CN105647435B - A kind of adhesive of IML and the preparation method and application thereof - Google Patents
A kind of adhesive of IML and the preparation method and application thereof Download PDFInfo
- Publication number
- CN105647435B CN105647435B CN201610024356.8A CN201610024356A CN105647435B CN 105647435 B CN105647435 B CN 105647435B CN 201610024356 A CN201610024356 A CN 201610024356A CN 105647435 B CN105647435 B CN 105647435B
- Authority
- CN
- China
- Prior art keywords
- iml
- adhesive
- catalyst
- organic solvent
- acrylic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
- C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J127/04—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C09J127/06—Homopolymers or copolymers of vinyl chloride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
- B29C2045/14245—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity using deforming or preforming means outside the mould cavity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of adhesives of IML and the preparation method and application thereof.The adhesive includes：Acrylic resin 15~25%, vinyl chloride-vinyl acetate resin 15~25%, curing agent 3~5%, catalyst 0.1~0.3%, fumed silica 0.5~1%, organic solvent 50~60%.After the present invention by acrylic resin and vinyl chloride-vinyl acetate resin by being now dissolved in organic solvent, curing agent, catalyst and fumed silica are added, mixing obtains the adhesive of IML.The adhesive has the following advantages that：Heat-resisting quantity is good, humidity resistance is good, environmentally friendly.The adhesive of IML provided by the invention breaks monopolization of the external product to this field, can be widely applied to the bonding between ink sheet and injection molding material.
Description
Technical field
The invention belongs to technical field of chemical adhesive, more particularly to a kind of adhesive of IML and preparation method thereof with
Using.
Background technology
IML (In Mold Label), i.e. in-mode inserts injection molding, be on clear sheet (PET, PC, ABS etc.) according to
It is secondary printing IML ink and IML adhesive, first drying and punch forming after, be embedded in injection mold cavity again mold-closing injection at
Type.The adhesive of IML makes clear sheet, IML ink and plastic rubber material (PC, ABS, PC/ABS, TPU etc.) that can combine closely, oil
Layer of ink pattern is among clear sheet and plastic rubber material base material.Since the wear resistance of sheet surface is good, protective effect is strong, pattern is not
It can disappear due to high-frequency is touched and rubbed, moisture resistance, dust tightness stability are good.Injection-molded finished decorative effect is beautiful, service life
For a long time, and it is applicable in very much the batch production of various plastic material incrustations.
In the prior art, the adhesive of IML is solvent type One-component adhesive.However, in current application process
In have the following problems：First, in high-temperature injection, high temperature plastic cement fluid can impact at elevated pressures adhesive on sheet material and
There is the problems such as poor adhesion or red ink in ink layer；The flexibility of the adhesive of second, IML is poor, temperature tolerance and moisture-proof not
It is enough, easy to produce the bad problem such as discontinuous slight crack, alice；The smell of third, the adhesive of existing IML is very heavy, environment
Load is big, can not only cause damages to the body of construction personnel, but also be easy to cause environmental pollution；The adhesive of 4th, IML
Import is all relied at present, limits the using and promoting at home of IML technologies.
Therefore, above-mentioned insufficient adhesive can be overcome there is an urgent need for a kind of.
Invention content
The primary purpose of the present invention is that the shortcomings that overcoming the prior art and deficiency, provide a kind of adhesive of IML.
Another object of the present invention is to provide the preparation methods of the adhesive of the IML.
It is still another object of the present invention to provide the applications of the adhesive of the IML.
The purpose of the invention is achieved by the following technical solution：A kind of adhesive of IML, including following mass percent
The component of meter：Acrylic resin 15~25%, vinyl chloride-vinyl acetate resin 15~25%, curing agent 3~5%, catalyst 0.1~0.3%, gas
Phase method silica 0.5~1%, organic solvent 50~60%.
The acrylic resin is thermoplastic acrylic resin, and containing certain hydroxyl, hydroxyl value is 10~40mg
KOH/g, acid value 5~15mg KOH/g, glass transition temperature are 60~80 DEG C.The too high then resin of glass transition temperature compared with
Firmly, the flexibility of glue-line can be caused relatively low；The too low then resin of glass transition temperature is softer, can lead to temperature tolerance, the moisture-proof of glue-line
It is poor.
