CN105623215B - Flexible circuit conductive composition and the method that flexible circuit is built based on 3D printing - Google Patents
Flexible circuit conductive composition and the method that flexible circuit is built based on 3D printing Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
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- C08K7/06—Elements
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K7/24—Expanded, porous or hollow particles inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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Abstract
A kind of method that flexible circuit is built the present invention relates to flexible circuit conductive composition and based on 3D printing.Belong to polymeric material field.Thermoplastic matrix and conductive filler are pre-mixed by solution, pass through melt blending again, flexible circuit conductive composition most is made through melting extrusion afterwards, flexible circuit conductive composition is printed to matrix by way of 3D printing, so as to get flexible circuit not only ensure that overall high conductivity but also with excellent mechanical property and preferably flexible.
Description
Technical field：
A kind of method that flexible circuit is built the present invention relates to flexible circuit conductive composition and based on 3D printing.Belong to high
Molecular material field.
Background technology：
With developing rapidly for 21 century computer industry, the update speed of electronic component is also accelerated therewith.Electricity
Sub- equipment, electronic component turn into the core of the fields such as traffic, national defence, communication, space flight operation.Electronic equipment and its first device
Part develops towards direction smaller, faster, portable, inexpensive.In this context, the manufacturing process and method of circuit are also needed badly not
It is disconnected to improve, the new demand proposed after electronic equipment updates is adapted to this.Flexible circuit is in view of its portable, inexpensive spy
Levy, be one of dominant direction of new-type circuit development all the time.
The manufacture of flexible circuit is most commonly realized by the method printed：Layers of copper and flexible base layer are fitted in one
Rise, interlayer is bonded together with adhesive.Then circuit pattern is obtained with the method for conventional etch.Also can be by flexible base layer
It is placed between two layers of copper, is formed after etching between double-sided PCB, two conductive layers by connection of perforating.Patent CN101460020,
CN101203095 discloses a kind of method for manufacturing multi-layer flexible circuit version, and its main technique is the stacking of single circuit version, figure
The method of case remains as conventional etch.In this stage, the method for conventional etch considerably increases being manufactured into for flexible PCB
This, the use of conductive bodies copper so that reducing weight of equipment turns into problem, therefore as portable major obstacle.On the other hand,
Such a method, only substrate material are flexible material, and conductive bodies do not change for the metallic copper of hard, therefore are not carried out
Flexible circuit truly.
In recent years, silk-screen printing and nanometer embossing turned into the main flow skill for improving conventional flex circuits board fabrication method
Art.This two methods has the advantages that technique is simple, cost is low, product flexibility good.But the conductive material of substitution copper is led at present
Electric rate is relatively low, is not reaching to the conductive extensions of conductor or high conductor, therefore its actual application value is not considerable.Patent
CN104527247A discloses the method for printing screen after a kind of improvement, is manufactured that the combustion that electric conductivity is good, stability is high
Expect battery microcircuit, but be due to that its conductive bodies is silver paste, its cost is beyond most of printing technology cost, therefore not
Possesses actual application value.
Meanwhile, inkjet printing also turns into one of main stream approach that existing flexible circuit is manufactured.Its cardinal principle is to lead
Electric main body is dissolved in or is dispersed in ink-jet ink, and it is regulated and controled by regulating and controlling its solvent and other additive levels and is glued
Degree, so as to smoothly be printed to from business printer on flexible parent metal.Patent CN103619128A discloses one kind and is based on
The preparation method of the flexible PCB of inkjet printing, has prepared the higher flexible circuit pattern of quality.But, inkjet printing with
There are three major obstacles between the production of actual industrial metaplasia, first, the conductive bodies of inkjet printing are usually metal dust or metal
Nano-particle, such as gold, silver, copper, the powder of nickel or its nano-particle.The cost of such a metallic product is too high so that input is real
Border application becomes unrealistic.Second, the ink used in inkjet printing was being prepared because of the ink-jet printer of business to be adapted to
Its viscosity is controlled by various allotments in journey, its technique is excessively complicated, and rise and the efficiency of cost are brought to actual production
Reduction.3rd, the conductive bodies of inkjet printing are powder, therefore its flexible circuit printed is after solvent volatilization, though powder
Adhesion can form conductive path between end, but the slight stretching of external force or bending all may interrupt its adhesion, so that its
Open circuit.Defect in mechanical property makes it be difficult to flexibility truly.
