CN105633108B - Multi-camera module and assembly method thereof - Google Patents

Multi-camera module and assembly method thereof Download PDF

Info

Publication number
CN105633108B
CN105633108B CN201510915243.2A CN201510915243A CN105633108B CN 105633108 B CN105633108 B CN 105633108B CN 201510915243 A CN201510915243 A CN 201510915243A CN 105633108 B CN105633108 B CN 105633108B
Authority
CN
China
Prior art keywords
image sensor
camera module
assembling
sensor chips
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510915243.2A
Other languages
Chinese (zh)
Other versions
CN105633108A (en
Inventor
赵立新
侯欣楠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Galaxycore Shanghai Ltd Corp
Original Assignee
Galaxycore Shanghai Ltd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Galaxycore Shanghai Ltd Corp filed Critical Galaxycore Shanghai Ltd Corp
Priority to CN201510915243.2A priority Critical patent/CN105633108B/en
Publication of CN105633108A publication Critical patent/CN105633108A/en
Application granted granted Critical
Publication of CN105633108B publication Critical patent/CN105633108B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

The invention provides an assembly method of a multi-camera module, which comprises the following steps: providing a plurality of image sensor chips with suspended metal wires, wherein the first ends of the metal wires are bonded to bonding pads of the image sensor chips, and the second ends of the metal wires are suspended in the image sensor chips; providing a lens barrel frame, wherein the lens barrel frame is a whole body and is suitable for assembling a plurality of groups of lens modules and a plurality of image sensor chips; and assembling the plurality of image sensor chips and the lens barrel frame to form a standard component, and then assembling the standard component and the circuit board through the second ends of the metal wires to form the multi-camera module.

