A CN 201610021601A CN 105648484 A CN105648484 A CN 105648484A
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- 239000000956 alloy Substances 0.000 title claims abstract description 18
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000009713 electroplating Methods 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 9
- 239000010955 niobium Substances 0.000 claims abstract description 9
- 238000000137 annealing Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 238000002474 experimental method Methods 0.000 claims description 12
- 239000010959 steel Substances 0.000 claims description 12
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 12
- 150000002500 ions Chemical class 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 7
- 108010010803 Gelatin Proteins 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000003792 electrolyte Substances 0.000 claims description 6
- 229920000159 gelatin Polymers 0.000 claims description 6
- 239000008273 gelatin Substances 0.000 claims description 6
- 235000019322 gelatine Nutrition 0.000 claims description 6
- 235000011852 gelatine desserts Nutrition 0.000 claims description 6
- 235000011149 sulphuric acid Nutrition 0.000 claims description 6
- 239000001117 sulphuric acid Substances 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 238000002347 injection Methods 0.000 abstract description 2
- 239000007924 injection Substances 0.000 abstract description 2
- 229910001297 Zn alloy Inorganic materials 0.000 abstract 4
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 abstract 4
- 238000003754 machining Methods 0.000 abstract 1
- 238000004321 preservation Methods 0.000 abstract 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000003513 alkali Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 238000005554 pickling Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000007709 nanocrystallization Methods 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002929 anti-fatigue Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a preparation method of a double-gradient copper alloy material and belongs to the technical field of material machining. The preparation method comprises the steps that a copper-zinc alloy sheet is subjected to annealing and heat preservation for 1-2 hours at the temperature of 350-400 DEG C, and mechanical lapping is conducted on the surface of the copper-zinc alloy sheet for 5-30 minutes under the vacuum condition or the low-temperature condition; after the copper-zinc alloy sheet subjected to surface mechanical lapping is cleaned, double-anode electroplating is conducted; and finally, pure niobium is injected into the surface of a coating of the prepared double-gradient copper alloy through a high-energy ion injection method. According to the copper-zinc alloy sheet prepared through the preparation method, the highest yield strength can reach 371 MPa and is improved by 139 Mpa compared with an annealing state; meanwhile, good plasticity is maintained, and the uniform elongation reaches 18.2%. The high-strength and high-plasticity double-gradient copper alloy material prepared through the preparation method has wide application prospects in the mechanical field, the electronic field and the aviation field.
Description
Technical field
The present invention relates to a kind of double-deck gradient copper alloy material preparation method for material, belong to materials processing technology field.
Background technology
Copper and copper alloy are to live closely-related non-ferrous metal with people, there is the advantages such as good electric conductivity, heat conductivity, workability, extensibility because of it and be widely used in electrically, electronics, traffic, machine-building, building, the field such as space flight. Power transmission, motor manufacturing, communication cable, some vacuum device, integrated circuit, automobile, railway etc. all be unable to do without copper and copper alloy products, are only second to aluminum in the consumption of China YouSe metal material.
The intensity of metal material and plasticity generally can not get both, and high intensity often correspond to inductile. Along with being obviously improved of intensity and hardness, metal material work hardening capacity in plastic history fades away, thus causing that plasticity and toughness significantly reduce. When metal material crystallite dimensionDuring less than 100nm, fracture elongation is often less than 7%, and metal material plasticity is low, poor toughness seriously governs its application. Therefore, at present research is to be progressively deep into microstructural research and the exploration of novel deformation mechanism, tries hard to this " inversion " relation solving the strength of materials-plasticity. Gradient Materials effectively solves above-mentioned contradiction, by constructing the multistage of material structure unit (crystallite dimension/lamellar spacing) thus realizing it in space is continuous gradient change. The essence of gradient-structure is grain boundary density graded spatially, is namely exactly that the construction unit of material increases continuously to macro-scale from micro-scale. This feature makes material different structure unit in deformation process mutually coordinated, makes overall performance be optimized.