Preferably, the thermoplastic acrylic resin is NeoCrylB-722, NeoCrylB- of Dutch Royal DSM company
723, at least one in NeoCrylB-725, NeoCrylB-734, NeoCrylB-735, NeoCrylB-813 and NeoCrylB-814
Kind.
The vinyl chloride-vinyl acetate resin is ternary chlorine vinegar copolymer resins.
Preferably, the vinyl chloride-vinyl acetate resin is VINNMC AC45, VINNMC AC50, VINNMC of the Germany than Buddhist nun company
At least one of MC42 and VINNMC MC48.
The curing agent is closed isocyanate crosslinker.Closed isocyanate crosslinker refers to can under room temperature
It is coexisted steadily in the long term with the resin containing active group (such as hydroxyl, carboxyl, amido, epoxy group), after solvent volatilization, film passes through
It release-NCO group and can react to form crosslinked friendship with the hydroxyl on molecular resin chain, carboxyl, amino groups after heat treatment
Join agent.
Preferably, the curing agent refer to the Desmodur BL3165 of Bayer Bitterfeld GmbH, Desmodur BL3175,
At least one of Desmodur BL3272 and Desmodur BL4265.
The catalyst is preferably organic tin catalyst, more preferably di lauric dibutyl acid tin, such as U.S.'s gas
The DBTDL-T12 of body company.Catalyst is for being catalyzed reacting for hydroxyl and curing agent in acrylic resin or vinyl chloride-vinyl acetate resin one
As select organic tin reagent, catalyst amount influences the performance of adhesive very big.When catalyst amount exceeds the range, meeting
Lead to the decline of the performances such as caking property, temperature tolerance or the moisture-proof of adhesive.
The fumed silica abbreviation gas silicon, refers to aerosil of the grain size between 7~16nm.Vapor phase method
Silica is the rheological property for adjusting adhesive, is more advantageous to silk-screen printing.
Preferably, the fumed silica refer to German Ying Chuan Degussa companies AEROSOL R805,
At least one of AEROSOL R812, AEROSOL R972 and AEROSOL R974.
The organic solvent is one or both of based organic solvent and organic solvent of ketone.
The based organic solvent be preferably dimethyl succinate, dimethyl glutarate, propylene glycol methyl ether acetate and
At least one of n-butyl acetate.
The organic solvent of ketone is preferably at least one of 3- espeletons and cyclohexanone.
The preparation method of the adhesive of above-mentioned IML, comprises the steps of：
(1) under 60~70 DEG C of condition of heating and stirring, acrylic resin and vinyl chloride-vinyl acetate resin are dissolved in organic solvent；
(2) cooling when acrylic resin and vinyl chloride-vinyl acetate resin are completely dissolved to clear；
(3) curing agent, catalyst and vapor phase method are sequentially added into step (2) finally obtained solution under stirring
Silica is uniformly mixed, obtains the adhesive of IML；
Wherein, the content of each ingredient is as follows by mass percentage：Acrylic resin 15~25%, vinyl chloride-vinyl acetate resin 15~
25%, curing agent 3~5%, catalyst 0.1~0.3%, fumed silica 0.5~1%, organic solvent 50~60%.
Preferably, the rotating speed of the stirring is 600~1000r/min.
The degree of cooling in step (2) is preferably cooled to 20~30 DEG C.
The bonding that the adhesive of the IML can be used between printed ink material and injection molding material.
The adhesive of the IML of the present invention is one-pack type, is stored and easy to use, caking property is strong, temperature tolerance and moisture-proof
It is hot excellent, European Union environmental protection (RoHS) requirement can be reached, can be applied to panel, display screen and control panel, the 3C of household electrical appliance
The fields such as product casing and automotive upholstery.Its specific application process, comprises the steps of：
(A) IML ink is printed on base material, the baking-curing in 90~100 DEG C of baking ovens；
(B) adhesive of the IML, the baking-curing in 90~100 DEG C of baking ovens are printed on ink layer；
(C) punching punching press, shape by die-cutting, then the in-mode inserts high-temperature injection together with injection molding material are molded after solidification is cooling；
IML ink described in step (A) is preferably the IML ink of Guangzhou Huigu Chemical Co., Ltd's production and sales.
Base material described in step (A) is preferably PET film, and more preferably thickness is 125 μm~188 μm of PET film.
The time of baking described in step (A) is preferably 30~40min.
The time of baking described in step (B) is preferably 60~70min.