Description

Multi-camera module and assembly method thereof
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to an assembly method of a multi-camera module.
Background
Currently, a mainstream packaging method of an image sensor (CIS: CMOS Image Sensor) includes: chip scale package (Chip Scale Package, CSP), chip On Board (COB), and Flip Chip package (FC).
The CIS CSP is a packaging technology commonly applied to a middle-low end and low-pixel (2M pixel or below) image sensor at present, and a Die level packaging technology or a Wafer level packaging technology can be adopted. The packaging technology generally uses wafer level glass and wafer bonding and uses dam separation between image sensor chips of the wafer, then through a through silicon via technology (TSV: through Silicon Via) for making a metal connection on the pad surface or the inner hole side of the pad surface or a T-shaped metal contact chip size packaging technology on the side of the pad after dicing, and after extending the circuit on the back of the wafer, a Ball Grid Array (BGA) is made, and then the image sensor unit of a single sealed cavity is formed after dicing. The rear end forms a module assembly structure by an SMT method. However, CSP packages have the following significant problems: 1. affecting product performance: the absorption, refraction, reflection and scattering of light by the thick support glass have a great influence on the performance of the image sensor, especially for small pixel size products; 2. reliability problems: the difference of thermal expansion coefficients between components in the packaging structure and the sealing gas in the cavity have reliability problems in the following SMT process or the change of the use environment of the product; 3. large investment scale, large environmental pollution control requirement, longer production period, higher unit chip cost and especially high-pixel large-size image sensor products.
CIS COB packaging is a Die Level packaging technology currently in common use for high-end, high-pixel product (5M pixels or more) image sensors. The packaging technology uses bonding metal wires on bonding pads of a PCB (printed circuit board) by bonding the back of the ground and cut chip, and mounts a bracket with an IR glass sheet and a lens to form an assembled module structure. However, COB packages have the following significant problems: 1. the dust control is very difficult, the ultra-high clean room grade is needed, and the manufacturing maintenance cost is high; 2. the product design is customized, the period is long, and the flexibility is not enough; 3. the large-scale production is not easy;
CIS FC packages the Die Level packaging technology of the recently emerging high-end, high-pixel (5M pixel or more) image sensors. The packaging technology directly connects the chip bonding pad with the gold bumps made on the bonding pad and the bonding pad of the PCB through the grinding and cutting with all the contact bumps at one time under the action of thermosonic waves to form a packaging structure. The rear end forms a module assembly structure through a bonding pad or a solder ball on the outer side of the PCB by adopting an SMT method. However, FC packaging has the following significant problems: 1. the package has high requirements on the PCB substrate, has a similar thermal expansion coefficient with Si, and has high cost; 2. the manufacturing reliability is very difficult, the consistency requirement of the connection of all the bumps and the bonding pads by thermosonic is very high, the bumps and the bonding pads are hard connected, and the ductility is not good; 3. the dust control difficulty is high, the process environment requirement is high, and the cost is high;
the conventional method for assembling the CIS module is as follows:
step 1, welding an image sensor chip onto a circuit board to form a first component;
step 2, assembling the lens module and the sleeve module to form a second component;
and 3, assembling the first component and the second component to form a complete camera module.
The assembly method of the camera module has the following defects: for the camera module, high-precision mounting equipment is required to be used for carrying out the accurate mounting in the step 3, otherwise, the imaging effect of the camera module is affected, and the qualification rate of the finished product of the assembled camera module is low; especially for the camera module of high pixel, use ordinary erection equipment to hardly accomplish above-mentioned step 3's accurate installation well for the imaging of the camera module of high pixel receives great influence, and the imaging quality of the image of formation is relatively poor, and the imaging quality is especially apparent poor around the image.
In addition, in the image sensor chip packaging process adopting metal wire bonding, the image sensor chip is usually die-bonded (for example, adhered) onto an adapter plate (flexible circuit board), then bonding wire bonding is performed, a first end of the metal wire is connected to a bonding pad of the image sensor chip, and a second end of the metal wire is connected to the adapter plate, so that the image sensor chip and the adapter plate are electrically connected, and then the packaged image sensor chip is connected to the circuit board through a lead wire or a solder ball on the adapter plate.
The existing wire bonding method is easy to cause poor structural flexibility after encapsulation, the subsequent assembly precision requirement of the camera module is high, and the relative positions of the lens and the image sensor chip are difficult to control so as to influence the performance of the camera module; in addition, as the flow of the existing method is longer and the packaging efficiency is lower, the image sensor chip is exposed to the air for a long time, multiple times of detection and cleaning are needed, the yield is reduced, and the cost of the camera module is increased. In particular, for image sensor chips in which the second ends of metal wires are connected by other processes, a new bonding method and apparatus are needed to connect the first ends of the wires to the pads of the image sensor chip, with the second ends of the wires suspended outside the image sensor chip.
