CN105633044A - Connecting member - Google Patents

Abstract

Disclosed is a connecting member that is capable of reliably and efficiently achieve electrical connection between an external terminal of an IC card and an FPC on a card substrate. The connecting member of the invention is used for connecting a wiring portion disposed on the card substrate of the IC card and an external terminal portion having a plurality of bonding pads, and is provided with a flat plate component made of insulation materials; a plurality of through holes penetrating through the flat plate component in a thickness direction of the flat plate component; and conductivity components, which are at least disposed inside the through holes and through which the plurality of bonding pads of the external terminal portion and the wiring of the wiring portion disposed opposed to the plurality of bonding pads are electrically connected.

Description

Connection member

Technical field

The present invention relates to a kind of connection member, particularly relate to the connection member in IC-card (integrated circuit card), the wiring on outside terminal and card base material being electrically connected.

Background technology

In recent years, the application of Contact Type Ic Card is more and more extensive, except arranging display on card, sometimes always according to needing to carry operated key and RFID (RF identification), GSM (global system for mobile communications), parts etc. relevant for WiFi.

In this case, the IC in IC-card, not only like the function like that in the past with storage more new card information, also to possess the function that the various parts to lift-launch are controlled. That is, conventional had changed into, by the IC situation carrying out read-write card information, the situation being controlled various parts by multiple IC. In conventional IC-card, the IC being generally used for reading writing information is arranged in the outside terminal of IC-card (hard contact exposed) back side, and have recently emerged and together with being used for controlling the IC of various parts, the IC being used for reading writing information is arranged in the type spaced apart position with outside terminal.

In the IC-card of the type, IC electrically connects with the FPC (flexible print wiring board) being arranged on card base material, FPC generally extends into the lower section of outside terminal, and outside terminal is linked together (referring for example to patent documentation 1) with FPC by the bonding agent again through conduction.

In the IC-card that such IC is spaced apart with outside terminal, it may be considered that connected outside terminal and FPC by solder ball or copper wire welding. But in such method of attachment, it is necessary to multiple outside terminals (electrode pad) are coupled together with each wiring of FPC etc. respectively, and such operation is difficulty with automatization, can expend the more time by manual welding. Additionally, when by manual welding, yield management is also highly difficult.

In addition, owing to not arranging IC at the back side of outside terminal, on the thickness direction of IC-card, the part of hollow is there is between the back side and IC of outside terminal, if connecting only by solder ball or copper cash, yet suffer from more hollow space, it is easy to the problem that the flatness between card substrate surface and the surface of outside terminal of final products is inconsistent occurs. On the other hand, although the method that the thickness of the card base material by thickening the wiring being equipped with FPC etc. shortens the distance between the wiring such as outside terminal and FPC can be considered, but the thickness of actually general card base material is 0.2mm, it is generally difficult to change, and the cost changing thickness is higher.

Patent documentation 1: Japanese Unexamined Patent Publication 2013-4028

Summary of the invention

The present invention makes in view of the above problems, its object is to provide the connection member of a kind of outside terminal that can reliably and efficiently realize IC-card and the electrical connection of the FPC on card base material.

The present invention provides a kind of connection member, the wiring portion arranged on the card base material connect IC-card and the external terminal portions with multiple pad, possesses: planar plate members, is made up of Ins. ulative material; Multiple through holes, this planar plate members through on the thickness direction of described planar plate members; And electroconductive member, it is electrically connected via the described electroconductive member of described inside through holes at least provided with the inside at described through hole, the plurality of pad of described external terminal portions and the wiring in the described wiring portion opposite disposed with the plurality of pad.

Based on above-mentioned connection member, it is possible to reliably connect multiple pads of opposed external terminal portions and multiple wirings in wiring portion, play a role as embedding separator between them, it is possible to make to connect working performance and improve.

And, this connection member efficiently utilizes the hollow space existed between the back side of outside terminal and IC or wiring portion, outside terminal and wiring be can stably connect under not making the thickening premise of base material, and the card surface of end article and the flatness of electrode pad are easily guaranteed that.

In above-mentioned connection member, described electroconductive member is connected by surface mounting technology with described wiring portion, and described electroconductive member and described external terminal portions are fetched by Laser Welding and be connected.

With carried out situation about welding in the past by manual work compared with, fetch enforcement connection operation by surface mounting technology and/or Laser Welding, it is possible to working performance is greatly improved. And, management and the improvement of yield rate it is more beneficial for based on the surface mounting technology automatically controlled and/or laser weld.