The temperature of injection molding described in step (C) is preferably 260~270 DEG C.
Injection molding material described in step (C) is preferably high temperature resistant PC plastic, and injection molding is black such as at 260~270 DEG C
Coloured particles shape makrolon.
The present invention compared with the existing technology, has the following advantages and advantageous effect：
(1) heat-resisting quantity of the adhesive of IML provided by the invention is good, will not in 260~270 DEG C of high-temperature injections
There is the problems such as injection-molded finished local bonding difference or red ink.
(2) humidity resistance of the adhesive of IML provided by the invention is good, injection-molded finished in constant temperature constant humidity baking oven (temperature
65 DEG C, humidity 95%) in 48h, the problems such as not will produce disengaging, slight crack, alice.
(3) adhesive of IML provided by the invention is free of benzene,toluene,xylene etc. harmful noxious material,
It is environmentally friendly adhesive the advantages of low environmental load with low smelly environment.
(4) adhesive of IML provided by the invention starts the beginning of domestic technique, and the current country there is no enterprise to slap
The mature technology of the adhesive of production IML is held, the adhesive of the IML on domestic market is all from countries such as Japan, Germany
Import, the adhesive of IML of the invention breaks monopolization of the external product to this field.
Specific implementation mode
With reference to embodiment, the present invention is described in further detail, and embodiments of the present invention are not limited thereto.
Embodiment 1
(1) adhesive A of IML is prepared, each component mass percentage content is as follows：
(2) preparation method of the adhesive A of IML is as follows：
(a) n-butyl acetate and cyclohexanone are uniformly mixed, in heating (60-70 DEG C) and stirring (1000r/min) condition
Under, sequentially add acrylic resin (B-725) and vinyl chloride-vinyl acetate resin (AC45), continue heating and thermal insulation
And stir 3h；
(b) it waits for that resin is completely dissolved to clear, mixed liquor is cooled to room temperature；
(c) when being stirred at room temperature, curing agent is sequentially addedBL3175, the gentle silicon of catalyst DBTDL-T12R805, room temperature are slowly stirred, are uniformly mixed, and obtain the adhesive of IML.
(3) application process of the adhesive A of IML is as follows：
(a) IML ink is printed in PET base material, 30min is toasted in 90~100 DEG C of baking ovens；
(b) adhesive A that this IML is printed on ink layer toasts 60min in 90~100 DEG C of baking ovens；
(c) punching press is punched after cooling, after shape by die-cutting, the injection molding together with PC plastic at 265 DEG C.
Embodiment 2
(1) the adhesive B of IML is prepared, each component mass percentage content is as follows：
(2) preparation method of the adhesive B of IML is as follows：
(a) dimethyl succinate and 3- espeletons are uniformly mixed, in heating (60-70 DEG C) and stirring (1000r/
Min under the conditions of), sequentially add acrylic resin (B-734) and vinyl chloride-vinyl acetate resin (AC50), continue
Heating and thermal insulation simultaneously stirs 3h；
(b) it waits for that resin is completely dissolved to clear, mixed liquor is cooled to room temperature；
(c) when being stirred at room temperature, curing agent is sequentially addedBL3165, the gentle silicon of catalyst DBTDL-T12R812, room temperature are slowly stirred, are uniformly mixed, and obtain the adhesive of IML.
(3) application process of the adhesive B of IML is as follows：
(a) IML ink is printed in PET base material, 30min is toasted in 90~100 DEG C of baking ovens；
(b) the adhesive B that this IML is printed on ink layer, 60min is toasted in 90~100 DEG C of baking ovens；
(c) punching press is punched after cooling, after shape by die-cutting, the injection molding together with PC plastic at 265 DEG C.
Embodiment 3
(1) adhesive C of IML is prepared, each component mass percentage content is as follows：
(2) preparation method of the adhesive C of IML is as follows：
(a) dimethyl glutarate and cyclohexanone are uniformly mixed, in heating (60-70 DEG C) and stirring (1000r/min) item
Under part, sequentially add acrylic resin (B-735) and vinyl chloride-vinyl acetate resin (MC42), continue heating to protect
Temperature simultaneously stirs 3h；
(b) it waits for that resin is completely dissolved to clear, mixed liquor is cooled to room temperature；
(c) when being stirred at room temperature, curing agent is sequentially addedBL3272, the gentle silicon of catalyst DBTDL-T12R972, room temperature are slowly stirred, are uniformly mixed, and obtain the adhesive of IML.
