CN105637626A

CN105637626A - Apparatus and method for bonding a plurality of semiconductor chips onto a substrate

Info

Publication number: CN105637626A
Application number: CN201480056667.1A
Authority: CN
Inventors: 阿穆兰·森; 吉米·辉星·周; 雷蒙德·少雄·林
Original assignee: Orion Systems Integration Pte Ltd
Current assignee: Orion Systems Integration Pte Ltd
Priority date: 2013-08-14
Filing date: 2014-08-14
Publication date: 2016-06-01
Also published as: WO2015023232A1; TW201515160A

Abstract

An apparatus and a method for bonding semiconductor a plurality of semiconductor chips to a substrate are provided. The apparatus comprises a frame; a plurality of bond heads coupled to the frame, each bond head being operable to obtain and release a chip; and a bond stage coupled to the frame and operable to receive a substrate; each bond head of the plurality of bond heads being relatively moveable with respect to the bond stage and operable to contact a chip obtained by the bond head with a substrate received on the bond stage and to release the chip to bond the chip to the substrate.

Description

For multiple semiconductor chips being combined the apparatus and method on substrate

Technical field

Each embodiment relate to be bonded to semiconductor chip junction the device of substrate and on substrate in conjunction with the method for multiple semiconductor chips.

Background

Many electronic installations include the electronic circuit controlled in the way of electronic device functions. Electronic circuit can include one or more semiconductor chip and be combined in the substrate above it.

Process in conjunction with semiconductor chip can include using intermediate materials, is such as such as attached to the solder on substrate. It addition, intermediate materials can be conduction, in order to the signal of telecommunication can march to chip from substrate. Substrate can include between the different parts of substrate and combine to the one or more conductor rails transmitting the signal of telecommunication between the different semiconductor chips of substrate.

The process that semiconductor chip junction is bonded to substrate can include making semiconductor chip contact substrate and applying pressure and/or heat.

In the past few decades, there is the driving of continuous miniaturization electronic installation always. This produces less semiconductor chip is combined the demand to substrate then. Along with becoming smaller in size of semiconductor chip, its connection with substrate also becomes less. Therefore, semiconductor chip should be positioned accurately on substrate by cohesive process. If substrate and semiconductor chip misalignment, then semiconductor chip is likely to lose efficacy or not exclusively worked. Therefore, it is necessary to exploitation for being accurately directed at substrate and combining to substrate to the device in conjunction with semiconductor chip by semiconductor chip.

There is also minimizing and spend the driving in the time that semiconductor chip junction is bonded to substrate. By reducing this time, the total time that minimizing manufacture electronic installation is spent is possible. Then can manufacturing more electronic installation within the identical time period, this is substantially favourable for large-scale production and application. Therefore, it is necessary to exploitation for being bound effectively to substrate to the device in conjunction with semiconductor chip by semiconductor chip.

General introduction

According to aspects of the present invention, it is provided that for semiconductor chip junction is bonded to the device of substrate, described device includes:

Framework;

Being coupled to multiple joint heads of described framework, each joint head may operate to obtain and release chip; And

Be coupled to described framework and may operate to receive substrate in conjunction with platform;

Each joint head in the plurality of joint head can make the chip obtained by joint head contact in conjunction with the substrate received on platform with described and discharge described chip so that described chip to combine extremely described substrate relative to described in conjunction with platform relative motion may operate to.

At least two joint head in the plurality of joint head may operate to make the chip obtained by least two joint head move in conjunction with platform relative to described as one.

Described at least two joint head may operate to make the chip obtained by least two joint head as one be parallel to described in conjunction with the plane of the plane of platform in motion.

Described at least two joint head may operate to make the chip obtained by least two joint head to move in conjunction with platform in conjunction with platform or away from described towards described as one.

A joint head in the plurality of joint head may operate to make the chip obtained by one joint head relative to the chip relative motion obtained by another joint head in the plurality of joint head.

One joint head may operate to make the chip obtained by one joint head independent of the chip obtained by another joint head be parallel to described in conjunction with the plane of the plane of platform in motion.

One joint head may operate to make the chip obtained by one joint head to move in conjunction with platform in conjunction with platform or away from described towards described independent of the chip obtained by another joint head.

The plurality of joint head can be removably coupled to described framework, and described joint head can linear arrangement, and adjoin to joint head between spacing can be adjustable.

The plurality of joint head can be coupled to described framework via guide rail, and each joint head can may operate to described slide on rails with regulate adjoin to joint head between spacing.

The length of described guide rail can be dimensioned, make when at least one joint head described slides to the end of described guide rail, at least one joint head described and described restricted in conjunction with the relative motion between platform so that at least one joint head described can not make the chip contact substrate obtained by least one joint head described.

Described guide rail can be removably coupled to described framework and described guide rail can include may operate to make described guide rail move in conjunction with platform to described or move so that multiple joint head moves or away from the described driving mechanism in conjunction with platform motion in conjunction with platform to described in conjunction with platform away from described.

Described framework can include the first platform and the second relative platform, described first platform is separated by least one pillar and described second platform and is remained parallel to described second platform, and the plurality of joint head is coupled to the first platform and described is coupled to the second platform in conjunction with platform.

Described can being removably coupled to the second platform in conjunction with platform, and described can include driving mechanism in conjunction with platform, described driving mechanism may operate to move in the plane being parallel to the second platform in conjunction with platform.

Described device may also include the feeder being removably coupled to described framework, described feeder includes the driving mechanism that may operate to make described feeder move between loading position and feed position, wherein, at described loading position, described feeder is configured to receive chip, in described feed position, described feeder is configured to present chip in multiple joint heads, in order to one joint head can obtain chip from described feeder.

Described feeder can may operate to receive at least two chip and present each chip to the different joint heads in multiple joint heads.

Described device may also include load maintainer, and when described feeder is in loading position, load maintainer may operate to be loaded into described feeder chip from wafer.

Described device may also include the photographic head being removably coupled to described framework, described photographic head includes driving mechanism, it may operate to make photographic head relative to multiple joint heads with in conjunction with platform motion, described photographic head is configurable for measuring at least one joint head relative to the described position in conjunction with platform, wherein, move with aligned with each other at least one joint head described and the position that may operate to according to photographic head is surveyed in conjunction with platform.

Described photographic head can be configured at least one joint head described and described in conjunction with motion between platform, described photographic head has for measuring at least one joint head described first lens relative to the position of benchmark, and for measuring described the second lens in conjunction with platform relative to the position of benchmark, wherein, at least one joint head described and described in conjunction with platform be configured to according to by first and second lens measure position move with aligned with each other.

At least one joint head in the plurality of joint head may operate to the chip that heating is obtained by least one joint head.

When described chip contacts with substrate, at least one joint head in the plurality of joint head may operate to apply predetermined pressure to described chip.

At least one joint head in the plurality of joint head can include pumping equipment, wherein, when chip presents at least one joint head described, described pumping equipment is configured to be drawn onto by described chip at least one joint head described and keep suction so that described chip is maintained at least one joint head described, and wherein, described pumping equipment is configured to release suction to be discharged from least one joint head described by described chip.

Described device may also include and the described controller communicated in conjunction with each joint head in platform and the plurality of joint head, described controller may operate to control each joint head with relative to described in conjunction with platform relative motion, with the chip obtaining chip and release obtains.

Described device may also include other framework, be coupled to other multiple joint heads of described other framework, be coupled to the other in conjunction with platform and the other feeder being removably coupled to described other framework of described other framework,

Wherein, each joint head in described other multiple joint heads relative to described other can be movable relatively in conjunction with platform and may operate to make the chip obtained by described joint head with in described other contact in conjunction with the other substrate received on platform and discharge described chip described chip to be combined extremely described other substrate

Wherein, described other feeder includes the driving mechanism that may operate to make described other feeder move between loading position and feed position, wherein, at described loading position, described other feeder is configured to receive chip, and in described feed position, described other feeder is configured to present chip in described other multiple joint heads, so that one joint head can obtain chip from described other feeder, and

Wherein, when described feeder is in loading position, described load maintainer may operate to be loaded into by chip on described feeder to present to the joint head of the plurality of joint head, and when described other feeder is in loading position, described load maintainer may operate to the joint head being loaded into by chip on described other feeder for presenting to described other multiple joint heads.

According to the second aspect of the invention, it is provided that for multiple semiconductor chip junctions are bonded to the method on substrate, described method includes:

A. substrate is received in conjunction with on platform;

B. the first chip is obtained by the first joint head;

C. make the first joint head and described move relative to each other in conjunction with platform, with by the first chip on described first joint head with described in conjunction with the base plate alignment on platform;

D. the second chip is obtained by the second joint head;

E. make the first joint head move in conjunction with platform towards described, so that the first chip contacts described substrate and discharges the first chip so that the first chip combines to described substrate, and make the first joint head bounce back in conjunction with platform from described;

F. make the second joint head and described move relative to each other in conjunction with platform, with by the second chip on described second joint head with described in conjunction with the base plate alignment on platform; And

G. make the second joint head move in conjunction with platform towards described, so that the second chip contacts described substrate and discharges the second chip so that the second chip combines to described substrate, and make the second joint head bounce back in conjunction with platform from described.

Described method may also include that

The first joint head from described in conjunction with platform bounce back after, by first joint head obtain the 3rd chip, and

The second joint head from described in conjunction with platform bounce back after, by second joint head obtain fourth chip.

Described method may also include that

Before by the first chip release on the substrate, heat the first chip on the first joint head; And

Before by the second chip release on the substrate, heat the second chip on the second joint head.

Described method may also include that

After by the first chip release on the substrate, the first joint head is delayed to obtain the 3rd chip to allow the first joint head cooling; And

After by the second chip release on the substrate, the second joint head is delayed to obtain fourth chip to allow the second joint head cooling.

Accompanying drawing explanation

By following merely illustrative example of written description, and in conjunction with accompanying drawing, embodiments of the invention are best understood from for the ordinary skill in the art and are that it will be evident that wherein identical reference number refers to identical parts, wherein:

Fig. 1 is the perspective view according to the embodiment device for combining;

Fig. 2 is the front view of the joint head according to embodiment;

Fig. 3 is the front view of the parts of the device of the combination for Fig. 1;

Fig. 4 is the further perspective view of the device of the combination for Fig. 1;

Fig. 5 a and 5b is the front view of the device for combining according to two different embodiments;

Fig. 6 is the perspective view according to the embodiment device for combining;

Fig. 7 is the perspective view according to the embodiment device for combining;

Fig. 8 is the perspective view according to the embodiment device for combining;

Fig. 9 a is the front view according to the embodiment part of device for combining, and Fig. 9 b is the front view in conjunction with group of the device of Fig. 9 a, and Fig. 9 c is the described bottom view in conjunction with group;

Figure 10 a is the front view of the joint head of the device of the combination for Fig. 9 a, and Figure 10 b is the side view of joint head, and Fig. 9 c is the bottom view of described joint head;

Figure 11 a is the front view in conjunction with group of the device of the combination in constructing first for Fig. 9 a, and Fig. 9 b is the front view in conjunction with group in the second structure;

Figure 12 is the plane graph according to the embodiment device for combining;

Figure 13 is the flow chart according to the embodiment method for combining;

Figure 14 a-g is when running the method for combination to perform Figure 13, is used for the plane graph of the parts of the device combined according to embodiment;

Figure 15 a-d is the plane graph according to the embodiment parts of device for combining;

Figure 16 is the flow chart according to the embodiment method for combining.

Figure 17 a-c is when running the method for combination to perform Figure 16, is used for the plane graph of the parts of the device combined according to embodiment;

Figure 18 is the plane graph of the operation of the visual system according to embodiment; And

Figure 19 is the flow chart according to the embodiment method for combining.

Detailed description

Each embodiment relate to be bonded to semiconductor chip junction the device of substrate and on substrate in conjunction with the method for multiple semiconductor chips. In one embodiment, semiconductor chip can be described as chip or tube core.

Fig. 1 illustrates according to embodiment for semiconductor chip junction is bonded to the device 2 of substrate. Device 2 includes two basic change head 4,6, in conjunction with platform 8 and framework 10. Joint head 4,6 is coupled to framework 10. It is coupled to framework 10 in conjunction with platform 8. Should be appreciated that two basic change head 4,6 represents multiple joint heads. In use, each joint head 4,6 may operate to obtain and release semiconductor chip, and may operate to receive substrate in conjunction with platform 8. It addition, each joint head 4,6 can make the chip obtained by joint head 4,6 relative in conjunction with platform 8 relative motion may operate to and contact in conjunction with the substrate received on platform 8 and discharging described chip with by described chip combination extremely described substrate. In one embodiment, the plurality of joint head relative to moving in conjunction with platform 8 and/or can move relative to multiple joint heads in conjunction with platform 8.