Conductive carbon material, such as graphene, CNT are because its electrical conductivity is high, quality is small, excellent in mechanical performance gradually by
Widely use.Patent CN102212304A discloses one kind using modified carbon nano-tube as conductive bodies, using silk-screen printing as preparation
The flexible circuit preparation flow of method.Not only conductance is high for prepared flexible PCB, and excellent in mechanical performance, towards
Industrial applications have stepped major step.But its manufacturing process need further optimization, to improve efficiency.On the other hand, should
Method can only be confined to two-dimensional circuit, it is impossible to realize the structure of three-dimensional circuit or curved surface circuit.
And newest flexible circuit preparation method is the laser orientation sintering process based on graphene.Patent CN102501701A
A kind of flexible circuit preparation method based on graphene laser ablation is disclosed, graphene oxide is made film and is layered on by this method
On resistant to elevated temperatures base material or on CD, burning is oriented with DVD laser head or the laser head being connected with computer and is carved.Oxidation
Graphene is by the scanned part of thin beam laser, due to high temperature, and graphene oxide is reduced, and forms highly conductive graphene, from
And form highly conductive pattern.Although flexible circuit electrical conductivity prepared by such a method is high, similar with method before, still
The problem of so existing in some mechanical properties.After graphene oxide is reduced by laser orientation, cavernous body state is formed in structure,
It is more frangible.In addition, graphene oxide film mechanical property itself is bad, the support lining without flexible parent metal, becomes insecure in addition.
The content of the invention：
The present invention is intended to provide a kind of flexible circuit conductive composition and the method that flexible circuit is built based on 3D printing, will
Thermoplastic matrix is pre-mixed with conductive filler by solution, then by melt blending, flexible circuit most is made through melting extrusion afterwards
Electrically conductive composition, is printed flexible circuit conductive composition to flexible substrate by way of 3D printing, so as to get flexibility
Circuit not only ensure that overall high conductivity but also with excellent mechanical property and preferably flexible.
A kind of flexible circuit conductive composition that the present invention is provided, is made up of, thermoplasticity thermoplastic matrix and conductive filler
Matrix is with conductive filler mass ratio：9-200:1, preferably 20-50:1.
Described thermoplastic matrix is thermoplastic or thermoplastic elastomer (TPE), preferably is selected from：PLA (PLA), acetic acid are fine
Tie up element, polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP), styrene-butadiene-acrylonitrile terpolymer (ABS),
Polystyrene (PS), makrolon (PC), nylon 6, thermoplastic polyurethane (TPU).
Described conductive filler is selected from：CNT, graphene, chopped carbon fiber, Nano Silver or micron silver, Nanometer Copper or
Micron copper.
Above-mentioned CNT is selected from any one of following material or their mixture：Common CNT, oxygen
The CNT that carbon nano tube, nano metal particles are modified is (such as：CNT, the carbon of nanometer modified by silver of decorated by nano-gold
Nanotube, the CNT of Nano Silver nickel modification, the CNT of nano nickel modification).
The preparation method of above-mentioned oxide/carbon nanometer tube is：It is 3 that CNT is added into volume ratio:The 1 dense H of 98wt%2SO4
With the dense HNO of 62-63wt%3Mixed solution in, ultrasonic resonance 2-6 hours.Its handlability of CNT after oxidized and
Degree of orientation in the base can be greatly increased.
The preparation method of CNT of nano metal particles modification is：By oxide/carbon nanometer tube in DBSA
Ultrasonic resonance 1-3 hours in the solution of sodium (SDBS) and PVP (PVP)；Then (single point of polyalcohol is added
Sub- hydroxyl quantity 2-6 polyalcohol) and metal strong acid aqueous solution (AgNO3、NiSO4、HAuCI4), the ultrasonic resonance at 50-70 DEG C
2-6 hours.
Above-mentioned graphene is selected from any one of following material or their mixture：Electronation graphene, heat
Reduced graphene, high-performance mechanical peel off single-layer graphene, graphene nanometer sheet, chemistry-thermal reduction graphene.