Material surface method for making Nano refer to by physics or the method for chemistry, or in combination with use, the former coarse-grain crystal grain in refiner material top layer, prepare the top layer with nanostructured, and material internal still keep original structure. The anti-fatigue performance of material, wearability, corrosion resistance can be improved by making Nano surface technology. Common material surface method for making Nano has three kinds: surface deposition or coating, surface self-nanocrystallization and mixing nanorize mode, surface deposition or coating refer to and prepare the granule with nanoscale by methods such as mechanical attrition method, chemical vapor infiltration (PVD), electrolytic depositions, are combined in material surface in some way at the granule these prepared;Material is directly processed by surface self-nanocrystallization by the mode of non-equilibrium process, increases the surface free energy of material so that the coarse-grain grain refinement of surface layer is to Nano grade; Mixing nanorize refers to and surface self-nanocrystallization and surface-coated or deposition technique is combined, first pass through surface self-nanocrystallization and prepare top layer nanostructured, utilizing the means such as chemical treatment to form the solid solution/compound different from matrix composition at material surface, thus reaching to improve further the purpose of material property.
Ormolu sheet material is carried out surface treatment by surface mechanical attrition treatment method by the present invention, and intensity improves, but meanwhile, along with the prolongation of surface mechanical attrition treatment time, can cause that material plasticity reduces, and surface roughness increases. For overcoming this defect, in conjunction with copper facing on electroplating technology ormolu sheet material after treatment, material plasticity can be improved on the one hand, surface roughness can also be improved on the other hand. Additionally, material in use substantially all can require that top layer is hard, core is soft, therefore on copper-plated basis, utilizing the method that energetic ion injects that niobium element is injected into coating surface, improving case hardness, thus improving material entirety serviceability.
Summary of the invention
Present invention aim at providing a kind of double-deck gradient copper alloy material preparation method for material, surface mechanical attrition treatment method is utilized to improve the strength of materials, and the strength of materials and surface roughness is improved in conjunction with electroplating technology, the method injected eventually through energetic ion improves case hardness, thus preparing the double-deck gradient Cu alloy material of excellent combination property, the method for the invention is specifically through following steps:
(1) ormolu sheet material is carried out at 350 ~ 400 DEG C of temperature the annealing of 1 ~ 2 hour;
(2) sheet material under vacuum or cryogenic conditions, step (1) obtained carries out surface mechanical attrition treatment, and the time is 5 ~ 30min;
(3) the ormolu sheet material that step (2) was processed be carried out (successively in acetone soln ultrasonic vibration degrease, wash, alkali cleaning, pickling at 90 ~ 100 DEG C of temperature; Above-mentioned cleaning process is common process of the prior art);
(4) ormolu sheet material cleaned in step (3) carrying out double anode copper facing, plating environment is: temperature of electroplating solution 66 ~ 68 DEG C, and anode is electrolytic copper plate, ormolu sheet material is as negative electrode, ratio of cathodic to anodic area 1:1.5 ~ 2.5, die opening is 80 ~ 100mm, and electric current density is 1 ~ 2, electroplating time is 5 ~ 8h;
(5) to step (4) gained bilayer graded alloy, pure niobium is injected into coating surface by the method injected by energetic ion.
When processing under vacuum environment described in step of the present invention (2), treatment temperature is room temperature; When processing under cryogenic conditions, treatment temperature is liquid nitrogen temperature.
Surface mechanical attrition treatment of the present invention is completed by making Nano surface experimental machine, and experiment parameter is: test frequency 30 ~ 50Hz, steel ball 150 ~ 180, steel ball size 8mm.
In step of the present invention (4), the formula of electrolyte is Cu2+40 ~ 50g/L, sulphuric acid 155 ~ 165g/L, gelatin 30 ~ 35mg/L, thiourea 30 ~ 35mg/L.
Step of the present invention (5) injects the concentration of pure niobium be more than or equal to 99.95%, and experiment parameter is: vacuum��1 �� 10-4, energy 100keV, injects metering 1 �� 10-17~2��10-17ions/cm2��
The present invention and prior art compare and have an advantage in that:
(1) present invention combines traditional electroplating technology, energetic ion injection and surface mechanical attrition treatment, by surface mechanical attrition treatment method refiner material surface layer grain, strength enhancing;Meanwhile, refinement surface layer grain can make volume percentage of GB enlarge markedly, and these crystal boundaries can as the non-ideal channel of atoms permeating so that follow-up plating is easier to make for, and combines also more firm between coating and matrix.
(2) present invention final gained bilayer functionally gradient material (FGM) surfacing, roughness are low, and material surface is hard, core is soft, meets the instructions for use under generic condition.
(3) preparation method of the present invention is simple, and constant product quality, equipment funds input ratio is less, easy to maintenance.
Accompanying drawing explanation
Fig. 1 is the room temperature tensile curve comparison diagram of embodiment 1 ~ 4 and annealed state former state.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further details, but protection scope of the present invention is not limited to described content.
Embodiment 1
(1) ormolu sheet material (mass percent of zinc is 20%, and the mass percent of copper is 80%, and sheet metal thickness is 2 ~ 2.5mm) is carried out at 400 DEG C of temperature the annealing of 2 hours, sheet metal thickness 2.5mm.
(2) under vacuum sheet material in step (1) being carried out surface mechanical attrition treatment, the time is 5min, and experiment parameter is: test frequency 30Hz, steel ball 150, steel ball size 8mm.
(3) to step (2) gained ormolu sheet material successively in acetone soln ultrasonic vibration degrease, wash, alkali cleaning, pickling at 90 DEG C of temperature.
(4) ormolu sheet material cleaned in step (3) is carried out double anode copper facing. Plating environment is: temperature of electroplating solution 66 DEG C, anode is electrolytic copper plate, and ormolu sheet material is as negative electrode ratio of cathodic to anodic area 1:1.5, and die opening is 100mm, and electric current density is 1, electroplating time is 5h; The formula of electrolyte is Cu2+40g/L, sulphuric acid 165g/L, gelatin 30mg/L, thiourea 30mg/L.
(5) to step (4) gained bilayer graded alloy, pure niobium is injected into coating surface by the method injected by energetic ion, and experiment parameter is: vacuum��1 �� 10-4, energy 100keV, injects metering 1 �� 10-17ions/cm2��
The present embodiment prepares gained bilayer gradient ormolu sheet material yield strength 308MPa, tensile strength 366MPa, uniform elongation 26.1%. Compared with annealed state, yield strength promotes 76MPa, and keeps good plasticity.
Embodiment 2
(1) ormolu sheet material (mass percent of zinc is 20%, and the mass percent of copper is 80%) is carried out at 380 DEG C of temperature the annealing of 1.7 hours, sheet metal thickness 2.3mm.
(2) under cryogenic sheet material in step (1) being carried out surface mechanical attrition treatment, the time is 10min, and experiment parameter is: test frequency 35Hz, steel ball 160, steel ball size 8mm.
(3) to step (2) gained ormolu sheet material successively in acetone soln ultrasonic vibration degrease, wash, alkali cleaning, pickling at 95 DEG C of temperature.
(4) ormolu sheet material cleaned in step (3) is carried out double anode copper facing. Plating environment is: temperature of electroplating solution 67 DEG C, anode is electrolytic copper plate, and ormolu sheet material is as negative electrode ratio of cathodic to anodic area 1:1.8, and die opening is 95mm, and electric current density is 1.5, electroplating time is 6h; The formula of electrolyte is Cu2+43g/L, sulphuric acid 160g/L, gelatin 32mg/L, thiourea 34mg/L.
(5) to step (4) gained bilayer graded alloy, pure niobium is injected into coating surface by the method injected by energetic ion, and experiment parameter is: vacuum��1 �� 10-4, energy 100keV, injects metering 1.4 �� 10-17ions/cm2��
The present embodiment prepares gained bilayer gradient ormolu sheet material yield strength 335MPa, tensile strength 369MPa, uniform elongation 15.9%.Compared with annealed state, yield strength promotes 103MPa, and keeps good plasticity.
Embodiment 3
(1) ormolu sheet material (mass percent of zinc is 20%, and the mass percent of copper is 80%, and sheet metal thickness is 2 ~ 2.5mm) is carried out at 370 DEG C of temperature the annealing of 1.4 hours, sheet metal thickness 2.2mm.
(2) under vacuum sheet material in step (1) being carried out surface mechanical attrition treatment, the time is 15min, and experiment parameter is: test frequency 40Hz, steel ball 170, steel ball size 8mm.
(3) to step (2) gained ormolu sheet material successively in acetone soln ultrasonic vibration degrease, wash, alkali cleaning, pickling at 97 DEG C of temperature.
(4) ormolu sheet material cleaned in step (3) is carried out double anode copper facing. Plating environment is: temperature of electroplating solution 67 DEG C, anode is electrolytic copper plate, and ormolu sheet material is as negative electrode ratio of cathodic to anodic area 1:2, and die opening is 90mm, and electric current density is 1.7, electroplating time is 7h; The formula of electrolyte is Cu2+46g/L, sulphuric acid 155g/L, gelatin 34mg/L, thiourea 32mg/L.
(5) to step (4) gained bilayer graded alloy, pure niobium is injected into coating surface by the method injected by energetic ion, and experiment parameter is: vacuum��1 �� 10-4, energy 100keV, injects metering 1.6 �� 10-17ions/cm2��
The present embodiment prepares gained bilayer gradient ormolu sheet material yield strength 354MPa, tensile strength 380MPa, uniform elongation 11.7%. Compared with annealed state, yield strength promotes 122MPa, and has considerable plasticity.
Embodiment 4
(1) ormolu sheet material (mass percent of zinc is 20%, and the mass percent of copper is 80%, and sheet metal thickness is 2 ~ 2.5mm) is carried out at 350 DEG C of temperature the annealing of 1 hour, sheet metal thickness 2mm.
(2) under cryogenic sheet material in step (1) being carried out surface mechanical attrition treatment, the time is 30min, and experiment parameter is: test frequency 50Hz, steel ball 180, steel ball size 8mm.
(3) to step (2) gained ormolu sheet material successively in acetone soln ultrasonic vibration degrease, wash, alkali cleaning, pickling at 100 DEG C of temperature.
(4) ormolu sheet material cleaned in step (3) is carried out double anode copper facing. Plating environment is: temperature of electroplating solution 68 DEG C, anode is electrolytic copper plate, and ormolu sheet material is as negative electrode ratio of cathodic to anodic area 1:2.5, and die opening is 80mm, and electric current density is 2, electroplating time is 8h; The formula of electrolyte is Cu2+50g/L, sulphuric acid 145g/L, gelatin 35mg/L, thiourea 35mg/L.
(5) to step (4) gained bilayer graded alloy, pure niobium is injected into coating surface by the method injected by energetic ion, and experiment parameter is: vacuum��1 �� 10-4, energy 100keV, injects metering 2 �� 10-17ions/cm2��
The present embodiment prepares gained bilayer gradient ormolu sheet material yield strength 371MPa, tensile strength 391MPa, uniform elongation 18.2%. Compared with annealed state, yield strength promotes 139MPa, and keeps good plasticity.
Claims (5)
1. a double-deck gradient copper alloy material preparation method for material, it is characterised in that specifically include following steps:
(1) ormolu sheet material is carried out at 350 ~ 400 DEG C of temperature the annealing of 1 ~ 2 hour;
(2) sheet material under vacuum or cryogenic conditions, step (1) obtained carries out surface mechanical attrition treatment, and the time is 5 ~ 30min;
(3) the ormolu sheet material that step (2) was processed is carried out;
(4) ormolu sheet material cleaned in step (3) carrying out double anode copper facing, plating environment is: temperature of electroplating solution 66 ~ 68 DEG C, and anode is electrolytic copper plate, ormolu sheet material is as negative electrode, ratio of cathodic to anodic area 1:1.5 ~ 2.5, die opening is 80 ~ 100mm, and electric current density is 1 ~ 2, electroplating time is 5 ~ 8h;
(5) to step (4) gained bilayer graded alloy, pure niobium is injected into coating surface by the method injected by energetic ion.
2. double-deck gradient copper alloy material preparation method for material according to claim 1, it is characterised in that: when processing under vacuum environment described in step (2), treatment temperature is room temperature; When processing under cryogenic conditions, treatment temperature is liquid nitrogen temperature.
3. double-deck gradient copper alloy material preparation method for material according to claim 1, it is characterised in that: surface mechanical attrition treatment is completed by making Nano surface experimental machine, and experiment parameter is: test frequency 30 ~ 50Hz, steel ball 150 ~ 180, steel ball size 8mm.
4. double-deck gradient copper alloy material preparation method for material according to claim 1, it is characterised in that: in step (4), the formula of electrolyte is Cu2+40 ~ 50g/L, sulphuric acid 155 ~ 165g/L, gelatin 30 ~ 35mg/L, thiourea 30 ~ 35mg/L.
5. double-deck gradient copper alloy material preparation method for material according to claim 1, it is characterised in that: step (5) injects the concentration of pure niobium be more than or equal to 99.95%, and experiment parameter is: vacuum��1 �� 10-4, energy 100keV, injects metering 1 �� 10-17~2��10-17ions/cm2��
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108642539A (en) * | 2018-04-26 | 2018-10-12 | 昆明理工大学 | A kind of preparation method of multilayered and graded structure Cu alloy material |
| CN115537693A (en) * | 2022-10-27 | 2022-12-30 | 昆明理工大学 | Preparation method of copper-zinc alloy with surface double-peak and grain size double-heterostructure |
| CN115627378A (en) * | 2022-10-19 | 2023-01-20 | 昆明理工大学 | Preparation method of Cu-Al-Zn alloy material |
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| CN104342627A (en) * | 2014-09-25 | 2015-02-11 | 昆明理工大学 | Surface strengthening treatment method for pure copper material |
| CN104947013A (en) * | 2015-05-26 | 2015-09-30 | 昆明理工大学 | Preparation method of double-layer gradient ball-milled surface nano copper rod |
| CN105177645A (en) * | 2015-07-27 | 2015-12-23 | 昆明理工大学 | Preparation method of multi-layer composite gradient nano pure copper materials |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH06325710A (en) * | 1993-05-14 | 1994-11-25 | Hitachi Ltd | Microwave ion source and ion implanting device |
| CN104278137A (en) * | 2014-09-25 | 2015-01-14 | 昆明理工大学 | Method for surface nano-crystallization and structure stabilization of metal material |
| CN104342627A (en) * | 2014-09-25 | 2015-02-11 | 昆明理工大学 | Surface strengthening treatment method for pure copper material |
| CN104947013A (en) * | 2015-05-26 | 2015-09-30 | 昆明理工大学 | Preparation method of double-layer gradient ball-milled surface nano copper rod |
| CN105177645A (en) * | 2015-07-27 | 2015-12-23 | 昆明理工大学 | Preparation method of multi-layer composite gradient nano pure copper materials |
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| CN108642539A (en) * | 2018-04-26 | 2018-10-12 | 昆明理工大学 | A kind of preparation method of multilayered and graded structure Cu alloy material |
| CN108642539B (en) * | 2018-04-26 | 2020-05-15 | 昆明理工大学 | Preparation method of multilayer gradient structure copper alloy material |
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| CN115537693A (en) * | 2022-10-27 | 2022-12-30 | 昆明理工大学 | Preparation method of copper-zinc alloy with surface double-peak and grain size double-heterostructure |
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