CN105632945A - Method for preparing wafer back adhesive - Google Patents
Method for preparing wafer back adhesive Download PDFInfo
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- CN105632945A CN105632945A CN201410616537.0A CN201410616537A CN105632945A CN 105632945 A CN105632945 A CN 105632945A CN 201410616537 A CN201410616537 A CN 201410616537A CN 105632945 A CN105632945 A CN 105632945A
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- wafer
- gum
- prefabricated membrane
- preparation
- described prefabricated
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Abstract
The invention discloses a method for preparing a wafer back adhesive, and the method comprises the steps of providing a wafer and a prefabricated film; pressing the prefabricated film onto the back of the wafer by using a laminator; heating the prefabricated film to form a back adhesive; and making information of the wafer on the back adhesive. The method for preparing the wafer back adhesive adopts the method of pressing the prefabricated film, the flatness, thickness, viscosity and the like of the prefabricated film can be predetermined as required, the two sides of the prefabricated film each are covered with a protective layer for preventing the prefabricated film from being contaminated so that the prefabricated film will not be contaminated by particles in the environment, and afterwards, the information of the wafer is marked on the back adhesive. The invention achieves controllable preparation of the wafer back adhesive, and improves the reliability of the process.
Description
Technical field
The present invention relates to technical field of semiconductors, the preparation method particularly relating to a kind of wafer gum.
Background technology
In the follow-up encapsulation process of integrated circuit, need to carry out the techniques such as thinning back side of silicon wafer, burst, paster, wire bonding, before wafer is carried out burst, needs are in the information of each chip of rear indicia of wafer, at present, generally form one layer of polymeric at wafer rear, and be subsequently formed one layer of gum through techniques such as heat treated, gum carries out labelling with laser.
The detailed process forming gum is, wafer is oppositely positioned, use the instruments such as scraper that polymer is coated in wafer rear and form thin polymer film, and control the thickness of thin polymer film at 20 microns-25 microns, being placed in baking box by wafer afterwards and toast about 2 hours, the temperature of baking box controls at 135 DEG C-150 DEG C. Thin polymer film after overbaking forms the thin film that one layer of hardness is bigger, is gum. After forming gum, laser labelling can be carried out on gum.
But, due to scraper pressure in striking process, speed etc., the impact of the factor such as granule in the viscosity of polymer itself and environment, the thickness of the gum of formation, flatness etc. are difficult to control to, it is necessary to repeatedly debug. It is additionally, since thawing time when polymer uses, exposes the aerial time etc. and be difficult to control to so that the viscosity of polymer self not can determine that. The difference of the flatness of the gum of wafer so that follow-up technique is unstable, causes that waste paper rate is higher. Accordingly, it would be desirable to a kind of method forming wafer gum that controllability is good.
Summary of the invention
It is an object of the invention to, it is provided that the preparation method of a kind of controlled wafer gum so that the flatness of wafer gum of preparation, thickness, viscosity can make a reservation in advance, improve reliability of technology.
For solving above-mentioned technical problem, the preparation method that the present invention provides a kind of wafer gum, including:
Wafer and prefabricated membrane are provided;
Use film laminator that described prefabricated membrane is compressed on the back side of described wafer;
It is heated described prefabricated membrane processing, forms gum; And
The information of wafer described in labelling on described gum.
Optionally, the two sides of described prefabricated membrane is all covered with one and prevents the contaminated protective layer of described prefabricated membrane.
Optionally, the preparation method of described wafer gum also includes:
Before using film laminator that described prefabricated membrane is compressed on the step at the back side of described wafer, the described protective layer of the side of described prefabricated membrane is torn it down;
Using film laminator to be compressed on by described prefabricated membrane in the step at the back side of described wafer, the side of described prefabricated membrane is placed towards the back side of described wafer.
Optionally, the preparation method of described wafer gum also includes:
After using film laminator that described prefabricated membrane is compressed on the step at the back side of described wafer, the described protective layer of the opposite side of described prefabricated membrane is torn it down.