In order to keep good flexibility, the addition of conductive filler is reduced as far as possible, improves the electrical conductivity of circuit, it is preferably high
Performance mechanical stripping single-layer graphene or chemistry-thermal reduction graphene.
The preparation method of above-mentioned chemistry-thermal reduction graphene is：Native graphite is prepared into graphite oxide with Hummers methods
Alkene (GO).Ultrasonic resonance after graphene oxide is reduced with strong reductant, makes it fully peel off.It is then placed in nitrogen in tube furnace
Protection is heated to 800-1200 DEG C of insulation 1-2h.
Above-mentioned Nano Silver or micron silver is selected from：Nano silver wire, Nano silver grain, Nano silver piece or silver-colored powder and micron.
Above-mentioned Nanometer Copper or micron copper is selected from：Copper nano-wire, copper nano-particle, copper nanometer sheet or copper powder and micron.
Above-mentioned silver, copper nano-wire are the nano wire that metal salt back method or polyol process growth method are prepared, radial ruler
Very little is 30-60nm, and line length is 1-5 μm.Above-mentioned copper, Nano silver grain particle diameter are between 5-50nm.The horizontal stroke of above-mentioned copper, Nano silver piece
To size between 100-800nm.Above-mentioned copper, silver-colored powder and micron particle size between 10-40 μm.
A kind of method that flexible circuit is built based on 3D printing that the present invention is provided：
(1) first conductive filler is added and solution premixing is carried out in thermoplastic matrix's liquid solution, melted in banbury
Melt blending, then by extruder melting extrusion into conductive silk.
(2) by conductive silk, in insertion 3D printer, regulate and control suitable head temperature, according to computer software (CAD,
Solid Work, 3D Max etc.) Computer Aided Design circuit pattern, flexible circuit is made in flexible substrates in printing.It can realize
The printing of two dimension, three-dimensional and curve flexibility circuit.
Solution premixing solvent used is selected from above-mentioned steps (1)：Dichloromethane, chloroform, acetonitrile, tetrahydrochysene furan
Mutter, DMF, DMA, Isosorbide-5-Nitrae-dioxane, toluene, dimethylbenzene or dimethyl sulfoxide (DMSO).It is molten
The concentration of the prepared thermoplastic matrix's liquid solution of liquid premixing is preferably controlled within the scope of 0.1g/ml-0.25g/ml, to ensure
It can be sufficiently mixed after being stirred together for conductive filler.
It is 60-100r/min that banbury screw speed is controlled during melt blending of the present invention, and screw temperature set is height
Go out 10-15 degrees Celsius of thermoplastic matrix's bulk melting point (DEG C), blending effect is optimal under the conditions of this, be conducive to the company of being formed in thermoplastic matrix's body
Continuous conductive path.
Printer head temperature is set as during 3D printing in above-mentioned steps (2)：It is higher by thermoplastic matrix's bulk melting point 50-60
Degree Celsius (DEG C), to ensure that melting conductive material smoothly can be got from 400 μm of vestibule.
Flexible substrates of the present invention are selected from：Polyimide film (PI), polyethylene terephthalate film (PET),
Polychloroethylene film (PVC), polypropylene screen (PP), polyurethane film (PU), paper or aluminium tin thin slice.
To make to have between flexible substrates and electric conductor preferable adhesion, and avoid lubricating substance during 3D printing, can will be soft
Property substrate carry out surface plasma etching processing.
The preferred polyimide film of flexible substrates (PI) or polyethylene terephthalate film (PET), to make PI or PET film
There is more preferable adhesion between electric conductor, and avoid lubricating substance during 3D printing, PI or PET film are before preferably in volume ratio
For 3:The 1 dense H of 98wt%2SO4And 36%H2O21-3h is soaked in solution.
The method that the use 3D printing that the present invention is provided prepares flexible circuit.Preparation process is simple to operation, stability height,
Cycle is short.Prepared flexible circuit is excellent compared to conventional method electrical conductivity height, excellent in mechanical performance, flexibility.Meanwhile, prepare
Used in the process of the prices of raw materials it is cheap, can be mass-produced, can put into industrial production and use.
Brief description of the drawings：
Fig. 1 is the two-dimension flexible circuit that the embodiment of the present invention 1 is printed
Fig. 2 is the three-dimension flexible circuit that the embodiment of the present invention 6 is printed
Embodiment：
With reference to embodiment, the present invention will be further described：Part described in embodiment refers both to mass parts.