Details and the work thereof of device 2 is further described below with reference to the specific embodiment of Fig. 1. It is non-existent for should be appreciated that at least some of these further detail below is likely in some other embodiments.

As can be more specifically found out in FIG, what framework 10 supported device 2 includes joint head 4,6 and the various parts in conjunction with platform 8. Framework 10 includes relatively low platform 10b, higher platform 10a and two pillar 10c and 10d. Upper mounting plate 10a is maintained at above lower platform 10b and separates with lower platform 10b by pillar 10c and 10d. Precise distance between described upper mounting plate and lower platform can change between different embodiments. Upper mounting plate 10a remains substantially parallel to lower platform 10b. It is stable that different parts for guaranteeing device 2 are in operation, and framework 10 can be made up of rigid material such as such as metal.

In one embodiment, it is coupled to lower platform 10b in conjunction with platform 8 by X-Y alignment system (that is, driving mechanism). Specifically, it is configured to move on lower platform 10b and in plane in parallel by X-Y alignment system in conjunction with platform 8. X-Y alignment system includes sliver 12, and this sliver 12 has two guide rail 14a and the 14b being positioned on. In conjunction with being configured with guide rail 14a and the 14b collaborative groove (not shown) slided wherein below platform 8. Therefore, can be configured to slidably reciprocate along sliver 12 in conjunction with platform 8. Device 2 may also include the driving mechanism making to move on sliver 12 in conjunction with platform 8, such as motor. Should be appreciated that in conjunction with contrary with the face in conjunction with platform 8 being configured to receive described substrate below platform 8.

It addition, lower platform 10b includes two guide rail 16a and 16b. Guide rail 16a and the 16b collaborative groove (not shown) slided wherein it is configured with below sliver 12. Therefore, sliver 12 is configured to slidably reciprocate on lower platform 10b. Device 2 may also include the driving mechanism making to move on lower platform 10b on sliver 12, such as motor. Should be appreciated that below sliver 12 contrary with the face being configured to receive the sliver 12 in conjunction with platform 8. It is also understood that the motion that slidably reciprocates in conjunction with platform 8 is substantially perpendicular to the motion that slidably reciprocates of sliver 12 so that can move at X and/or Y-direction relative to lower platform 10b in conjunction with platform 8. Described X and Y-direction are represented by corresponding arrow in FIG.

Device 2 can include the controller (not shown) with X-Y positioning system communication. In use, controller can with X-Y alignment system switching telecommunication number, in order to control with X-Y positioning system communication and to it. Such as, controller can control the X in conjunction with platform 8 and Y motion. In one embodiment, controller can send instruction to X-Y alignment system, and how described designated command X-Y alignment system is run. X-Y alignment system can send feedback data to controller, to help controller to control the operation of X-Y alignment system.

Joint head 4 and 6 is coupled to upper mounting plate 10a. Joint head 4 and 6 can be identical.

The structure of joint head 201 is described below according to the embodiment of Fig. 2. Should be appreciated that in one embodiment, joint head 4 is identical with the joint head 201 of 6 Yu Fig. 2.

In one embodiment, joint head 201 may operate to obtain and release chip (not shown). Such as, described chip can with in conjunction with on platform 8 receive substrate contacting and be released on described substrate. Joint head 201 includes in conjunction with actuator 204, and it is coupled to the end face of upper mounting plate 10a. Drive axle 208 be coupled in joint head 201 in conjunction with between actuator 204 and board 210. Drive axle 208 by the bore hole (not shown) location in upper mounting plate 10a and can slide in described bore hole. Board 210 is coupled to upper mounting plate 10a also by least two of coupling apparatus 201 in conjunction with sliding guide piece 206a and 206b motion. Each slide in by the corresponding bore hole (not shown) of upper mounting plate 10a in conjunction with sliding guide piece 206a, 206b. Formed for controlling joint head 201 relative to the system moved both vertically in conjunction with platform 8 and upper mounting plate 10a in conjunction with actuator 204 with in conjunction with sliding guide piece 206a and 206b. Specifically, can extend vertically in conjunction with actuator 204 or bounce back drives axle 208, so that board 210 to upper mounting plate 10a motion or moves away from upper mounting plate 10a. The joint head 201 stability when moving both vertically and alignment is guaranteed in conjunction with sliding guide piece 206a and 206b.

In one embodiment, horizontal movement plate 212 may be coupled to below board 210. In one embodiment, horizontal movement plate 212 is configured to slide in the X-direction level across board 210. This direction of motion is represented by the arrow of X labelling in fig. 2. It addition, horizontal movement plate 212 is configured to slide in the Y-direction level across board 210. Considering Fig. 2, this direction of motion will removal and the immigration page. Should be appreciated that below board 210 contrary with the face of the board 210 towards upper mounting plate 10a. Joint head 201 may also include the driving mechanism making horizontal movement plate 212 move, such as motor relative to board 210.

In one embodiment, angular movement plate 214 can be coupled to below horizontal movement plate 212 via connecting plate 216. Connecting plate 216 is configured to move with horizontal movement plate 212 level (in X and/or Y-direction). Angular movement plate 214 is configured to rotate relative to connecting plate 216. Joint head 201 may also include the driving mechanism making angular movement plate 214 rotate, such as motor relative to connecting plate 216. It is to be understood that, the lower component of angular movement (also referred to as rotational motion or the motion of �� direction) permission joint head 201 is (namely, angular movement plate 214 and below) around the axle Z of joint head 201 relative to upper-part (that is, the connecting plate 216 and above) rotation of joint head 201. This axis represents in fig. 2 by being labeled as the dotted line of Z. In another embodiment, connecting plate 216 can omit, and angular movement plate 214 is configured to rotate relative to horizontal movement plate 212.

In one embodiment, the chip obtained by described joint head below angular movement plate 214 is may be coupled to allow joint head 201 to heat in conjunction with heater 220. The top of joint head 201 is provided by the combination tool 218 being coupled to below in conjunction with heater 220. Joint head 201 may be configured with permission combination tool 218 and obtains and discharge the vacuum equipment of chip, such as pumping equipment. In another embodiment, can be arranged to obtain and discharge the machinery such as clamping device of chip. Such as, described pumping equipment can be configurable for being drawn into being located just at joint head 201 chip below on combination tool 218 and keeping suction to be held in place by described chip. Described pumping equipment can be configured to disable to discharge described chip from combination tool 218. Should be appreciated that and can heat, in conjunction with heater 220, the chip obtained by combination tool 218. In another embodiment, board (not shown) can be included in conjunction with between heater 220 and angular movement plate 214.

Should be appreciated that combination tool 218 can move both vertically (that is, Z-direction) by conjunction with actuator 204 and driving axle 208 relative to upper mounting plate 10a. And, combination tool 218 can by horizontal movement plate 212 relative to upper mounting plate 10a horizontal movement (that is, X and Y-direction). And, combination tool 218 can rotate (that is, �� direction) by angular movement plate 214 relative to upper mounting plate 10a. And, the motion relative to upper mounting plate 10a is also translatable to the other side relative to framework 10 and/or the motion in conjunction with platform 8.

Should be appreciated that the joint head 201 of Fig. 2 can be fixing joint head, because it is fixed to the upper mounting plate 10a of framework 10. Specifically, combination tool 218 possibility of joint head 201 can be moved in vertical, level and �� direction relative to upper mounting plate 10a via board 210, horizontal movement plate 212 and angular movement plate 214. But, joint head 201 in conjunction with actuator 204 and can not move relative to upper mounting plate 10a in conjunction with sliding guide piece 206a, 206b, for instance, whole joint head 201 can not move along upper mounting plate 10a slip or towards upper mounting plate 10a or away from upper mounting plate 10a. Therefore, joint head 201 can be fixing joint head.

As it has been described above, device 2 can include controller. Described controller can communicate with joint head 4,6. In use, described controller can with joint head 4,6 switching telecommunication number, in order to communicate with joint head 4,6 and it is controlled. Such as, described controller can control the X of combination tool 218, Y, Z and �� motion. In one embodiment, described controller can send instruction to joint head 4,6, and how described designated command joint head 4,6 runs. Joint head 4,6 can send feedback data to described controller, to help controller to control the operation of joint head 4,6.

Considering the device 2 of Fig. 1, the above-mentioned motion of joint head 4 can perform together with the corresponding motion of joint head 6. Therefore, joint head 4,6 can be made as a whole in X, the motion of Y, Z and �� direction, i.e. they can carry out same movement in the identical time. Addition or alternatively, joint head 4 can independent of joint head 6 in X, the motion of Y, Z and �� direction.

Fig. 3 illustrates the alternative view of some parts of the embodiment of Fig. 1. In the fig. 3 embodiment, joint head 4 and 6 is similar to the joint head 201 of Fig. 2.

In one embodiment, joint head 4 and 6 abuts one another on upper mounting plate 10a and is spaced apart. Adjoin the spacing between joint head 4 and 6 to change between different embodiments. Joint head 4 and 6 is coupled to upper mounting plate 10a so that the corresponding combination tool of joint head 4 and 6 is between upper mounting plate 10a and lower platform 10b. In this arrangement, joint head 4 and 6 accordingly in conjunction with actuator be coupled to upper mounting plate 10a in conjunction with sliding guide piece accordingly. Joint head 4 and 6 combination tool relative to lower platform 10b and be located therein in conjunction with platform (not shown) when level, vertical and angular direction motion, framework 10 provides the support to joint head 4 and 6 and is held in place.

Fig. 4 illustrates the alternative view of some parts of the embodiment of Fig. 1. In the fig. 4 embodiment, joint head 4 and 6 is similar to the joint head 201 of Fig. 2.

In one embodiment, the fixed axis of each joint head 4,6 illustrates respectively through reference line 400a and 400b. The fixed axis of each joint head 4 and 6 can be the axis that the combination tool of corresponding joint head rotates about it. Joint head 4 can separate with joint head 6 so that corresponding fixed axis d separated by a distance. The value of d can change between different embodiments. As described in reference to Figure 2, the combination tool of joint head 4,6 is configured around and carries out angular movement along their corresponding fixed axis 400a and 400b and move both vertically. The angular movement of joint head 4 is illustrated by arrow 402a, and the angular movement of joint head 6 is illustrated by arrow 402b. Moving both vertically of joint head 4 is illustrated by arrow 404a, and moving both vertically of joint head 6 is illustrated by arrow 402b. In one embodiment, joint head 4 can the vertical and/or angular movement independent of joint head 6. Addition or alternatively, joint head 4 can with joint head 6 together as the vertical and/or angular movement of one.

Fig. 5 a and 5b illustrates two devices 500 and 502 according to different embodiments.

In the embodiment considering Fig. 5 a, device 500 is similar to device 2 as shown in Figure 3. But, device 500 only includes the half of device 2. Specifically, the framework of device 500 includes upper mounting plate 10a ' and lower platform 10b '. As it was earlier mentioned, described framework includes the pillar 10d ' that upper mounting plate 10a ' is connected to lower platform 10b '. But, it does not have pillar is arranged on other sides of described upper mounting plate and lower platform (that is, right side). This gives cantilevered or the C-shaped configuration that device 500 discharges other work space. It addition, upper mounting plate 10a ' remains substantially parallel to lower platform 10b ' by pillar 10d '. As it was earlier mentioned, upper mounting plate 10a ' couples it to joint head 4 '.

In the embodiment considering Fig. 5 b, device 502 is similar to the device 500 of device 2 as shown in Figure 3 and Fig. 5 a. Specifically, device 502 includes all features identical with device 500; But, device 502 includes the lower platform 10b from device 2 to replace lower platform 10b '. Additionally, device 502 includes the second upper mounting plate 10a ", it is substantially parallel to the first upper mounting plate 10a ' but is in different planes. Specifically, the second upper mounting plate 10a " than the first upper mounting plate 10a ' closer to lower platform 10b. Device 502 includes the second upper mounting plate 10a " it is connected to the pillar 10c of lower platform 10b ". It addition, the second upper mounting plate 10a " by pillar 10c " remain substantially parallel to lower platform 10b. Second upper mounting plate 10a " couple it to joint head 6 ". In one embodiment, more than one joint head may be coupled to the first and/or second upper mounting plate.

