CN105627150A - LED lamp - Google Patents
LED lamp Download PDFInfo
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- CN105627150A CN105627150A CN201410575435.9A CN201410575435A CN105627150A CN 105627150 A CN105627150 A CN 105627150A CN 201410575435 A CN201410575435 A CN 201410575435A CN 105627150 A CN105627150 A CN 105627150A
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- led
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- solder mask
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Abstract
The invention relates to an LED lamp with a heat radiation function. The LED lamp comprises a heat radiation layer, on which a heat conduction layer, an aluminum substrate layer and a solder mask layer are arranged in sequence. A lamp holder is arranged on the solder mask layer. Two ends of the lamp holder are provided with electrodes having silica gel. The middle of the lamp holder is provided with a PN knot of the LED. A solder paste solder block is arranged between the solder mask layer and the lamp holder and formed in such a manner that an exposed aluminum board upwardly sinks, a zinc surface is plated with nickel and nickel is plated with copper and finally copper is sprayed with tin or turmeric. The processing steps are adopted so that the LED lamp has high adhesion ability and fine heat conduction performance and the LED can be welded on the aluminum board. The LED lamp with a heat radiation function has following beneficial effects: the heat radiation effect is improved; and stability and service lifetime of the LED lamp can be improved and prolonged.
Description
Technical field
The present invention relates to a kind of heat sinking function LED.
Background technology
Light emitting diode, as a new generation's solid state light emitter, has the many merits such as life-span length, energy-efficient, environmental protection, is widely applied in display, lighting field. Along with development in science and technology, advanced technology are constantly applied in semiconductor production, so that the luminous efficiency of LED constantly promotes, cost continuous decrease.
The core of LED is PN junction. Injected electrons and hole are converted directly into luminous energy at PN junction compound tense electric energy, but the luminous energy of not all conversion can both be transmitted into outside LED, and it can be absorbed and converted to heat energy inside PN junction cyclization epoxy resins silica gel. This heat energy can not effectively dispel the heat, and LED internal temperature can be made to raise, and temperature is more high, and the luminous efficiency of LED is more low, and the life-span of 6LED is more short, can cause that LED wafer lost efficacy at once under serious conditions, so heat radiation is still the huge obstacle of great power LED application.
Summary of the invention
In order to solve the problems referred to above, the present invention relates to the LED that a kind of heat sinking function is high.
The present invention is achieved through the following technical solutions:
A kind of LED, including heat dissipating layer, heat dissipating layer is sequentially provided with heat-conducting layer, aluminium base flaggy, solder mask, solder mask is provided with lamp socket, lamp socket two ends are equipped with electrode, electrode is provided with silica gel, is provided with the PN junction of LED in the middle of lamp socket, it is characterised in that: it is provided with tin cream welding block between described solder mask and lamp socket; Described tin cream welding block is to set one layer of zinc on the aluminium sheet of naked leakage, nickel plating on zinc face, copper facing on nickel, sprays stannum or turmeric on copper.
Described heat-conducting layer selects heat-conducting silica gel sheet.
Described LED base heat conductivity is 80W/mk.
The heat conductivity of described heat-conducting layer is 5W/mk.
Described heat dissipating layer aluminium section bar.
The technique effect that the present invention is useful:
One LED of the present invention, including heat dissipating layer, heat dissipating layer is sequentially provided with heat-conducting layer, aluminium base flaggy, solder mask, solder mask is provided with lamp socket, and lamp socket two ends are equipped with electrode, and electrode is provided with silica gel, it is provided with the PN junction of LED in the middle of lamp socket, between described solder mask and lamp socket, is provided with tin cream welding block; Described tin cream welding block is heavy on the aluminium sheet of naked leakage, then nickel plating on zinc face, then copper facing on nickel, finally sprays stannum or turmeric on copper; The adhesive force adopting sequence described above processing is strong, and good heat conductivity can be welded on LED on aluminium sheet simultaneously. Invention enhances radiating effect, extending can stable and life-span of LED.
Accompanying drawing explanation
Fig. 1 one LED lamp structure figure.