(3) application process of the adhesive C of IML is as follows：
(a) IML ink is printed in PET base material, 30min is toasted in 90~100 DEG C of baking ovens；
(b) adhesive C that this IML is printed on ink layer toasts 60min in 90~100 DEG C of baking ovens；
(c) punching press is punched after cooling, after shape by die-cutting, the injection molding together with PC plastic at 265 DEG C.
Embodiment 4
(1) the adhesive D of IML is prepared, each component mass percentage content is as follows：
(2) preparation method of the adhesive D of IML is as follows：
(a) propylene glycol methyl ether acetate and 3- espeletons are uniformly mixed, in heating (60-70 DEG C) and stirring
Under the conditions of (1000r/min), sequentially add acrylic resin (B-725) and vinyl chloride-vinyl acetate resin (
MC48), continue heating and thermal insulation and stir 3h；
(b) it waits for that resin is completely dissolved to clear, mixed liquor is cooled to room temperature；
(c) when being stirred at room temperature, curing agent is sequentially addedBL4265, the gentle silicon of catalyst DBTDL-T12R974, room temperature are slowly stirred, are uniformly mixed, and obtain the adhesive of IML.
(3) application process of the adhesive D of IML is as follows：
(a) IML ink is printed in PET base material, 30min is toasted in 90~100 DEG C of baking ovens；
(b) the adhesive D that this IML is printed on ink layer, 60min is toasted in 90~100 DEG C of baking ovens；
(c) punching press is punched after cooling, after shape by die-cutting, the injection molding together with PC plastic at 265 DEG C.
Embodiment 5
(1) the adhesive E of IML is prepared, each component mass percentage content is as follows：
(2) preparation method of the adhesive E of IML is as follows：
(a) dimethyl glutarate is sequentially added into propylene under the conditions of heating (60-70 DEG C) and stirring (1000r/min)
Acid resin (B-735) and vinyl chloride-vinyl acetate resin (AC45), continue heating and thermal insulation and stir 3h；
(b) it waits for that resin is completely dissolved to clear, mixed liquor is cooled to room temperature；
(c) when being stirred at room temperature, curing agent is sequentially addedBL3175, the gentle silicon of catalyst DBTDL-T12R812, room temperature are slowly stirred, are uniformly mixed, and obtain the adhesive of IML.
(3) application process of the adhesive E of IML is as follows：
(a) IML ink is printed in PET base material, 30min is toasted in 90~100 DEG C of baking ovens；
(b) the adhesive E that this IML is printed on ink layer, 60min is toasted in 90~100 DEG C of baking ovens；
(c) punching press is punched after cooling, after shape by die-cutting, the injection molding together with PC plastic at 265 DEG C.
1 resin of comparative example and curing agent go beyond the scope
(1) the adhesive F of IML is prepared, each component mass percentage content is as follows：
(2) preparation method of the adhesive F of IML is as follows：
(a) n-butyl acetate and cyclohexanone are uniformly mixed, in heating (60-70 DEG C) and stirring (1000r/min) condition
Under, sequentially add acrylic resin (B-735) and vinyl chloride-vinyl acetate resin (MC48), continue heating and thermal insulation
And stir 3h；
(b) it waits for that resin is completely dissolved to clear, mixed liquor is cooled to room temperature；
(c) when being stirred at room temperature, curing agent is sequentially addedBL3165, catalyst DBTDL-T12 are gentle
SiliconR812, room temperature are slowly stirred, are uniformly mixed, and obtain the adhesive of IML.
(3) application process of the adhesive F of IML is as follows：
(a) IML ink is printed in PET base material, 30min is toasted in 90~100 DEG C of baking ovens；
(b) the adhesive F that this IML is printed on ink layer, 60min is toasted in 90~100 DEG C of baking ovens；
(c) punching press is punched after cooling, after shape by die-cutting, the injection molding together with PC plastic at 265 DEG C.