Fig. 6 illustrates according to embodiment for semiconductor chip junction is bonded to the device 600 of substrate (not shown). Device 600 is similar to the device 2 of Fig. 1; But, device 600 includes five joint head 602a-e. Each joint head 602a-e can be identical with the joint head 201 of Fig. 2. Should be appreciated that five joint head 602a-e represent multiple joint head (also referred to as joint head group). Difference between the device 600 of Fig. 6 and the device 2 of Fig. 1 is described below.

In one embodiment, each upper mounting plate 10a being coupled to framework 10 in the way of similar with the joint head 4,6 of Fig. 1 in five joint head 602a-e. But, each joint head 602a-e orientation of Fig. 6 joint head 4,6 somewhat different than Fig. 1. Specifically, in 602a-e each relative to joint head 4,6 rotate about 90 ��. So, joint head 602a-e in conjunction with actuator can located side by side each other, be disposed between in conjunction with sliding guide piece without any. Therefore, adjoin the distance between joint head and can reduce, and joint head 602a-e can closer to being placed together. Such as, this can be clear that by the joint head of the joint head of comparison diagram 6 and Fig. 1. Alternatively, each joint head 602a-e of Fig. 6 can be similar to the joint head 4,6 of Fig. 1 and carrys out orientation. In one embodiment, the fixed axis of joint head 602d and 602e can be close together more closely than the distance d of Fig. 4. In figure 6, adjoin the distance between joint head can change in different embodiments. Additionally, the distance between the different pairs of joint head adjoined in joint head can change in different embodiments. Such as, the distance between joint head 602a and 602b may differ from the distance between joint head 602c and 602d. In another embodiment, it is possible to there is the joint head of the upper mounting plate 10a being coupled to framework 10 more or less than five.

In one embodiment, can be different according to the quantity of joint head in conjunction with the shape of platform 8 and sliver 12. Such as, in the embodiment only having two basic change head 4,6 of Fig. 1, can be opposite, narrow in conjunction with platform 8, because it must across two basic change head 4,6. On the other hand, in the embodiment having five joint head 602a-e of Fig. 6, can be relatively wide in conjunction with platform 8, because it must across five joint head 602a-e. In one embodiment, quantity and the layout of joint head is can be depending in conjunction with the length of platform 8 and/or width. And, the shape of sliver 12 can change according to the shape in conjunction with platform 8. In one embodiment, the length/width of sliver 12 can be proportional to the length/width in conjunction with platform 8. Such as, when being wide in conjunction with platform 8, sliver 12 can be wide, and when being narrow in conjunction with platform 8, sliver 12 can be narrow. It addition, the shape of framework 10 can change according to the quantity of joint head. Such as, upper mounting plate 10a and lower platform 10b can become wider or narrower to adapt to the joint head of more or less quantity.

Greater number of joint head can be used for accelerating combined process and improving joint efficiency. Additionally, the distance adjoined between joint head is also by determine in the size in conjunction with the substrate received on platform 8.

Fig. 7 illustrates according to embodiment for semiconductor chip junction is bonded to the device 700 of substrate. Semiconductor chip junction can be bonded to one or more substrate by the embodiment of Fig. 7. Device 700 can include two device 702a and 702b of located side by side. Each device 600 that can be similar to Fig. 6 in device 702a and 702b. The other features of the device 702a compared with the device 600 with Fig. 6 is described below.

In one embodiment, device 702a includes feeder (or tube core feeder or chip feeding device) 720a. Feeder 720a includes the chip tray 722a being coupled to the framework 10 of device 702a by two gripping arm 724a and 726a. Specifically, chip tray 722a is usually rectangular shape, it has the length extended across whole joint head group, and arm 724a is attached to one end of chip tray 722a and the pillar 10d of framework 10, and arm 726a is attached to the other end of chip tray 722a and the pillar 10c of framework 10. In use, chip tray 722a can be configured to the running lengthwise along arm 724a, 726a so that chip tray 722a can move between loading position and feed position. In loading position, chip can be placed on chip tray 722a, by as described in below. In feed position, chip can present to joint head 602a-602e. Specifically, in feed position, chip tray 722a can located be located immediately at below joint head 602a-e so that joint head 602a-e can activated the chip that will be located on chip tray 722a and acquire on corresponding combination tool (such as, the 218 of Fig. 2). Such as, each joint head can include pumping equipment, and when described pumping equipment activated, it will be located into the chip on chip tray 722a and is drawn on corresponding combination tool. In this way, chip can be obtained from feeder 720a by joint head 602a-e. In one embodiment, feeder 720a can include linear motor (that is, driving mechanism), and it may operate to make chip tray 722a slide between loading position and feed position along arm 724a, 726a.

In one embodiment, device 700 can include and the feeder 720a controller communicated. In use, described controller can with feeder 720a switching telecommunication number, in order to communicate with feeder 720a and it is controlled. Such as, described controller controlled coremaking tablet tray 722a motion between loading position and feed position. In one embodiment, described controller can send instruction to feeder 720a, and how described designated command feeder 720a runs. Feeder 720a can send feedback data to described controller, to help described controller to control the operation of feeder 720a.

In one embodiment, device 702b also includes the feeder 720b of correspondence, and it is similar to the feeder 720a of device 702a. In use, device 702a, 702b can move as one or move independently of one another.

In one embodiment, device 700 includes the load maintainer for being loaded into by chip feeder 720a and feeder 720b from the wafer 730 being included in wafer container 732.

In one embodiment, described load maintainer includes turner (or tube core turner or chip turner) 734. Turner 734 has bar-shaped shape, and it has first end 736a and the second end 736b. Each end 736a and 736b is furnished with the device for obtaining chip from stripping and slicing wafer 730. Such as, described device can include pumping equipment, and when respective end 736a, 736b are positioned at the chip top of stripping and slicing wafer 730, described pumping equipment is configurable for being drawn on turner 734 chip from stripping and slicing wafer 730. It addition, described pumping equipment can be configured to keep suction to be maintained on turner 734 by described chip. Additionally, described pumping equipment can be configured to release suction to discharge described chip from turner 734. In another embodiment, described pumping equipment can be replaced by machinery such as clamping device. Turner 734 is coupled to servo motor 738 in the centre position part of turner 734. In use, servo motor 738 is configured to make turner 734 rotate such as about 180 ��. Therefore, turner 734 can move between the first upturned position and the second upturned position. In the first upturned position, first end 736a is relative, and stripping and slicing wafer 730 positions, and the placement device of the relative load maintainer of the second end 736b (or tube core placement device or chip placement device) 740a or 740b location. In the second upturned position, first end 736a device 740a or 740b location staggered relatively, and the relative stripping and slicing wafer 730 of the second end 736b positions. Servo motor 738 is configured between the first upturned position and the second upturned position to activate turner 734.

In one embodiment, wafer container 732 may operate to make wafer 730 move. Such as, wafer container 732 may operate to make wafer move relative to turner 734, in order in different operations, causes different chips to be reversed device 734 and picks up.

In embodiment as above, load maintainer also includes placement device 740a and 740b. Placement device 740a is configured to run with device 702a, and placement device 740b is configured to run with device 702b. Placement device 740a is described more fully below.

In one embodiment, placement device 740a is furnished with the device for obtaining chip from turner 734. Such as, described device can include pumping equipment, and when corresponding end 736a, 736b device 740 staggered relatively is placed, described pumping equipment is configurable for being drawn into placement device 740a chip from first end 736a or the second end 736b. It addition, described pumping equipment can be configured to keep suction to be maintained on placement device 740a by described chip. Additionally, described pumping equipment can be configured to release suction to discharge described chip from placement device 740a. In another embodiment, machinery such as clamping device can be used for substituting described pumping equipment. Placement device 740a is configurable for being sent to chip from turner 734 the chip tray 722a of device 702a. Therefore, placement device 740a is configured to slide along guide rail 736, and guide rail 736 is parallel to the upper mounting plate of device 702a and 702b and runs and adjoin described upper mounting plate.

In one embodiment, device 700 includes housing 740, and device 702a and 702b is arranged in described housing. Housing 740 includes pedestal 742, and the lower platform 10b of device 702a and 702b resides on described pedestal. Guide rail 736 forms the parts of described housing and is attached to described housing by stay 744 and 746. Stay 744 is parallel to the pillar 10d of device 702a and is preferably adjacent to described pillar, and stay 746 is parallel to the pillar 10c of device 702b and is preferably adjacent to described pillar.

In one embodiment, in use, placement device 740a slides between take-off location and placement location along guide rail 736. In take-off location, the orientation according to turner 734, placement device 740a is relative with the first end 736a of turner 734 or the second end 736b. In placement location, the chip tray 722a of placement device 740a and device 702a is relative. It will thus be appreciated that chip tray 722a slides along its corresponding arm 724,726 so that when in its loading position, it is relative with the placement device 740a in its placement location.

In one embodiment, according to above-mentioned operation, chip can be picked up from stripping and slicing wafer 730 by turner 734. Turner 734 can move to the second upturned position from the first upturned position so that described chip device 740a location staggered relatively. By the compounding practice of the respective chip acquisition device of placement device (such as, pumping equipment or clamping device), described chip is sent to placement device 740a from turner 734 subsequently. Placement device 740a can slide into described placement location from described take-off location along guide rail 736 subsequently, in order to placement device 740a is relative with the chip tray 722a at its loading position. Described chip can be sent to chip tray 722a from placement device 740a subsequently. Chip tray 722a can move to feed position from loading position subsequently, in order to chip is presented to one in the joint head 602a-e of device 702a. In this way, chip can be sent to joint head 602a-e from wafer 730.

In one embodiment, it will be appreciated that chip can be placed on the known on the specific part of specific in the joint head 602a-e of device 702a of chip tray 722a by placement device 740a. In this way, chip can be sent to specific of the joint head 602a-e of device 702a. In one embodiment, before chip tray 722a moves to feed position from loading position, multiple chips can be positioned on chip tray 722a. Therefore, what chip can be loaded in the joint head 602a-e of device 702a simultaneously is multiple.

In one embodiment, placement device 740a and guide rail 736 have and allow the placement device 740a collaborative slit slided along guide rail 736 and groove (not shown). In one embodiment, placement device 740a can include the driver element driving its slip, such as motor.

Should be appreciated that placement device 740b and the operation relative to device 702b thereof are similar to placement device 740a and the operation relative to device 702a thereof.

In one embodiment, device 700 can include the controller that communicates with load maintainer and wafer container. In use, described controller can with described load maintainer and wafer container switching telecommunication number, in order to control with described load maintainer and wafer container communication and to it. In one embodiment, described controller can send instruction to described load maintainer and wafer container, and how these parts of described designated command run. Described load maintainer and wafer container can send feedback data to described controller, to help described controller to control their operation.

In one embodiment, device 700 includes First look system 750a and the 750b of correspondence. First look system 750a is described more fully below.

In one embodiment, First look system 750a includes photographic head, and described photographic head is preferably mounted to the pillar 10c of the framework 10 from the device 702a arm extended. Described photographic head can through orientation so that its visual field can below placement device 740a. In this way, when placement device 740a just transports chip from take-off location to placement location, First look system 750a can catch the image of the chip on placement device 740a. Therefore, First look system 750a can obtain the orientation of the chip on placement device 740a or the image of position.

In one embodiment, First look system 750a may be coupled to described controller (not shown). Described controller may include determining whether the vision processor of the orientation of described chip. Such as, the image that the chip on placement device 740a shoots can be compared by described controller with reference picture. The difference of the chip position between two images can by controller for calculating the skew of described chip position. Such as, described controller can receive image from First look system 750a and it be compared with reference picture. Based on described comparison, described controller can determine that described chip turns clockwise 2 �� compared with reference.

In one embodiment, placement device 740a is also configured to be placed the device 740a chip kept for rotating. Such as, placement device 740a can include the motor that can rotate described chip. As it has been described above, described controller can communicate with placement device 740a and First look system 750a. Therefore, after determining the position skew on placement device 740a of the described chip, described controller can transmit signal to promote placement device 740a to compensate described skew to placement device 740a. Such as, if be detected that 2 �� rotate clockwise skew, placement device 740a can rotate counterclockwise described chip 2 ��. Therefore, described chip orientation on placement device 740a can be adjusted or change to mate described reference.