In above-mentioned connection member, the central part in described connection member is provided with the centrally-located portion of the allocation position for determining described connection member, and this centrally-located portion is made up of more than one middle thereof hole and/or hole with the end.

By being arranged at the centrally-located portion in connection member and the cooperation between the corresponding location division being arranged on card base material (or wiring portion) or outside terminal, it is possible to increase each parts assemble time accuracy and operability.

Additionally, when connection member be circular etc. be not easy to determine towards, can by centrally-located portion be shaped so as to rectangle etc. easily determine towards shape, coordinated with the location division of the rectangle being arranged on miscellaneous part by the centrally-located portion of this rectangle, it is possible to be easily achieved the location between connection member and card base material (or wiring portion) and assembling.

In above-mentioned connection member, the circumference in described connection member is provided with the periphery location division of the allocation position for determining described connection member, and this periphery location division is formed by peripheral incisions or periphery cut-away.

By the circumference of at least side of circular connection member is machined away a part and forms straight line peripheral part, coordinated with the connection member accommodation portion with straight edge sections being arranged on miscellaneous part by this straight line peripheral part, it is possible to be easily achieved the location between connection member and card base material (or wiring portion) and assembling.

In above-mentioned connection member, described planar plate members is circular or substantially rectangular shape.

When planar plate members is shaped generally as the symmetric shape such as circular or substantially rectangular, by interruption-forming will be watered in symmetrical centre, it is capable of in whole resin flowing equably when planar plate members shapes.

In above-mentioned connection member, fixing conductive member, it is molding by insert integrally formed with described planar plate members: and bonding conductive member, the one or both sides on the described thickness direction of the described fixing conductive member being arranged in described through hole.

In above-mentioned connection member, described fixing conductive member is made up of metal or alloy, and described bonding conductive member is made up of scolding tin or silver paste.

By by fixing conductive member big for hardness ratio planar plate members and planar plate members one insert moulding, planar plate members is served the effect of reinforcement by this fixing conductive member, compared with the situation that the inside of the through hole at planar plate members independently forms conductive member, it is possible to prevent the planar plate members generation warpage of connecting elements.

Additionally, due to the thickness of bonding conductive member is little, it is possible to by reflow welding etc., bonding conductive member is fixed on fixing conductive member, it is more prone to so that manufacture. Additionally, when bonding conductive member being fixed on fixing conductive member by reflow soldering, owing to being formed with the more than one middle thereof hole as centrally-located portion at the central part of connection member, the deformation that the space in this middle thereof hole produces when can absorb reflow soldering, it is possible to suppress the warpage of connection member.

In above-mentioned connection member, the mask that described fixing conductive member is formed as on described thickness direction has protuberance, has recess at another side.

At fixing conductive member when being provided above side bonds conductive member, owing to having the recess on the upside of this, by increasing capacitance it is possible to increase upper contact area between side bonds conductive member and fixing conductive member hardware, improve connection characteristic. Additionally, due to have the protuberance of upside, when making fixing conductive member be connected with the lower side bonds conductive member being arranged at wiring portion, it is possible to avoid the unevenness because fixing conductive member (or upwards swelling) and the bad connection that causes.

In above-mentioned connection member, having on the described another side of recess and being provided with described bonding conductive member at described fixing conductive member, on above-mentioned thickness direction, this bonding conductive member protrudes from the surface of the described another side side of described planar plate members.

By making bonding conductive member protrude from the surface of described another side side of described planar plate members in a thickness direction, it is possible to more make bonding conductive member be connected more reliably with the pad of outside terminal.

Accompanying drawing explanation

Fig. 1 is the exploded perspective view of the IC-card schematically showing the present invention.

Fig. 2 is the axonometric chart of the IC-card schematically showing the present invention.

Fig. 3 indicates that the exploded perspective view of connection member.

Fig. 4 indicates that the axonometric chart of connection member.

Fig. 5 indicates that the top view of connection member.

Fig. 6 indicates that the upward view of connection member.

Fig. 7 indicates that the sectional view of the line A-A along Fig. 5.

Fig. 8 indicate that electroconductive member be formed after the top view of state.

Fig. 9 indicates that the state top view after the electroconductive member in Fig. 8 carries out insert part forming.

Figure 10 indicates that the top view of the state after the component after insert part forming in Fig. 9 is cut off.