Optionally, the thickness of described prefabricated membrane and viscosity pre-establish as requested.
Optionally, described prefabricated membrane is that flatness is less than or equal to 5%.
Optionally, the temperature adopted in the process of prefabricated membrane described in heat treated is 130 DEG C-150 DEG C.
Optionally, the time processed in the process of prefabricated membrane described in heat treated is 100min-120min.
Optionally, method information of wafer described in labelling on described gum of laser labelling is adopted.
Optionally, described information includes the information of output voltage, output.
Compared with prior art, the preparation method of wafer gum of the present invention has the advantage that
In the preparation method of wafer gum provided by the invention, including: wafer and prefabricated membrane are provided; Use film laminator that described prefabricated membrane is compressed on the back side of described wafer; It is heated described prefabricated membrane processing, forms gum; The information of wafer described in labelling on described gum. The preparation method of the wafer gum of the present invention; the method adopting compacting prefabricated membrane; the flatness of described prefabricated membrane, thickness, viscosity etc. can pre-establish as requested; and described prefabricated membrane two sides is all covered with one prevents the contaminated protective layer of described prefabricated membrane; make the described prefabricated membrane will not by the particle contamination in environment, the information of marking wafer on the gum formed afterwards. The preparation method of the wafer gum of the present invention, it is achieved the controlled synthesis of wafer gum, improves the reliability of technique.
Accompanying drawing explanation
Fig. 1 is the flow chart of wafer gum preparation method in one embodiment of the invention;
Fig. 2 is the schematic diagram of wafer gum preparation method compacting prefabricated membrane in one embodiment of the invention;
Fig. 3 be in one embodiment of the invention on wafer gum schematic diagram after label information.
Detailed description of the invention
Below in conjunction with schematic diagram, the preparation method of the wafer gum of the present invention is described in more detail, which show the preferred embodiments of the present invention, should be appreciated that those skilled in the art can revise invention described herein, and still realize the advantageous effects of the present invention. Therefore, it is widely known that description below is appreciated that for those skilled in the art, and is not intended as limitation of the present invention.
In order to clear, whole features of practical embodiments are not described. They in the following description, it are not described in detail known function and structure, because can make to due to the fact that unnecessary details and chaotic. Will be understood that in the exploitation of any practical embodiments, it is necessary to make a large amount of implementation detail to realize the specific objective of developer, for instance according to about system or about the restriction of business, an embodiment change into another embodiment. Additionally, it should it is complicated and time-consuming to think that this development is probably, but it is only routine work to those skilled in the art.
With reference to the accompanying drawing present invention more particularly described below by way of example in the following passage. According to the following describes and claims, advantages and features of the invention will be apparent from. It should be noted that, accompanying drawing all adopts the form simplified very much and all uses non-ratio accurately, only in order to convenience, the purpose aiding in illustrating the embodiment of the present invention lucidly.
The core concept of the present invention is in that, it is provided that wafer gum preparation method in, including: wafer and prefabricated membrane are provided; Use film laminator that described prefabricated membrane is compressed on the back side of described wafer; It is heated described prefabricated membrane processing, forms gum; The information of wafer described in labelling on described gum. The preparation method of the wafer gum of the present invention; the method adopting compacting prefabricated membrane; the flatness of described prefabricated membrane, thickness, viscosity etc. can pre-establish as requested; and described prefabricated membrane two sides is all covered with one prevents the contaminated protective layer of described prefabricated membrane; make the described prefabricated membrane will not by the particle contamination in environment, the information of marking wafer on the gum formed afterwards. The preparation method of the wafer gum of the present invention, it is achieved the controlled synthesis of wafer gum, improves the reliability of technique.
Concrete, in conjunction with above-mentioned core concept, shown in flow chart reference Fig. 1 of the preparation method of the wafer gum of the present invention, and it is specifically described in conjunction with Fig. 2.