In one embodiment, described reference picture can include by the relatively early image of First look system 750a shooting. In one embodiment, described reference picture can include the image that is maintained at the chip of predetermined orientation by placement device 740a, i.e. described chip is in desired alignment relative to placement device 740a.

Should be appreciated that First look system 750b and the operation about controller, placement device 740b and device 702b thereof are similar to First look system 750a and the operation about controller, placement device 740a and device 702a thereof. However, it is to be noted that First look system 750b is preferably mounted to the pillar 10d of the framework 10 from the device 702b arm extended, as can be as seen from Figure 7.

In one embodiment, device 700 includes the second visual system 756a and 756b of correspondence. Second visual system 756a is described more fully below.

In one embodiment, the second visual system 756a includes photographic head. Second visual system 756a can relative to multiple joint head 602a-e of device 702a and moving in conjunction with platform 8. Described photographic head can be configurable for measuring each joint head 602a-e relative to the position in conjunction with platform 8. Such as, it is contemplated that joint head 602a. Specifically, the second visual system 756a can be configured in joint head 602a and move in conjunction with between platform 8. Second visual system 756a can have for measuring the joint head 602a the first lens relative to reference (such as, preset reference position). Second visual system 756a can have for measuring in conjunction with the platform 8 second lens relative to the position of same reference.

Should be appreciated that the second visual system 756a can be attached to the arm extended from the framework 10 of device 702a in order to make the second visual system 756a relative to multiple joint head 602a-e of device 702a and move in conjunction with platform 8. Described arm is extendible so that the second visual system 756a can be parallel to joint head 602a-e and in conjunction with platform 8 and joint head 602a-e and in conjunction with the plane between platform 8 in motion. Second visual system 756a can include allowing it relative to joint head 602a-e and the driving mechanism in conjunction with platform 8 motion.

In one embodiment, the second visual system 756a communicates with described controller (not shown). Described controller can include vision processor, and it determines the measured joint head (such as, 602a) of device 702a and in conjunction with the alignment between platform 8 based on the image obtained by the second visual system 756a. Specifically, owing to joint head 602a may operate to be combined by chip in conjunction with on the substrate received on platform 8, described alignment is likely with reference in conjunction with the appointment position on platform 8. This position can pass through in conjunction with on platform 8 or in conjunction with on platform 8 receive substrate on alignment mark distinguishing. Described appointment position corresponds to the appointment position (also referred to as binding site) that the chip obtained on substrate wants combined by joint head 602a.

Such as, described controller comparable by second visual system 756a shooting two images and calculate two differences. First difference can be the difference (that is, skew) between the image and described reference of joint head 602a. Second difference can be in conjunction with the difference (that is, skew) between image and the described reference of platform 8. Should be appreciated that described skew can be the motion according to X, Y and/or ��.

In one embodiment, described controller calculations incorporated head 602a and/or the total alignment offset in conjunction with platform 8. It addition, described controller can with joint head 602a and/or communicate in conjunction with platform 8 and can promote joint head 602a and/or in conjunction with platform 8 according to determined skew campaign. The joint head 201 of the motion reference above figure 2 of joint head 602a describes. Motion reference above figure 1 in conjunction with platform 8 describes. For example, it may be determined that joint head 604a should be maintained at its current location, and should move based on described controller image procossing in conjunction with platform 8 and be directed at joint head 602a. Alternatively, joint head 602a is movable, and can remain stationary in conjunction with platform 8. Alternatively, joint head 602a is movable with in conjunction with both platforms 8.

In one embodiment, it not joint head 602a motion, but move in conjunction with platform 8, because compared with joint head 602a, can move bigger amount in conjunction with platform 8 possibility. In one embodiment, any X and/or Y motion can be performed in conjunction with platform 8, and joint head 602a can perform any �� (that is, angle) motion.

According to above-mentioned operation, device 702a can be directed at one or more in the joint head 602a-e of device 702a in conjunction with platform 8. Therefore, it is being extremely possible in conjunction with the accurate location of the substrate of reception on platform that the chip accurately controlling to be obtained by joint head combines. In addition, once each joint head 602a-e of device 702a has obtained chip from feeder 720 and joint head 602a-e has been correctly aligned in conjunction with the substrate received platform 8, then each joint head 602a-e can vertically (namely, Z) direction activates, in order to combined to described substrate by the chip obtained. Specifically, described chip can such as by aspirating or mechanically obtaining and be maintained on described joint head. Subsequently, described joint head can towards described substrate motion so that described chip contacts described substrate. Then, the releasable described chip of described joint head, for instance, by removing the actuating of suction or machinery. The step of release can include chip pressing (such as, with predetermined pressure) on substrate to improve the intensity combined. And, as described in reference diagram 2 above, the chip that joint head can obtain with period heating before bonding is to improve the intensity combined. After bonding, the releasable chip of joint head and in the vertical direction from substrate bounce back.

Should be appreciated that the second visual system 750b and be similar to the second visual system 750a and the operation relative to controller and device 702a thereof relative to the operation of controller and device 702b.

In one embodiment, device 702a and device 702b separates, although both can be serviced by identical load maintainer. Described load maintainer can include turner 734, servo motor 738 and placement device 740a and 740b. Device 702a can have its multiple joint head 602a-e, and its multiple joint head 602a-e with device 702b separate. Device 702a has the feeder 740a of their own, and its feeder 740b with device 702b separates. Therefore, device 702a can be used for combining to a substrate chip, and device 702b can be used for combining to another substrate chip. But, may be from identical load maintainer for the chip of device 702a and device 702b. And, described chip may be from identical stripping and slicing wafer.

In various embodiments, device 700 can include the many more than two device according to Fig. 6. Such as, device 700 can include four such device 702a-d. Described device can linear arrangement or by different way, such as with the form of square or circular structure. According to foregoing description, identical load maintainer can be shared between some or all of device 702a-d.

Fig. 8 illustrates according to embodiment for semiconductor chip junction is bonded to the device 750 of substrate. Semiconductor chip junction can be bonded to one or more substrate by the embodiment of Fig. 8. Device 750 includes two device 752a and 752b of located side by side. Each device 2 being similar to Fig. 1 in device 752a and 752b. Therefore, device 752a and 752b is similar to device 702a and the 702b of Fig. 7, but includes two basic change head rather than five.

The device 750 of Fig. 8 is similar to the device 700 of Fig. 7. Difference compared with the following describes between device 700 with device 750.

In one embodiment, device 752a includes two basic change head 4a and 6a, and device 752b includes two basic change head 4b and 6b. In one embodiment, device 752a includes two feeder 754a and 756a. Feeder 754a is configured to run with joint head 4a, and feeder 756b is configured to run with joint head 6a. Device 752b includes two feeder 754b and 756b. Feeder 754b is configured to run with joint head 4b, and feeder 756b is configured to run with joint head 6b.

In one embodiment, feeder 754a includes being attached to the chip tray 760a from the pillar 10d of the device 752a arm 762a extended. In use, chip tray 760a can move between loading position and feed position along arm 762a. When loading position, chip tray 760a can at arm 762a from end farthest for joint head 4a, in order to corresponding placement device can on chip tray 760a chip placement. When feed position, chip tray 760a can at arm 762a from end nearest for joint head 4a, in order to chip tray 760a is positioned directly in below joint head 4a.

In one embodiment, feeder 756a is similar to feeder 754a, but is associated with joint head 6a rather than joint head 4a. But, the arm of feeder 756a extends from the pillar 10c rather than pillar 10c of device 752a. Feeder 754b and 756b is analogous respectively to feeder 754a and 756a, but respectively to joint head 4b and 6b rather than relevant with joint head 4a and 6a.

Fig. 9 a-9c illustrates the multiple joint heads according to embodiment or joint head group 801. Joint head group 801 can include five the joint head 801a-e being coupled to guide rail 808, and wherein, guide rail 808 is coupled to upper mounting plate 810. In other words, the plurality of joint head is coupled to described framework via guide rail 808. In use, each in joint head 801a-e can slide along guide rail 808, in order to change their position along upper mounting plate 810. Therefore, in one embodiment, the plurality of joint head is removably coupled to described framework, in order to adjoin to joint head between spacing be adjustable, and the plurality of joint head linear arrangement.

Fig. 9 a-9c is intended to show that the motion of the joint head 801a-e as one, i.e. each 801a-e carries out identical motion in the identical time.

In one embodiment, each and in joint head group 801 the joint head that adjoins in joint head 801a-e separates predetermined distance. The quantity of the joint head in joint head group 801 can be different in different embodiments, and to adjoin the distance between joint head can be different in different embodiments.

In the embodiment of parked position, joint head group 801 is positioned at and above and separates with in conjunction with platform 802 in conjunction with platform 802. As it has been described above, can slide on sliver 804 in conjunction with platform 802, and described sliver can slide on the guide rail 805 being positioned on lower platform 806. In use, it is configured to receive substrate (not shown) in conjunction with platform 802, and each joint head 801a-e is configured to obtain chip and combine described chip to described substrate.

In one embodiment, joint head group 801 is preferably arranged to the overlap whole width in conjunction with platform 802, as illustrated in fig. 9. As more specifically found out from Fig. 9 b, it can be seen that joint head group 801 can be moved in conjunction with platform 802 in vertical (that is, Z) direction as single unit. In one embodiment, guide rail 808 can be coupled to upper mounting plate 810 via vertical actuator device (that is, vertical driving mechanism). In use, described vertical actuator device can be configured to make joint head group 801 move in conjunction with platform 802, for instance, the chip obtained on joint head is combined in conjunction with the substrate on platform 802. It addition, described vertical actuator device can be configured to make joint head group 801 move away from conjunction with platform 802, for instance, combine to substrate at chip, make joint head group bounce back from substrate. Should be appreciated that described vertical actuator device may be made directly on guide rail 808, in order to make joint head group 801 move both vertically. Alternatively, bracket may be present between guide rail 808 and described vertical actuator device. Described vertical actuator device can include linear motor and drive axle. In operation, described linear motor can drive described axle so that guide rail 808 is to extending (that is, away from upper mounting plate 810) in conjunction with platform 802 or making guide rail 808 from bounce back in conjunction with platform 802 (that is, to upper mounting plate 810). Described vertical actuator device can with controller communication. Described controller is configured for controlling the operation of described vertical actuator device. Therefore, joint head 801a-e can move both vertically together as one, namely moves both vertically together in group 801 simultaneously.

In one embodiment, as more specifically found out from Fig. 9 c, joint head group 801 can be moved in level (that is, X and/or Y) direction relative in conjunction with platform 802 as single unit. Described X and Y-direction are represented by corresponding arrow in Fig. 9 c. In one embodiment, guide rail 808 may be coupled to horizontal actuator device (that is, horizontal drive mechanism). In use, described horizontal actuator mechanism can be configured to make joint head group 801 move relative in conjunction with platform 802. Should be appreciated that described horizontal actuator device may be made directly on guide rail 808, in order to make joint head group 801 horizontal movement. Alternatively, bracket may be present between guide rail 808 and described horizontal actuator device. Described controller is configured for controlling the operation of described horizontal actuator device. Therefore, joint head 801a-e can as one horizontal movement together, i.e. horizontal movement together in group 801 simultaneously.

Joint head 801a is described more fully below it should be appreciated that this description is equally applicable to joint head 801b-e. Joint head 801a can find out specifically in Figure 10 a-10c.

In one embodiment, joint head 801a can include the linear drive unit 904a that is coupled to guide rail 808. Described linear drive unit can be made up of motor and bearing, and it allows joint head 902a to move along guide rail 808 or slide. This motion is represented by the arrow being labeled as X in figure loa. In one embodiment, linear drive unit 904a and controller communication controlled by described controller. Horizontal movement plate 912a it is coupled to below linear drive unit 904a. In one embodiment, horizontal movement plate 912a is configured to relative to linear drive unit 904a horizontal movement (that is, in X-direction). This direction of motion is represented by the arrow of X labelling in figure loa. Alternatively or in addition, horizontal movement plate 912a is configured to relative to linear drive unit 904a horizontal movement (that is, in the Y direction). This direction of motion is represented by the arrow of Y labelling in figure 10b. Should be appreciated that the horizontal movement beyond level (X and/or Y) the direction motion that the motion of this level (X and/or Y) direction can be in addition to be provided by linear drive unit 904a. Such as, linear drive unit 904a can be used for providing rough level (X and/or Y) direction to move, and horizontal movement plate 912a can be used for providing fine level (X and/or Y) direction to move. Joint head 801a may also include and makes horizontal movement plate 912a relative to the linear drive unit 904a driving mechanism moved, such as motor. In one embodiment, described driving mechanism and controller communication controlled by described controller.