In addition, with the daily variation of consumer electronic products, single cameras suitable for portable electronic devices have defects in partial market segments, and focusing capability and dynamic balance have difficulty in meeting requirements under certain conditions. The portable electronic device has a plurality of camera modules, and the plurality of camera modules are applied to a main camera of a smart phone, but in the assembly of the plurality of camera modules, the problems of misalignment of light sensitive surfaces of an image sensor chip, high and low angles and deviation angles exist, and the problem that cannot be solved in the subsequent imaging process can be brought.
In view of the foregoing, a new method for assembling a multi-camera module is a subject to be searched for.
Disclosure of Invention
Based on the above consideration, the present invention provides an assembly method of a multi-camera module, including:
providing a plurality of image sensor chips with suspended metal wires, wherein the first ends of the metal wires are bonded to bonding pads of the image sensor chips, and the second ends of the metal wires are suspended in the image sensor chips;
providing a lens barrel frame, wherein the lens barrel frame is a whole body and is suitable for assembling a plurality of groups of lens modules and a plurality of image sensor chips;
and assembling the plurality of image sensor chips and the lens barrel frame to form a standard component, and then assembling the standard component and the circuit board through the second ends of the metal wires to form the multi-camera module.
Preferably, the photosensitive surfaces of the plurality of image sensor chips are aligned.
Preferably, the metal wire forms an elastic structure, and the second end of the metal wire is 5 micrometers to 300 micrometers lower than the lower surface of the image sensor chip.
Preferably, in the electrical testing process of the standard component, the elastic structure of the metal wire is elastically deformed to provide contact pressure, so that the electrical connection performance of the metal wire and the testing device is improved; in the assembly process of the standard component and the circuit board, the elastic structure of the metal wire is elastically deformed to provide contact pressure, so that the electrical connection performance of the metal wire and the circuit board is improved.
Preferably, the step of assembling the standard component with the circuit board includes: and electrically connecting the second end of the metal wire with the circuit board through a pressing contact mode, a quick welding mode, a conductive adhesive mode or a non-conductive adhesive mode.
The invention also provides a multi-camera module, which is characterized by comprising:
the image sensor chip is electrically connected with suspended metal wires, the first ends of the metal wires are bonded to the bonding pads of the image sensor chip, and the second ends of the metal wires are suspended in the image sensor chip;
the lens barrel frame is a whole body suitable for assembling a plurality of groups of lens modules and a plurality of image sensor chips, and the lens barrel frame and the image sensor chips are assembled to form a standard part; wherein the light sensitive surfaces of the plurality of image sensor chips are respectively parallel and have no inclination angle;
and the circuit board is electrically connected with the standard component through the second end of the metal wire.
Preferably, the plurality of image sensor chips are aligned with the photosensitive surface.
Preferably, the metal wire forms an elastic structure and the second end of the metal wire is lower than the lower surface of the image sensor chip by 5 micrometers to 300 micrometers.
Preferably, the second end of the metal wire is connected with the circuit board in a pressing contact mode, a quick welding mode, a conductive adhesive mode or a non-conductive adhesive mode.
The assembling method of the multi-camera module can accurately assemble the multi-camera module by using common mounting equipment, overcomes the defect that the high-precision mounting equipment is needed in the assembling method of the multi-camera module in the prior art, is simple and easy to implement, is easy to adjust the focal plane from an image sensor chip to a lens, is easy to correct the inclination of the lens and the image sensor chip, and ensures the optical performance of the multi-camera module after the assembly is finished.
The chip of the image sensor is formed into the suspended metal wire through the bonding metal wire, the integral lens barrel frame is further assembled with the plurality of image sensor chips, the suspended end of the metal wire is electrically connected with the circuit board, the metal wire is of an elastic structure, elastic deformation can be generated, the electrical performance can be better improved, and the invention has more technological advantages than the SMT connection of the bonding pad, the BGA and the soldering tin of the traditional CSP; and the lens barrel frame is a whole body and can be assembled with a plurality of image sensor chips, the photosensitive surfaces of the image sensor chips are aligned, and the assembly precision of the multi-camera module and the performance of the module are improved.
The invention uses gold wires to directly connect the chip and the PCB substrate bonding pad, and the gold wires have good extensibility, strong environmental adaptability and good reliability. The lens barrel frame can form an open structure with the image sensor chip, so that stray light of light rays in the camera module is effectively reduced, and the module performance is provided.
By the method for forming the multi-image sensor module, positioning and assembling precision between the image sensors can be guaranteed, misalignment and angle deviation of the photosensitive surfaces of the image sensors are avoided, and imaging performance degradation of the multi-image sensor module due to the assembling precision is avoided.
Various aspects of the invention will become apparent from the following description of specific embodiments.
Drawings
Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments which follows, which is read in connection with the accompanying drawings.
FIG. 1 is a schematic diagram of an image sensor chip with suspended metal wires according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a standard component according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a camera module according to an embodiment of the invention;
fig. 4 is a flowchart of an assembling method of a camera module according to the present invention.
In the drawings, the same or similar reference numerals denote the same or similar devices (modules) or steps throughout the different drawings.
Detailed Description