Embodiment 1：
47.5 parts of PLAs (PLA) are added in dichloromethane, are sufficiently stirred for until PLA is dissolved completely in dichloro
In methane, transparent PLA solution (solution concentration 0.15g/ml) is formed.Under agitation, 2.5 parts of chemistry-heat are slowly added to
Reduced graphene is (by the tubular type for after strong reductant electronation, being put into argon gas protection of graphene oxide made from Hummers methods
1000 DEG C are incubated 1 hour in stove) and continue to stir 20min.PLA- graphene dispersing solutions are poured into container, divulges information, treats solvent
After volatilization, it is dried in vacuo.Taking-up is ground into powder, is put into HAKKE banburies and is blended, and extruder temperature is 160 DEG C, screw rod
Rotating speed is 80r/min, and the blending time is 10min.Pelletizing is crushed after blending, is put into melting extrusion in single screw extrusion machine, is extruded
Machine extruder temperature is 213 DEG C, and a diameter of 1.75mm silk is made.By silk insertion 3D printer (Makerbot
Replicator 2) in, the single-layer model circuit gone out according to CAD design, by PI films substrate, (substrate is first 3 in volume ratio:1
98% dense H2SO4With 36%H2O23h is soaked in mixed solution) it is fixed on print platform, head temperature is controlled at 210 DEG C, is beaten
Print off flexible circuit.
Prepared flexible circuit electrical conductivity reaches 3.98S/cm, and Young's modulus reaches 12.1MPa.Elongation at break reaches
7.09%.
Embodiment 2：
20 parts of terpolymer ABS are added to the mixed solution (volume ratio 1 of appropriate chloroform and toluene:1) in, fill
Divide stirring up to ABS is completely dissolved, form turbid white ABS solution (solution concentration 0.15g/ml).In high-speed stirred, slowly
Add the chloroform dispersion liquid containing 2 parts of nano silver wires and continue to stir 1h.ABS- nano silver wire dispersion liquids are poured into container
In, ventilation after the solvent is volatilized, is dried in vacuo.Take out ABS- nano silver wires and be ground into powder, be put into single screw extrusion machine
Middle melting extrusion, extruder temperature is 237 DEG C, and a diameter of 1.75mm silk is made.Silk is inserted in 3D printer, passed through
CAD design goes out single-layer model circuit, and by PET film substrate, (substrate is first 3 in volume ratio:1 98% dense H2SO4With 36%H2O2It is mixed
Close in solution and soak 3h) it is fixed on print platform, head temperature is controlled at 240 DEG C, prints flexible circuit.
Above-mentioned nano silver wire preparation method is：It is the molten of 0.1g/ml that 3.34 parts of PVP and ethylene glycol are mixed to form into concentration
Liquid, is heated to after 170 DEG C, is slowly added to after 2.5 parts of grindings broken AgCI, 3min are added immediately containing 11 parts of AgNO3It is dilute molten
Liquid, after be heated to 170 DEG C of holding 30min, nano silver wire is made through separation, radial dimension is 30-60nm, line length is 1-5 μm.
Prepared flexible circuit electrical conductivity reaches 2.01S/cm, and Young's modulus reaches 9.41MPa.Elongation at break reaches
8.70%.
Embodiment 3：
47 parts of polystyrene (PS) are added in appropriate tetrahydrofuran, are sufficiently stirred for until polystyrene is dissolved completely in
In tetrahydrofuran, transparent polystyrene solution (solution concentration 0.15g/ml) is formed.In high-speed stirred, 3 parts of nanometers are added
After modified by silver CNT and continue stir 20min.PS- carbon nano-tube solutions are poured into container, divulged information, treat that solvent volatilizees
Afterwards, it is dried in vacuo.Take out PS- CNTs and be ground into powder, be put into HAKKE banburies and be blended, extruder temperature is 220
DEG C, screw speed is 80r/min, and the blending time is 10min.Pelletizing is crushed after blending, is put into melt in single screw extrusion machine and is squeezed
Go out, extruder screw temperature is 240 DEG C, and a diameter of 1.75mm silk is made.Silk is inserted in 3D printer, passes through CAD
Single-layer model circuit is designed, using paper as substrate, is fixed on print platform, head temperature is controlled at 240 DEG C, flexible electrical is printed
Road.