In one embodiment, angular movement plate 914a is coupled to below horizontal movement plate 912a via connecting plate 916a. Connecting plate 916a is configured to horizontal movement plate 912a horizontal movement. Angular movement plate 914a is configured to rotate relative to connecting plate 916a. Alternatively, connecting plate 916a can omit, and angular movement plate 914a is configured to rotate relative to horizontal movement plate 912a. This direction of motion is passed through to be labeled as the arrow of �� in Figure 10 c and is represented. Joint head 801a may also include and makes angular movement plate 914a relative to the connecting plate 916a driving mechanism rotated, such as motor. In one embodiment, described driving mechanism and controller communication controlled by described controller. It is to be understood that, the lower component of rotation or angular movement permission joint head 801a is (namely, angular movement plate 914 and below) around upper-part relative to joint head 801a of vertical (that is, Z) axis of joint head 801a (that is, connecting plate 916a and above) rotation.

In one embodiment, the chip obtained by joint head 801a below angular movement plate 914a it is coupled to allow joint head 801a to heat in conjunction with heater 920a. The top of joint head 801a is provided by the combination tool 918a being coupled to below in conjunction with heater 920a. Joint head 801a is configured with the device for obtaining chip. Described device can include allowing combination tool 918a obtain and discharge pumping equipment or the clamping device of chip. Such as, described pumping equipment can be configurable for the chip being located just at below described top is drawn into above combination tool 918a and keeps suction to be held in place by described chip. Described pumping equipment can be configured to disable to discharge described chip from combination tool 918a. Should be appreciated that and can heat, in conjunction with heater 920a, the chip obtained by combination tool 918a.

Should be appreciated that the horizontal movement plate 912a in joint head 801a, angular movement plate 914a and the structure in conjunction with heater 920a can be different in different embodiments.

In one embodiment, in joint head 801a-e multiple can as one X, Y, Z and �� direction motion, namely they carry out same movement simultaneously. Addition or alternatively, in joint head 801a-e one or more can independent of other joint heads one or more in joint head 801a X, Y, Z and �� direction motion. That is, each joint head can include the independent horizontal controlled by controller, vertical and angle driving mechanism.

Figure 11 a and 11b illustrates the joint head group 801 including joint head 801a-e. Joint head group 801 can be used on and is previously discussed for being bonded in the device of substrate semiconductor chip junction.

As it has been described above, in one embodiment, the joint head 801a-e of joint head group 801 is linearly arranged on guide rail 808. Specifically, each joint head 801a-e is configured on guide rail 808 to slide. Each joint head 801a-e includes linear drive unit, and described linear drive unit allows described each joint head to slide to another particular location along guide rail 808 from a particular location. Each joint head 801a-e can communicate with described controller. Described controller is configured for controlling the operation of joint head 801a-e. Therefore, each joint head 801a-e can be controlled by described controller to slide between two or more particular locations along guide rail 808.

As more specifically found out from Figure 11 a, in one embodiment, the joint head 801a-e of joint head group 801 slides on guide rail 808 and adjoins joint head to change, for instance the spacing between 801a and 801b. Such as, specific spacing is probably necessity, in order to the chip being attached on substrate is that described specific range separates. Specifically, chip binding site on substrate can separate specific range, and therefore, before performing to combine, described chip must flow through specific range separately.

In one embodiment, whole joint head group 801 can be slided along guide rail 808 as one. Whole operation is regarded as rough horizontal movement. Alternatively, single joint head can slide independent of other joint heads some or all of. Operation by the horizontal movement plate of each joint head 801a-e, it may be achieved finer horizontal movement. These horizontal movement plates can as one motion. Alternatively, the horizontal movement plate of different joint heads may differ from or horizontal movement plate independent of other joint head moves. All joint heads can pass through they respective corners maneuvering boards and perform identical angular movement track. Alternatively, different joint heads can perform different angular movements. In one embodiment, the level of each joint head and angular movement are controlled by described controller.

In one embodiment, after joint head 801a-e picks up chip from feeder, perform separating of joint head 801a-e. Moving on to when joint head group 801 location below in conjunction with platform 802, can perform to separate motion simultaneously. The advantage of this operation is in that, chip can be placed on the feeder of same configuration, regardless of spacing required between chip during combining. Such as, described chip can be close together and be placed on feeder, but when described chip is attached on substrate, described chip can separate more. The spacing increased is slided on guide rail 808 by joint head 801a-e and is realized.

In one embodiment, as more specifically found out from Figure 11 b, when only joint head 801a-d needs given cohesive process, joint head 801e is moveable to an end of guide rail 808. Specifically, joint head 801e can slide into the end not overlapped in conjunction with the substrate received on platform 802 along guide rail 808. Remaining joint head 801a-d can separate as mentioned above. In one embodiment, guide rail 808 is comparable longer in conjunction with platform 802 and described substrate. In this way, the joint head of the end sliding into described guide rail can be excluded outside binding operation. In other words, the length dimension of described guide rail is provided so that when at least one joint head described slides to the end of described guide rail, at least one joint head described and restricted in conjunction with the relative motion between platform so that at least one joint head described can not contact substrate.

In one embodiment, when all joint heads beyond a joint head (such as, 801a) have slid into the end of guide rail 808, last remaining joint head 801a can be used for combining to any part in conjunction with platform 802 chip. Specifically, in conjunction with platform 802 can relative to joint head group 801 horizontal movement, as described by reference Fig. 1 and 9a. When a joint head (such as, 801a) of only joint head group 801 does not slide into the end of guide rail 808, can move relative to this joint head in conjunction with platform 802, in order to chip is combined in conjunction with on platform Anywhere. In addition, in one embodiment, when all joint heads beyond two basic change head (such as, 801a and 801b) have slid into the end of guide rail 808, latter two remaining joint head 801a can be used for combining to any part in conjunction with platform 802 chip. This principle is applicable to the remaining joint head of other quantity.

Figure 12 illustrates the top view of the coupling apparatus 1000 according to embodiment. Device 1000 includes upper mounting plate 1002a and lower platform 1002b. Lines 1004 represent the edge of upper mounting plate 1002a. Therefore, upper mounting plate 1002a has a width about the same with lower platform 1002b, but is the degree of depth only about half of of lower platform 1002b. Pillar 1006a and 1006b shown in broken lines keeps upper mounting plate 1002a be parallel to lower platform 1002b and be spaced from. Device 1000 includes two basic change head 1008a and 1008b, and both of which is coupled to upper mounting plate 1002a. In one embodiment, joint head 1008a and 1008b represents multiple joint head.

Figure 12 illustrates the working area 1010 of device 1000. The surface that working area 1010 includes being parallel to lower platform 1002b, the plane on the surface of lower platform 1002b and between two pillar 1006a and 1006b. Working area 1010 is divided into two region 1012a and 1012b. Region 1012a corresponds to joint head 1008a, and region 1012b is corresponding to joint head 1008b.

In one embodiment, device 1000 also includes two basic change platform 1014a and 1014b. In conjunction with platform 1014a corresponding to joint head 1008a, and in conjunction with platform 1014b corresponding to joint head 1008b. In use, can move relative to joint head 1008a and 1008b in conjunction with platform 1014a and 1014b. Specifically, can in the motion Anywhere in the region 1012a of working area 1010 in conjunction with platform 1014a. On the other hand, can in the motion Anywhere in the region 1012b of working area 1010 in conjunction with platform 1014b. Therefore, can move relative to joint head 1008a in conjunction with platform 1014a so that joint head 1008a can be bonded to platform 1014a Anywhere. On the other hand, can move relative to joint head 1008b in conjunction with platform 1014b so that joint head 1008b can be bonded to platform 1014b Anywhere.

According to the above embodiments, it is possible to provide multiple in conjunction with platform, wherein, each in conjunction with platform corresponding to specific joint head. In one embodiment, each in conjunction with platform corresponding to different joint head, or the joint head of different group may correspond to each other in conjunction with platform. In one embodiment, each in conjunction with platform can with other in conjunction with platform corresponding at least some in identical combination head.

Figure 13 illustrates binding sequence 1100 embodiment performed by device 1200 embodiment shown in Figure 14 a-g. Figure 14 a-g only illustrates a part for device 1200, in order to can clearly be seen that each operation in described sequence. But, device 1200 is similar to the device 2 of Fig. 1 and device 752a and the 752b of Fig. 8. Therefore, device 1200 includes two basic change head 1202a and 1202b, and said two joint head represents multiple joint head. As it is shown in figure 1, joint head 1202a and 1202b is coupled to the upper mounting plate (not shown) of framework. The lower platform 1203 of described framework is remained parallel to lower platform 1203 by pillar 1205a and 1205b (shown in dotted line) and separates with lower platform 1203. Lower platform 1203 include substrate 1208 be positioned on face in conjunction with platform (not shown). Described described substrate can be made to move above at lower platform 1203 in conjunction with platform, as described with reference to fig. 1. Described joint head can provide such as vertical, level described in reference diagram 2 above and angular movement. In one embodiment, joint head 1202a can move independent of joint head 1202b. In one embodiment, joint head 1202a can with joint head 1202b as one motion.

Some other features of device 1200 are described more fully below.

In one embodiment, feeder 1204a configured for by chip feeding to joint head 1202a, and feeder 1204b is configured for by chip feeding to joint head 1202b. Feeder 1204a includes being attached to the chip tray 1210a from the pillar 1205b arm 1212a extended. In use, chip tray 1210a can move between loading position and feed position along arm 1212a. When loading position, chip tray 1210a can at arm 1212a from end farthest for joint head 1202a, in order to corresponding placement device (not shown) can on chip tray 1210a chip placement. When feed position, chip tray 1210a can at arm 1212a from end nearest for joint head 1202a, in order to chip tray 1210a is positioned directly in below joint head 1202a. Feeder 1204b is similar to feeder 1204a, but is associated with joint head 1202b rather than joint head 1202a. Feeder 1204a and 1204b is similar to those feeders of Fig. 8.

In one embodiment, visual system 1206 configured for will on joint head 1202a and 1202b obtain chip with described in conjunction with on platform receive substrate 1208 on appointment position alignment. Visual system 1206 is similar to second visual system 756a and the 756b of Fig. 7.

The detail setting of the binding sequence 1100 of Figure 13 is as follows. Should be appreciated that the operation of device 1200 can be controlled by the controller of device 1200.

Step 1101 can more specifically be found out from Figure 14 a. In step 1101, substrate 1208 receives in conjunction with on platform described. And, feeder 1204a is positioned in its loading position, and the first chip 1220 is such as placed on feeder 1204a by corresponding placement device. Feeder 1204b is positioned in its loading position, but does not have chip to be placed on it face. Joint head 1202a and 1202b is in from the clear position bounced back completely in conjunction with platform, i.e. move to upper mounting plate completely. Visual system 1206 is in the centre of lower platform 1203 and away from the clear position of joint head 1202a or 1202b.

Step 1102 can more specifically be found out from Figure 14 b. In step 1102, described substrate 1208 is made to move in joint head 1202a location below in conjunction with platform. Described location-dependent query 1220 combined 1202a of the first chip in conjunction with platform are combined in the exact position on substrate 1208. , the first chip 1220 to be incorporated in the lower right corner of substrate 1208 from Figure 12 b it can be seen that in the case, as shown on Figure 14 b. It follows that feeder 1204a moves to its feed position below joint head 1202a from its loading position. Once be in described feed position, joint head 1202a such as picks up the first chip 1220 by suction from feeder 1204a. Alternatively, after joint head 1202a picks up the first chip 1220 from feeder 1204a, described substrate 1208 is made to move in described joint head location below in conjunction with platform. Subsequently, the second chip 1222 is such as placed on feeder 1204b by corresponding placement device.

Step 1104 more specifically can be found out from Figure 14 c. In step 1104, empty feeder 1204a moves back into its loading position. Visual system 1206 moves between joint head 1202a and substrate 1208. Then, visual system 1206 determines the described necessary motion in conjunction with platform and joint head 1202a in conjunction with described controller, in order to the first chip 1220 introduces the first chip binding site being aligned on substrate 1208. Then, described move in conjunction with platform and/or joint head 1202a, so that the first chip is directed at the first chip binding site. Subsequently, feeder 1204b moves to its feed position below joint head 1202b from its loading position.