Detailed description of the invention
A kind of LED, including heat dissipating layer 1, heat dissipating layer is sequentially provided with heat-conducting layer 2, aluminium base flaggy 3, solder mask 4, solder mask 4 is provided with base 5, base 5 two ends are equipped with electrode 6, electrode 6 is provided with silica gel 7, is provided with the PN junction 8 of LED in the middle of base 5, it is characterised in that: it is provided with tin cream welding block 9 between described solder mask 4 and base 5; Described tin cream welding block 9 is to set one layer of zinc on the aluminium sheet of naked leakage, nickel plating on zinc face, copper facing on nickel, sprays stannum or turmeric on copper.
Specifically, the radiator structure of LED lamp is heat dissipating layer 1 aluminium section bar, and heat-conducting layer 2 selects heat-conducting silica gel sheet or silicone grease, is provided with solder mask 4 between aluminium base flaggy 3 and base 5, and this solder mask 4 is protection base; Base 5 two ends are equipped with electrode 6, and electrode 6 is provided with silica gel 7, are provided with the PN junction 8 of LED in the middle of base 5, it is characterised in that: it is provided with tin cream welding block 9 between described solder mask 4 and base 5. Base 5 heat conductivity is 80W/mk, and the heat conductivity of aluminium base flaggy 3 is 200W/mk, and the heat conductivity of heat-conducting layer 2 is 5W/mk, but the closer to the PN junction 8 of LED, heat flow density is more high, and heat-conducting layer 2 has had the horizontal heat-conduction even temperature of heat dissipating layer 1; Therefore, tin cream welding block 9 is processed, first heavy zinc on the aluminium sheet of naked leakage, nickel plating on zinc face again, then copper facing on nickel again, finally sprays stannum or turmeric on copper, and this operation coating adhesion is strong, good heat conductivity, then base 5 is welded with aluminium base 3, the heat that the PN junction 8 of the LED after welding sends through aluminium base flaggy 3 heat-conducting layer 2 heat dissipating layer 1 of base 5 tin cream welding block 9, distribute with in air, greatly strengthen heat-sinking capability, also improve the stable of LED etc. and life-span simultaneously.
Claims (5)
1. a LED, including heat dissipating layer (1), heat dissipating layer is sequentially provided with heat-conducting layer (2), aluminium base flaggy (3), solder mask (4), solder mask (4) is provided with base (5), base (5) two ends are equipped with electrode (6), electrode (6) is provided with silica gel (7), is provided with the PN junction (8) of LED in the middle of base (5), it is characterised in that: it is provided with tin cream welding block (9) between described solder mask (4) and base (5); Described tin cream welding block (9) is to set one layer of zinc on the aluminium sheet of naked leakage, nickel plating on zinc face, copper facing on nickel, sprays stannum or turmeric on copper.
2. a kind of LED as claimed in claim 1, it is characterised in that: described heat-conducting layer (2) selects heat-conducting silica gel sheet.
3. a kind of LED as claimed in claim 1, it is characterised in that: described base (5) heat conductivity is 80W/mk.
4. a kind of LED as claimed in claim 1, it is characterised in that: the heat conductivity of described heat-conducting layer (2) is 5W/mk.
5. a kind of LED as claimed in claim 1, it is characterised in that: described heat dissipating layer (1) aluminium section bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410575435.9A CN105627150A (en) | 2014-10-25 | 2014-10-25 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410575435.9A CN105627150A (en) | 2014-10-25 | 2014-10-25 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105627150A true CN105627150A (en) | 2016-06-01 |
Family
ID=56042337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410575435.9A Pending CN105627150A (en) | 2014-10-25 | 2014-10-25 | LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105627150A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108488644A (en) * | 2018-03-28 | 2018-09-04 | 杭州和顺建设有限公司 | A kind of high-efficient heat-dissipating LED lamp |
-
2014
- 2014-10-25 CN CN201410575435.9A patent/CN105627150A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108488644A (en) * | 2018-03-28 | 2018-09-04 | 杭州和顺建设有限公司 | A kind of high-efficient heat-dissipating LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160601 |
|
| WD01 | Invention patent application deemed withdrawn after publication |