The preparation method of above-mentioned modified by silver CNT is：2 parts of CNTs after peroxidating are taken to be added to ethylene glycol
Middle formation 0.1g/ml solution, more than ultrasonic disperse 15min obtains solution A.1 part of AgNO is weighed respectively3, 1 part of polyvinyl
Pyrrolidones (PVP) and 1 part of sodium dodecyl benzenylsulfonate (SDBS) are added to the solution that 0.1g/ml is formed in ethylene glycol, ultrasound
Vibrate 10min solution Bs derived above.Solution A is mixed and more than sonic oscillation 3h with solution B.After be put into ultraviolet drying box
Dry.
Prepared flexible circuit electrical conductivity reaches 4.10S/cm, and Young's modulus reaches 13.9MPa.Elongation at break reaches
6.82%.
Embodiment 4：
46 parts of cellulose acetates are added in appropriate DMF (DMF), are sufficiently stirred for until acetic acid is fine
Dimension element is dissolved completely in DMF, forms transparent cellulose acetate solution (solution concentration 0.15g/ml).In high-speed stirred,
Add 4 parts of commercially available chopped carbon fibers and continue to stir 20min.Cellulose acetate-carbon fiber solution is poured into container, divulged information,
After the solvent is volatilized, it is dried in vacuo.Take out cellulose acetate-carbon fiber powder and be broken into powder, be put into HAKKE banburies altogether
Mixed, extruder temperature is 227 DEG C, and screw speed is 80r/min, and the blending time is 10min.Pelletizing is crushed after blending, is put into single spiral shell
Melting extrusion in bar extruder, extruder screw temperature is 233 DEG C, and a diameter of 1.75mm silk is made.Silk is inserted into 3D
In printer, single-layer model circuit is gone out by CAD design, aluminium tin platelet substrate is fixed on print platform, head temperature control
System prints flexible circuit at 240 DEG C.
Prepared flexible circuit electrical conductivity reaches 3.87S/cm, but is due to that carbon is fine after 3D printer printing extrusion
Dimension is orientated, therefore prepared circuit local conductivity is up to 100S/cm.Young's modulus reaches 16.77MPa.Extension at break
Rate reaches 7.24%.
Embodiment 5：
47 parts of thermoplastic polyurethanes (TPU) are added in appropriate DMF, are sufficiently stirred for until TPU is dissolved completely in DMF
In, form thermoplastic polyurethane solution (solution concentration 0.19g/ml).In high-speed stirred, 3 parts of chemistry-thermal reduction graphite are added
Alkene (with preparation method in example 1) simultaneously continues to stir 20min.TPU- graphene solutions are poured into container, divulges information, treats that solvent is waved
After hair, it is dried in vacuo.Take out TPU- Graphene powders and be broken into powder, be put into HAKKE banburies and be blended, extruder temperature is
200 DEG C, screw speed is 80r/min, and the blending time is 10min.Pelletizing is crushed after blending, is put into the feed well of 3D printer
In, single-layer model circuit is gone out by CAD design, (substrate must be first in 98% dense H by PET film substrate2SO4With 36%H2O2Mixing is molten
3h is soaked in liquid) it is fixed on print platform, head temperature is controlled at 230 DEG C, prints flexible circuit.
Prepared flexible circuit electrical conductivity reaches 2.24S/cm, and Young's modulus reaches 8.89MPa.Elongation at break reaches
10.07%.Because matrix used in this method is thermoplastic elastomer (TPE), thus prepared circuit it is good except having it is flexible with
Outside, also with good elasticity and pliability.
Embodiment 6：
47 parts of thermoplastic polyurethanes (TPU) are added in 300ml DMF, are sufficiently stirred for until TPU is dissolved completely in DMF
In, form thermoplastic polyurethane solution (solution concentration 0.19g/ml).In high-speed stirred, add 3 parts of Nano Silver modified carbons and receive
Mitron (with preparation method in example 3) simultaneously continues to stir 20min.TPU- carbon nano-tube solutions are poured into container, divulges information, treats molten
After agent volatilization, it is dried in vacuo.Take out TPU- CNTs and be ground into powder, be put into HAKKE banburies and be blended, screw rod temperature
Spend for 200 DEG C, screw speed is 80r/min, the blending time is 10min.Pelletizing is crushed after blending, is put into the charging of 3D printer
In groove, single-layer model circuit is gone out by CAD design, (substrate must be first in 98% dense H by PI films substrate2SO4With 36%H2O2Mixing
3h is soaked in solution) it is fixed on print platform, head temperature is controlled at 230 DEG C, prints flexible circuit.