The process being directed at the first chip binding site by first chip 1220 is explained in greater detail with reference to Figure 14 d.

Figure 14 d illustrates according to embodiment, and how visual system 1206 may operate to make the first chip 1220 obtained by described joint head be directed at the first chip binding site on substrate 1208. In one embodiment, the photographic head of visual system 1206 can include two lens. First lens of the photographic head of visual system 1206 are for measuring first chip 1220 position on joint head 1202a. Second lens of the photographic head of visual system 1206 are for measuring first chip binding site position on substrate 1208. As it has been described above, described binding site can be identified by the alignment mark (or reference mark) on substrate 1208. Described alignment mark is illustrated on Figure 14 d by cross mark. As from Figure 14 d it can be seen that the first chip 1220 is intended to combined so that two diagonal angle 1220a and 1220b and two alignment mark 1208a and 1208b of the first chip 1220 are respectively aligned to. Alternatively, alignment mark (or reference mark) also is present on the first chip 1220. First chip 1220 is intended to combined so that the alignment mark of the first chip 1220 is respectively aligned to the alignment mark on substrate 1208. Therefore, in operating first, visual system 1206 moves to catch the first chip 1220 at the image being positioned on the joint head 1202a above substrate 1208. In operating second, first visual system 1206 moves to position 1206a, to catch the image of first alignment mark in two alignment mark 1208a. Subsequently, visual system 1206 moves to position 1206b, to catch the image of second alignment mark in two alignment mark 1208b. Visual system 1206 is then returned to its clear position. Therefore, total of three image is caught. Alternatively, the image of movable the first diagonal angle 1220a to catch the first chip 1220 of visual system 1206. It follows that visual system 1206 moves to catch the second diagonal angle 1220b of the first chip 1220. Therefore, total of four image is caught. Each image can compare with reference position, in order to determines whether the first chip 1220 is directed at the first chip binding site. If being directed at incorrect, then calculate skew and described move to alignment in conjunction with platform and/or joint head 1202a.

Step 1106 can more specifically be found out from Figure 14 e. In step 1106, the second chip is such as picked up from feeder 1204b by joint head 1202b by suction. Then, empty feeder 1204b motion returns its loading position. Visual system 1206 moves between joint head 1202b and substrate 1208. Then, visual system 1206 determines the described necessary motion in conjunction with platform and joint head 1202b in conjunction with described controller, in order to the second chip introduces the second chip binding site being aligned on substrate 1208. Move it follows that described in conjunction with platform and/or joint head 1202b, so that the second chip and the second chip binding site alignment. This process is similar to the above-mentioned process relevant to the first chip and the first chip binding site alignment.

It follows that the first chip on joint head 1202a is combined on substrate 1208 at the first chip binding site. Specifically, joint head 1202a moves towards substrate 1208 vertical (that is, in Z-direction), until the first chip contact substrate 1208. First chip is combined to substrate 1208 by this operation. Subsequently, joint head 1202a is such as by releasing suction release the first chip. Joint head 1202a vertically upward and moves away from substrate 1208 towards upper mounting plate subsequently. It follows that the 3rd chip 1224 is held in place on the feeder 1204a of its loading position.

In one embodiment, the contact between the first chip and substrate can be detected by the sensor device of joint head 1202a, such as by displacement transducer or force transducer. In use, the sensor device of joint head 1202a can detect the point of the impedance of motion generation downward vertically. This point can represent that the first chip has contacted described substrate.

In one embodiment, joint head 1202a is additionally configured to be pressed against on substrate 1208 by the first chip 1220, i.e. by applying pressure. Such as, described sensor device may recognize that the first chip 1220 has contacted described substrate, but this can subsequently result in joint head 1202a and increase the power moved downward. In this way, pressure can be applied to the first chip 1220, to improve the combination between the first chip 1220 and substrate 1208. The operation of joint head 1202a can be controlled by described controller. In one embodiment, the pressure of predetermined amount of time and/or predetermined force can be applied. Described predetermined amount of time and/or power can be defined by described controller. Described predetermined amount of time and/or power can change between different embodiments and between the various process step of identical embodiment.

In one embodiment, joint head 1202a is additionally configured to, when the first chip 1220 is kept by joint head 1202a and/or is incorporated in substrate 1208, heat the first chip 1220. Joint head 1202a can use in conjunction with heater as described in reference diagram 2 above. At the first chip 1220 in time introducing contact substrate 1208, heat the first chip 1220 and may result in the solder entrance molten condition being present on the first chip 1220. Once the first chip 1220 discharges, joint head 12020a can be deactivated in conjunction with heater, in order to combination tool can cool down before obtaining another chip.

Step 1108 can more specifically be found out from Figure 14 f. In step 1108, described substrate 1208 is made to move to next binding site below joint head 1202b in conjunction with platform. Specifically, next binding site described is the second chip binding site of the lower left side that can be located at substrate 1208, as from Figure 14 f find out. Therefore, described substrate 1208 is made to move in conjunction with platform, in order to the second chip binding site is located immediately at below joint head 1202b. It follows that vision camera 1206 uses as mentioned above, to guarantee that the second chip 1222 on joint head 1202b is directed at the second chip binding site of substrate 1208. It is moved to realize alignment if it is necessary, then described in conjunction with platform and/or joint head 1202b. Subsequently, feeder 1204a moves to its feed position from its loading position.

Step 1110 can more specifically be found out from Figure 14 g. In step 1110, the 3rd chip 1224 is obtained from the feeder 1204a in feed position by joint head 1202a. Then, feeder 1204a motion returns its loading position. Then, visual system 1206 moves to joint head 1202a to prepare the alignment of joint head 1202a. It follows that the second chip 1222 on joint head 1202b is combined on substrate 1208 at the second chip binding site. Specifically, joint head 1202b moves towards substrate 1208 vertical (that is, in Z-direction), until the second chip 1222 contact substrate 1208. This operation makes the second chip 1222 combine to substrate 1208. Subsequently, joint head 1202b such as discharges the second chip 1222 by releasing suction. Joint head 1202b vertically upward and moves away from substrate 1208 towards upper mounting plate subsequently. The combination of the second chip 1222 is similar to the joint head 1202a combination to the first chip 1220 by joint head 1202b. And, feeder 1204b receives fourth chip 1226 at its loading position.

Aforesaid operations completes a cycle of cohesive process. According to said process, two chips have been incorporated on described substrate. First chip 1220 is combined by joint head 1202a, and the second chip 1222 is combined by joint head 1202b.

Step 1112 after step 1110, carries out about other chip the need of combining the decision to substrate. If need not be further combined with, then cohesive process 1100 terminates. But, if need further combined with, then repeat above-mentioned operation 1104-1110. But, for being ready for the device 1200 of operation 1104, substrate 1206 moves to below joint head 1202a so that the 3rd chip binding site is directly below the 3rd chip 1224.

When repeating step 1104-1110, the operation about the first chip 1220 is now relevant to the 3rd chip 1224, and the operation about the second chip 1224 is now relevant to fourth chip 1226. It may be noted that aforesaid operations has been introduced into both the 3rd chip 1224 and fourth chip 1226. Additionally, described operation is introduced into new fifth chip and the 6th new chip. Therefore, it can be seen that above-mentioned binding sequence may be used for being attached on substrate 1208 any amount of chip.

Figure 15 a illustrates the top view of device 1300. A part for device 1300 is only shown, in order to can the various operations of more clearly interpreting means 1300. Device 1300 is similar to the device 1200 of Figure 14 a-g. But, device 1300 has following difference.

In one embodiment, device 1300 includes five joint head 1307a-e rather than the joint head group of two basic change head 1202a and 1202b. It addition, described joint head group is similar to the joint head group 801 of Fig. 9 a, 9b, 11a and 11b and each joint head 902a-e being similar to Fig. 9 a, 9b and 10a-c in joint head 1307a-e. Therefore, joint head 1307a-e is arranged on guide rail and can slide on the guideway. In this way, adjoin joint head between spacing be variable.

In one embodiment, device 1300 includes by each feeder 1309 in chip feeding to joint head 1307a-e, rather than having the independent feeder (1204a and 1204b) for each joint head (1202a and 1202b). Feeder 1309 includes chip tray 1310, and it usually has the rectangular shape of the length extended across whole joint head group. One end of chip tray 1310 is attached to from the pillar 1205a arm 1312a extended. The other end of chip tray 1310 is attached to from the pillar 1205b arm 1312b extended. In use, chip tray 1310 can move between loading position and feed position along arm 1312a and 1312b. When loading position, chip tray 1310 can at arm 1312a and 1312b from end farthest for joint head 1307a-e, in order to corresponding placement device (not shown) can on chip tray 1310 chip placement. When feed position, chip tray 1310 can at arm 1312a and 1312b from end nearest for joint head 1307a-e, in order to chip tray 1310 is positioned directly in below joint head 1307a-e. Feeder 1309 can be identical with feeder 720a and 720b of Fig. 7.

In one embodiment, described device includes substrate 1303 rather than substrate 1208. The two substrate can be essentially identical.

In one embodiment, device 1300 in use can run as follows.

In one embodiment, feeder 1309 can be configured at its loading position. Such as, by the placement device (not shown) of one or more correspondences, chip can be placed on chip tray 1310. In one embodiment, five chips can be placed along chip tray 1310 evenly spacedly, and wherein, each chip is corresponding in joint head 1307a-e. This can be found out by the chip 1314a-e of Figure 15 a. In one embodiment, adjoining the spacing between chip 1314a-e can be identical with the spacing adjoined between joint head 1307a-e.

In one embodiment, feeder 1310 can move to its feed position from its loading position. In feed position, joint head 1307a-e such as can obtain chip 1314a-e by suction from chip tray 1310. Then, feeder 1310 returns its loading position. Now, more chip can be loaded on chip tray 1310.

In one embodiment, described substrate 1303 can be made to move in joint head 1307a-e location below in conjunction with platform. Specifically, each joint head 1307a-e carries the different chips in chip 1314a-e, and described substrate will have the corresponding chip binding site for each chip 1314a-e. Therefore, the position of substrate 1303 is intended to make chip binding site chip corresponding with them align. This location can be controlled by described controller.

In one embodiment, although above-mentioned operation is intended to make chip binding site be directed at their respective chip, but described alignment can be insufficient accurately. Therefore, visual system 1206 can move between joint head 1307a-e and substrate 1303, to determine being directed between each chip 1314a-e with its respective chip binding site. As previously described, the alignment mark on substrate 1303 can be used for providing the reference point on substrate 1303. The result of this process can be the calculating of a series of skew. Can for joint head 1307a-e with in conjunction with each offer skew in platform. Described skew can represent that chip 1314a-e is introduced the motion required to they corresponding binding site alignments on substrate 1303 by described joint head. Joint head skew definable X, Y and/or �� motion. Described X motion can by making joint head at moving on rails and/or by using its horizontal movement plate to provide. Definable X and Y motion is offset in conjunction with platform. Once carry out the offset movement of necessity, it is possible to start to combine.

In one embodiment, each in joint head 1307a-e can move both vertically to substrate 1303. For given joint head (such as, 1307a), once chip (such as, 1314a) contacts its binding site on substrate 1303, then move both vertically described in and can stop. Once described joint head contact substrate, then described joint head can apply pressure (that is, extruding force) to improve bond strength to chip. Before described binding operation and/or period, described joint head can heat chip to improve bond strength. Once described chip has combined to substrate, then described joint head such as discharges described chip by releasing suction. Described joint head moves both vertically away from substrate 1303 subsequently or the upper mounting plate that couples towards described joint head moves both vertically. Should be appreciated that joint head 1307a-e can move both vertically together or independently of one another as one.

In one embodiment, once all of joint head 1307a-e completes to combine, then, when preparing another binding operation, feeder 1309 can be reused, new chip to be fed to joint head 1307a-e.

In one embodiment, in given binding operation, all joint head 1307a-e can be used for combining to substrate 1303 chip. In another embodiment, one or more joint heads are not useable for combining to substrate chip. Such as, chip can be not added with being loaded onto the feeder for particular combination head, and described particular combination head can not perform any binding operation.

Figure 15 b illustrates the further operation of device 1300. Figure 15 b only illustrates a part for device 1300. Specifically, joint head 1307a-e and substrate 1303 are only shown.