In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof. The accompanying drawings illustrate, by way of example, specific embodiments in which the invention may be practiced. The illustrated embodiments are not intended to be exhaustive of all embodiments according to the invention. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
In order to more clearly illustrate the packaging method of the present invention, in the following examples, glass is used as a substrate. Those skilled in the art will appreciate that the substrate may be constructed of other transparent materials.
FIG. 1 is a schematic diagram of an image sensor chip with suspended metal wires according to an embodiment of the present invention; FIG. 2 is a schematic diagram of a standard component according to an embodiment of the present invention; FIG. 3 is a schematic diagram of a camera module according to an embodiment of the invention; fig. 4 is a flowchart of an assembling method of a camera module according to an embodiment of the invention.
As shown in fig. 4, referring to fig. 1 to 3, the packaging method includes the following steps:
s10: providing a plurality of image sensor chips 110 with suspended metal wires 120, wherein first ends 121 of the metal wires 120 are bonded to bonding pads 111 of the image sensor chips 110, and second ends 122 are suspended from the image sensor chips 110;
in this step, the front surface of the image sensor chip 110 has an image sensing region 112 and a pad region 113 surrounding the image sensing region 112, and the pad region 113 includes a plurality of pads 111. In this step, the second end of the metal wire 120 is suspended and not bonded with any medium, and the metal wire is gold wire, silver wire, copper wire, etc. with good wire performance and elastic structure, and can be elastically deformed when acting force is applied to the second end 122;
referring to fig. 2, step S20: providing a lens barrel frame 131, wherein the lens barrel frame 131 is integrally suitable for assembling a plurality of groups of lens modules 132 and a plurality of image sensor chips 110;
step S30: the plurality of image sensor chips 110, the lens barrel frame 131 and the lens module 132 are assembled to form a standard component 200, and then the standard component 200 and the circuit board 300 are assembled to form a camera module 400 through the second ends of the metal wires 120.
In this step, the image sensor chip 110 with suspended metal wires, the lens barrel frame 131 (mounting frame) and the lens module 132 located inside the lens barrel frame, in an embodiment, the inner surface of the lens barrel frame 131 further has a step 1311, the step 1311 is disposed corresponding to one end of the lens 132 facing the image sensor chip 110, and is suitable for assembling a package substrate 140, the package substrate 140 is made of glass or plastic, and the surface of the package substrate 140 is covered with an IR film or an AR film; in another embodiment, the step 1311 and the package substrate 140 are not provided, and the surface of the lens 132 near the image sensing region 112 is directly covered with an IR film or an AR film.
After the assembly of the standard component 200 is completed, the standard component 200 and the circuit board 300 are assembled to form the camera module 400 by a second end 122 of the metal wire in a press contact mode, a quick welding mode, a conductive adhesive mode or a non-conductive adhesive mode.
Specifically, in the first embodiment, the second end 122 is in good contact with the bonding pad 310 on the circuit board 300 by using a press-fit contact manner, and the standard component 200 is fixed to a partial area of the circuit board 300 by using a snap-fit or adhesive manner.
In the second embodiment, a quick welding mode is adopted, and the specific modes are as follows: plating a gold-tin alloy welding layer on the second end 122 of the metal wire or the bonding pad 310 of the circuit board 300, and controlling heat conduction of a welding area through local quick welding so as not to influence the performance of the lens component;
and (one) a gold-plating tin alloy mode of a bonding pad: s201, providing a camera module, wherein the camera module comprises a lens sensitive to temperature, and further comprises a metal wire with one end suspended and electrically connected with an image sensor chip; s203, providing a circuit board with a plurality of bonding pads; and S205, a solder layer is pre-attached to the bonding pad of the circuit board, and the suspended end of the metal wire and the bonding pad of the circuit board are quickly welded. The metal wire is gold thread, and the diameter of gold thread is more than or equal to 10 microns, and the solder layer is tin layer for through controlling tin layer's thickness, make in the quick local welding of follow-up, gold thread and tin layer can form the higher gold-tin alloy welded layer of stable gold content. In another embodiment: the step of pre-attaching the solder layer to the pads of the circuit board further comprises: s206, adopting a printing process and attaching solder on the bonding pad of the circuit board, and reflowing to form a solder layer. In another embodiment, the step of pre-attaching the solder layer to the pads of the circuit board further comprises: s206' attaching a solder layer on the bonding pad of the circuit board by wave soldering process. In one embodiment, a method of controlling a thickness of a tin layer includes: parameters of the wave soldering process are controlled so that the thickness of the tin layer is smaller than the diameter of the gold wire. In another embodiment, a method of controlling a thickness of a tin layer includes: and (3) attaching solder paste to a bonding pad of the circuit board by adopting a printing process, forming a tin layer by reflow soldering, and enabling the tin layer to be smaller than the proceeding thickness by adopting an air knife mode, a suction gun suction mode or a welding head adhesion mode. The thickness of the tin layer is smaller than that of the gold wire, and the gold-tin alloy has good material advantages in the welding process, can reduce crystal brittleness, and has the characteristics of good fluidity, low resistivity and good thermal conductivity. The quick welding comprises the following steps: the pulse hot-press welding process, the laser welding process and the ultrasonic hot-press welding process are adopted, the rapid welding is a local welding mode, and the heating range is smaller than 1/2 of the area of the bottom of the camera module.