Prepared flexible circuit electrical conductivity reaches 2.67S/cm, and Young's modulus reaches 8.13MPa.Elongation at break reaches
11.20%.Because matrix used in example 5 and the method for example 6 is thermoplastic elastomer (TPE), therefore prepared circuit is good except having
It is flexible beyond, also with good elasticity and pliability.
Claims (6)
1. a kind of flexible circuit built based on 3D printing, is made by the steps and obtained：
(1) first conductive filler is added and solution premixing is carried out in thermoplastic matrix's liquid solution, carry out melting altogether in banbury
It is mixed, then by extruder melting extrusion into conductive silk；
(2) by conductive silk, in insertion 3D printer, suitable head temperature is regulated and controled, according to computer software Computer Aided Design
In circuit pattern, printing to flexible substrates, flexible circuit is made；
The mass ratio of the thermoplastic matrix and the conductive filler is：9-200:1；
Described thermoplastic matrix is thermoplastic or thermoplastic elastomer (TPE), is selected from：PLA, cellulose acetate, polyethylene,
Polyvinyl chloride, polypropylene, styrene-butadiene-acrylonitrile terpolymer, polystyrene, makrolon, nylon 6 or thermoplastic
Property polyurethane；
Described conductive filler is selected from：CNT, chemistry-thermal reduction graphene, the carbon that is chopped of nano metal particles modification are fine
Dimension or nano silver wire.
2. the flexible circuit according to claim 1 built based on 3D printing, it is characterized in that：Thermoplastic matrix and conductive filler matter
Measuring ratio is：20-50:1.
3. the flexible circuit according to claim 1 built based on 3D printing, it is characterized in that：Nano silver wire radial dimension is 30-
60nm, line length is 1-5 μm.
4. a kind of method that flexible circuit is built based on 3D printing, methods described is comprised the following steps：
(1) first conductive filler is added and solution premixing is carried out in thermoplastic matrix's liquid solution, carry out melting altogether in banbury
It is mixed, then by extruder melting extrusion into conductive silk；
(2) by conductive silk, in insertion 3D printer, suitable head temperature is regulated and controled, according to computer software Computer Aided Design
In circuit pattern, printing to flexible substrates, flexible circuit is made；
The mass ratio of the thermoplastic matrix and the conductive filler is：9-200:1；
Described thermoplastic matrix is thermoplastic or thermoplastic elastomer (TPE), is selected from：PLA, cellulose acetate, polyethylene,
Polyvinyl chloride, polypropylene, styrene-butadiene-acrylonitrile terpolymer, polystyrene, makrolon, nylon 6 or thermoplastic
Property polyurethane；
Described conductive filler is selected from：CNT, chemistry-thermal reduction graphene, the carbon that is chopped of nano metal particles modification are fine
Dimension or nano silver wire.
5. method according to claim 4, it is characterized in that：Solution premixing solvent used is selected from step (1)：Dichloro
Methane, chloroform, acetonitrile, tetrahydrofuran, DMF, DMA, Isosorbide-5-Nitrae-dioxane, first
Benzene, dimethylbenzene or dimethyl sulfoxide (DMSO).
6. method according to claim 4, it is characterized in that：The prepared thermoplastic matrix of solution premixing in step (1)
The concentration of solution is controlled within the scope of 0.1g/ml-0.25g/ml.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610071643.4A CN105623215B (en) | 2016-02-02 | 2016-02-02 | Flexible circuit conductive composition and the method that flexible circuit is built based on 3D printing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610071643.4A CN105623215B (en) | 2016-02-02 | 2016-02-02 | Flexible circuit conductive composition and the method that flexible circuit is built based on 3D printing |
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| Publication Number | Publication Date |
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| CN105623215A CN105623215A (en) | 2016-06-01 |
| CN105623215B true CN105623215B (en) | 2017-10-27 |
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