Figure 11 indicate that the electroconductive member of the first variation be formed after the top view of state.

Figure 12 indicates that the top view of the state after the electroconductive member in Figure 11 carries out insert part forming.

Figure 13 indicates that the top view of the state after the component after insert part forming in Figure 12 is cut off.

Figure 14 indicate that the electroconductive member of the second variation be formed after the top view of state.

Figure 15 indicates that the top view of the state after the electroconductive member in Figure 14 is cut off.

Description of reference numerals

1IC card

2 card base materials

2a connection member accommodation portion

2a1 straight edge sections

3 outer end daughter boards (external terminal portions)

3a pad electrode

4 flexible wiring boards (wiring portion)

4a wiring terminals

5,15,25 connection members

5a, 15a planar plate members

5b, 15b through hole

5c, 25c electroconductive member

5d middle thereof hole

5e shallow bore hole

5f periphery location division (straight line peripheral part)

5g cast gate

6,26 fixing conductive members

6a protuberance

6b recess

Side bonds conductive member on 7

8 times side bonds conductive members

8a protuberance

9,29 arms

29a branch part

10 concentration portions

11 linking parts

Detailed description of the invention

Fig. 1 is the exploded perspective view of the IC-card schematically showing the present invention. Fig. 2 is the axonometric chart of the IC-card schematically showing the present invention.

IC-card in Fig. 1 is a kind of Contact Type Ic Card 1, including card base material 2, outer end daughter board (external terminal portions) 3, flexible wiring board (wiring portion) 4 and connection member 5.

Card base material 2 constitutes the main body of Contact Type Ic Card 1, is made up of insulant. It is internally provided with an IC (not shown) at card base material 2, this IC can either also be able to the miscellaneous part that controls to be integrated in this IC-card 1 by reading writing information, and this IC be configured without the back side of outside terminal board 3 or near, and be disposed on spaced apart position with outer end daughter board 3.

As in figure 2 it is shown, outer end daughter board 3 is made up of copper coin, there are 8 pad electrode 3a, play a role as connection terminal when contact communicates. Additionally, outer end daughter board 3 is arranged on the upper surface side of card base material 2, and the upper surface of the upper surface of outer end daughter board 3 and card base material 2 is in approximately the same plane.

Flexible wiring board 4 extends in the inside of card base material 2, and one end of flexible wiring board 4 electrically connects with not shown IC, and the wiring terminals 4a of the other end electrically connects with connection member 5.

Fig. 3 indicates that the exploded perspective view of connection member. Fig. 4 indicates that the axonometric chart of connection member. Fig. 5 indicates that the top view of connection member. Fig. 6 indicates that the upward view of connection member. Fig. 7 indicates that the sectional view of the line A-A along Fig. 5.

Connection member 5 possesses: planar plate members 5a, is shaped generally as the tabular of circle, is made up of Ins. ulative material such as resins; 8 through hole 5b, this planar plate members 5a through on the thickness direction of planar plate members 5a; And electroconductive member 5c, at least provided with the inside at through hole 5b, multiple pad 3a of outer end daughter board 3 and being electrically connected via the electroconductive member 5c within through hole 5b with the wiring on the plurality of flexible wiring board 4 opposite disposed for pad 3a.

In the present embodiment, electroconductive member 5c is such as connected by surface mounting technology (SurfaceMountedTechnology:SMT) with flexible wiring board 4. Electroconductive member 5c is such as fetched by Laser Welding with outer end daughter board 3 and is connected.

With carried out situation about welding in the past by manual work compared with, fetch enforcement connection operation by surface mounting technology and/or Laser Welding, it is possible to working performance is greatly improved. And, management and the improvement of yield rate it is more beneficial for based on the surface mounting technology automatically controlled and/or laser weld.

As shown in fig. 5 or the like, the central part in connection member 5 is provided with the middle thereof hole 5d of a general square shape, and the upside around openings at this middle thereof hole 5d is also formed with a shallow bore hole 5e overlooked in general square shape. As it is shown in fig. 7, the length of side of shallow bore hole 5e is slightly larger than middle thereof hole 5d, the degree of depth degree of depth much smaller than planar plate members 5a.

Additionally, be provided with the periphery location division 5f of the allocation position for determining connection member 5 at the circumference of connection member 5, this periphery location division is formed by the periphery cut-away of linearity.