2 catalyst of comparative example goes beyond the scope
(1) the adhesive G of IML is prepared, each component mass percentage content is as follows：
(2) preparation method of the adhesive G of IML is as follows：
(a) n-butyl acetate and 3- espeletons are uniformly mixed, in heating (60-70 DEG C) and stirring (1000r/min)
Under the conditions of, sequentially add acrylic resin (B-725) and vinyl chloride-vinyl acetate resin (AC45), continue to heat
It keeps the temperature and stirs 3h；
(b) it waits for that resin is completely dissolved to clear, mixed liquor is cooled to room temperature；
(c) when being stirred at room temperature, curing agent is sequentially addedBL3175, catalyst DBTDL-T12 are gentle
SiliconR972, room temperature are slowly stirred, are uniformly mixed, and obtain the adhesive of IML.
(3) application process of the adhesive G of IML is as follows：
(a) IML ink is printed in PET base material, 30min is toasted in 90~100 DEG C of baking ovens；
(b) the adhesive G that this IML is printed on ink layer, 60min is toasted in 90~100 DEG C of baking ovens；
(c) punching press is punched after cooling, after shape by die-cutting, the injection molding together with PC plastic at 265 DEG C.
3 Japanese empire Teikoku adhesives H of comparative example
The application process of Japanese empire Teikoku adhesives H is as follows：
(a) IML ink is printed in PET base material, 30min is toasted in 90~100 DEG C of baking ovens；
(b) the adhesive H that this IML is printed on ink layer, 60min is toasted in 90~100 DEG C of baking ovens；
(c) punching press is punched after cooling, after shape by die-cutting, the injection molding together with PC plastic at 265 DEG C.
The performance indicator of the adhesive of effect example IML
Product testing：The properties of product of the present invention are detected, specific detection content is as follows：
I, detection content：Caking property, heat-resisting quantity, humidity resistance, impact resistance.
II, examination criteria
(1) caking property detects
JIS K5600-5-6：Cross-streak method-after injection molding, with the delineation of lattice device is drawn, uses glass under 265 DEG C of high temperature
Paper self-adhesive tape is removed, and is observed and injection-molded finished is stripped situation；The OK if PET sheet and ink layer can not be removed, if PET sheet or
Ink layer is stripped then NG.
(2) heat-resisting quantity detects
The PET sheet that the adhesive of IML ink and IML will be printed, the injection molding under 265 DEG C of high temperature, observation note
The red ink situation being moulded at the sprue of product, the OK if ink layer intact (not washed open by high temperature PC material), if ink layer is by high temperature
PC material wash then NG open.
(3) humidity resistance detects
GB/T2423.4：It is positioned over 48h in constant temperature constant humidity baking oven (65 DEG C of temperature, humidity 95%) by injection-molded finished, is taken out
Whether have disengaging, alice problem, no disengaging and without alice then OK if observing afterwards around finished product, there is disengaging and alice then NG.
(4) impact resistance detects
JIS K5600-5-3 are fallen the jump bit of 1kg from the height of 1m using Du Pont's shock machine, with a stroke lattice device
Delineation, is removed with cellophane tape, is observed and injection-molded finished is stripped situation；The OK if PET sheet and ink layer can not be removed,
The NG if PET sheet or ink layer are stripped.
III, testing result are as shown in table 1：
Table 1, IML adhesive performance test
| Detection project | Caking property | Heat-resisting quantity | Humidity resistance | Impact resistance |
| Embodiment 1 | OK | OK | OK | OK |
| Embodiment 2 | OK | OK | OK | OK |
| Embodiment 3 | OK | OK | OK | OK |
| Embodiment 4 | OK | OK | OK | OK |
| Embodiment 5 | OK | OK | OK | OK |
| Comparative example 1 | OK | NG | NG | OK |
| Comparative example 2 | NG | NG | NG | NG |
| Comparative example 3 | OK | NG | NG | OK |
By table 1 as it can be seen that the adhesive of IML provided by the invention has good caking property to IML ink and PC plastic
Energy.Compared with comparative example 3 (empire Teikoku adhesive H), the adhesive of IML provided by the invention has better high temperature resistant
Property and humidity resistance.By comparative example 1 and 2 as it can be seen that the dosage of the components such as resin, catalyst, curing agent is more than the numerical value of the present invention
Range can all lead to the degradation of adhesive.
Therefore, the adhesive of IML provided by the invention to IML ink and high temperature PC plastic have good caking property,
Heat-resisting quantity, humidity resistance and impact resistance.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, it is other it is any without departing from the spirit and principles of the present invention made by changes, modifications, substitutions, combinations, simplifications,
Equivalent substitute mode is should be, is included within the scope of the present invention.