Perform step S1: provide wafer 1 and prefabricated membrane 2. In the present embodiment, the inside of described wafer 1 comprises different device architectures, it is necessary to wafer carries out cutting burst, forms chip independent one by one. But needing to be formed at the back side of wafer gum before being cut by wafer, and utilize laser to carry out labelling on gum, label information mainly includes the information such as output voltage, output. Described prefabricated membrane 2 is what pre-establish as requested so that the thickness of described prefabricated membrane 2, flatness and viscosity anticipated that. Such as, in the present invention, the flatness of described prefabricated membrane controls less than 5%, and thickness is 25 trifling. In the present embodiment, all there is layer protective layer the both sides of described prefabricated membrane 2, it is prevented that described prefabricated membrane, by ambient contamination, forms the pollutant such as granule.
Perform step S2: use film laminator that described prefabricated membrane 2 is compressed on the back side of described wafer 1. General; before using film laminator that described prefabricated membrane 2 is compressed on the back side of described wafer 1; the described protective layer of described prefabricated membrane 2 side is torn it down; in the process of the described wafer 1 of described prefabricated membrane 2 compacting; the side of described prefabricated membrane is placed towards described wafer 1; use film laminator that described prefabricated membrane 2 is compressed on the back side of described wafer 1, and before carrying out ensuing operation, the more described protective layer of opposite side is torn it down.
Perform step S3: be heated described prefabricated membrane 2 processing, form gum. In the present embodiment, being heated described prefabricated membrane processing in baking box, in processing procedure, the temperature of process controls at 130 DEG C-150 DEG C, and the process time is 100min-120min, for instance, adopt 135 DEG C of baking 120min. After heat treated, described prefabricated membrane 2 can form comparatively hard gum 3, with reference to shown in Fig. 3. The gum adopting the method preparation of compacting prefabricated membrane to be formed, can pre-establish due to the thickness of described prefabricated membrane 2, flatness and viscosity etc., and therefore, the thickness of described gum 3 of formation, flatness and viscosity etc. can control.
Perform step S4: the information 4 of wafer 1 described in labelling on described gum 3. In the present embodiment, adopt the method for laser labelling in the described enterprising line flag of gum 3, when described gum 3 enterprising line flag, each region is carried out separate marking, making after follow-up cutting, the label information required for this chip is contained at the back side of each independent chip. The described information of labelling includes the information such as the output in this region, output voltage.
In sum, in the preparation method of wafer gum provided by the invention, including: wafer and prefabricated membrane are provided; Use film laminator that described prefabricated membrane is compressed on the back side of described wafer; It is heated described prefabricated membrane processing, forms gum; The information of wafer described in labelling on described gum. The preparation method of the wafer gum of the present invention; the method adopting compacting prefabricated membrane; the flatness of described prefabricated membrane, thickness, viscosity etc. can pre-establish as requested; and described prefabricated membrane two sides is all covered with one prevents the contaminated protective layer of described prefabricated membrane; make the described prefabricated membrane will not by the particle contamination in environment, the information of marking wafer on the gum formed afterwards. The preparation method of the wafer gum of the present invention, it is achieved the controlled synthesis of wafer gum, improves the reliability of technique.
Obviously, the present invention can be carried out various change and modification without deviating from the spirit and scope of the present invention by those skilled in the art. So, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. the preparation method of a wafer gum, it is characterised in that including:
Wafer and prefabricated membrane are provided;
Use film laminator that described prefabricated membrane is compressed on the back side of described wafer;
It is heated described prefabricated membrane processing, forms gum; And
The information of wafer described in labelling on described gum.
2. the preparation method of wafer gum as claimed in claim 1, it is characterised in that the two sides of described prefabricated membrane is all covered with and prevents the contaminated protective layer of described prefabricated membrane.