In one embodiment, the pre-combined structure of joint head 1307a-e illustrates with dotted line (that is, chain-dotted line). In described pre-combined structure, the spacing between joint head 1307a-e can be relatively small, and the joint head namely adjoined can be close together. The combined structure solid line of joint head 1307a-e illustrates. In described combined structure, the spacing between joint head 1307a-e can be more wider than described pre-combined structure, and the joint head namely adjoined can farther separate. Should be appreciated that this operation can be realized by the joint head 1307a-e at slide on rails, as described in reference Fig. 9-11.

In one embodiment, adjoin the spacing between joint head 1307a-e to arrange according to the alignment mark on substrate 1303. Specifically, substrate 1303 can include the grid of the alignment mark of cross shape. Described grid can include multirow alignment mark and multiple row alignment mark, for instance, three row and ten arrange. Two example alignment labelling 1304a and 1304b indicate on Figure 15 b. Two alignment mark 1304a and 1304b adjoin alignment mark in going together mutually. The unit pitch of the spacing definable substrate 1303 between two alignment mark 1304a and 1304b. Described unit pitch can be about 20mm. Every pair of spacing adjoined between labelling in colleague mutually can be equal unit pitch. It can be equal unit pitch that in same column every pair adjoins the spacing between labelling.

In one embodiment, each alignment mark can represent the binding site for chip. Addition or alternatively, multiple alignment marks can represent the binding site (such as, as in Figure 14 d) of one single chip. Addition or alternatively, only some alignment marks can represent a part for binding site or binding site. In the embodiment of Figure 15 b, each alignment mark represents the center of binding site. How explained later device 1300 combines in the case.

In one embodiment, in combined structure, the spacing adjoined between joint head of joint head 1307a-e is set to the twice of unit pitch. In the first binding operation, chip can be combined the alignment mark to the top line of the alignment mark of substrate 1303 every an alignment mark by each joint head 1307a-e. Therefore, this first operated after, in the top line of alignment mark, will have the chip of combination every an alignment mark. In the second binding operation, the gap in described top line will be filled, so that each alignment mark in the top line of alignment mark will have the chip of combination. Subsequently, this process can continue on for each descending of alignment mark. In this way, chip can be combined each alignment mark to substrate 1303 by joint head 1307a-e. In one embodiment, can make in differing order, for instance, the first binding operation can be executed successively for each row, and then, the second binding operation can be executed successively for each row.

Figure 15 c illustrates the further operation of the device 1300 according to embodiment. Figure 15 c illustrates further substrate 1350, and it includes three row alignment marks and eight row alignment marks. Owing to device 1300 includes five joint head 1307a-e, and having eight row, a joint head in described joint head can be excluded outside described binding operation. Therefore, in one embodiment, by making joint head 1307e slide into the end of guide rail, joint head 1307e can be removed from described binding operation, as described in above with reference to Figure 11 b. Therefore, described dotted line represents all joint head 1307a-e pre-combined structure closely separated together. But, described solid line represents the joint head 1307a-d combined structure separated by double unit pitch, and joint head 1307e removes from substrate 1350, in order to joint head 1307e is not included in described binding operation. Therefore, similar binding operation can be performed, as described in above with reference to Figure 15 b, in order to use joint head 1307a-d to combine chip to each alignment mark on substrate 1350.

Figure 15 d illustrates the further operation of the device 1300 according to embodiment. Figure 15 d illustrates further substrate 1360, and it includes three row alignment marks and ten string alignment marks. Owing to device 1300 includes five joint head 1307a-e, and there are ten string, use all five joint head 1307a-e rather than to make the end that one or more joint head moves to guide rail be effective. Described binding operation will be identical with the binding operation of Figure 15 b; But, joint head 1307e will have in conjunction with three row, and other joint head 1307a-d will have in conjunction with two row. Therefore, in one embodiment, different joint heads can perform the binding operation of varying number. Such as, in conjunction with last chip (that is, the right column) chip tray 1309 of each row is placed a chip only. Described chip can with chip 1314e in identical position.

In one embodiment, adjoin the spacing between joint head 1307a-e to be determined based on predetermined algorithm by controller. Described algorithm can receive the quantity of the joint head such as described device, the binding site on substrate quantity, the spacing adjoining between binding site, as described in the input of binding site layout on substrate. Some or all in these inputs can such as be predefined by the operator of described device. Some or all in these inputs can be determined by the visual system of described device. Under any circumstance, based on described input, controller can determine that the quantity of stand-by joint head, the spacing adjoining between joint head and the combined amount performed by each joint head used.

Figure 16 illustrates binding sequence 1400 embodiment performed by device 1300 embodiment shown in Figure 17 a-d. Before described binding sequence starts, device 1300 is in the structure as described in above with reference to Figure 17 a.

Step 1402 can more specifically be found out from Figure 17 a. In step 1402, described substrate 1303 is made to move in joint head 1307a-e location below in conjunction with platform, in order to make chip relative to their corresponding binding site. Substrate 1303 includes three row alignment marks and ten string alignment marks. Owing to device 1300 includes five joint head 1307a-e, and having ten string, it is effective for using all five joint head 1307a-e. Described binding operation will be similar to that the binding operation of Figure 15 d. Therefore, joint head 1307e will have in conjunction with three row, and other joint head 1307a-d will have in conjunction with two row. As from 17a it can be noted that the joint head 1307a-e alignment mark that is positioned directly on substrate 1303 the most descending above. Additionally, there is the joint head above an alignment mark being positioned in lowermost row, but there are two unlapped alignment marks at the low order end of lowermost row.

Also in step 1402, feeder 1309 moves to feed position from loading position. Once be in feed position, joint head 1307a-e picks up the different chips chip 1314a-e from chip tray 1310.

Step 1404 can more specifically be found out from Figure 17 b. In step 1404, feeder 1309 returns its loading position. The alignment of each chip 1314a-e binding site (that is, alignment mark) corresponding to chip that visual system 1206 is then checked on its corresponding joint head. For each chip and binding site for, offset and used the image caught by described visual system to determine by controller. Described skew represents that the joint head introduced by chip with its corresponding binding site alignment and/or what motion in conjunction with platform are necessary. Such as, first visual system 1206 can catch chip 1314a image on joint head 1307a. It follows that described visual system can catch binding site image on substrate 1303. Required X, Y and/or the �� that be directed at described binding site that be introduced into needed for described chip moves and can be calculated by described controller. Described controller can promote joint head 1307a amount needed for chip is directed at by the motion of X, Y and/or �� direction with described binding site subsequently. This process is repeatable for other joint head 1307b-e subsequently. In one embodiment, the image for multiple chips and binding site can be captured, and can determine that multiple skew subsequently and perform alignment motion. When this process terminates, each chip 1314a-e is directed at its corresponding binding site on substrate 1303. In one embodiment, except joint head 1307b-e, described movable in conjunction with platform.

Step 1406 can more specifically be found out from Figure 17 c. In step 1406, visual system 1206 moves to its clear position from joint head 1307a-e. Each joint head 1307a-e performs their chip moving both vertically to substrate. Each joint head 1307a-e discharges its chip moving both vertically subsequently and leaves substrate and move to upper mounting plate. Joint head 1307a-e can as integrally moving both vertically. This operation can be similar to the operation of the step 1106 of reference Figure 11 as mentioned above. It follows that new chip 1370a-e is placed on feeder 1309 prepares follow-up binding operation. Such as, new chip 1370a-e is bonded to the different rows of colleague or the alignment mark mutually of alignment mark.

After decision block 1408 is present in step 1406. In decision block 1408, it may be judged whether complete to combine. If completing to combine, then cohesive process terminates. Alternatively, be not fully complete if combined, then cohesive process is back to step 1402.

Should be appreciated that each joint head 1307a-e can move independently of one another as one together motion or joint head. Such as, namely all joint head 1307a-e can perform motion in X, Y and/or �� direction simultaneously together. Alternatively, a joint head can perform motion independent of at least one other joint head in X, Y and/or �� direction. Alternatively, the motion in a direction can be performed together by joint head, but can be independently executed by different joint heads in the motion of other direction. Such as, vertical (that is, Z-direction) motion can be performed by all joint heads as one. But, level (that is, X and/or Y) and/or angle (that is, ��) motion can be performed independent of other joint head by each joint head.

Figure 18 illustrates the blocked operation of the vision camera 1206 of the device 1300 according to embodiment. This operation is similar to the operation of Figure 14 d. But, although the operation of Figure 14 d is relevant to the alignment of its respective chip binding site to one single chip, but the operation of Figure 18 is relevant to the alignment of its corresponding binding site on substrate 1600 to five chips (1314a-e).

In one embodiment, as can be seen from Figure 18, chip 1314a is intended to combined so that two diagonal angles of chip 1314a are respectively aligned to two alignment marks on substrate 1600. Therefore, in operating first, visual system 1206 moves to catch chip 1314a at the image being positioned on the joint head 1307a above substrate 1600. In operating second, first visual system 1206 moves to position 1602, to catch the image of first alignment mark in two alignment marks. Subsequently, visual system 1206 moves to position 1604, to catch the image of second alignment mark in two alignment marks. At this point, visual system 1206 moves to perform the similar procedure for chip 1314b and binding site thereof subsequently. After this, this process is recycled and reused for each remaining chip, i.e. chip 1314c, 1314d and 1314e. Visual system 1206 is then returned to its clear position. The path of visual system 1206 is represented by arrow in figure 18.

In view of above-mentioned, catch the total of three image for each chip and binding site pair. Each image can compare with reference position, in order to determines whether described chip is directed at corresponding binding site. If there being two misalignments, then calculate skew, and make the described joint head in conjunction with platform and/or correspondence move to realize alignment. This process is similar to reference to the process described in Figure 14 d.

It may be noted that described controller can promote each joint head to move to alignment once the image catching correspondence. Alternatively, described controller can promote the wait of some or all joint heads that all joint heads are completed image capturing before promoting joint head to move to alignment.

Figure 19 is the flow chart according to the embodiment method 1700 for combining. Method 1700 can be suitable for being bonded on substrate multiple semiconductor chip junctions. Method 1700 can use the device of Fig. 1 or the device of Figure 14 a-g to perform. For clarity sake, described method is referred to Fig. 1 and describes.

In step 1702, substrate is receiving in conjunction with on platform 8. Such as, described substrate can be placed in conjunction with on platform either manually or by some machinerys.

In step 1704, chip is obtained by the first joint head 4. Described chip can be the first chip combined according to this method. Described chip can be obtained by joint head 4 as mentioned above. Such as, load maintainer can be used for from wafer, chip is transferred to feeder, and described feeder can be used for presenting described chip to described joint head.

In step 1706, the first joint head 4 and moving relative to each other in conjunction with platform 8, with by the first chip on the first joint head 4 with in conjunction with the base plate alignment on platform 8. Joint head 4 and/or movable in conjunction with platform 8. Visual system can be used for determining that what motion is to realize necessary to alignment. This is described in detail above.

In step 1708, next chip is obtained by the second joint head 6. Next chip can be the second chip combined according to this method. Described chip can be obtained by joint head 6 as mentioned above. Such as, load maintainer can be used for from wafer, chip is transferred to feeder, and described feeder can be used for presenting described chip to described joint head.

In step 1710, the first chip is incorporated in described substrate. Specifically, the first joint head 4 moves in conjunction with platform 8, so that the first chip contacts with described substrate. It follows that joint head 4 discharges the first chip. Subsequently, the first joint head 4 bounces back from described in conjunction with platform.

In step 1712, the second joint head 6 and moving relative to each other in conjunction with platform 8, with by the second chip on the second joint head 6 with in conjunction with the base plate alignment on platform 8. Joint head 6 and/or movable in conjunction with platform 8. Visual system can be used for determining that what motion is to realize necessary to alignment. This is described in detail above.

In step 1714, the second chip is incorporated in described substrate. Specifically, the second joint head 6 moves in conjunction with platform 8, so that the second chip contacts with described substrate. It follows that joint head 6 discharges the second chip. Subsequently, the second joint head 6 bounces back from described in conjunction with platform.

In step 1716, if completing to combine, i.e. only two chips will in conjunction with to described substrate, then described method terminates. On the other hand, if it is necessary for further combining, then processes stream and return step 1704. But, the 3rd chip and fourth chip are combined to described substrate by this stage of described method. The other stage of described method can be performed, to combine other chip to described substrate. Such as, described method can be used for combining to described substrate ten, 20 or 100 chips. Additionally, certain methods step can not perform in some stages, in order to the chip of Odd number can be incorporated in described substrate.