S101 provides a camera module, wherein the camera module comprises a lens sensitive to temperature, and the camera module further comprises a metal wire with one end suspended and electrically connected with the image sensor chip; s103, providing a circuit board with a plurality of bonding pads; and S105, pre-attaching a solder layer on the suspension end of the metal wire, and rapidly welding the suspension end of the metal wire and a bonding pad of the circuit board. The metal wire is gold thread, and the diameter of gold thread is more than or equal to 10 microns, and the solder layer is tin layer for in the quick local welding of follow-up, gold thread and tin layer can form the gold-tin alloy welded layer that stable gold content is higher (rich gold), and wherein tin layer thickness is less than gold thread thickness, and gold-tin alloy has good material advantage in the welding process, can reduce the brilliant crisp, has the mobility and is good, and the resistivity is low, characteristics that the thermal conductivity is good. The quick welding comprises the following steps: the pulse hot-press welding process, the laser welding process and the ultrasonic hot-press welding process are adopted, the rapid welding is a local welding mode, and the heating range is smaller than 1/2 of the area of the bottom of the camera module.
In the third embodiment, a conductive adhesive is adhered to the suspension end of a specific metal wire in advance, and in this embodiment, the conductive adhesive is silver paste, so that the suspension end of the metal wire and a bonding pad of the circuit board are electrically connected by curing. The silver paste has good adhesiveness and conductivity, can be used for preparing point electrode paste, and still has good performance according to controllability after solidification. The metal wire is gold wire, the diameter of the gold wire is more than or equal to 5 microns, and the thickness of the silver paste is 2 microns to 100 microns. The curing mode is performed by adopting a heat curing mode or a UV curing mode. The silver paste in this embodiment comprises the following components: epoxy resin glue or UV glue and tiny silver flake, the thickness of the silver paste is as follows: 2 microns to 100 microns. In addition, it is also possible to use: and the bonding pad of the circuit board is pre-attached with silver paste, and the suspended end of the metal wire is solidified and electrically connected with the bonding pad of the circuit board. The silver paste has good adhesiveness and conductivity, can be used for preparing point electrode paste, and still has good performance according to controllability after solidification. The metal wire is gold wire, the diameter of the gold wire is more than or equal to 5 microns, and the thickness of the silver paste is 2 microns to 100 microns. The curing mode is performed by adopting a heat curing mode or a UV curing mode. The silver paste in this embodiment comprises the following components: epoxy resin glue or UV glue and tiny silver flake, the thickness of the silver paste is as follows: 2 microns to 100 microns. In this embodiment, the conductive adhesive may also be made of other metal materials with conductive properties.
In the fourth embodiment, a non-conductive adhesive may be used, but the second ends 122 of the metal wires need to have good electrical contact with the pads of the circuit board.
After the standard component 200 is formed, the standard component 200 may be further tested, and in the electrical testing process of the standard component 200, the elastic structure of the metal wire 120 is elastically deformed to provide a contact pressure, and since the second end 122 of the metal wire is lower than the lower surface of the image sensor chip 110 by 5 micrometers to 300 micrometers (please refer to fig. 1, the distance is h), the connection performance between the metal wire 120 and the testing device (not labeled) is improved; in the assembly process of the standard component 200 and the circuit board 300, the elastic structure of the metal wire 120 is elastically deformed to provide a contact pressure, and the second end 122 of the metal wire is lower than the lower surface of the image sensor chip 110 by 5 micrometers to 300 micrometers (see fig. 1, the distance is h), so that the connection performance between the metal wire and the circuit board can be improved. Referring to fig. 4, a broken line 120' in fig. 4 shows a first shape state of the metal wire 120 when the standard component 200 is not assembled with the circuit board 300; the solid line 120″ shows the second shape of the metal wire after the assembly of the standard component 200 and the circuit board 300 is completed, and at this time, the second shape of the metal wire is elastically deformed, so that the second end of the metal wire is in better contact with the pad, which is beneficial to signal transmission, and at this time, the contact area between the second end and the pad is greater than or equal to 0.01 square millimeter.
The invention also provides a multi-camera module, comprising: the image sensor chip is electrically connected with suspended metal wires, the first ends of the metal wires are bonded to the bonding pads of the image sensor chip, and the second ends of the metal wires are suspended in the image sensor chip; the lens barrel frame is a whole body suitable for assembling a plurality of groups of lens modules and a plurality of image sensor chips, and the lens barrel frame and the image sensor chips are assembled to form a standard part; wherein the light sensitive surfaces of the plurality of image sensor chips are respectively parallel and have no inclination angle; and the circuit board is electrically connected with the standard component through the second end of the metal wire.
The plurality of image sensor chip photo-sensitive surfaces are aligned. The metal wire forms an elastic structure and the second end of the metal wire is 5 micrometers to 300 micrometers lower than the lower surface of the image sensor chip. The second end of the metal wire is connected with the circuit board in a pressing contact mode, a quick welding mode, a conductive adhesive mode or a non-conductive adhesive mode.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. Thus, the embodiments should be considered in all respects as illustrative and not restrictive. Furthermore, it is evident that the word "comprising" does not exclude other elements or steps, and that the word "a" or "an" does not exclude a plurality. The elements recited in the apparatus claims may also be embodied by one element. The terms first, second, etc. are used to denote a name, but not any particular order.