As shown in fig. 5 or the like, the circumference of the opposed both sides of circular connection member 5 is respectively machined away a part and forms straight line peripheral part 5f, when connection member accommodation portion 2a connection member 5 being positioned on card base material 2, owing to this connection member accommodation portion 2a both sides on card width (above-below direction in Fig. 5) have opposed two straight edge sections 2a1, and the distance between these two straight edge sections 2a1 is equal with the distance between the two of connection member 5 straight line peripheral part 5f, thus, by the cooperation between these two straight edge sections 2a1 and two straight line peripheral part 5f, the location between connection member 5 and card base material 2 and assembling can be easily achieved.

Electroconductive member 5c includes: fixing conductive member 6, is molding by insert integrally formed with planar plate members 5a; Upper side bonds conductive member 7, is arranged on the upside on the thickness direction of the fixing conductive member 6 in through hole 5b; And lower side bonds conductive member 8, it is arranged on the downside on the thickness direction of the fixing conductive member 6 in through hole 5b.

Fixing conductive member 6 is made up of metal or alloy, is formed by carrying out stamping to metallic plate etc. Bonding conductive member 7 is made up of scolding tin or silver paste.

The hardness ratio planar plate members 5a of fixing conductive member 6 is big, and it is positioned at the substantial middle on the thickness direction of planar plate members 5a, by make stamping after the fixing conductive member 6 that obtains and planar plate members 5a one insert moulding, planar plate members 5a is also served the effect of reinforcement by this fixing conductive member 6 as the skeleton of planar plate members 5a. Compared with not adopting insert part forming and only independently form the situation of conductive member 5c in the inside of the through hole 5b of planar plate members 5a, it is possible to prevent the planar plate members 5a of connecting elements 5 from warpage occurring in the courses of processing such as Reflow Soldering.

Additionally, due to the thickness of upper side bonds conductive member 7 and lower side bonds conductive member 8 is little, it is possible to be fastened on fixing conductive member 6 by reflow welding etc., be more prone to so that manufacture.

Additionally, when upper side bonds conductive member 7 or lower side bonds conductive member 8 being fixed on fixing conductive member 6 by reflow soldering, owing to being formed with the middle thereof hole 5d of at the central part of connection member 5, the deformation that the space of this middle thereof hole 5d produces when can also absorb reflow soldering, it is possible to suppress the planar plate members 5a in connection member 5 that warpage occurs.

As it is shown in fig. 7, fixing conductive member 6 is formed as lower surface in a thickness direction and has protuberance 6a, at upper surface, there is recess 6b.

When being provided above side bonds conductive member 7 of fixing conductive member 6, owing to having the recess 6b on the upside of this, by increasing capacitance it is possible to increase upper contact area between side bonds conductive member 7 and fixing conductive member 6, improve connection characteristic.

Additionally, as it is shown in fig. 7, the upper surface going up side bonds conductive member 7 in a thickness direction protrudes from the surface of the upside of planar plate members 5a.

By making upper side bonds conductive member 7 protrude from the surface of upside of planar plate members 4 in a thickness direction, it is possible to more make side bonds conductive member 7 be connected more reliably with the pad 3a of outer end daughter board 3.

Additionally, make fixing conductive member 6 possess protuberance 6a by punch process, even if the lower surface of the fixing conductive member 6 after insert part forming there occurs such as the deformation of protuberance upward etc., it is also possible to reliably ensure the shape of the lower surface of fixing conductive member 6. Thereby, it is possible to avoid the bad connection caused because the lower surface of fixing conductive member 6 is uneven.

As shown in Figure 7, lower side bonds conductive member 8 in present embodiment also has the protuberance 8a protruded upward, and this protuberance 8a is formed as and protuberance 6a same shape and size, it is possible to more reliably ensure fixing consistent degree between conductive member 6 and the contact surface of lower side bonds conductive member 8, it is possible to ensure good electric conductivity.

Connection member 5 in first embodiment mode is located between multiple pad 3a of opposed outer end daughter board 3 and multiple wiring terminals 4a of flexible wiring board 4, preferred 0.30mm��the 0.38mm of thickness of connection member 5, play a role as embedding separator between them, reliably pad 3a and wiring terminals 4a can be electrically connected by electroconductive member 5c, and connection working performance can be improved.

And, this connection member 5 efficiently utilizes the hollow space existed between the back side and the flexible wiring board 4 of outside terminal board 3, with only use conductive adhesive to compared with electrically connecting the situation of outside terminal plate 3 and flexible wiring board 4, outer end daughter board 3 and flexible wiring board 4 be can stably connect under not making the thickening premise of IC-card, and the card surface of end article and the flatness of electrode pad are easily guaranteed that.

Below, with reference to Fig. 8��Figure 10, the manufacture method of connection member 5 is illustrated.

First, by being that the metallic plate of strip carries out machining and obtains the shape shown in multiple Fig. 8 to the above-below direction along Fig. 8, Fig. 8 only shows the shape corresponding with a fixing conductive member 6. As shown in Figure 8, the metallic plate after being cut has 8 fixing conductive members 6, and these 8 fixing conductive members 6 are connected in concentration portion 10 by radial arm 9. And, under the vertical view state shown in Fig. 8, each fixing conductive member 6 is formed with the recess 6b of circle. Additionally, the fixing conductive member 6 of both sides is respectively provided with the linking part 11 that the frame with metallic plate is connected up and down.

Then, by the insert moulding together with the insulant such as synthetic resin of the metallic plate in Fig. 8, Fig. 9 illustrates the top view of the state after insert moulding. Planar plate members 5a in Fig. 9 has cast gate 5g at central part, is provided with the shallow bore hole 5e of general square shape around cast gate 5g.

Due to planar plate members 5a be shaped generally as circle shape, by by cast gate 5g formed in its symmetrical centre, be capable of in whole when planar plate members 5a shapes equably resin flow.

Then, the shape shown in Figure 10 is obtained by carrying out the cut-out of cast gate 5g to process. That is, will be located in the cast gate of the central authorities of connection member 5 to cut together with metallic plate, thus obtaining the middle thereof hole 5d of general square shape.

Then, the top of the fixing conductive member 6 scolding tin being coated in the through hole 5b in Figure 10, by the mode of reflow soldering, upper side bonds conductive member 7 is fixed on the upside of fixing conductive member 6. In like manner, it is possible to lower side bonds conductive member 8 is fixed on the downside of fixing conductive member 6.

Finally, by cutting off linking part 11, it is thus achieved that the connecting member 5 shown in Fig. 3��Fig. 7.

It should be noted that, the opportunity that upper side bonds conductive member 7 and lower side bonds conductive member 8 are fixed on fixing conductive member 6 is not limited only to above-mentioned opportunity, it is also possible to the connection of side bonds conductive member 7 (and/or lower side bonds conductive member 8) and fixing conductive member 6 on carrying out again after having performed cut-out linking part 11.

For example, it is also possible to first lower side bonds conductive member 8 is separately fixed on each wiring terminals 4a of flexible wiring board 4 according to actual needs, then the lower side bonds conductive member 8 being fixed on flexible wiring board 4 and fixing conductive member 6 are linked together.

Additionally, the a part of thickness above and below arm 9 that is positioned in planar plate members 5a is likely less than 0.1mm, the technique of Reflow Soldering is susceptible to warpage, the deformation produced during by arranging the space of middle thereof hole 5d and can absorb reflow soldering, it is possible to suppress the part generation warpage that in planar plate members 5a, thickness is thin.

(the first variation)

From connection member 5, the connection member 15 of the first variation is distinctive in that the shape of connection member is different, the flat part 15a of the connection member 15 of the first variation is substantially rectangular shape. And, the connection member 15 of the first variation includes 10 through hole 15b, 10 through hole 15b are arranged in inside the periphery of flat part 15a of rectangular shape.

Figure 11 indicate that the electroconductive member of the first variation be formed after the top view of state. Figure 12 indicates that the top view of the state after the electroconductive member in Figure 11 carries out insert part forming. Figure 13 indicates that the top view of the state after the component after insert part forming in Figure 12 is cut off.

Except the difference of connection member shape and through hole number, the structure of the connection member 15 of the first variation is all identical with connection member 5 with manufacture method, and at this, the repetitive description thereof will be omitted.

(the second variation)

The connection member 25 of the second variation is distinctive in that from connection member 5 shaping form of the metallic plate constituting electroconductive member is different.

As shown in figure 14, the electroconductive member 25c of the connection member 25 of the second variation includes 8 fixing conductive members 26 and the fixing public arm 29 of conductive member 26 of each two.

After insert part forming, as shown in figure 15, by cutting the branch part 29a that arm 29 is connected with two fixing conductive members 26, each independent fixing conductive member 26 can be obtained.

Figure 14 indicate that the electroconductive member 25c of the second variation be formed after the top view of state. Figure 15 indicates that the top view of the state after the electroconductive member 25c in Figure 14 is cut off.

Except the shape of electroconductive member 25c and except cutting position difference, the structure of the connection member 25 of the second variation is all identical with connection member 5 with manufacture method, and at this, the repetitive description thereof will be omitted.

(other variation)

Specific embodiment described above is only some preferred embodiments or specific embodiment, and protection scope of the present invention is not limited in these embodiments. Under the premise without departing from the purport of the present invention, it is possible to the element in above-described embodiment is carried out suitable change or deletion.

Such as, assume that the situation that an IC is only set in IC-card in the above-described embodiment, IC-card actually can also arrange multiple IC, and multiple IC can be electrically connected with connection member by one or more flexible wiring boards.

Additionally, what the periphery location division 5f in above-described embodiment nor is it necessary that, when rectangular shape as connecting elements is formed as the first variation, it is also possible to be not provided with periphery location division. Even if it addition, when needs arrange periphery location division, periphery location division is also not limited to the periphery cut-away of linearity, it is also possible to be the peripheral incisions of semicircle or triangle etc.

It addition, the middle thereof hole 5d of general square shape can also as being used for determining that the centrally-located portion of the allocation position of connection member 5 plays a role.

The projection of general square shape can be set, by the engaging of this projection with middle thereof hole 5d, it is possible to improve accuracy when each parts assemble and operability further in the position corresponding with this middle thereof hole 5d of card base material 2 (or flexible wiring board 4).

In addition it is also possible to replace middle thereof hole 5d, only arranging a circular recess (that is, hole with the end, top) at the lower surface of the central part of connection member, the degree of depth of this recess is such as the half of planar plate members thickness. Meanwhile, in the position corresponding with this recess of card base material (or wiring portion), a protuberance is set, cooperation by recess and protuberance, it is possible to simply realize the location between connection member and card base material (or wiring portion) and assembling exactly.

Additionally, the shape of connection member in the present invention mainly shape according to outer end daughter board or wiring terminals is determined, it is also possible to be asymmetrical shape.

Additionally, above-described embodiment shows and has located the shape that fixing conductive member is formed as having protuberance and recess, but the difference according to the material of electroconductive member or size, it is understood that there may be even if being not provided with protuberance and recess also is able to obtain the situation of enough bonding strengths and connection characteristic. In this case, it is also possible to fixing conductive member is not arranged protuberance and recess.

Claims (8)

1. a connection member, the wiring portion arranged on the card base material connect IC-card and the external terminal portions with multiple pad, it is characterised in that possess:

Planar plate members, is made up of Ins. ulative material;

Multiple through holes, this planar plate members through on the thickness direction of described planar plate members; And

Electroconductive member, at least provided with the inside of through hole at each described,

The plurality of pad of described external terminal portions and the wiring in the described wiring portion opposite disposed with the plurality of pad are electrically connected via the described electroconductive member of described inside through holes.

2. connection member as claimed in claim 1, it is characterised in that

Central part in described connection member is provided with the centrally-located portion of the allocation position for determining described connection member, and this centrally-located portion is made up of more than one middle thereof hole and/or hole with the end.

3. connection member as claimed in claim 1, it is characterised in that

Circumference in described connection member is provided with the periphery location division of the allocation position for determining described connection member, and this periphery location division is formed by peripheral incisions or periphery cut-away.

4. connection member as claimed in claim 1, it is characterised in that

Described planar plate members is circular or substantially rectangular shape.

5. the connection member as according to any one of Claims 1 to 4, it is characterised in that

Described electroconductive member includes:

Fixing conductive member, is molding by insert integrally formed with described planar plate members: and

Bonding conductive member, the one or both sides on the described thickness direction of the described fixing conductive member being arranged in described through hole.

6. connection member as claimed in claim 5, it is characterised in that

Described fixing conductive member is made up of metal or alloy, and described bonding conductive member is made up of scolding tin or silver paste.

7. connection member as claimed in claim 6, it is characterised in that

The mask that described fixing conductive member is formed as on described thickness direction has protuberance, has recess at another side.

8. connection member as claimed in claim 7, it is characterised in that

Being provided with described bonding conductive member on the described another side of described fixing conductive member, on above-mentioned thickness direction, this bonding conductive member protrudes from the surface of the described another side side of described planar plate members.