In one embodiment, after in conjunction with the first chip the first joint head 4 from described bounce back in conjunction with platform after, the 3rd chip obtains on the first joint head 4. In one embodiment, after in conjunction with the second chip the second joint head 6 from described bounce back in conjunction with platform after, fourth chip obtains on the second tieing 6.

In one embodiment, the first joint head 4 release chip before, heat by the chip of its acquisition after the coupling. Such as, joint head 4 can begin to heat described chip at an acquisition chip. Alternatively, joint head 4 can begin to warm up described chip after carrying out chip alignment or completing chip alignment. Second joint head 6 can run in a corresponding way.

In one embodiment, the first joint head 4 can, after performing integrating step, namely delay to obtain follow-up chip after release chip. Such as, the first joint head 4 is likely to needs and cools down, in order to be not too hot when it obtains new chip. Too hot possible thermal shock new chip, this can cause the damage of chip. Second joint head 6 can run in a corresponding way.

In one embodiment, some steps of method 1700 can be rearranged. Such as, the first joint head 4 can before step 1712 and/or step 1714 or period obtain chip (such as, the 3rd chip). In one embodiment, the first joint head 4 can obtain chip between step 1712 and 1714. And, the second joint head 6 can delay to obtain chip (such as, fourth chip) until after step 1710.

The advantage of method 1700 is in that one joint head can cool down and/or heat at other joint head when alignment, combination or acquisition chip. In this way, it is possible to make yield reach maximum. Specifically, the time is not wasted for joint head cooling or heating, because this time has been used for combining relevant operation by other joint head.

In the above-described embodiments, described in conjunction with platform be configurable for receive substrate. In certain embodiments, described can include for guaranteeing the device that described substrate receives with specific orientation in conjunction with platform. Can include for guaranteeing that described substrate is once be received with regard to no motion of device it addition, described in conjunction with platform. Such as, the described surface in conjunction with platform can include being sized and shaped for the depressed part of coupling substrate. Therefore, described substrate may fitted in described depressed part to guarantee its orientation. It is addition or alternatively, described that can to include being configurable for making described substrate be maintained in conjunction with platform described in conjunction with the other machinery (such as, fixture or securing member) on platform. And, described can include being configurable for being attracted to described substrate the described magnetic means in conjunction with platform in conjunction with platform.

The above embodiments relate to combine chip the device to substrate or method. In one embodiment, described chip is integrated circuit or monolithic integrated optical circuit (also referred to as IC or microchip). In one embodiment, described chip is on a little thin plate of semi-conducting material, for instance silicon or one group of electronic circuit on GaAs (GaAs). In one embodiment, described substrate can be material bands, such as silicon, GaAs (GaAs), pottery, BT resin, epoxy resin, FR4 or polymer. In one embodiment, described substrate serves as semiconductor chip and is deposited thereon the base material in face. In one embodiment, described substrate may be included near substrate and combining the one or more conductive traces transmitting electric charge between the different chips of described substrate.

In one embodiment, described chip and/or substrate can comprise for described chip is combined the intermediate materials to described substrate. Such as, described intermediate materials can be solder. In operation, described chip can be mechanically bonded to described substrate by described intermediate materials. It addition, described intermediate materials can protect a part for described chip and/or substrate in order to avoid physical damage. It addition, described intermediate materials can be conduction, to promote that electric charge flows between described chip and described substrate.

The above embodiments relate to be bonded to semiconductor chip junction the device of substrate. Described device includes multiple joint head and in conjunction with platform. Each joint head of the plurality of joint head may operate to obtain and release chip. Described in conjunction with platform may operate to receive substrate. And, each joint head of the plurality of joint head can make the chip obtained by joint head contact in conjunction with the substrate received on platform with described and discharge described chip so that described chip to combine extremely described substrate relative to described in conjunction with platform relative motion may operate to. In one embodiment, described device may also include and the described controller communicated in conjunction with each joint head in platform and the plurality of joint head. It addition, described controller can control each joint head of the plurality of joint head with relative to described in conjunction with platform relative motion and make the chip obtained by joint head contact in conjunction with the substrate received on platform with described and discharge described chip so that described chip to combine extremely described substrate.

It is to be understood that, one or more features of one embodiment of above-described embodiment can combine with one or more features of one or more other embodiments of above-described embodiment, with the one or more new embodiment that formation is contained by the scope of appended claims.

It should be apparent to a person skilled in the art that when without departing from the scope of appended claims, the one or more embodiments in above-described embodiment can be carried out various modification and change. Therefore, all aspects of above-described embodiment should be regarded as illustrative and not restrictive.

Claims

1., for semiconductor chip junction is bonded to a device for substrate, described device includes:

Framework;

Multiple joint heads, it is coupled to described framework, and each joint head is operable to obtain and release chip; And

In conjunction with platform, it is coupled to described framework and operable to receive substrate;

Each joint head in the plurality of joint head is relatively movable in conjunction with platform relative to described, and may operate to make the chip obtained by described joint head contact in conjunction with the substrate received on platform with described and discharge described chip so that described chip to combine extremely described substrate.

2. device according to claim 1, wherein, at least two joint head in the plurality of joint head is operable such that the chip obtained by described at least two joint head moves in conjunction with platform relative to described as one.

3. device according to claim 2, wherein, described at least two joint head be operable such that by described at least two joint head obtain chip as one be parallel to described in conjunction with the plane of the plane of platform in motion.

4. the device according to claim 2 or claim 3, wherein, described at least two joint head be operable such that by described at least two joint head obtain chip as one towards described in conjunction with platform or away from described in conjunction with platform move.

5. the device according to arbitrary aforementioned claim, wherein, a joint head in the plurality of joint head is operable such that the chip obtained by one joint head is relative to the chip relative motion obtained by another joint head in the plurality of joint head.

6. device according to claim 5, wherein, one joint head be operable such that the chip obtained by one joint head independent of the chip obtained by another joint head described be parallel to described in conjunction with the plane of the plane of platform in motion.

7. the device according to claim 5 or claim 6, wherein, one joint head is operable such that the chip that obtained by one joint head moves in conjunction with platform in conjunction with platform or away from described towards described independent of the chip obtained by another joint head described.

8. the device according to arbitrary aforementioned claim, wherein, the plurality of joint head is removably coupled to described framework, and described joint head is by linear arrangement, and wherein, adjoin to joint head between spacing be adjustable.

9. device according to claim 8, wherein, the plurality of joint head is coupled to described framework via guide rail, and each joint head operable with described slide on rails with regulate adjoin to joint head between spacing.

10. device according to claim 9, wherein, the length dimension of described guide rail is provided so that when at least one joint head slides to the end of described guide rail, at least one joint head described and described restricted in conjunction with the relative motion between platform so that at least one joint head described can not make the chip obtained by least one joint head described contact described substrate.

11. the device according to claim 9 or 10, wherein, described guide rail is removably coupled to described framework, and described guide rail includes driving mechanism, described driving mechanism may operate to make described guide rail to described in conjunction with platform motion or away from described in conjunction with platform motion so that the plurality of joint head moves in conjunction with platform to described in conjunction with platform motion or away from described.

12. according to the device described in arbitrary aforementioned claim, wherein, described framework includes the first platform and the second relative platform, described first platform is separated by least one pillar and described second platform and is remained parallel to described second platform, and the plurality of joint head is coupled to described first platform and described is coupled to described second platform in conjunction with platform.

13. device according to claim 12, wherein, described it is removably coupled to described second platform in conjunction with platform, and described includes may operate to the mobile described driving mechanism in conjunction with platform in the plane being parallel to described second platform in conjunction with platform.

14. according to the device described in arbitrary aforementioned claim, also include the feeder being removably coupled to described framework, described feeder includes the driving mechanism that may operate to make described feeder move between loading position and feed position, wherein, at described loading position, described feeder is configured to receive chip, in described feed position, described feeder is configured to present chip to a joint head in the plurality of joint head, in order to one joint head can obtain chip from described feeder.

15. device according to claim 14, wherein, described feeder may operate to receive at least two chip and present each chip to the different joint heads in the plurality of joint head.

16. the device according to claims 14 or 15, also including load maintainer, when described feeder is in described loading position, described load maintainer may operate to be loaded into described feeder chip from wafer.

17. according to the device described in arbitrary aforementioned claim, also include the photographic head being removably coupled to described framework, described photographic head includes may operate to make described photographic head relative to the plurality of joint head and the described driving mechanism in conjunction with platform motion, described photographic head is configurable for measuring at least one joint head relative to the described position in conjunction with platform, wherein, move with aligned with each other at least one joint head described and the described position that may operate to survey according to described photographic head in conjunction with platform.

18. device according to claim 17, wherein, described photographic head is configured at least one joint head described and described in conjunction with motion between platform, described photographic head has for measuring at least one joint head described first lens relative to the position of benchmark, and for measuring described the second lens in conjunction with platform relative to the position of described benchmark, wherein, at least one joint head described and described in conjunction with platform be configured to according to by described first lens and described second lens measure position move with aligned with each other.

19. according to the device described in arbitrary aforementioned claim, wherein, at least one joint head in the plurality of joint head may operate to heat the chip obtained by least one joint head described.

20. according to the device described in arbitrary aforementioned claim, wherein, when making described chip contact with described substrate, at least one joint head in the plurality of joint head may operate to apply predetermined pressure to described chip.

21. according to the device described in arbitrary aforementioned claim, wherein, at least one joint head in the plurality of joint head includes pumping equipment, wherein, when chip presents at least one joint head described, described pumping equipment is configured to be drawn onto by described chip at least one joint head described and keep suction so that described chip is maintained at least one joint head described, and wherein, described pumping equipment is configured to release suction to be discharged from least one joint head described by described chip.

22. according to the device described in arbitrary aforementioned claim, also include and the described controller communicated in conjunction with each joint head in platform and the plurality of joint head, described controller may operate to control each joint head with relative to described in conjunction with platform relative motion, with the chip obtaining chip and release obtains.

23. device according to claim 16, also include other framework, be coupled to other multiple joint heads of described other framework, be coupled to the other in conjunction with platform and the other feeder being removably coupled to described other framework of described other framework

Wherein, each joint head in described other multiple joint heads other contacts described other in conjunction with the other substrate received on platform in conjunction with platform relatively chip that is movable and that may operate to make to be obtained by described joint head relative to described, and discharge described chip to combine described chip to described other substrate

Wherein, described other feeder includes the driving mechanism that may operate to make described other feeder move between loading position and feed position, at described loading position, described other feeder is configured to receive chip, in described feed position, described other feeder is configured to present described chip to a joint head in described other multiple joint heads, in order to one joint head can obtain described chip from described other feeder, and

Wherein, when described feeder is in described loading position, described load maintainer may operate to be loaded into by chip on described feeder for the joint head presented in the plurality of joint head, and when described other feeder is in described loading position, described load maintainer may operate to the joint head being loaded into by chip on described other feeder for presenting in described other multiple joint heads.

24. for multiple semiconductor chip junctions are bonded to the method on substrate, described method includes:

A. substrate is received in conjunction with on platform;

B. the first chip is obtained by the first joint head;

C. make described first joint head and described move relative to each other in conjunction with platform, with by described first chip on described first joint head with described in conjunction with the described base plate alignment on platform;

D. the second chip is obtained by the second joint head;

E. make described first joint head move in conjunction with platform towards described, so that described first chip contacts described substrate and discharges described first chip so that described first chip combines to described substrate, and make described first joint head bounce back in conjunction with platform from described;

F. make described second joint head and described move relative to each other in conjunction with platform, with by described second chip on described second joint head with described in conjunction with the described base plate alignment on platform; And

G. make described second joint head move in conjunction with platform towards described, so that described second chip contacts described substrate and discharges described second chip so that described second chip combines to described substrate, and make described second joint head bounce back in conjunction with platform from described.

25. method according to claim 24, also include:

Described first joint head from described in conjunction with platform bounce back after, by described first joint head obtain the 3rd chip, and

Described second joint head from described in conjunction with platform bounce back after, by described second joint head obtain fourth chip.

26. the method according to claim 24 or 25, also include:

Before by described first chip release on the substrate, heat described first chip on described first joint head; And

Before by described second chip release on the substrate, heat described second chip on described second joint head.

27. the method according to the claim 26 when being subordinated to claim 25, also include:

After by described first chip release on the substrate, described first joint head is delayed to obtain described 3rd chip, to allow described first joint head cooling; And

After by described second chip release on the substrate, described second joint head is delayed to obtain described fourth chip, to allow described second joint head cooling.