Claims (7)

1. The assembling method of the multi-camera module is characterized by comprising the following steps of:
providing a plurality of image sensor chips with suspended metal wires, wherein the first ends of the metal wires are bonded to the bonding pads of the image sensor chips, the second ends of the metal wires are suspended from the image sensor chips, the metal wires form an elastic structure, and the second ends of the metal wires are lower than the lower surface 5 of the image sensor chips
From microns to 300 microns;
providing a lens barrel frame, wherein the lens barrel frame is a whole body and is suitable for assembling a plurality of groups of lens modules and a plurality of image sensor chips;
assembling the plurality of image sensor chips and the lens barrel frame to form a standard component, and then assembling the standard component and a circuit board through the second end of the metal wire to form a multi-camera module;
in the electrical test process of the standard component, the elastic structure of the metal wire is elastically deformed to provide contact pressure, so that the electrical connection performance of the metal wire and the test device is improved; in the assembly process of the standard component and the circuit board, the elastic structure of the metal wire is elastically deformed to provide contact pressure, so that the electrical connection performance of the metal wire and the circuit board is improved.
2. The method of assembling a multi-camera module of claim 1, wherein the photosensitive surfaces of the plurality of image sensor chips are aligned.
3. The method of assembling a multiple camera module of claim 1, wherein the step of assembling the standard with a circuit board comprises: and electrically connecting the second end of the metal wire with the circuit board through a pressing contact mode, a quick welding mode, a conductive adhesive mode or a non-conductive adhesive mode.
4. A multi-camera module assembled by the assembling method of the multi-camera module according to claims 1 to 3, comprising:
the image sensor chip is electrically connected with suspended metal wires, and the first ends of the metal wires are bonded to bonding pads of the image sensor chip;
the lens barrel frame is a whole body suitable for assembling a plurality of groups of lens modules and a plurality of image sensor chips, and the lens barrel frame and the image sensor chips are assembled to form a standard part; wherein the light sensitive surfaces of the plurality of image sensor chips are respectively parallel and have no inclination angle;
and the circuit board is electrically connected with the standard component through the second end of the metal wire.
5. The multi-camera module of claim 4, wherein the plurality of image sensor chip photosites are aligned.
6. The multi-camera module of claim 4, wherein the metal wire forms a resilient structure.
7. The multi-camera module of claim 4, wherein the second ends of the metal wires are connected to the circuit board by press-fit contact, flash soldering, conductive adhesive, or non-conductive adhesive.
CN201510915243.2A 2015-12-10 2015-12-10 Multi-camera module and assembly method thereof Active CN105633108B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510915243.2A CN105633108B (en) 2015-12-10 2015-12-10 Multi-camera module and assembly method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510915243.2A CN105633108B (en) 2015-12-10 2015-12-10 Multi-camera module and assembly method thereof