Claims (10)
1. a kind of adhesive of IML, it is characterised in that be grouped as by the group of following mass percent meter：Acrylic resin 15~
25%, vinyl chloride-vinyl acetate resin 15~25%, curing agent 3~5%, catalyst 0.1~0.3%, fumed silica 0.5~1%, You Jirong
Agent 50~60%；
The acrylic resin is thermoplastic acrylic resin, and hydroxyl value is 10~40 mg KOH/g, 5~15mg of acid value KOH/
G, glass transition temperature are 60~80 DEG C；
The curing agent is closed isocyanate crosslinker；
The catalyst is organic tin catalyst.
2. the adhesive of IML according to claim 1, it is characterised in that：The organic solvent is based organic solvent
One or both of with organic solvent of ketone.
3. the adhesive of IML according to claim 1, it is characterised in that：The thermoplastic acrylic resin is Holland
At least one of NeoCrylB-725, NeoCrylB-735 and NeoCrylB-813 of Royal DSM company.
4. the adhesive of IML according to claim 2, it is characterised in that：The curing agent refers to Bayer Bitterfeld GmbH
At least one of Desmodur BL3165, Desmodur BL3175, Desmodur BL3272 and Desmodur BL4265.
5. the adhesive of IML according to claim 2, it is characterised in that：
The catalyst is dibutyl tin laurate；
The based organic solvent is dimethyl succinate, dimethyl glutarate, propylene glycol methyl ether acetate and the positive fourth of acetic acid
At least one of ester；
The organic solvent of ketone is at least one of 3- espeletons and cyclohexanone.
6. the adhesive of IML according to claim 1, it is characterised in that：The vinyl chloride-vinyl acetate resin is Germany than Buddhist nun company
At least one of VINNMCAC45, VINNMCAC50, VINNMCMC42 and VINNMC MC48.
7. the adhesive of IML according to claim 1, it is characterised in that：The fumed silica is grain size 7
Aerosil between~16nm.
8. the preparation method of the adhesive of any one of claim 1~7 IML, it is characterised in that comprise the steps of：
（1）Under 60~70 DEG C of condition of heating and stirring, acrylic resin and vinyl chloride-vinyl acetate resin are dissolved in organic solvent；
（2）It is cooling when acrylic resin and vinyl chloride-vinyl acetate resin are completely dissolved to clear；
（3）Toward step under stirring（2）Curing agent, catalyst and vapor phase method dioxy are sequentially added in finally obtained solution
SiClx is uniformly mixed, obtains the adhesive of IML；
Wherein, the content of each ingredient is as follows by mass percentage：Acrylic resin 15~25%, is consolidated vinyl chloride-vinyl acetate resin 15~25%
Agent 3~5%, catalyst 0.1~0.3%, fumed silica 0.5~1%, organic solvent 50~60%.
9. the application of the adhesive of any one of claim 1~7 IML, it is characterised in that：The bonding of the IML
Agent bonded between printed ink material and injection molding material in application.
10. the application of the adhesive of IML according to claim 9, it is characterised in that comprise the steps of：
（A）IML ink is printed on base material, the baking-curing in 90~100 DEG C of baking ovens；
（B）The adhesive of the IML, the baking-curing in 90~100 DEG C of baking ovens are printed on ink layer；
（C）Punching punching press, shape by die-cutting, then the in-mode inserts high-temperature injection together with injection molding material are molded after solidification is cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610024356.8A CN105647435B (en) | 2016-01-13 | 2016-01-13 | A kind of adhesive of IML and the preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610024356.8A CN105647435B (en) | 2016-01-13 | 2016-01-13 | A kind of adhesive of IML and the preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105647435A CN105647435A (en) | 2016-06-08 |
| CN105647435B true CN105647435B (en) | 2018-08-28 |
Family
ID=56487482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610024356.8A Active CN105647435B (en) | 2016-01-13 | 2016-01-13 | A kind of adhesive of IML and the preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105647435B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107011829A (en) * | 2017-02-08 | 2017-08-04 | 滁州金桥德克新材料有限公司 | Automobile instrument panel is with resistant to elevated temperatures IMD glue |
| CN110938381A (en) * | 2018-09-25 | 2020-03-31 | 重庆利尔达科技开发有限公司 | Environment-friendly laminated adhesive and preparation method thereof |
| CN109517542A (en) * | 2018-11-13 | 2019-03-26 | 香洋新材料（江苏）有限公司 | A kind of transfer film high grade of transparency ABS glue and preparation method thereof |
| CN109575682A (en) * | 2018-12-28 | 2019-04-05 | 张展清 | A kind of IML ink of resistance to red ink and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101255324B (en) * | 2007-02-26 | 2010-05-19 | 北京高盟化工有限公司 | Trans-printing composition and preparation method thereof |
| CN102673287A (en) * | 2012-05-14 | 2012-09-19 | 保定乐凯新材料股份有限公司 | Non-halogen transfer type decoration film used for plastic surface decoration |
| CN104029448B (en) * | 2014-05-30 | 2016-06-29 | 浙江永成印务有限公司 | The transfer film of glass or the transfer of the transparent film back side and production application process thereof |
| CN104827725B (en) * | 2015-04-29 | 2016-10-05 | 江苏欧邦涂装技术有限公司 | A kind of chromatic metallic composite plate and preparation technology |
-
2016
- 2016-01-13 CN CN201610024356.8A patent/CN105647435B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105647435A (en) | 2016-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105647435B (en) | A kind of adhesive of IML and the preparation method and application thereof | |
| CN101864259B (en) | SIS (Styrene-Isoprene-Styrene) hot melt adhesive for car light adhesion and preparation method thereof | |
| CN107286897A (en) | A kind of Single-component low-viscosity dealcoholized type organic silicon potting adhesive and preparation method thereof | |
| CN106085309B (en) | Automobile floor leather melt pressure sensitive glue composition and preparation method thereof | |
| CN102618211A (en) | Hot melt adhesive used for automotive interiors, and preparation method of hot melt adhesive | |
| CN102732209B (en) | High-temperature-resistant flexible adhesive cured at normal temperature and preparation method thereof | |
| CN104449533A (en) | Reactive polyurethane hot melt adhesive for electronic appliance and preparing method thereof | |
| CN102504755B (en) | Epoxy resin modified two-component silicone rubber adhesive | |
| CN110003828A (en) | Hot-fusible pressure-sensitive adhesive and preparation method thereof | |
| JP2009155447A (en) | Polybutylene terephthalate resin composition | |
| CN108384507A (en) | A kind of UV optic-solidified adhesives and preparation method thereof that adhesive strength is high | |
| CN104789185B (en) | A kind of High temperature-resistanadhesive adhesive tape and its high-temperature resistance adhesive for using | |
| CN103820038A (en) | Optical liquid adhesive with high weather resistance and preparation method thereof | |
| CN103320067A (en) | Rapid bonding hot-melt pressure-sensitive adhesive for expressing waterproof bag and preparation method of rapid bonding hot-melt pressure-sensitive adhesive | |
| CN113637446B (en) | High-strength silane modified polyether adhesive and preparation method thereof | |
| CN107603537A (en) | Thermotropic pressure sensitive glue and preparation method thereof | |
| CN110982448B (en) | Tackifier, dealcoholized RTV (room temperature vulcanized) silicone rubber and preparation method thereof | |
| CN112029381B (en) | Insulating powder with good flexibility and mechanical impact resistance, preparation method and application method | |
| CN102532910B (en) | Double-component room-temperature vulcanized silicon rubber having adhesiveness and acidosis resistance and preparation method | |
| CN105111990B (en) | A kind of preparation method of modified poly ester PUR and its glued membrane | |
| CN112980381A (en) | High-temperature-resistant water-based environment-friendly adhesive and preparation method thereof | |
| CN113025265A (en) | Preparation method of solvent type organic silicon glue for manufacturing optical transparent adhesive film | |
| CN102477263B (en) | Composition for anisotropy conducting film, anisotropy conducting film, and semiconductor device | |
| CN104262587A (en) | Epoxy resin curing agent and epoxy resin material | |
| CN108276776B (en) | Reproduction method of recycled silicone rubber |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200326 Address after: No.1 Chuangye Avenue, Qingyuan overseas Chinese Industrial Park, Yingde Donghua Town, Qingyuan City, Guangdong Province Patentee after: QINGYUAN HUIGU NEW MATERIAL TECHNOLOGY Co.,Ltd. Address before: 511365 Guangdong city of Guangzhou Province in the new town of Zengcheng Heng Industrial Park Patentee before: GUANGZHOU HUMAN ENGINEERING MATERIAL Co.,Ltd. |