3. the preparation method of wafer gum as claimed in claim 2, it is characterised in that the preparation method of described wafer gum also includes:
Before using film laminator that described prefabricated membrane is compressed on the step at the back side of described wafer, the described protective layer of the side of described prefabricated membrane is torn it down;
Using film laminator to be compressed on by described prefabricated membrane in the step at the back side of described wafer, the side of described prefabricated membrane is placed towards the back side of described wafer.
4. the preparation method of wafer gum as claimed in claim 2, it is characterised in that the preparation method of described wafer gum also includes:
After using film laminator that described prefabricated membrane is compressed on the step at the back side of described wafer, the described protective layer of the opposite side of described prefabricated membrane is torn it down.
5. the preparation method of wafer gum as claimed in claim 1, it is characterised in that thickness and the viscosity of described prefabricated membrane pre-establish as requested.
6. the preparation method of wafer gum as claimed in claim 5, it is characterised in that the flatness of described prefabricated membrane is less than or equal to 5%.
7. the preparation method of wafer gum as claimed in claim 1, it is characterised in that the temperature adopted in the process of prefabricated membrane described in heat treated is 130 DEG C-140 DEG C.
8. the preparation method of wafer gum as claimed in claim 6, it is characterised in that the time processed in the process of prefabricated membrane described in heat treated is 100min-120min.
9. the preparation method of wafer gum as claimed in claim 1, it is characterised in that adopt method information of wafer described in labelling on described gum of laser labelling.
10. the preparation method of wafer gum as claimed in claim 9, it is characterised in that described information includes the information of output voltage, output.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410616537.0A CN105632945A (en) | 2014-11-05 | 2014-11-05 | Method for preparing wafer back adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410616537.0A CN105632945A (en) | 2014-11-05 | 2014-11-05 | Method for preparing wafer back adhesive |
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| Publication Number | Publication Date |
|---|---|
| CN105632945A true CN105632945A (en) | 2016-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410616537.0A Pending CN105632945A (en) | 2014-11-05 | 2014-11-05 | Method for preparing wafer back adhesive |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021548A (en) * | 2019-04-03 | 2019-07-16 | 江苏纳沛斯半导体有限公司 | A kind of technique reducing chip cutting edge chipping |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020096491A1 (en) * | 2000-08-25 | 2002-07-25 | Tandy William D. | Method and apparatus for marking a bare semiconductor die |
| US6972244B1 (en) * | 2004-04-23 | 2005-12-06 | National Semiconductor Corporation | Marking semiconductor devices through a mount tape |
| CN1921066A (en) * | 2005-08-26 | 2007-02-28 | 南茂科技股份有限公司 | Wafer laser marker method and its wafer |
| US20070080450A1 (en) * | 2005-10-07 | 2007-04-12 | Stats Chippac Ltd. | Wafer level laser marking system for ultra-thin wafers using support tape |
-
2014
- 2014-11-05 CN CN201410616537.0A patent/CN105632945A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020096491A1 (en) * | 2000-08-25 | 2002-07-25 | Tandy William D. | Method and apparatus for marking a bare semiconductor die |
| US6972244B1 (en) * | 2004-04-23 | 2005-12-06 | National Semiconductor Corporation | Marking semiconductor devices through a mount tape |
| CN1921066A (en) * | 2005-08-26 | 2007-02-28 | 南茂科技股份有限公司 | Wafer laser marker method and its wafer |
| US20070080450A1 (en) * | 2005-10-07 | 2007-04-12 | Stats Chippac Ltd. | Wafer level laser marking system for ultra-thin wafers using support tape |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021548A (en) * | 2019-04-03 | 2019-07-16 | 江苏纳沛斯半导体有限公司 | A kind of technique reducing chip cutting edge chipping |
| CN110021548B (en) * | 2019-04-03 | 2020-09-11 | 江苏纳沛斯半导体有限公司 | Process for reducing edge breakage of chip cutting edge |
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Application publication date: 20160601 |
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