Publications (2)

Publication Number Publication Date
CN105633108A CN105633108A (en) 2016-06-01
CN105633108B true CN105633108B (en) 2024-04-12

Family

ID=56047857

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510915243.2A Active CN105633108B (en) 2015-12-10 2015-12-10 Multi-camera module and assembly method thereof

Country Status (1)

Country Link
CN (1) CN105633108B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107301988B (en) * 2017-05-27 2023-06-13 格科微电子（上海）有限公司 Camera module and assembly method thereof
CN109256359A (en) * 2017-07-14 2019-01-22 格科微电子（上海）有限公司 The encapsulating structure of imaging sensor
CN109698896A (en) * 2017-10-24 2019-04-30 格科微电子（上海）有限公司 Camera module and its electrical connection methods
CN108881689B (en) * 2018-07-06 2023-11-14 信利光电股份有限公司 Assembly method of 3D camera module and 3D camera module
CN112188038B (en) * 2019-07-01 2023-03-24 格科微电子（上海）有限公司 Method for improving assembling precision of camera module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103956370A (en) * 2014-05-20 2014-07-30 苏州晶方半导体科技股份有限公司 Image sensor module and forming method thereof
CN103996684A (en) * 2014-05-20 2014-08-20 格科微电子（上海）有限公司 Image sensor structure and packaging method thereof
CN104966724A (en) * 2015-06-15 2015-10-07 格科微电子（上海）有限公司 Method for configuring camera module to terminal mainboard and terminal equipment
CN205621732U (en) * 2015-12-10 2016-10-05 格科微电子（上海）有限公司 Many cameras module

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483101B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103956370A (en) * 2014-05-20 2014-07-30 苏州晶方半导体科技股份有限公司 Image sensor module and forming method thereof
CN103996684A (en) * 2014-05-20 2014-08-20 格科微电子（上海）有限公司 Image sensor structure and packaging method thereof
CN104966724A (en) * 2015-06-15 2015-10-07 格科微电子（上海）有限公司 Method for configuring camera module to terminal mainboard and terminal equipment
CN205621732U (en) * 2015-12-10 2016-10-05 格科微电子（上海）有限公司 Many cameras module

Also Published As

Publication number Publication date
CN105633108A (en) 2016-06-01

Similar Documents

Publication Publication Date Title
CN107301988B (en) Camera module and assembly method thereof
CN105206640B (en) Camera module and assembling method thereof
CN205621732U (en) Many cameras module
CN105633108B (en) Multi-camera module and assembly method thereof
US10032824B2 (en) Image sensor structure and packaging method thereof
US6759642B2 (en) Image pick-up device, camera module and camera system
US7375757B1 (en) Imaging element, imaging device, camera module and camera system
KR0172142B1 (en) Use of anisotropically conductive film for connecting leads of wiring board with electrode pads of photoelectric transducer
KR101294419B1 (en) Camera module and manufacturing method thereof
KR102076339B1 (en) Semiconductor pakage and method of manufacturing the same
US6737292B2 (en) Method of fabricating an image sensor module at the wafer level and mounting on circuit board
JP2007288755A (en) Camera module
US20080055438A1 (en) Image sensor package, related method of manufacture and image sensor module
KR100557140B1 (en) Connector and image sensor module using the same
US20060057770A1 (en) Method for packaging chip and package assembly produced thereby
TWI564610B (en) Camera module and method for fabricating the same
KR100756245B1 (en) Camera module
KR100653551B1 (en) A manufacture method of a chip scale package of a image sensor using a supersonic junction
TWI555398B (en) Camera Module And Method For Fabricating The Same
CN105390517B (en) Testing method and testing device for camera module
JP2006245359A (en) Photoelectric conversion device, and manufacturing method thereof
KR20100027857A (en) Wafer level camera module and manufacturing method thereof
JP2010016013A (en) Method for mounting semiconductor device, semiconductor element module, and electronic information apparatus
TWI476876B (en) Window type camera module structure
JP2005065285A (en) Solid-state image pickup semiconductor device and method for manufacturing the same

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant